test readiness review - university of colorado boulder · 2017-10-04 · project goals •develop a...

TestReadinessReview

Presenting:AnthonyAnglin, EmmettBailey,AspenCoates, ZachMcConnel,SierraWilliams

OtherTeamMembers:LindsayGoldworm,ElizabethLuke,NicholausMonahan,MaryScites

Customer:ScottTaylor,

SurreySatelliteTechnologyU.S.

PABAdvisor:JoshStamps,

SierraNevadaCorporationBaffling

BuffsBAFFLING BUFFS

1

Overview

2

ProjectMotivation• Startrackersneedtoseedimlightfromdistantstars

• Theycompare whattheyseewithonboardstarcatalogtomakespacecraftattitudeadjustments

• Nearbybodiesemit/reflectstraylightwhichhinders startrackersabilitytoseedimlight

• Bafflesattenuateandeliminatestraylightfromnearbybodies

• Lightweightdeployablebaffleforsmallsats

3Overview Schedule TestReadiness Budget

ProjectGoals•Developaprototypedeployablebaffleforastartrackertobeusedonasmallsatelliteplatform

•Designandmanufacture adeployablebaffletolimitstraylightintoanopticalsensor

•Developatestmethodologyandinstrumentationsuitetomeasureperformanceofthebaffleforstraylightelimination

•Performthetests forthedeploymentandstraylighteliminationofthebaffle


Requirements&LevelsofSuccessFunctionalRequirements Tier1 Tier2

FR1:Baffleshallbedeployable Manualdeployment Electronicdeploymentwithwiredconnection

FR2:Baffleshallconformtostowedvolumeconstraint

175mmx175mmx50mm 125mmx125mmx50mm

FR3:Baffleshalladheretomassconstraint

<500grams <300grams

FR4:Baffleshallattenuatelightto99.9%

At40° lightincidenceangle At30° lightincidenceangle


Smallsat deployment

Startrackersaturatedbysun

Deploybaffle

Excesslightattenuated

Starpatterndetectedandattitudedetermined

Attitudechanged

ProjectScope

Y

X

Y

X

MissionCONOPS


DeploymentCONOPS

7

V

Powersenttomotor

PowerScrewRotatesBaffleDeploys

Overview Schedule TestReadiness Budget

LightAttenuationCONOPS

8

0degrees 10to15degrees

Morethan30degrees

Sensor


FunctionalBlockDiagram

9

BaffleDeploymentAssembly

PrecisionMicrodrivesDCMotor

PowerScrew

τMOTOR

3-TieredBaffle

FLIFT

KillSwitchAssembly

BatteryPoweredLaser

Photo-transistor

NPNTransistor

5VtoBase

NarrowLightBeam

3VtoCollector

ExternalComponents

PowerSupply

LabVIEWStation

NIUSB-6009DAQ

3VtoMotor

Windings

LightGenerationandDetection

14-BitDigitalVoltage

30V

HamamatsuPhotodiode

Current-to-VoltageOp-Amp

Light

Light

Photo-current64LED

Source

AnalogVoltage

9


BaselineDesign:CDRvs.Now

LinearBearing

SteelShaft

Vane3Tier3

Vane2Tier2

Vane1Tier1

5/8-20ThreadedRod

PrecisionMicrodrives 212-117

NoMajorStructuralChanges

SinceCDR


Sensorwillbehere

10

Schedule

11

ManufacturingPrep

BraceManufacturing

BaffleManufacturing

BaseplateManufacturing

ManufacturingMargin

Deployment&StrayLightTesting

ResultCompilation

TestingStructureManufacturing

CircuitValidation

- OrderingandDevelopment

- ClassDeliverablePrep

- ClassPresentations&Break

- Manufacturing

- Testing

- CriticalPath

FinalPresentation

FinalsWeek

MSR Today

PCBscreated.Onlyphotodiode&amp.circuitstillneedtobevalidated.Allbraceshavebeencreated.OnschedulesinceMSRMiddletiercomplete,toptier

inprogress,andbottomtiernotstarted.2weeksbehindsinceMSR

1of43Dmoldscreated.Testingstructureinprogress.4daysbehindsinceMSRVaneManufacturing

Vanessentoutofhouseformanufacturing.1weekbehindsinceMSRNotyetmanufactured.1weekbehindsinceMSR

Overall,weare2weeksbehindonmanufacturing.Usingmanufacturingandtestingmargin,theprojectisontime.

