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*Customer:
SPECIFICATION
ITEM TOP LED DEVICE MODEL SSC-MFT722N-S
[Contents]
1. Features ------------------------------------------------------------- 2 2. Application ------------------------------------------------------------- 2 3. Absolute Maximum Ratings ------------------------------------------ 2 4. Electro-optical Characteristics ---------------------------------------- 3 5. Rank of MFT722N-S ---------------------------------------- 4 6. White balance Color Rank -------------------------------------5 7. Soldering Profile ---------------------------------------------------- 7 8. Outline Dimension ---------------------------------------------------- 8 9. Packing ----------------------------------------------------------------- 9 10. Reel Packing Structure ------------------------------------------- 10 11. Lot number ------------------------------------------------- 11 12. Precaution for Use --------------------------------------------------- 12 13. Characteristic Diagram ---------------------------------------- 13
CUSTOMER
Checked by Approved by
SUPPLIER
Drawn by Checked by Approved by
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 1/13 -
SSC-MFT722N-SSSC-QP-7-03-08(REV.00)
1. Features Pb-free Reflow Soldering application
RoHS Compliant
Material : InGaN(Blue) / InGaN(Green) / AlGaInP(Red)
6-Pin (R,G,B separate) type
Suitable for all SMT assembly methods ; Suitable for all soldering methods
White colored SMT package and colorless clear window
Encapsulating Resin : Silicon Resin
2. Application Indoor and outdoor displays
LCD Backlights etc.
R G B – displays
Automotive
Signage and Channel letter
Indicator
3. Absolute Maximum Ratings *1 (Ta=25ºC) Value Parameter Symbol
Red Green Blue Unit
Forward Current IF 30 30 30 mA Forward Peak Surge Current *2 IFM 100 100 100 mA
Reverse Voltage (per die) VR 5 V 81*3 120*3 114*3
Power Dissipation Pd 263*4 mW
Operating Temperature Topr -40 ~ +100 ºC Storage Temperature Tstg -40 ~ +100 ºC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. *3 The value for one LED device.(Single color) *4 The value for total power dissipation when two and more devices are lit simultaneously.
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 2/13 -
SSC-MFT722N-SSSC-QP-7-03-08(REV.00)
4. Electro-Optical Characteristics (Ta=25ºC)
Parameter Symbol Condition Min Typ Max Unit
Red IF =20mA 1.5 2.2 2.7 Green IF =20mA 2.8 3.3 4.0 Forward Voltage Blue
VF IF =20mA 2.8 3.3 3.9
V
Red - - 10 Green - - 10 Reverse Current Blue
IR VR=5V (per die) - - 10
µA
Red 350 450 550 Green 350 800 1200 Luminance Intensity *1 Blue
IV IF =20mA (per chip) 100 195 350
mcd
Red - 1.94 - Green - 2.3 - Luminance Flux Blue
Φ V IF =20mA (per chip) - 0.6 -
lm
Red IF =20mA - 634 - Green IF =20mA - 520 - Peak Wavelength Blue
λP IF =20mA - 459 -
nm
Red IF =20mA 619 625 631 Green IF =20mA 519 527 538 Dominant Wavelength Blue
λd IF =20mA 465 470 477
nm
Red IF =20mA - 14 - Green IF =20mA - 39 - Spectral Bandwidth Blue
∆λ IF =20mA - 23 -
nm
Viewing Angle *2 R, G, B 2θ½ IF =20mA (per die) - 120 - deg.
Red - 44 - Green - 36 - Optical Efficiency Blue
η opt IF =20mA (per chip) - 10 -
lm/W
*1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC.
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 3/13 -
SSC-MFT722N-SSSC-QP-7-03-08(REV.00)
5. Rank of MFT722-SN ▣ Rank NameIF Condition RED=9mA, GREEN=20mA, BLUE19mA1) Special binning (White balance)
X1
Iv
▣ Luminous Intensity [Total Iv]
MIN MAXN 640 940O 940 1330P 1330 1950
▣ Green wavelength [WD]
MIN MAXL 519 524M 524 531H 531 538
▣ Luminous Intensity [Iv]R G B
MIN MAX MIN MAX MIN MAX140 440 350 1200 100 350
▣ Dominant Wavelength [λd]R G B
MIN MAX MIN MAX MIN MAX619 631 519 538 465 477
▣ Forward VoltageR G B
MIN MAX MIN MAX MIN MAX1.5 2.7 2.8 4.0 2.8 3.9
X2
W-Color Rank
RankName
Total Iv
RankName
Total Iv
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 4/13 -
SSC-MFT722N-SSSC-QP-7-03-08(REV.00)
6. White balance Color Rank ◈ Default Group (Select Group) : Bluish White
- Color Coordinates (typ.): x 0.255 , y 0.257 - IF Condition = 9mA for Red / 20mA for Green / 19mA for Blue - Color Rank : a, b, c, d, e, f, g, h (8BIN)
*1Bin Cell Size : x0.031, y0.024 *8Bin Total Cell Size : x0.076, y0.096
a b c d
X y x y x y x y 0.217 0.209 0.241 0.209 0.224 0.233 0.248 0.233 0.241 0.209 0.265 0.209 0.248 0.233 0.272 0.233 0.248 0.233 0.272 0.233 0.255 0.257 0.279 0.257 0.224 0.233 0.248 0.233 0.231 0.257 0.255 0.257
e f g h x y x y x y x y
0.231 0.257 0.255 0.257 0.238 0.281 0.262 0.281 0.255 0.257 0.279 0.257 0.262 0.281 0.286 0.281 0.262 0.281 0.286 0.281 0.269 0.305 0.293 0.305 0.238 0.281 0.262 0.281 0.245 0.305 0.269 0.305
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 5/13 -
SSC-MFT722N-SSSC-QP-7-03-08(REV.00)
0.22 0.24 0.26 0.28 0.300.20
0.22
0.24
0.26
0.28
0.30
hg
fe
dc
b
y
x
a
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.80.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9C
IE(y
)
CIE(x)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 6/13 -
SSC-MFT722N-SSSC-QP-7-03-08(REV.00)
7. Soldering Profile (1) Reflow Soldering Conditions / Profile
Lead Solder Pre-heat 130~210℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max.
