silicon to system - nmi | connected communities · silicon to system packaging selection ... real...

Silicon to System

Packaging Selection, Rise of the System in Package (SiP)

Nicole Tien

ASEEu Technologist

November 23rd, 2016

NMI, DSP Valley and IMEC

Leuven, Belgium Nov-23rd-2016

© ASE Group. All rights reserved.

Outline

Introduction- IoT Market Outlook and Drivers- ASE Group SiP-SiM Synergies- ASE SiP Technology Toolbox and Focus

SiP Technology Development and Design Capability- SiP Technologies for IoT and Smart Living- Possible Co-development Work Methods- IoT DK Collaborations

Conclusion

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© ASE Group. All rights reserved.ASE CONFIDENTIAL

IoT Market Outlook

IoT is a growing but highly fragmented long tailed market

Source: Gartner Q3 2016

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Outlook of Market Trend Segments

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ASE Confidential

SiP vs Soc vs ModuleSiP value mapping

Above chart from Sony Tsugio Makimoto and Infineon Grit Sommer (2005)

In many cases, systems are made of a weighted mix of SoC, SiP and SoB

4


ASE Confidential

ASE Group Synergies

ASE ATM USI EMS

Main operations IC assembly and test (A&T) services

Module/System Design and Manufacturing Services (DMS)

Main technologies die attach, wire bonding, bumping, flip chip, moulding, IC test, Wafer level packaging

Compartment Shielding, Conformal Shielding, Hi-Density SMT, and Embedded Technologies.

Accuracy range 1µm – 50µm 20µm-100µm

Business models - Outsourced IC assemblyand test services.

ASE is a service company

- Module/System design and manufacture including Supply chain and Services.

USI is a service company

Increasingly integrating EMS

& IC packaging assembly services

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ASE Confidential

Smartest package solution

for IoT, mobile, ATV etc… !

Group Synergies leading to disruptive innovation

SiP / SiM with HD integration

Advanced packagin

for semiconductor ICPCBA, module assembly

and system assembly

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ASE SiP Package Solution Focus

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© ASE Group. All rights reserved.ASE CONFIDENTIAL

ASE SiP Product Track Records

Smartphone

Wearable

PC / Tablet

• Enable > 30% PCBA

miniaturization…

• Integrated >400+ Components inside one

SiP…

• Enable New Functionality using SiP…

1- Higher Service level 2- Higher Packaging Technology 3- Higher System Overall value+ =

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ASE Confidential * SESUB is a trademark or registered trademark of TDK Corporation.

All other trademarks not owned by ASE that appear in this document are the property of their respective owners,

who may or may not be affiliated with, connected to, or sponsored by ASE.

Encapsulation• Exposed Molding• Irregular Molding• Selective Molding• Double Side Molding

Interconnection• Wire Bond• Flip Chip

IPD

AFE EPS

Memory

APU / MPUMEMS

1

2

Wafer Level Packaging• Bumping• Fan-Out, Fan-In• TSV, TGV• IPD

3

Embedded Technology• a-EASI• SESUB (Partner w/ TDK)

4Stacking• Die Stacking• 2.5D, 3D (Partner w/ Inotera)• PoP, PiP

5

Board Assembly• HD-SMT• Flex & Mechanical

Assembly

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Shielding / Antenna• Conformal Shielding• Compartment Shielding• Selective Shielding• AoP (Metal Stamped Antenna)• AoP (Lamination Antenna)

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ASE SiP Technology Toolbox

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ASE Confidential

SiP Technologies for IoT and Smart Living

ASE Confidential

RFFlash

MCU

MEMS

Optical

RF Shielding•Conformal Shielding

•Compartment Shielding

Antenna on Package•Stamping Antenna (<5GHz)

•LCP/Laminate Antenna (>5GHz)•Simulation, Design and Validation

Double-Side Structure•Solder Frame Board

•Double-Side & Exposed Molding•HDSMT

Embedded SBS•Embedded Passive SBS•Embedded Active SBS

-aEASi-SESUB

Multi-Sensor Embedded SiP-Smaller Dimension-Lower System Cost

-Higher Signal Quality

Wearable Tracker(Chips on Board)

DK Platform for RF/Sensor Integration•Stackable Board for Multi-Function Integration

•BLE/WLAN with MCU •Sensor Built-In for Motion/Physiological/Environment

•SDK with MESH Feature

Multi-Sensor Integration•MCU+ RF+ Sensors

•ARM(M0~M4), Firmware/Algorithm•Motion (Accelerator, Gyro., Gesture)•Physiological Sign (HRM, ECG, SpO2..)

•Environment (CO, CO2, Alcohol)

Network Topology •BLE Mesh, IPv6, WiFi•IoT Bridge/Gateway

•BLE Audio with sensor •LP-WAN: SigFox, LoRa,

NB-IoT, LTE-M

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ASE Confidential

SiP Module Design Solution Capabilities

Chipset Package

Package Structure

Component Selection

Advanced SiPTechnology

Substrate Process Regulatory

Laminate Single Sided

Double Sided

Stacked Die

PoP / Pip

BGA

WLCSP

QFN

Bare die w/ WB

RF Passive

LTCC / SAW

Active

IPD

EPS

EDS

TSV

Conformal Shield

Metal Lid

Mold

Module Requirement

Function Dimension Cost

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ASE Confidential

To-Be

Device Design

Package + SiPDesign

WLCSP

QFN

SiP

ReferenceDesign

PackageOptions

Device Design

PackageDesign

ReferenceDesign

As-IsQFN

WLCSP

PackageOptions

Co-Development Proposal 1 Offering SiP Reference Design

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Antenna on Package Solution- BT Low Energy for Wearable Applications -

