singulus technologies - geic st_02_2018_tokyo_torsten new.pdf · singulus technologies ag february...

SINGULUS

TECHNOLOGIES

February 2018

Innovate processing systems for high performance solar cell concepts

Torsten Eisert, Director Marketing & Sales

SINGULUS TECHNOLOGIES AG

February 2018 - 2 -

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History SINGULUS TECHNOLOGIES

Foundation

SINGULUS

TECHNOLOGIES

Ernst Leybold started his business in Cologne

Company building 1860

1966 1851 1860 1967 1995

LEYBOLD HERAEUS

Vacuum Technology, Metallurgy

and Coating

Unicorn Pharmacy was founded 1600 in Hanau

W.C. Heraeus took over business in 1851 and

started with platinum

18

51

Merger

LEYBOLD / BALZERS

1995


February 2018 - 3 -

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Headquarter Kahl am Main, Germany

Production Site

Fürstenfeldbruck (Munich), Germany

France

Sausheim

Latin America

Sao Paulo

China

Guangzhou

Asia Pacific

Singapore

Taiwan

Taipeih

Legend:

Subsidiaries/Sales & Services

Headquarter

Production Site Fürstenfeldbruck

Agents

SINGULUS TECHNOLOGIES

Subsidiaries & Agents Worldwide

China

Shanghai

Worldwide Connected, Close to the Markets,

Close to the Customer Base

Semiconductor:

Over 180

systems installed

Photovoltaic:

Over 6000 MW

production capacity

Optical Disc:

Over 8.550

systems sold

Medical Technology:

Market entry 2017

First order received

Consumer Goods:

New POLYCOATER

orders received

Japan

Tokyo


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Process Overview SINGULUS TECHNOLOGIES

Thin Film Deposition

- Sputter deposition (DC, RF, MF, Bipolar, pulsed)

- Evaporation (thermal evaporation)

- CVD

- PECVD (ICP, µ-Wave) - AACVD (aerosol assisted CVD)

SURFACE ENGINEERING

- Embossing, imprint nano lithography

- Injection molding

- Functionalization

- Oxidation

- Plasma cleaning & etching

- Lacquering & bonding

Thermal Processing

- Rapid thermal processing

- Conditioning

- Annealing

Wet Chemical

- Cleaning/washing

- Etching/polishing

- Texturing

- Conditioning

- Chemical bath deposition

- Developing

THIN FILM

DEPOSITION

SURFACE

ENGINEERING

THERMAL

PROCESSING

WET

CHEMICAL


February 2018 - 5 -

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SINGULUS TECHNOLOGIES is Active in both:

Crystalline Solar & CIGS Thin Film Solar

• High cell & module efficiency

• Easy process

• Advanced technology

• Production split on different

locations (silicon, ingot, wafer,

cell, module)

Crystalline Solar

• Excellent stability

• Good low light performance

• Light soaking effect

• Reduced sensitivity to overheating

• Tolerance to shading & low intensity

CIGS Thin Film


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Test

incoming

wafer

Cleaning and

Texturing

(Wet

Chemical)

A-Si:H

Frontside

Deposition

(PECVD)

A-Si:H

Backside

Deposition

(PECVD)

TCO Front &

Backside

Deposition

(PVD)

Testing and

Sorting

Metallization

(Screen

Printing &

Annealing)

Selected Key Process- and Equipment Steps at

the Heterjunction Solar Cells Process

▲ SILEX II CLEANTEX

Cleaning and Texturing

GENERIS PVD

TCO Front & Backside ▼


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GENERIS PVD Inline Sputtering Equipment

ITO top down ITO bottom up

Gas separation

TMP


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Typical System Requirements for GENERIS PVD

- Wafer size: c-Si 156 x 156 mm2

- Wafer thickness: 120 – 200µm

- Double side deposition of ITO Indium Tin Oxide using rotatable

cathodes

-Throughput: >2.500 w/h (gross) approx 100 MW)

-Throughput: >5.000 w/h (gross) approx 200 MW

- Layer characteristics:

- Layer thickness

- Frontside: 110 nm; uniformity: +/- 5%

- Backside: 110 nm; uniformity: +/- 5%

- Target lifetime: > 15 days

- Optional: Gas separation between ITO front/back

- Temperature on substrate during process: < 200° C

- Typical process pressure: 2 - 5 x 10-3mbar

- Vacuum base pressure : 1 x 10-6mbar


February 2018 - 9 -

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SILEX II Wet Processing System for

Heterojunction Solar Cells


February 2018 - 10 -

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Wet Chemical

SINGULUS - Innovations for New Technologies

Integration of common and advanced wet process applications

Product Information Wet Processing

Cleaning

Organic Cleaning

Metal Cleaning

Surface Conditioning

SC1/SC2

Megasonic

TMAH/H2O2

O3 Application

Etching

HF

P-Etch

BOE

HCl

KOH

Metal Etching PR

Strip

Rinse Cascade Overflow

Dump-Spray System

Combination Rinse

Lift

off

Dry Spin-Rinse Dryer

Hot/Cold Air, N2 Drying

Marangoni Dryer

Coating



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New Product Development:

