size matters bare die small solutions for the information age
TRANSCRIPT
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SizeMatters
Bare DieSmall Solutions For The Information Age
ES Components108 Pratts Junction Road
Sterling, MA 01564978-422-7641
www.escomponents.com
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Great! We've got your attention.So what's next?
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Are you using standard semiconductor packaging?
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Are your design engineers challenged with shrinkingspace and expanding functional needs?
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If the answer is yes...
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Then you need to use unpackaged Bare Die.
Motorola CX68EN360RC25B Quad Communicator Controller
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Why?
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Because the design engineers will have opportunities for more efficient use of limited space.
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What else you say?Well, how about...
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Think SmallSmall Solutions For The Information AgeBare Die
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Unpackaged Bare Die...
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Improves electrical performance.
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Gives better signal integrity.
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Has higher levels of integrationwith reduced weight and height.
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Can be used in wire bondapplications.
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Can reduce space consumptionby greater than 50%
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Okay, take a break.Take a deep breath.
This is a lot to absorb.There's more...
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Okay, time to recap.
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Electrical Performance
Size and Weight
Reliability
Lower Cost of Ownership
The main application drivers:
Unpackaged Bare Die
The lower inductance and capacitance of bare die is important in analog, RF, and powerapplications. Signal propagation and power/ground distributions are also improved.
Improvements vary based on the current packaging in use.
The reduced number of interconnects with die use leads to improved reliability. The typicalpackaged part has three connection points per 1/O. Compare this with only two for wire bonds.
This is most notable in high volume applications where density is required and high yield silicon isimplemented. The lower cost of ownership takes into consideration sustrate, assembly, system test,equipment utilization, rework, and increased product value. In addition, the cost of a die product istypically lower than the package equivalent.
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Just a bit more...
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We want you to remember...
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Promote:
Higher levels of integration using existing products.Lead to increased functionality per square area, and reduce costs.Performance improvements are achieved with no additional cost penalty.Integrating bare die for SIP (System-in-Package) solutions provides a benefitover both standard package solutions and SOC (System-on-Chip) solutions.
The Bare Die Advantages
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Finally...
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SizeMatters
ThinkSmall
Bare DieSmall Solutions For the Information Age
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Need more information?Glad to help.
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ES Components
Call978-422-7641
For more informationtES Components
108-Pratts Junction RoadSterling, MA 01564
www.escomponents.com