slides metal finishing
TRANSCRIPT
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Metal FinishingContents
Theory of electroplating
Polarization, decomposition potential & overvoltage
Characteristics of a good deposit
Factors influencing the nature of deposit
Methods of cleaning the metal surface
Hard chromium & decorative chromium plating
Electroless plating ! Copper plating
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Learning Objectives
E"plain the theory of electroplating & factors affecting it
#ifferentiate electroplating & electrolessplating
#escri$e the methods of cleaning the metal surface
#iscuss the characteristics of a good deposit
%llustrate electroplating process of Cr & electrolessplatingof Cu
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Process of deposition of an adherent metallic
film of a no$le metal on a $ase metal orpolymer surface
Technological Importance
Methods of Metal finishing
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ELECTROPLATI!
Process in hich a thin layer of coating metal is deposited on a $ase
metal $y passing d'c' through an electrolytic soln', containing the
solu$le salt of the coating metal
Theor" of electroplating# (node, cathode, Electrolyte, #irect current
Mechanism of electroplating$ Three steps
%& '(l) diff(sion$ Mn* +b(l), Mn* +s(bstrate,
-& Atomic la"er formation$ Mn* *ne. Mad
/& Macro.deposition$ Mad * M +atoms, Ms(bstrate
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0chematic of electroplating bath
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Factors Governing ElectroplatingDecomposition otential !D.."
olari#ation
$vervoltage
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1ecomposition Potential Minim(m e2ternal potential at 3hich the electrol"sis c(rrent
begins to increase appreciabl" 4 contin(o(s electrol"sis sets in is
)no3n as decomposition potential of the electrol"te& Meas(rement
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Factor affecting 1P)trength of the current floing through the cell
Chemical nature of the electrodes
Physical nature of the electrodes
(ctivity of the electrolyte
($solute temperature
*ses of #P
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Overvoltage
#ifference $eteen the actual applied emf to $ring
a$out continuous electrolysis & the theoretical emfneeded for such electrolysis'
Factors affecting overvoltage$
+ature & physical state of the electrodes Current density
Temperature
+ature of the electrolyte +ature of the material deposited
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Polari5ation
EMF reuired for the electrolysis ill $e greater than the reversi$le
EMF of the corresponding galvanic cell' (n electrolytic cell thatreuires e"cess voltage over the theoretical is said to $e polarized &
the phenomenon is called polarization'
Concentration polari5ation
6inetic polari5ation
Factors
%mportance
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Characteristics of a good deposit7 should $e $right & lustrous
- should $e uniform, nonporous & have good adhesion
should $e hard & ductile
should have fine grained structure
Factors affecting the nat(re of deposit$
Current density
Metal ion concentration
Temperature
pH(dditives
Throing poer
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Methods of cleaning the metal s(rface
Physical cleaning
Chemical Cleaning
Mechanical Cleaning
Pic.ling
Electropolishing
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Electroplating of chromi(m
#ecorative coating Hard coating
/ath composition Chromic acid 0123 g4 5
H1)6701'2 g4 5Trivalent chromium08g4
Chromic acid 0123 g4 5
H1)6701'2g45 Trivalentchromium08g4
6perating temp' 98991: ; 98991: ;
(node %nsolu$le P$)n alloy %nsolu$le P$)n alloy
Cathode (rticle to $e coated (rticle to $e coatedCurrent density 1373 m(
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Electrolessplating
Method of depositing a metal film on a su$strate surface
0conductor
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Electrolessplating
Advantages
More uniform coating ith $etterTP than electroplating
Electrical poer & other
accessories not reuired
Coating is harder & $etter earresistance
#eposits have compati$le
etta$ility
)uperior uality deposits
(dditives, levelers or thecomple" filtration method not
reuired
)imple euipment sufficient
Disadvantages
Cost of aste treatment high Freuency of dumping
electroless $ath high
Costs per unit eight of the
deposited metal are more +eeds pure chemicals
Chemical reductants e"pensive Metal salts & reductants are
thermodynamically not sta$le
%mpurities, dust or colloidal
particles promote decomposition
of $ath components
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Electroless plating of Copper
1%
* Coating sol+tion , C+$4 soln
* e/+cing agent , 0C0$
* +er, a$0 ochelle salt* Compleing agent, ED67 /i so/i+m
salt
* $ptim+m p0, 11* $ptim+m temperat+re, 25 8C
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Comparison of electroplating 4 electroless platingParticulars Electroplating Electrolessplating
#riving force Electrical energy #ecrease in free energy of theredo" reaction
Cathodic ?eaction Mn5 5 neM Mn5 5 neM
Cathode (rticle to $e plated (rticle to $e plated ithcatalytic surface
(node )eparate anode ?educing agent in the soln'
+ature of deposit Pure metal or alloy Metal ith reducing agent &o"idized products asimpurities
Thic.nesslimit
0@m4
8 833 8 ! 833
(pplica$ility (pplica$le toconductors only
Can $e used for conductors &nonconductors
Throing poer0TP4
Aess TPB cannot $eused for irregular
shapes & intricate
More TPB can $e used forirregular & uneven shaped
o$ects 1&
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0(mmar"
Metal finishing $y surface modification is an important aspect of
various engineering applications
Commonly used metal finishing techniues include electroplating &
electrolessplating
Theory of electroplating, electrolesssplating & the factors
influencing electroplating are discussed
Electroplating of chromium & electrolessplating of copper areillustrated
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?evie Duestions 8' hat is electroplating #iscuss the steps involved in
electroplating
1' #escri$e the various purposes & applications ofelectroplating
9' #efine polarization' Aist the factors that affect it'
7' E"plain the effect of the folloing on the nature of thedepositB i4 current density ii4 pH iii4 metal ion concentration
iv4 throing poer
2' Mention the characteristics of a good deposit
=' Give reasons i4 Concentration polarization can $e
minimized $y constant stirring of the electrolyte ii4 #P of
ater is more than that reuired for its formation
1(Metal Finishing - Dept. of Chemistry