smart systems integration - advancing 3d system...

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Dr. Markus [email protected]

www.maristechcon.com

Smart Systems Integration -Advancing 3D system integration and

miniaturization

Markus Riester

March 25, 2009

MIT Europe Conference 2009March 25/26, 2009

26. March 2009, 2, Markus Riester

Agenda

• What is Smart Systems Integration, what is a Smart Integrated System?

– Definition, Attributes, Markets & Applications

– What does a Smart Integrated System do?

• How do you build Smart Integrated Systems?

– Technologies for building Smart Systems


What is Smart Systems Integration ? What is a Smart Integrated System ?


Smart Systems Integration -Semantic analysis

• Smart

(1) Skillful, adroit in using hands or body

(2) mentally quick and resourceful

(3) Marked by wit or ingenuity

(4) Easy to use or handle

• Systems

– a group of devices or artificial objects or an organization forming a network, especially for distributing something or serving a common purpose

• Integration

– the act or process or an instance of forming, coordinating, or blending into a functioning or unified whole

With support of


Smart Systems Integration

• search: first 30 entries

Smart System Integration Annual Conference

European Technology Platform


Smart Systems –Bridging the gap

SoftwareComponents

Products

Smart Systems

autonomous

efficient

robust

usable

Materials Tools

Smart Systems in the Value Chain

Schymanietz, SSI09, Brussels, March 10/11, 2009


Attributes of Smart Integrated Systems

• Integrated systems, which are able to sense and diagnose a situation and to describe it

• Mutually address and identify each other

• Are predictive and are able to decide and help to decide

• Operate in a discreet, ubiquitous and quasi invisible manner

• Utilise properties of materials, components or processes in an innovative way to achieve more performance and new functionalities

• Are able to interface, interact and communicate with the environment and with other Smart Systems

• Are able to act, perform multiple tasks and assist the user


Intelligent and cognitivesystems

Smart Systems Integration• mechanistic, technology

driven view on integration

and miniaturization

Intelligent and cognitive systems(i.e. EU FP7 ICT-2007.8.5 programme) go beyond SSI and use

technology to create evolutionary self-optimizing systems

Short/Mid term Long term


The evolution of Smart Systems

2nd generation

Smart Systems

3rd generationSmart Systems

Integrated, miniaturised systems

with advanced functionality.

Predictive & reactive systems matching harsh environments andequipped with advanced energy

management capabilities.

Self aware, autonomous systemsinterfacing physical w/ virtual world,

adaptive to environment, ubiquitously connected, with cognitive abilities

1st generationSmart Systems

Functions Complexity


The Evolution of medicalelectronic systems

Paul Galvin, Nanobiogroup, Tyndall National Institute, Cork


Medical application: Ambulatory EEG monitoring

Chris van Hoof© IMEC 2009

1cm3

8-Channel EEG


The evolution of aeronauticssystems

Airbus A380 (2007)

Wright (1903)

(many steps)

(still more steps)

Daedalus (1987)


Application of AbandonedSensor

Antenna 1

An

tenn

a 2

An

ten

na

3

diagram at time Ti

diagram at time Ti + 1

© 3D Plus


Application of Tire-Pressure Monitoring Systems (TPMS)

Today’s rim mounted TPMS: ~60cm³

Future self-sufficient tire mounted TPMS: <1cm³


Main challenges for Microsystems and smart miniaturised systems

1. Multiple research fields to combine

– Mechanics, electronics, fluidics, biology, magnetism, photonics

2. Multiple materials need to work side by side

– Semiconductor, ceramic, glass, organic

3. Multiple functions to integrate

– Sensing, processing, logic, memory, communication, actors

4. Multiple integration options towards Heterogeneous Integration

– Monolithic, hybrid, multichip, …

Budapest ICT Proposers’ Day 2009 – 22-Jan-09 – Griet van Caenegem


Smart Dust

Warneke, Last, Liebowitz, Pister (2001)Stanislaw Lem (1964)

University of California, Berkeley: Smart Dust (Motes), Tiny OS, Picoradio

IZM: eGRAIN, AVM

IMEC: System in a Cube e-Grain

NMRC, Irland: I-Seed

VTT Electronics: SoapBox

ETH Zurich: Smart Its


Swarm intelligence

I-Swarm, EU FP6 Project #507006


Who needs smart integrated systems?


