Smart Systems Integration: Challenges, Opportunities, and the Role of EPoSS (European Technology Platform on Smart Systems Integration)

1

MICROTECH 2011Boston, 16th June 2011

Salvo CoffaGroup VP, R&D General ManagerIndustrial & Multisegment SectorSTMicroelectronics

Ultra low power

Smart Systems Definition

2

Harvesting Device (PV, Piezo, etc)

Wireless Transmission : RF low power, ZigBee

Sensors Analog Front End, Back End

Energy Storage :Supercap, EnFilmBatteries

Low power digital processing

Power Management

Power Actuators : SiC, GaN, Power MOSFET, IGBT

Value Chain for Smart Systems Integration

Advanced Technologies

Final products/ applications

System solution know-how

DC/DC ConverterInverter

Electric Motor

Battery

3

Emerging Applications Require Smart Integration

4

More than Moore

Moo

reLa

w

Bas

elin

e C

MO

S :

CPU

, Mem

ory,

Log

ic

BiochipsSensorsActuators

HVPowerAnalog/RF Passives

130nm

90nm

65nm

45nm

32nm

22nm...V

130nm

90nm

65nm

45nm

32nm

22nm...V

Information Processing

Digital content:System-on-Chip

Interacting with people and environment

Non - Digital content :System-in-Package

Beyond CMOS:Quantum Computing, Molecular ElectronicsSpintronics

SiP

SoC

Small PCB percentage reduction via Moore LawPCB still busy mostly with bulky passive and discretesSmart Integration pass via mix of SoC and other enablers

System-on-Chip

Advanced packaging & System-in-Package

3D HeterogeneousIntegration/ TSV

Flexible ICs

Innovation and new conceptsSilicon technology scalingNew materials and processingApplication driven (or drives new applications)

Advanced CMOS, BCD technologies

SiC & GaNnew materials

MEMS & Sensors technologies

Ultra low powertechnologies

Harvesting & Thin Batteries

5

Smart Systems Go Far Beyond

Smart Systems require thinking beyond the Chip!

Internet of Things

Mobility

Medicaloffer new sophisticated functionalities which replace entire perceptive and cognitive human functions

are energy autonomous and interact in a wireless environment whenever possible

reach a level of complexity which requires new processes and set new challenges of robustness and reliability

6

Systems approach

Integration approach

Multi-materials approach and multi-technology approach

The Smart Systems Characteristics

7

Example

Source: Sensimed, STM

Entering the world of visionSmart monitor for intraocular pressureSmart lens, containing passive and active strain gauges Output signal sent wirelessly Adhesive Antenna

Non-invasive and convenientMonitoring IOP continuously up to 24 hoursAmbulatory or in-hospital useRecording during sleep and normal activities

8

Integration at systems level: realization of miniaturized systems

Integration into the macro-system

Integration into the application environment

Forming an interface for bridging orders of magnitude

Bridging the Gap from the Component to Product

9

Emerging Applications Require Smart Integration

Smart systems integration is penetrating a series ofindustry sectors, bringing many market opportunitiesand a broad-based manufacturing infrastructure.

Smart systems are used in various applications,ranging from low-cost, high-volume automotiveapplications to high-cost, low-volume instrumentationapplications.

10

Smart Systems will enable technology breakthroughs that providesolutions for health and aging, and sustainable mobility, safety &security, communication and ambient intelligence by

giving intelligent, self-controlled, and adaptable functionalities tothe userimproving products through optimization of the overall systemthat exceeds the sum of its componentsactivating the immense potential of new materials and solutions,e.g. functional materials, cognitive capabilities, microtechnologies, nano-effects, composite layers, nanosizedelementsredefining the interaction between the person and technologythrough new solutions for the human-machine interface (HMI).

Smart Systems in the varies application areas help to improve energy& resource efficiency, sustainable consumption and production

11

Driver Status Monitoring Piezo Injection Valve

Smart PillSmart ImplantsImplantable glucose fuel cells

Autonomous (Bio)-RobotSwarming AgentInternet of Things

Examples

2nd generationSmart Systems

3rd generationSmart Systems

Integrated, miniaturized systems with advanced functionality.

Predictive & reactive systems matching harsh environments andequipped with advanced energy management capabilities.