Module With Chip Antenna Antenna on Package

Applications: Low Power Wireless ModuleAntenna: Chip AntennaModule Size: 15x15x2.0mmSize estate: ~200mm2

Total Height: ~1.5mm

Metal Stamped Antenna

RF Chip

Applications: Low Power Wireless ModuleAntenna: Metal Stamped Antenna (Antenna on Package)Size estate: ~42.5mm2

Module Size: 6.5x6.5x1.2mmTotal Height: ~1.2mm

• BLE 4.0 (2.4 GHz)• Single Chip (Nordic n51822)• RF Passive 20 Pcs• Single Sided Module

X-Y Form Factor80% smaller

Z Height20% thinner

Cost~60% lower

© ASE Group. All rights reserved. 13


ASE Confidential

Existing Development Board

SiP Solution ready for MP

Co-Development Proposal 2 Standardize Development Board

Standardize Development Board including ASE SiP

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ASE Confidential

IoT Development Kit Introduction

Smallest Size-SiP (System in Package)

-Smaller PCB design

Low Cost & Fast Time to Market

-SiP ready for HVM

-Simplest BOM-Hardware ref. schematic

& board design

Stackable(Lego-Like)

-24~40 Stacking Pin

-Power/GND-JTAG/USB

-GPIO/I2C/UART/PWM

Flexible-IDE: Arduino/Keil/GCC

-Sensor algorithm library-App/cloud SDK

-Support B2B/B2C model

RF+MCU- BT/BLE/ANT+

- WLAN- SigFox

- ZigBee/NFC- ARM Cortex M0~M4F

- Bridge/Gateway

Motion- Accelerometer

- Gyrometer- Gesture Sensor- Proximity/ALS

- Beacon

Environment- Temp./Humidity

- Pressure- Alcohol/VOCs

- PM2.5- Smart Lighting

Physiological Sign- ECG Waveform

- Static/Dynamic HRM/HRV- SpO2

- Blood pressure

Bridge/Gateway

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ASE Confidential

DK Portfolio and Roadmap

BLE+MCU(M0) WiFi+MCU(M3)BLE+MCU(RISC) LP-WAN(SigFox/Lora/LTE-M)

WiFi+MCU(M4F)

Connectivity with MCU

WiFi/BLEBridge

IoT Gateway

Environment(Temp.,Humidity, Pressure)

HRM/SpO2Gas(CO/CO2/VOC)

GestureUV/ALS Motion(Accel.,Gyro.)

eCompass

Sensors

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IoT Product Use Cases

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IoT Market: Smart Lighting

Mesh Lighting Network System

Prototyping using DK

-BLE Mesh firmware to connect lighting bulbs(up to 65536 bulbs)

-PWM driver to control R/G/B/W color tone(up to 16M color)

-APP design(iOS/Android) for group, setup, and multi-user control

-Connect to cloud via gateway for remote monitor & services

Real Case

Office Building

-BLE Mesh grouping for different rooms control

-Brightness control for energy saving

-Beacon detection for light bulb auto-on/off

-Link with sensors for environment monitoring

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IoT Market: Smart Building (Indoor GPS & LBS)

Proximity Beacon

Real Case

Prototyping using DK

-BLE Beacon firmware to broadcast iBeacon/Eddystone format

-Proximity Beacon for promotion advertisement

-GPS APP(iOS/Android) for location detection and navigation

Shopping Mall

-Location detection and goods search

-Promotion advertisement

-Beacon Mesh link for Remote Management(Battery status, On/OFF, Proximity URL Update)

-Link with sensors for environment monitoring

APP

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IoT Market: Smart Factory

Temp./Humidity BLE + MCU

Prototyping using DK-BLE Mesh firmware to connect sensors (up to 65536 nodes)

-Sensor algorithm for temp. & humidity collection

Sensor extension: motion, IR, gas, Beacon tracking

-Connect to cloud via gateway for remote monitor & services

Garment Factory-Upload sensor data(temp./humidity) to cloud for

remote monitor

-Local N2 and heater control

-Backend system for abnormal alert and reaction

Real Case

Storage Cabinet

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IoT Market: Smart Bike / Smart City

BLE+MCU

Motion

Motion Detection

BLE+MCU

HRM/SpO2

HRM/Blood Oxygen

Real Case

Prototyping using DK-Sensor Algorithm development:

a. motion sensor for security

b. HRM/SpO2

c. UV sensing and ALS lighting control

d. gesture sensing for turning light

Bike Manufacturer Demo

-BLE wireless data connect to handset & cycling computer

-APP(iOS/Android) for user identification and auto-lock/unlock

-Firmware optimization for longer battery life

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IoT Market: Smart Health Assist

Air qualityFall detectionGlucose HR/SpO2

Medical Devices

System Integrator customer’s cloud

Heart Rate

SpO2

Toxic GasBlood Sugar

Motion

Real Case

Prototyping using DK-HRM/SpO2 algorithm optimization and customization

-BLE medical profile support (ECG, HRM, Glucose)

-Wireless Bridge connect to cloud for remote monitor & services

Healthcare Center-Physiology data update to cloud for monitor, record

-Doctor remote diagnostic analysis

-Patient location and tracking

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Summary

SiP Technology – Package Level Shielding & Antenna on Package

1. ASE Group has performed R&D and investing in SiP solutions over the past 10 years. - applying package level technology to improve system board level issues

2. Two Key Areas:- Conformal & Compartment Shielding solutions- Antenna on Package (for connectivity applications)

3. ASE SiP toolbox solutions can enable a combination of improved SiP product performance, reaching lower cost vs. system board based conventional solutions

4. Time to market: SiP module solution can be plug and play, allow quick integration and minimizing initial development risks and time

5. RF Expertise: Complete SiP module design solutions

6. Certification and Final Test

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