12

TestReadinessOverview

• LightAttenuation&SymmetryTests

• DeploymentTesting

13

TestReadinessLightAttenuation&SymmetryTests

14

LightAttenuationOverview

• Willbetestinglightattenuationwithrespecttopointingangle

• Twodifferenttests:• Symmetric• Asymmetric

15Overview Schedule TestReadiness Budget 15

SymmetricBaffle

AsymmetricBaffle

4.9 m

Light Source

Top Down View

LightAttenuationTest

0o

90o

θ

θRotary Table


Willvalidatelightattenuation

requirements!

16

RequirementsToBeValidated

• Lightattenuationtestingwillverifybothoftheserequirements

• Willbetestingbafflesymmetryandasymmetry

Requirement RelativeIncidentPower(P/P0)

Angle(Degrees)

Pass-Band(DR4.3) >95% 10°

Stop-Band(DR4.2) <0.1% 30°

Overview Schedule TestReadiness Budget 17

Final Model

Pre-Obscuration Angle 11.1°

ObscurationAngle 20.7°

Stop

BandRe

quire

men

t

Obscuratio

nAn

gle

PassBandRe

quire

men

t

Pre-Obscuratio

nAn

gle


ZemaxValidation– Symmetric ModelExpectedResults

18

ZemaxValidation– Asymmetric ModelExpectedResults

SteepSide ShallowSide

Pre-Obscuration Angle 8.8° 10.9°ObscurationAngle 19.7° 22.3°

SteepSide

Pre-Obscuratio

n

Stop

BandRe

quire

men

t

PassBandRe

quire

men

t

ShallowSidePre-Obscuratio

n

SteepSide

Obscuratio

n

ShallowSideObscuratio

n

19

TestReadinessLightAttenuationTestFixtures

20

LightAttenuationTestFixtures– ExplodedView


LightAttenuationTestFixtures– ExplodedView


Alignmentwillbedoneusingcalibrationplate

PVCpipe

CalibrationPlate

Holeemulatingapparentsizeofsun

Baffle

3Dbafflesupport

Baseplate

RotaryTable

Bafflelevelingplate

LightbulbisinsidePVC

140mm

280mm

140mm

CalibrationMethod– Position

BasePlate

LightStand

Rope268m

m150mm


CalibrationMethod– Orientation

95mm 100mm

dd

LightSource

CalibrationPlate

20mm 20mm

20mm

20m

m

145mm


CalibrationTestTolerancesPart Tolerance Requirements

Rope(Distance) ±200𝑚𝑚changesFOV by <0.01°

Apparentsundiameter= 0.5°Error:<2%

Laser(Orientation) ±20𝑚𝑚 +ManufacturingError

ChangesResults Angleby0.40°

Pre-obscurationMargin:1.1°

ObscurationMargin:9.3°


LightAttenuation&SymmetryTests

EquipmentandNeededFacilities

• CNLcleanroom• Photodiodehandlingitems• LaserSafetyGlasses

Risk

• Delicatephotodioderoutinelycleaned.

• ESDsafeenvironment• Groundallelectronics


LightAttenuationTestConcernsRisk Mitigation

Alignmentofsensor&lightsource Calibrationplate

Staticelectricity Groundedelectricalcomponents

Eyedamagefromlaserpointers Lasersafetyglassesforcalibration

Photodiodecontamination • Paintmask&powderfreenitrilegloves• Cleanphotodiodewith99%isopropylalcohol

andESDswabs• Cleanbothsidesofthefilter• Handlephotodiodewithplasticantistatic

tweezers• Whennotinuse,storethephotodiodeinan

ESDbagandasecondESDbagwithdesiccant• Willonlyhandlephotodiodeincleanroom


LightAttenuationTestProcedure

• TakeP0 measurementat0°• Takepower(P)measurementsevery4°• Between8°-12°,and28°-32°,measurementswillbetakenevery0.1°• CalculatelightattenuationusingrelativepowermeasurementP/P0

Fulltestproceduresavailableuponrequest

28

TestReadinessDeploymentTesting

29

DeploymentTestingOverview

• Willbetestingdeploymentwithrespecttotheminimumandmaximumallowabledeploymentheights


DeploymentTestingOverview• Objective:

• Toensurebafflecantransitionfromastowedtoadeployedstatewithintheexpectedrange

• HowItReducesRisk:• Opticalperformancewillnotbecompromisedifbaffledeployswithinacceptableheight

• AssociatedModel&CircuitValidation:

• Killswitchcircuit(validated)

• KeyData:• Averageheightoffullydeployedbaffle

• Expect: 87mm± 1mm

• Requirement:• FR1:Baffleshallbedeployable


DeploymentTesting

87 mm86 mm

2 mm

Bottom of laser pointer at minimum deployment

height!

