switching characteristics of a 4h-sic igbt with interface ... · b. dynamic simulation results at...

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B. Dynamic Simulation Results At slow switching (t rise = 20μs), the dynamic current without D it increases according to the applied gate bias. With D it , a surge of current becomes visible at the beginning due to carriers being trapped. The current decays until it reaches the static value. At fast switching (t rise = 200ns), the dynamic current without D it exhibits a delay in reaching the static value. Carriers exhibit a delay to build-up the channel and allow current flow, which is referred to as the nonquasi-static (NQS effect). With D it , the surge of current that is observed in slow switching is bounded by the current without D it . This means that the effects on the current due to trapping are limited by the NQS current without D it . For different switching times, the initial surges are all bounded by the NQS current without D it . The current decay occurs much later for faster switching due to the stronger NQS effect. In quasi-static (QS) approximation, the current follows the applied bias without any delay. Due to the traps, the QS current exhibits an initial surge then it decays to reach the static value. In NQS case, the current flow is delayed because carriers do not respond instantaneously to the abrupt change of applied bias. The current with trapping effects is bounded by the NQS current. Trapping effect is concealed by NQS itself. Therefore, any calculation of current with carrier trapping in the static case does not necessarily appear as degradation in the transient current during switching. In compact modeling, the I NQS = I QS + dQ/dt. Therefore, a first-order approximation of the maximum current difference ΔI is dQ/dt. IV. Summary The effect on the device characteristics of a 4H-SiC IGBT device is investigated by including measurements of the density of interface states in a consistent Poisson solver. In the static case, threshold voltage shift and current magnitude degradation are observed. At nonquasi-static switching, the surge of current due to trapping is concealed by the NQS current without defects. The NQS behavior itself limits the effect of trapping of carriers. Reference 1. V. V. Afanasev, et al, Phys. Stat. Sol. (a) 162, 321 (1997). 3. Atlas Manual, SILVACO, Inc. (2013). 2. I. Pesic, et al, Int. Semiconductor Device Research Symp. (2013). V 0 SiC-IGBT GND I c g V c Extension to Transient Simulation Extension of investigation from static to dynamic is not straightforward because the dynamics of carriers is governed by: - the time to charge/discharge the channel - the time for trapping/detrapping of carriers Time Input Current (QS) Current (NQS) (QS + trapping effect) (NQS + trapping effect) ΔI C. Trapping Effects and NQS Interplay t rise Time (10 s) 1.0e-05 Current (A) 0.4e-05 0.8e-05 0.6e-05 0.2e-05 0 0 1.0 2.0 3.0 4.0 -6 5.0 6.0 Without D it r t = 200ns t = 500ns t = 1000ns With D + D 1a 2a r r rise 0 1.0 2.0 3.0 Time (Normalized to 1 / t ) 0 25.0 Gate voltage (V) Time (10 s) 1.0e-05 Current (A) 0.4e-05 0.8e-05 0.6e-05 0.2e-05 0 Without D With D only With D only it 1a 2a With D + D 1a 2a 0 1.0 2.0 3.0 4.0 -5 5.0 t rise = 20μs 0 1.0 2.0 3.0 4.0 Time (10 s) -6 5.0 Without D With D only With D only it 1a 2a With D + D 1a 2a 0 25.0 Gate voltage (V) t rise = 200ns -0.4 -0.2 0 0.2 0.4 0.6 0.8 Current (mA) Device Simulator 0 5 10 15 20 25 30 35 Time (ps) Quasi-static-based Model Vds = 5V 0 4.0 Gate voltage (V) Gate voltage Electron concentration source channel drain t 1 t 2 V gs Quasi-static Approximation Nonquasi-static t 2 t 1 Switch-on Parameters are extracted from measurements. 15 20 25 30 35 Gate Voltage (V) (Linear plot) 1.0e-05 0.4e-05 0.8e-05 0.6e-05 0.2e-05 0 0 5 10 (Log plot) With D only With D only it 1a 1a 2a 2a 1.0e-30 1.0e-25 1.0e-20 1.0e-15 1.0e-10 1.0e-05 1.0 Current (A) 0 5 10 15 20 25 30 35 Gate Voltage (V) V c = 15V Without D With D + D 1.0e-35 D 1a : Modeled as a Gaussian distribution D 2a : Modeled as an Exponential distribution Poisson’s Equation: Continuity Equations: Q T Modeling: Probability of Trap Occupation for Exponential Distribution: Shockley-Read-Hall Recombination/Generation Rate: Additional Rate Equations with Transient Probability of Trap Occupation: Similar forms of equation are used for Gaussian distribution. Oxide Thickness : 0.1μm Channel Doping : 4 x 10 17 cm -3 Base Doping : 6 x 10 14 cm -3 Simulation is perfomed in 2D device simulator ATLAS. 1 Hiroshima University, 2 Silvaco Japan Two degradation characteristics are observed: 1.0e+12 1.0e+13 Density (cm -2 eV -1 ) D 2a D 1a 0 0.5 1.0 1.5 2.0 2.5 3.0 Energy (eV) E v E c Total Interface Defect Density Afanasev, et al. Phys. Stat. Sol. 1997 1.0e+11 D 2a (D 1a + ) SiC, a wide-band semiconductor material with high thermal conductivity and high thermal stability, has become widely employed in power semiconductor devices. I. Background and Motivation 4H-SiC has been given focus because of its substantially higher carrier mobility, shallower dopant ionization energies, and lower intrinsic carrier concentration. However, reported measurements of the 4H-SiC/SiO 2 interface show a high interface trap density D it , characterized by distinct deep and shallow traps. The impact of traps on the device electrical characteristics should be investigated. II. Simulation-Based Investigation Reported measurements of the defect densities are included as interface defect states in the SiC bandgap. The effects on the device electrical characteristics are investigated. A. Reported Measurements of Defect Density at the 4H-SiC/SiO 2 interface B. Device Simulation with Defects C. Trench 4H-SiC IGBT Device Structure III. Results and Discussion A. Static Simulation Results 2. The collector current magnitude is decreased. This is due to shallow traps defined by the D 2a defect distribution. 1. The onset of the conduction current is shifted towards a higher gate voltage. This is due to deep traps defined by the D 1a defect distribution. Switching Characteristics of a 4H-SiC IGBT with Interface Defects Up to the Nonquasi-Static Regime Iliya Pesic 1,2 , Dondee Navarro 2 , Masato Fujinaga 2 , Yoshiharu Furui 2 , and Mitiko Miura-Mattausch 1