. * Condition
ocooling6 C/sec. Max.
240 C Max.10 sec. Max.
o
60sec. Max.Above 210 C
120sec. Max.
Pre-heating130~210 C1~5 C / sec. o
oo
o1~5 C / sec.
Lead Solder
(2) Lead-free solder
* Condition
260 C Max.10 sec. Max.
o
60sec. Max.Above 220 C
120sec. Max.
Pre-heating180~220 C1~5 C / sec. o
oo
o1~5 C / sec.
Lead-frame Solder
cooling6 C/sec. Max.o
(1) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(2) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 7/13 -
SSC-MFT722N-SSSC-QP-7-03-08(REV.00)
Pre-heat 180~200℃
Pre-heat time 120 sec. Max.Peak-Temperature 260℃ Max.Soldering time Condition 10 sec. Max.
Lead Free Solder
* MATERIALS
PARTS MATERIALS Package Heat-Resistant Polymer
Encapsulating Resin Silicon Resin Electrodes Ag Plating Copper Alloy
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 8/13 -
SSC-MFT722N-SSSC-QP-7-03-08(REV.00)
8. Outline Dimension
3
4
2
56
1
Circuit Diagram
RedAnode
GreenAnode
BlueAnode
GreenCathode
RedCathode
BlueCathode
Rear ViewRight ViewFront View
PackageMarking(Cathode) 1 2 3
456
Package Outlines
Recommended Solder Pad
( Tolerance: ±0.2, Unit: mm )
( Tolerance: ±0.2, Unit: mm )
PackageMarking
SSC-QP-7-0
(1) Qu
(2) Cu
(3) Ad
car
(4) Pa
( Tolerance: ±0.2, Unit: mm )
9. Packing
antity : 700pcs/Reel
mulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
hesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the
rier tape at the angle of 10º to the carrier tape
ckage : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 9/13 -
SSC-MFT722N-S3-08(REV.00)
10. Reel Packing Structure
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 10/13 -
SSC-MFT722N-SSSC-QP-7-03-08(REV.00)
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
Outer Box Structure
1
PART NUMBER : XXXXXXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
QUANTITY : XXXX
XXX
XXX
a
TOP LEDRoHS
ba c
SIDE
2457inch 220 142
SEOUL SEMICONDUCTOR CO., LTD.
Material : Paper(SW3B(B))SIZE (mm)
TYPE
b
c1
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
Reel
Aluminum Vinyl Bag
PART NUMBER : XXXXXXXXXX
HUMIDITY INDICATOR
DESI PAK
XXX
SEOUL SEMICONDUCTOR CO., LTD.
LOT NUMBER : XXXXXXXXXX
PART NUMBER : XXXXXXXXXX
11. Lot Number The lot number is composed of the following characters; MFT○□□◎◎ # ~ # MFT First Part Name ○ Year (6 for 2006, 7 for 2007, 8 for 2008 ) □□ Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.) ◎◎ Day ( 01, 02, 03, 04, ‥‥‥‥‥‥28, 29, 30, 31.) # ~# The number of the internal quality control
XXX
LOT NUMBER : MFT70426 01 512
SEOUL SEMICONDUCTOR CO., LTD.
QUANTITY : 700
PART NUMBER : MFT722N-S
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 11/13 -
SSC-MFT722N-SSSC-QP-7-03-08(REV.00)
12. Precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator)
with a desiccant. Otherwise, to store them in the following environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light
transmission efficiency, causing the light intensity to drop. Attention in followed;
Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 1 week passed after opening or change color of indicator on desiccant,
components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to
normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When
washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after considering the ambient
maximum temperature.
(10) The LEDs must be soldered within seven days after opening the moisture-proof packing.
(11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry
place.
(12) The appearance and specifications of the product may be modified for improvement without notice.
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 12/13 -
SSC-MFT722N-SSSC-QP-7-03-08(REV.00)
13. Characteristic Diagram
SSC-QP-
1.5
10
For
war
d C
urre
nt I
F [m
A]
Forw
ard
Cur
rent
I F
[mA
]
Relative Luminous Intensity vs. Forward Current
00
10
20
30
]
Forward Current vs. Forward Voltage
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 13/13 -
SSC-MFT722N-S7-03-08(REV.00)
2.0 2.5 3.0 3.5 4.0
Forward Voltage VF [V]
Blue GreenRed
Forward Current Derating Curve
Ambient Temperature Ta [ºC]
Radiation Diagram
(TA=25ºC)
(TA=25ºC) (TA=25ºC)
-90
-60
-30
90
60
300
20 40 60 80 100
3 CHIP ON
1 CHIP ONRed, Green, Blue
0 5 10 15 20 25 30 350.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
Rel
ativ
e Lu
min
ous
Inte
nsity
IV
/ IV
(20m
A) [R
el.
Forward Current IF [mA]
R G B