Self aware, autonomous systemsinterfacing physical w/ virtual world, adaptive to environment, ubiquitously connected, with cognitive abilities

1st generationSmart Systems

Functions Complexity

The Evolution of Smart Systems

12

Give a voice to the European Smart Systems Community

Promote Smart Systems R&D involving new disruptive technologies and leading to innovative marketable products

Address areas of economic and societal relevance

Provide roadmaps and Strategic Research Agendas

Contribute to competitiveness of European industry, esp. of SMEs

The EPoSS Rationale

13

Next Milestones

1. Enlarging the range of action

Improve the presence and influence of EPoSS, e.g. in the European Green Cars Initiative, Factory of the Future, Future

Enlarge the range of networking within the European policy

2. Driving the new EPOSS SRA 2011

Identifying new application challenges, e.g. robotics

Defining development paths at technology and systems level

Clear demarkation towards other interest groups and ETPs and elaboration of a unique EPoSS approach

Estimation of markets and added value of Smart Systems production

14

3. Setting the stage to Framework Programme 8 (a)

15

3. Setting the stage to Framework Programme 8 (b)

Content:Translating SRA priorities into policy priorities within FP8

Instruments:Defining research policy instruments according to industry requirements: Strategic industrial research

16

17

Moving Forward : From Traditional to Emerging Applications

3D Heterogeneous Integration and TSV

18

Vertical stacking and connection of various materials, technologies and functional components together :

Bio, MEMs and other SensorsDigital processing (MCU, MPU)RF transceivers for data transmissionMicro-battery (i.e.Thin Film)

Other analog ICs & mixed technologies

Integrating multiple functions via 3D/ TSV

Integrated multi-functionality More interconnectionsReduced power consumptionSmaller packaging Increased yield and reliabilityReduced overall costs.

Advantages

Through Silicon Vias (TSV)

TSV example for IPADSilicon Vias microscopic detail

19

CPUs

lamination

lamination

AM Optical Scanfrom back side

Flex Drivers with Touch

Smart Systems on Plastic Foils

Application fields-User interface (e.g. e-book)--Energy (eg. flexible solar cells, microbatteries)-

Remote Monitoring

20

Standard Medical Equipment

ImagingPositron Emission TomographyUltrasound ScannerNuclear Magnetic Resonance

Portable Healthcare Systems

Remote Patient Monitoring

Drug Delivery Systems

Fitness Systems

PET Scanner

Flexible Eye Lens IC for Glaucoma

Insulin Nano Pump3D Ultrasound Machine

MEMS Micro Electro Mechanical SystemsWide MEMS portfolio at ST :

AccelerometersGyroscopesFunctional Sensors

Drug Delivery Systems Example with ST MEMS Microtechnologies

21

MEMS-based Insulin Pump for Diabetes For subcutaneous infusion of insulin :

Accurate delivery of insulin 150nl (0,02U)Reproducibility ± 2% close to physiological insulin delivery Pressure sensor and error detection to prevent malfunctions Small-sized system for discrete wearability

A Complete system for blood analysis , insulin delivery and wireless connection

3D-4D Ultrasound Scanner for Advanced Echographs with TSV Integration

22

HV Switch Transducer Array for 3D-4D Scanners

(BCD6/SOI technology)

TSV integrationAllow back vertical connection between HV transducer array and ASIC for processingIdeal for array transducer packaging

3D Integrationtransducer array

ASIC (TSV)TSV

2D 3D

3D enhancement vs. 2D scanner

Applications for Remote Patient MonitoringSmart Sensors and Smart Integration (iNemo)

23

Wireless TransceiverBT, Low Power RF, ZigBee®

Data Storage

Data processing

Analog FE/BE

SensorsMEMS AccelerometersGyroscopesMagnetometersPressureTemperature

Thin Film Battery

ST iNemo Node for diagnostics

iNemo Today Discrete board - 30cm2

iNemo 2011SiP Integration - 50 mm2

Parameter Monitoringblood pressure, heart bit, temperature, fitness values

Patient Treatment (i.e. Insulin)Wireless Transmission of DataBattery operated

Portable Distributed Diagnostic Units example

Inertial Units for Fitness Monitoring Systems

iNEMO : Inertial Measurement Unit

Extended Connector for external module (i.e.Wireless

Connectivity)

Data Storage uSDEMIF06-MSD02N16

STM32F103R

MEMS 3xACCELEROMETER3xMAGNETOMETER

MODULELSM303DLH

MEMS GYROSCOPE

LY330ALH

TEMPERATURE SENSOR

STLM75DS2F

MEMS PRESSURE SENSOR

LPS001DL

MEMS GYROSCOPE

LPR430AL

POWER MANAGEMENTLD3985M18RLD3985M33R

USB CommunicationUSBUF02W6

*

**

*Only GPI/O and connector available ** Any Firmware available

The perfect integration and complementarity of STsensors is demonstrated by the (inertialmodule) system-on-board, giving you, for the firsttime, 10 degrees of freedom

10 degrees of freedom (DoF) inertialmeasurement unit opens the way to newapplications

Digital temperature sensor

6x geomagneticmodule

Pressuresensor

MEMS gyroscope

MEMS gyroscope

STM32MCU

24

From Disposable Sensors to Disposable Systems

25

26

Contact Lens Sensor for Glaucoma Detection

The complete system include:- Contact Lens- Antenna and data-cable- Recorder- Software

Non-invasive solution for continuous monitoring of intraocular pressure.