Laser Pointer Laser


DeploymentTestSetUp

Laser Pointer Support

Laser Pointer

Laser Pointer

Laser Pointer Support

Phototransistor

PC Board

“Beam of Light”

“Beam of Light”

PCB Support

PCB Support


DeploymentTestProcedure• Ensurebottomoflaserpointerisatacceptableminimumdeploymentheight

• Turnonlaserpointertostartdeployment• Whenfullydeployed,laserlighttophototransistorwillbeimpededcausingvoltagetomotortostopendingdeployment

• Repeatformaximumacceptabledeploymentheight

• Location:• Bobby’sLab


TestingStatusTest Status: Awaiting:LightAttenuationTest(Symmetrical)

Notcompleted • 13Dbafflenegative• Baffle• Baseplate

LightAttenuationTest(Asymmetrical)

Notcompleted • 23Dbafflenegatives• Baffle• Baseplate

DeploymentTest Notcompleted • Baffle• Baseplate• Laserpointersupport• PCB• PCBsupport


Budget

36

Electronics, $52.93TestingEquipment,

$835.82

Optics, $1,006.94

StockMetal, $258.80

BaffleAdd-Ons,$269.32

Safety/Handling,$50.76

Other, $748.95

FutureCostsEstimate,$600.00

Margin, $1,176.48

BUDGET

37

Electronics - $52.93Testing Equipment - $835.82Optics - $1,006.94Stock Metal - $258.80Baffle Add-Ons - $269.32Safety/Handling - $50.76Other - $748.95Future Costs Estimate - $600.00

Sum - $3,823.52

Margin - $1,176.48

References

38

References• http://cnl.colorado.edu/cnl/index.php?option=com_content&view=article&id=211&Itemid=155

• http://www.cleanairtechnology.com/cleanroom-classifications-class.php

• https://static.rapidonline.com/catalogueimages/Module/M071087P01WL.jpg

39

BackupSlides

40

BackupSlides• Zemax

• FinalModelSpecs• AsymmetricModelSpecs• ParallelRayModel

• Specs• Results

• MeshRefinementStudy• Specs• Results• Analysis

• 4PhotodiodesSpecs

• BaffleNegativeCAD

41

Breakdown

42

•Electronics•Includes PC board, resistors, batteries and other small components

•Testing Equipment•Includes lasers, light bulbs, diffuser disk, and test setup material

•Optics•Includes filter, primary photodiode, and backup photodiodes

•Stock Metal•Includes Aluminum 2024-T4

•Baffle Add-Ons•Includes thread tap, bearing, shaft, motor, and gear

•Safety/Handling•Includes alcohol cleaner, ESD safe tweezers, gloves, dust mask, and static control bag

•Other•Includes epoxy, adhesive, printing, Aeroglaze coating and shipping costs

•Future Costs Estimate•Vanes ($150), Coating application ($200), Felt ($250)

FinancialSummary

43

• All items (except 1) are currently in the locker•Felt for the light attenuation test needs to be purchased

•Future cost include:•Re-ordering items/stock material if necessary•Outsourcing vanes

•$150•Will get back this week

•Application of coating on baffle•2-3 days

LightAttenuationTest- CalibrationPlate


LightAttenuationTestFixtures- ExplodedView


LightAttenuationTestFixtures


2nd Tiershift–PrimaryDegreeofFreedom

2nd Tiershifts

‘Steepside’‘ShallowSide’

δ

θθ - δ

• ‘ShallowSide’s’effectiveFOVremainsthesame.