LINEX Inline Wet Process Equipment

Applications

• Final Clean

• SDE & alkaline texturing

• Acidic texturing & polishing

• Single side etching & PSG removal



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5 Lanes 10 Lanes

LINEX

Throughput up to 8400 wph

Lanes 5 Lane & 10 lanes

Velocity 2,5 m / min

LINEX - Basic Approach



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LINEX – Process Flow Comparison to Slurry

HF/HNO3/Additive Rinse Singozon Rinse porSi Rinse HF/HCl Rinse Hot Air Dryer

Standard process flow

Slurry -Cut

HF/HNO3 Rinse porSi Rinse HF/HCl Rinse Hot Air Dryer

DW-Cut

DW process flow



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LINEX DW – Process Results

REM microscopy – DW Texture

Supplier A Supplier B Supplier C

DW multi material of different suppliers can be texturized with our solution



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Advantage for enduser:

No Change on Existing Utility

HF/HNO3/Additive Rinse Singozon Rinse porSi Rinse HF/HCl Rinse Hot Air Dryer

HF/HNO3 Rinse porSi Rinse HF/HCl Rinse Hot Air Dryer Slurry-Cut

DW-Cut

• No Ag particle treatment needed

• No change on the existing utility for isotropic etching

• Much less disposal to be treated compared to MCCE



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Smart Solutions for High Tech Infrastructure



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Si barrier layer &

Mo Back

Contact

>Sputtering

Scribing P1 > Laser

CdS or. alt. buffer

Deposition

>Buffer Layer

Deposition Interconnect and

Encapsulation >Lamination

Glass Washing

> Wet cleaning

Scribing P2 >Mechanical

>Laser

2

7 Scribing P3 >Mechanical

> Laser

CIS/CIGS

Substrate

Inspection

Precursor

> Sputtering

Front Contact

> Sputtering

3

InS &

iZnO

> Evaporation,

Sputtering Automation

5

1 6

6

SINGULUS TECHNOLOGIES Provides all Key

Production Steps for a CIGS Fab.

Selenezation/

Sulphurization

> CISARIS Oven

4

Selen Evaporation

> Thermal evaporation



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Innovative Large Sputtering Systems for CIGS

Thin Film Modules

• Integrated power supply design

• No carrier return system necessary

• Fully vertical substrate transport

• Special designed carrier transport system

• Load and Unload of substrate from the same side of the machine

• Usage of rotatable cylindrical magnetrons for highest utilization of target material

• Temperature processing before and during deposition available

• Gas separation by dynamic slit valves and/or by individual lock chambers



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SELENIUS Vacuum Evaporation System for

CIGS Thin Film Modules

• Inline evaporation tool with high throughput capability

• Optimized utilization of evaporation material through unique chamber design

• High deposition rate and repeatability

• Excellent flux uniformity

• Excellent temperature uniformity during process sequence

• Substrate Pre-Heating

• In-situ monitoring of flux and temperature



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CISARIS Selenization - Innovative Production

Equipment for CIGS Manufacturing

• Rapid heating (up to ∼ 4 °C/s) of large substrates with metal precursor coating (CIG)

• Homogeneous gas distribution and low gas consumption Introduction of H2S & H2Se

gas at various stages Uniform heating of large substrates up to 550 °C

• Uniform cooling of the substrate to avoid glass warpage

• Excellent temperature control (mean variation < 5 °C) at all process stages



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Deposition of Buffer Layer for CIGS Modules

• Standard reference process: highest efficiencies and low risk

• More than 150 process modules in production

• Minimized chemical consumption

• Single side deposition incl. protection against backside contamination

• Modular system (easy upgrade for higher throughput)

• Reproducible process results

• Automatic dosage and mixing system

• Deposition systems for cadmium-free buffer layers



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Contact


Hanauer Landstrasse 103

D-63796 Kahl/Main

Dr.-Ing. Stefan Rinck, President and CEO

Tel: +49-6188-440-109

[email protected] Markus Ehret, CFO

Tel: +49-6188-440-204 [email protected]

Maren Schuster, Head of Investor Relations

Tel: +49-6188-440-612

[email protected] Bernhard Krause, Communications Worldwide

Tel: +49-6181-9828020

[email protected]

Forward-Looking Statements

This presentation contains forward-looking statements

based on current expectations, assumptions and forecasts

of the executive board and on currently available

information. Various known and unknown risks,

unpredictable developments, changes in the economic and

political environment and other presently not yet

identifiable effects could result in the fact that the actual

future results, financial situation or the outlook for the

company differ from the estimates given here. We are not

obligated to update the forward-looking statements made in

this presentation unless there is a legal obligation.

singulus technologies - geic st_02_2018_tokyo_torsten new.pdf · singulus technologies ag february...

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