A Beat Forward in Remote Monitoring

Care Server

User / Doctor PC

User set-top-box

BodyGateWay Mobilephone

Internet

scale

cuff

DUN profile

SPP profile

Integrated Remote Monitoring Solution for Advanced Telemedicine

Platforms

STM32

Bluetoothmodule

+1.5-3V-

Energymanager

3.3 V

2.8 V

LED

16Mbit Flash

I2C

SPI1

USART3

ADC

input output

ST Components

ECG-Impedancefront-end

Temperature I2C

PWM

3axis accel.

1Gbit Flash

µBUSMicrophoneOptical FE ADC

PWM

27

28

Hybrid Electric TractionMotor DriversPower conversion Battery-Cell Management Fast Battery Charger

Photovoltaic Panel Converters

Smart GridSmart Energy MeteringSmart Appliance PlugPower-Line Modem

Thin-Film Flexible Batteries

UPS

SiC Power-Transistor applicationsIdeal for power conversion in high voltage, high

temperature, high frequency applications

Server & ConsumerHybrid Electric VehiclesPhotovoltaic, Wind TurbineMotor ControlUPS

Innovative Power Transistors with New Materials Enabling Smart System : Silicon Carbide

SiC propertiesExcellent switching behavior : low reverse-recovery current and charge radically decreases switching losses at higher switching frequenciesIncreased efficiency and power density in SiC Schottky diodes and soon in MOSFETs

29

Electric Cars Servers

Integrating Materials and Solutions for Photovoltaic Energy

... products and solutions for power conversion in PV

Innovating to increase high-conversion efficiency ICs and compact solutions

Boost converter with Maximum Peak Power Tracker IC (MPPT) DC/DC & DC/AC converters for stand-alone and grid-connected systems

Si Quantum DotsIncreasing PV efficiency Nano StructureEfficiency: 20% (2015 )

Micro Crystal-Si Available technologyMicro Structure

Efficiency: 8.5 %

30

31

Sensor Networks for Building Automation

Smart Meters for Grid Connection

Home Automation through Advanced Wired (200 Mbit/s) and Wireless Connectivity

Smart Modules for Robotics and Industrial Automation

Harvesting in Smart Systems An Example in Wireless Sensor Nodes for Automation

32

Autonomous Wireless Sensor Node

Harvesting Device (PV, Piezo, etc) Low Power

RF Transceiver

Sensors

Ultra Low Power

Microcontroller

Energy Conversion

Battery Storage

Integrating Harvesting in Smart Systems

Courtesy EnOcean Alliance

Solar

Thermal

Wind

RF

Kinetic

Electro-chemical

Energy

Enabling wireless sensors for energy autonomy

Rechargeable Solid-State BatteriesA Key Element in the Smart System Chain in WSN

33

Innovation in Power Technologies

34

Advanced Packaging & System-in-Package

3D Heterogeneous Integration/ TSV

Advanced BCD, BCD-SOI

Si Power Transistors & Compound: SiC & GaN

Ultra Low Power Technologies

Harvesting and Thin-Film Batteries

Innovative Wire Bonding

Cutting Power losses throughPower Discrete Technologies

Higher Efficiency through Smart Power ICs

Improved Power Efficiency Through Better Technologies

35

1995

PowerMESH SuperMESH

-20%today

-82% -90%2000 2005

1995 today Coming Soon

PlatinumImplantation

ElectronIrradiation

Trench /FieldStopEmitter Implant

-50%-30%

STripFET STripFET IIISTripFET VIDeepGATE

1995 today2006-30% -80%

The Current Challenge: the Use of Compound Semiconductors (SiC and GaN) in Power Electronic

Much better performances expected (and already demonstrated) based on their electrical properties:

Breakthroughs in SiC crystal growth and GaN epitaxy on Si have been achieved recently

SiC and GaN are the next technology node for power conversion

ST is working on them at R&D level since many year and is already producing SiCSchottly diode

0.1

1

10

100

1000

100 1000 10000

Ron

Area

(mO

hm*c

m2 )

Breakdown Voltage (v)

MD5Si  IGBT

Si  SJ  

SiC MOSFET

36

Power devices in new materials (SiC, GaN)

SiC Power Schottky (in production)SiC Power MOSFET (product prototype)

GaN on Si HEMTs (product Prototype)

37

Smart System for Power Efficiency: Power Modules

IPM Hi End Power Modules

38

39

Smart Systems Have a Bright Future

efficiency

Growing ULP demand in:Portable electronicsHealthcare Portable MonitoringMedical Disposable DevicesPersonal Fitness, Sport and WellnessWireless Sensors Networks (WSN)i.e. in Building and Factory Automation, LogisticEnergy Harvested Systems (EHS)

Thank you very much for your attention!