EPoSS application space of smart systems

Automotive Aeronautics MedTech

Information &

CommunicationIoT / RFID Security

• Infrastructure

monitoring

•Communication/

Networks

•Safety functionalities

•RF solutions

•Sensors integration

•Autarkic ad hoc

sensor networks

•Autonomous power•Security, privacy

•Health & in-vivo monitoring

•Assisted therapy

•assisting the inde-

pendence of living

•Network technology &

infrastructure

•Wireless access

networks•Power management

•Wireless

•Autonomous sensors

•eCorner

•Energy efficiency

•Smart actuaction

•HMI

Key Technologies

•Materials &

processes

•Micro & Nanoscale

devices

•Packaging

•Methodologies &

design tools

•Manufacturing aspects

•Biometric

technolgies

• Infrastructure

security•Safety


Applications of Smart Systems

Source: EPoSS Strategic Research Agenda, 03/09


European NanoelectronicsInitiative Advisory Council

• The technology behind the curtain of Smart Systems

Application Environments

System Integration

“Heterogenous Integration”

More Moore

Nanoelectronics

↑

Microelectronics

More than Moore

(Nano) Electronics +

Sensors & Actuators(e.g. Opto-/ Biotechnology)

Requirements

Technology

SoCMicro

Systems

Macro

Systems


How are Smart Systems integrated?


Electronics Value Chain


Advancing 3D Integration & Miniaturization

Printed Circuit Board

Assembly

Packaging

Key Manufacturingtechnologies

Key Manufacturingtechnologies

Methodologies & design tools

Semiconductor

Test


Advancing 3D Integration & Miniaturization

Optics & Photonics

RF

Energy

Surfaceengineering

Technology domains

Technology domains

Human machineInterfaces

Communicationnetworks

Printedelectronics

Logistics & Supply Chain

Materials & processes


JISSO – the total packagingsolution

Jisso is Japanese and stands for

Total solution for Interconnecting, Assembling, Packaging, Mounting and

Integrating system design.

Supports and encourages

• standards development at an international level

• the development of technological roadmaps

• addressing environmental issues

• monitoring of market trends.Source: jisso.ipc.org


Be SMART about Integration

Product life cycle

Higher Integration, lower cost, lower complexity


Advancement through higherintegration

Power 65Transceiver 86Total 151

Power 54Transceiver 49Total 104

Parts count

Parts count reduced by 1/3 on same area, with increased functionality.


Semiconductor – More Moore


Silicon integration vs. packaging

Source: IBM, Intel


Pushing the limits of integration

High Density

Interconnect Board

High Density

Interconnect Board

3D Integration3D Integration Embedded ActivesEmbedded Actives

OpticalInterconnectsOpticalInterconnects

Integrated

Heat Sinks

Integrated

Heat Sinks

MEMS

Components

MEMS

Components

Integrated

RF Components

Integrated

RF ComponentsIntegratedPassivesIntegratedPassives

Power

Converter

Power

Converter


Pushing the limits of packaging

Chip-on-Chip

Wire

bonding

Edge connection

Bus metal Bus silver

epoxy

Wafer Level Stacking

Rebuilt Wafer

to Rebuilt

wafer

Wafer to wafer

Thru-Polymer Via

« TPV »

Thru-Si Via

« TSV »

- Amkor- ASE- STATS

ChipPac- … - 3D Plus

- Irvine Sensors - VCI - IBM- INTEL- ST Micro- Micron- Toshiba- Tezzaron- Ziptronix- Samsung- …

- 3D Plus- Amkor

Amkor

Fraunhofer IZM

Fraunhofer ENAS

3D Plus


Wirebonding

• Proven technology, widely implemented

Fraunhofer IZM


3D Wafer-to-Wafer or Chip-to-Wafer Technologies

Through Si Via

(TSV) Technology

with CVD-Cu or

ECD Cu

72 µm

AR: 20 : 1

High aspect ratio

Si etching

Schematics of ICV (TSV) technology (FhG IZM Munich)