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  • B. Dynamic Simulation Results

    At slow switching (trise = 20μs), the dynamic current without Dit increasesaccording to the applied gate bias. With Dit, a surge of current becomesvisible at the beginning due to carriers being trapped. The current decaysuntil it reaches the static value.At fast switching (trise = 200ns), the dynamic current without Dit exhibitsa delay in reaching the static value.

    Carriers exhibit a delay to build-up the channel and allow current flow,which is referred to as the nonquasi-static (NQS effect).

    With Dit, the surge of current that is observed in slow switching is boundedby the current without Dit. This means that the effects on the current due totrapping are limited by the NQS current without Dit.

    For different switching times, the initial surges are all bounded by the NQScurrent without Dit. The current decay occurs much later for fasterswitching due to the stronger NQS effect.

    In quasi-static (QS) approximation, the current follows the applied bias without any delay. Due to the traps, the QS current exhibits an initial surge then it decays to reach the static value.

    In NQS case, the current flow is delayed because carriers do not respond instantaneously to the abrupt change of applied bias. The current withtrapping effects is bounded by the NQS current.

    Trapping effect is concealed by NQS itself. Therefore, any calculation ofcurrent with carrier trapping in the static case does not necessarily appearas degradation in the transient current during switching.In compact modeling, the INQS = IQS + dQ/dt. Therefore, a first-orderapproximation of the maximum current difference ΔI is dQ/dt.

    IV. SummaryThe effect on the device characteristics of a 4H-SiC IGBT device isinvestigated by including measurements of the density of interface statesin a consistent Poisson solver.In the static case, threshold voltage shift and current magnitude degradationare observed.At nonquasi-static switching, the surge of current due to trapping is concealedby the NQS current without defects. The NQS behavior itself limits the effectof trapping of carriers.

    Reference1. V. V. Afanasev, et al, Phys. Stat. Sol. (a) 162, 321 (1997).

    3. Atlas Manual, SILVACO, Inc. (2013).2. I. Pesic, et al, Int. Semiconductor Device Research Symp. (2013).

    V0

    SiC-IGBT

    GND

    Ic

    g

    Vc

    Extension to Transient SimulationExtension of investigation from static todynamic is not straightforward becausethe dynamics of carriers is governed by:- the time to charge/discharge the channel- the time for trapping/detrapping of carriers

    Time

    Input Current (QS)

    Current (NQS)

    (QS + trapping effect)

    (NQS + trapping effect)

    ΔI

    C. Trapping Effects and NQS Interplay

    trise

    Time (10 s)

    1.0e-05

    Cur

    rent

    (A

    )