• ‘SteepSide’s’newfieldofviewis‘designed’–‘perturbedangle’


- OrderingandDevelopment

- ClassDeliverablePrep

- ClassPresentations&Break

- Manufacturing

- Testing

- CriticalPath49

Specification– FinalModel

• BaffleModel:Fullydeployedwithvanesandcoating

• Resolution:0.1°• AngleSweep:(0° to30°)• Numberofraysfromlightsource:

• 200,000,000rays

50

Tier3

Tier2

Tier1

Specification- AsymmetricTest

• BaffleModel:Maximummiddletieroffsetfullydeployedwithvanesandcoating

• Resolution:0.1°• AngleSweep:(0° to30°)• Numberofraysfromlightsource:

• 10,000,000rays

51

2mm

Specifications– ParallelRays

• BaffleModel:Symmetricfullydeployedwithvanesandcoating

• Resolution:0.1°• AngleSweep:(0° to12.4°)• Distance:15m• Numberofraysfromlightsource:

• 200,000,000rays

52

Distance=15000mm

Results– ParallelRays

53

15m 4.88m

Pre-Obscuration Angle 11.4° 11.1°

ObscurationAngle N/A 20.7°

15m 4.88m

AngleFromParallel 0.19° 0.58°

Pre-ObscurationAngleZone

PassBandRe

quire

men

t

Specifications- MeshIndependence

• BaffleModel:Symmetricfullydeployedwithvanesandcoating

• Resolution:0.1°• AngleSweep:(0° to30°)• Distance:4.88m• Numberofraysfromlightsource:

• 10,000,000rays• 100,000,000rays• 200,000,000rays

54

49m

m

StrayLightRays

44mm

30.25mm

18mm

Results-MeshIndependence

55

Pre-ObscurationAngleZone

ObscurationAngleZone

Analysis-MeshIndependence

56

10,000,000Rays 100,000,000Rays

Pre-Obscuration Error 3.6% 1.8%

ObscurationError 1.9% 0

𝑃𝑒𝑟𝑐𝑒𝑛𝑡𝐸𝑟𝑟𝑜𝑟 = 𝐸𝑥𝑝𝑒𝑟𝑖𝑚𝑒𝑛𝑡𝑎𝑙 − 𝑇𝑟𝑢𝑡ℎ

𝑇𝑟𝑢𝑡ℎx100

Requirement 10,000,000Rays 100,000,000Rays 200,000,000Rays(Truth)

Pre-Obscuration >10° 11.5° 10.9° 11.1°

Obscuration <30° 21.1° 20.7° 20.7°

Specification– 4Photodiodes

• BaffleModel:Maximummiddletieroffsetfullydeployedwithvanesandcoating

• Resolution:0.1°• AngleSweep:(0° to30°)• NumberofDetectors:4• Numberofraysfromlightsource:

• 10,000,000rays

• NotCompletedasof(03/06/17)

57

1.4m

m10

mm

10mm

13.2mm

9mm

11.4mm

MOLDA– horizontalorientation,symmetricallineup(metricunits)

58

87.154

250.000

116.508

39.334

63.989

15.000

66.000

21.403

12.000

12.000

20.000

REV. DESCRIPTION DATE

TOLERANCESUNLESSNOTED:

UNITS:MM

PROPRIETARY AND CONFIDENTIAL

THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF UNIVERSITY OF COLORADO. ANY REPRODUCTION IN PART OR AS A WHOLE WITHOUT WRITTEN PERMISSION IS PROHIBITED.

SHEET

1 of 1REVPN

DESCRIPTION

UNIVERSITY OF COLORADO

1111 ENGINEERING DRIVEBOULDER, CO 80309-0427

FINISH

MATERIAL

X.X 0.050 X.XX 0.010 X.XXX 0.005 X.X 1

MOLDA– horizontalorientation,symmetricallineup(Englishunits)

59

3.431

9.843

4.587

1.549

2.519

.591

2.598

.843

.472

.472

.787



UNITS:INCHES



SHEET

1 of 1REVPN

DESCRIPTION



FINISH

MATERIAL

X.X 0.050 X.XX 0.010 X.XXX 0.005 X.X 1

MOLDB– horizontalorientation,asymmetricallineup(metricunits)

60

14.732

87.250

250.170

116.341

63.994

39.990

67.869

11.036

12.968



UNITS: MM



SHEET

1 of 1REVPN

DESCRIPTION



FINISH

MATERIAL

X.X 0.050 X.XX 0.010 X.XXX 0.005 X.X 1

MOLDB– horizontalorientation,symmetricallineup(Englishunits)

