the calice –ecal

CALICE collaboration CALICE collaboration J-C BRIENT LCWS02 – Jeju Island

The CALICE –ECAL

Silicon - V. VrbaVery FE - S. Manen Readout/DAQ - P. DaunceyMechanics … - Myself

Presentation on the hardware R&D Tungsten-silicon sampling calorimeter

OUTLINE

status on the physics prototype (mechanics)

status of the technological R&D on the new design


The mechanics for the physics prototype

Tungsten metrology

Detector slab design

W-Carbon fiber structure

The LLR mechanics group participating M.Anduze, A.Busata, P.Maritaz,

D.Pineihro, P.Poileux,etc…


Physics Prototype – global presentation

VMEHCAL

Movable tableSilicon wafer

Electronics

Beam monitoring

Movable table

ECAL

Detector slab

1st structure (1.4mm of W plates)

2nd structure (2×1.4mm of W plates)

3rd structure (3×1.4mm of W plates)

370 mm

370 mm

180 mm

from Marc Anduze ( LLR) The CALICE-ECAL physics prototype

beam


1.37

1.38

1.39

1.4

1.41

1.42

1.43

1.44

1.45

thic

kn

ess (

mm

)

0 25 50 75 100 125 150 175 200 225 250 275 300 325 3500

75

length (mm)

width (mm)

thickness measurement (W n°1)1.44-1.45

1.43-1.44

1.42-1.43

1.41-1.42

1.4-1.41

1.39-1.4

1.38-1.39

1.37-1.38

1.37

1.38

1.39

1.4

1.41

1.42

1.43

1.44

1.45

1.46

thic

kn

ess (

mm

)

0 25 50 75 100 125 150 175 200 225 250 275 300 325 3500

75

length (mm)

width (mm)

thickness measurement (W n°2) 1.45-1.46

1.44-1.45

1.43-1.44

1.42-1.43

1.41-1.42

1.4-1.41

1.39-1.4

1.38-1.39

1.37-1.38

1.37

1.38

1.39

1.4

1.41

1.42

1.43

1.44

1.45

thic

kn

es

s (

mm

)

0 25 50 75 100 125 150 175 200 225 250 275 300 325 350

0

50

100

length (mm)

width (mm)

thickness measurement (W n°3)1.44-1.45

1.43-1.44

1.42-1.43

1.41-1.42

1.4-1.41

1.39-1.4

1.38-1.39

1.37-1.38

The first 3 tungsten plates The first 3 tungsten plates measured at LLRmeasured at LLR

It confirms the goodquality of the platesAs measured atIHEP and ITEP.Assuming no strongGeometrical correlationLike for the first 3 plates

Marginal impact on the energy resolution for single particle*

* Following MOKKA and GEANT4

Tungsten metrology


Front End electronics

(CFi / W) structure type H

PCB

Silicon wafer

Prototype configuration : using PCB solution + external Frond End

Shielding

Detector slab schematic view


Tungsten 1.4 mm thick Carbon fiber

Structure type H

Piece of the first structure

Structure W-Cfi 5 alveoli (10 layers)


Structure type HStructure type H with its aluminum shielding


DONEDONE The production of a sample of 40 tungsten plates starts. it corresponds to the first technological test and first stack of prototype

Production of the final set of masks for the silicon wafers and successful processing of the first 25 silicon wafers (DC coupled) at MSU

The design of the front-end chip is fixed. First batch for test in September.

Fall 2002Fall 2002 Processing and test of about 100 silicon wafers (PRAGUE, MSU, LLR)

Final submission of the VFE chip for the prototype (LAL)

Construction of the first 1/3 of the W-CFi structure of the prototype (LLR)

Summary on the ECAL prototype


Pad

Silicon wafer

PCB

Aluminium

Cooling tube Cooling tubeVFE chip

1.3 mm

1.0 mm

0.5 mm

Thermal contact

Gluing for electrical contact

AC coupling elements ?

power line command line signal out

A design with electronics inside detector

R&D on the new design of the full scale detector


A priori, all processes are uncorrelated (Si wafer , VFE chip , PCB,...) we could expect a good Industrial Yield

A priori, all processes are (quasi-)industrial The mounting of the detector slab is a classical job for electronics industrial

Probably easier access to VFE board (not so trivial argument) Technically, There are interesting challenges, BUT there are no orders of magnitude to gain Almost feasible today

What is the behaviour of a VFE chip when a 400 GeV e.m. Shower goes through ??

Thermal studies to design of a ``realistic’’ cooling system

Advantages

Drawbacks

Advantages and drawbacks


1 – Analytic calculation

2 – First simple test with SPICESPICE software

3 – A PCB prototype to validate SPICESPICE

4 – Very small grid size with SAMCEFSAMCEF software 5 - ``Realistic’’ PCB with cooling circuit SAMCEF-SPICE validation

Thermal studies

Participation at LLRParticipation at LLR M.Anduze , J.Badier , A.Karar ….


What we simulate

The analytic resultfor 6 ``VFE chips’’

Note the asymmetricTemperature peak

Heat points(VFE chip)

One of the 7 points ofmeasurements

Simulated cooling tube

PCB 1mm thick


The way to simulate with SPICE SPICE

The results

Point numbers

Degree K

Here differentlevel of coolingon the borderis applied

V=Temperature I=Caloric quantity


The time constant

Is very large Average calculationIs good enough

SPICE SPICE

REAL PROTO.The prototype is notexactly simulatedsince it is not insidea W-Cfi structure…And other ``small’’differences

It will be improved in the future

FIRST TESTon the time constant


SPICE SPICE is tested with the PCB prototype and use for the test of the dynamic of the system

When SPICESPICE is validated, it is used to give the condition at the limit for a more sophisticated software : SAMCEFSAMCEF

Try to find reasonable agreement between SPICE SPICE and SAMCEFSAMCEF and the measurement with the prototype

Use SAMCEFSAMCEF for the simulation of the full scale detector- heat source not pointlike- different caloric capacitance (PCB,VFE,strips,…)- very small grid size

The proposed

strategy


First simulation with SAMCEFSAMCEF software

Note the asymmetric behavior


New design of the detector slabNew design of the detector slabThermal studies begin ….The behavior of the VFE with 400 GeV e.m. shower ??? Volunteers !!!

TThe prototypehe prototype More or less in the scheduled time (ready for beam at the end of 2003) Carbon-fiber and tungsten have good behavior …

Conclusion

Beam 5<P<50 GeV/c

Pion/electron beam in 2004 –2005 ?????Pion/electron beam in 2004 –2005 ?????

Same problem for SLAC/Oregon design !!!Same problem for SLAC/Oregon design !!!

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