Shrinking Silicon Packaging

~ 10 µm> 200 µm

sealing layercontact padseal glass

capping wafer


PoP and WDoD

© 3D-Plus SA

Wireless Die-on-Die

Thickness per layer 100 µm

Rebuilt wafer with KGD

Package-on-Package

Thickness per die 100 µm

+ solder + package


3D-Plus: WDoD Concept

Val, Smart Systems Integration 2009

© 3D-Plus SA

Wireless Die-on-Die


Printed circuit boards

Legacy Circuit Boards

• Substrate on which components canbe assembled

• Wiring by wires or etched copper

State-of-the-art Circuit Boards

• Integrates functionality of hosting

components on and inside the board

• Substrate technology for smart systems

Historical Circuit Board, 1958 , © IBM Archives


3D-PCBsMolded Interconnect devices

Motorcycle handle switch, Kromberg & Schubert

Duromer MID Package Schematic


Embedding IC in PCBs

Cross section of a single stack package

via to board metallization

solder ball

filled through

hole

embedded chipand via to chip pad

build-up layer

0.5mm FR4 board Stack of 4 single packages

A. Ostmann, R. Aschenbrenner, et al. IZM Berlin


Embedded discrete components

• Copper interconnect to component

• Excellent Rf properties

• Excellent properties regarding mechanical shock

– Capacitor 47 nF 0402 size ESD circuit WLCSP


Ultrathin Flip Chip Interconnects

Ultra thin contacts (∼∼∼∼10 µm) Ultrathin IC (1,5 µm)Courtesy NXP+Philips

Ultrathin

PI Substra

te

(10-50 µm)

10 µm50 µm

650 µm

Std. solder contact (80 µm)

so

lde

rA

CA

B. Pahl, Ch. Kallmayer, R. Aschenbrenner, IZM-Berlin


Folded Flex-PCB Integration


Textile Electronics


Printing Electronics

http://en.wikipedia.org/wiki/File:ComplementaryTechnologies.png


Methodologies & Design Tools

• Specific Electronic Design Automation (EDA) tools forindividual technology domains exist

– Technical design decisions are supported in one technicaldomain

• No tool integrates knowledge accross domains!

• „Expert-system“ decision support for engineers desirabletaking into account all levels of integration!

�Room for R&D


Example:Mobile Phone Electrical Design

Origin

Korea

Japan

1 2 3 4 5

#PCBs in phone


Example:Mobile Phone Layout comparison

Japanese vs. Korean layout, single board designs


What was not covered?

• Many other smart packaging methods and smart technology options

• Testability

• Manufacturability

• Reliability


Reliability is critical

T

N

Nf

Reliability inexperiment

°C125

0-40

T

N

NfT

N

Nf

Reliability inexperiment

°C125

0-40

°C125

0-40

SimulationSimulation

ε ε ε ε cr

Deform

Creep

Strain

ε ε ε ε cr

Deform

Creep

Strain

Material

characterisation

Experiment

Material

characterisation

Experiment

Lifetime prediction

Failure analysis

T

N

T

N

T

N

Material Modells

verification

Lang, Fraunhofer IZM


No matter what you do:Yield the Yield!

Process Yields

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

0 1 2 3 4 5 6 7 8 9 10 11 12 13

Deviating processes

Overa

ll Y

ield

99,9

99,5

99

98,5

95

90

85

80

© maris TechCon


Degrees of smartness

Technicalcapability

Wisdom/ Experience

Needs

Financialbackground


Acknowledgements

• Stefan Rohringer, Infineon Technologies, AT

• Hannes Stahr, AT&S, AT

• Emil List, NTC Weiz, AT

• Klaus-Dieter Lang, Rolf Aschenbrenner, Fraunhofer IZM, DE

• Klaus Schymanietz, EADS, DE

• Sebastian Lange, VDI/VDE-IT, DE

• Chris van Hoof, IMEC, BE


Thank you for your kind attention

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