61

.580

3.435

9.849

4.580

2.519

1.574

2.672

.434

.511



UNITS: INCHES



SHEET

1 of 1REVPN

DESCRIPTION



FINISH

MATERIAL

X.X 0.050 X.XX 0.010 X.XXX 0.005 X.X 1

MOLDC– verticalorientation,symmetricallineup(metricunits)

62

87.949 63.929 39.887

80.000

87.250

250.059

87.949

63.929

14.732



UNITS: MM



SHEET

1 of 1REVPN

DESCRIPTION



FINISH

MATERIAL

X.X 0.050 X.XX 0.010 X.XXX 0.005 X.X 1

MOLDC– verticalorientation,symmetricallineup(Englishunits)

63

3.463 2.517 1.570

3.150

3.435

9.845

3.463

2.517

.580



UNITS: INCHES



SHEET

1 of 1REVPN

DESCRIPTION



FINISH

MATERIAL

X.X 0.050 X.XX 0.010 X.XXX 0.005 X.X 1

MOLDD– verticalorientation,asymmetricallineup(metricunits)

64

250.554

87.250

88.000

63.974

14.309

11.987



UNITS:MM



SHEET

1 of 1REVPN

DESCRIPTION



FINISH

MATERIAL

X.X 0.050 X.XX 0.010 X.XXX 0.005 X.X 1

MOLDC– verticalorientation,asymmetricallineup(Englishunits)

65

9.864

3.435

3.465

2.519

.563

.472



UNITS: INCHES



SHEET

1 of 1REVPN

DESCRIPTION



FINISH

MATERIAL

X.X 0.050 X.XX 0.010 X.XXX 0.005 X.X 1

ElectronicCircuits– BreadboardTestingMotorDeploymentCircuit/KillSwitch

• STATUS: Verifiedviabreadboardtest

• PLAN: OrderPCBandsoldercomponents

• COMPLETION: March14

• ADDITIONALINFO: Phototransistorisonlysensitivetohighintensitygreenlight(530nm)

• Darkroomnotrequiredfordeploymenttesting• Personnelsafetyhazardsreducedduetowelllittestingarea

66

ElectronicCircuits– BreadboardTestingSensorandAmplifierCircuit

• STATUS: Breadboardtestinginprogress(March6)

• PLAN: Completetesting,orderPCB,andsoldercomponents

• COMPLETION: March14

• ADDITIONALINFO: Breadboardtestingdelayedduetotheneedforcleanroomcontrolsforsafehandlingofcomponent

• ColoradoNanofabricationLaboratorygrantedfreeaccess• Photodiodesolderingwillalsobeperformedatthissite• Lightattenuationtestingwillalsobeperformedatthissite

67

CleanroomControls

• GrantedfreeaccesstoColoradoNanofabricationLaboratorycleanroomfacility• Typically$58/hour

• Class1000cleanroom– Fewerparticlesthannormalambientairbyafactorof1000• CleanerthanaClass10,000cleanroom

• ConsiderednecessaryforsafehandlingofHamamatsuphotodiode

• Additionalequipmentrequired• Bluecoatandbooties

• NightaccessgrantedtofacilitatecleanLightAttenuationtesting• Eliminatesneedtohermeticallysealthefilter/photodiodeassemblyonthebafflebaseplate

68

SensorandAmplifierCircuit– NoiseReduction

• Twisted,shieldedwirepairforphotodiodeleads• Groundshieldtoreducenoise

• FaradayCage– Metalenclosureforcircuit• GroundedviaGNDpinonDAQtoreducenoise• SalvagedfromElectronicsLab

PCB

DAQCPU

FaradayCage

TwistedWirePairUSB

GroundedShield

GroundedFaradayCageviaDAQUSBtoCPUground 69

OrientationVerificationLightSource

LaserBeam

10mm20m

m𝜃C4900mm

20mm

𝜃C = tanGH204900

𝜃C = 0.23°

𝜃 = 𝜃C +𝜃K𝜃 = 0.23° + 0.17°𝜃 = 0.40°

𝜃K88.25mm

0.254mm

𝜃K = tanGH0.25488.25

𝜃K = 0.17°

21mm

20mm


test readiness review - university of colorado boulder · 2017-10-04 · project goals •develop a...

Documents