    0.4e-05

    0.8e-05

    0.6e-05

    0.2e-05

    0

    0 1.0 2.0 3.0 4.0-6

    5.0 6.0

    Without D it

    rt = 200nst = 500nst = 1000ns

    With D + D 1a 2a

    rr

    rise 0 1.0 2.0 3.0

    Time (Normalized to 1 / t )

    0

    25.0

    Gate voltage (V

    )

    Time (10 s)

    1.0e-05

    Cur

    rent

    (A

    )

    0.4e-05

    0.8e-05

    0.6e-05

    0.2e-05

    0

    Without D

    With D only

    With D only

    it

    1a

    2a

    With D + D 1a 2a

    0 1.0 2.0 3.0 4.0-5

    5.0

    trise = 20μs

    0 1.0 2.0 3.0 4.0Time (10 s)-6

    5.0

    Without D

    With D only

    With D only

    it

    1a

    2a

    With D + D 1a 2a 0

    25.0

    Gate voltage (V

    )

    trise = 200ns

    -0.4

    -0.2

    0

    0.2

    0.4

    0.6

    0.8

    Cur

    rent

    (mA

    )

    Device Simulator

    0 5 10 15 20 2530 35Time (ps)

    Quasi-static-based Model

    Vds = 5V

    0

    4.0

    Gate voltage (V

    )

    Gate voltage

    Ele

    ctro

    n co

    ncen

    tratio

    n

    source channel drain

    t1 t2

    Vgs

    Quasi-static ApproximationNonquasi-static

    t2

    t1

    Switch-on

    Parameters are extracted from measurements.

    15 20 25 30 35Gate Voltage (V)

    (Linear plot) 1.0e-05

    0.4e-05

    0.8e-05

    0.6e-05

    0.2e-05

    0

    0 5 10

    (Log plot)

    With D onlyWith D only

    it1a1a

    2a

    2a

    1.0e-30

    1.0e-25

    1.0e-20

    1.0e-15

    1.0e-10

    1.0e-05

    1.0

    Cur

    rent

    (A

    )

    0 5 10 15 20 25 30 35Gate Voltage (V)

    Vc = 15V

    Without DWith D + D

    1.0e-35

    D1a : Modeled as a Gaussian distribution

    D2a : Modeled as an Exponential distribution

    Poisson’s Equation:・

    Continuity Equations:・

    QT Modeling:・

    Probability of Trap Occupation for Exponential Distribution:・

    Shockley-Read-Hall Recombination/Generation Rate:・

    Additional Rate Equations with Transient Probability of Trap Occupation:・

    Similar forms of equation are used for Gaussian distribution.・

    Oxide Thickness : 0.1μmChannel Doping : 4 x 1017 cm-3

    Base Doping : 6 x 1014 cm-3

    Simulation is perfomed in2D device simulator ATLAS.

    1Hiroshima University, 2Silvaco Japan

    Two degradation characteristics are observed:・

    1.0e+12

    1.0e+13

    Den

    sity

    (cm

    -2 eV

    -1) D2a

    D1a

    0 0.5 1.0 1.5 2.0 2.5 3.0Energy (eV)Ev Ec

    Total Interface Defect Density

    Afanasev, et al. Phys. Stat. Sol. 1997

    1.0e+11

    D2a(D1a+ )

    SiC, a wide-band semiconductor material with high thermal conductivity andhigh thermal stability, has become widely employed in power semiconductordevices.

    I. Background and Motivation

    4H-SiC has been given focus because of its substantially higher carrier mobility,shallower dopant ionization energies, and lower intrinsic carrier concentration.However, reported measurements of the 4H-SiC/SiO2 interface show a highinterface trap density Dit, characterized by distinct deep and shallow traps.The impact of traps on the device electrical characteristics should be investigated.

    II. Simulation-Based InvestigationReported measurements of the defect densities are included as interfacedefect states in the SiC bandgap.The effects on the device electrical characteristics are investigated.

    A. Reported Measurements of Defect Density at the 4H-SiC/SiO2 interface

    B. Device Simulation with Defects

    C. Trench 4H-SiC IGBT Device Structure

    III. Results and DiscussionA. Static Simulation Results

    2. The collector current magnitude is decreased. This is due to shallow traps defined by the D2a defect distribution.

    1. The onset of the conduction current is shifted towards a higher gate voltage. This is due to deep traps defined by the D1a defect distribution.

    Switching Characteristics of a 4H-SiC IGBT with Interface DefectsUp to the Nonquasi-Static Regime

    Iliya Pesic1,2, Dondee Navarro2, Masato Fujinaga2, Yoshiharu Furui2, and Mitiko Miura-Mattausch1