the drive to improved performance/watt and increasing compute density steve pawlowski intel senior...
TRANSCRIPT
The Drive to The Drive to Improved Improved
Performance/watt Performance/watt and Increasing and Increasing
Compute DensityCompute Density
Steve Pawlowski Steve Pawlowski Intel Senior FellowIntel Senior Fellow
GM, Architecture and PlanningGM, Architecture and PlanningCTO, Digital Enterprise GroupCTO, Digital Enterprise Group
Intel CorporationIntel Corporation
22
Legal DisclaimerLegal DisclaimerINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL® PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO RELATING TO SALE AND/OR USE OF INTEL® PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS. SAVING, OR LIFE SUSTAINING APPLICATIONS. Intel may make changes to specifications and product descriptions at any time, without notice.Intel may make changes to specifications and product descriptions at any time, without notice.All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.notice.Intel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the Intel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.product to deviate from published specifications. Current characterized errata are available on request.This document may contain information on products in the design phase of development. The information here is subject to This document may contain information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information. change without notice. Do not finalize a design with this information. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.from future changes to them.Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.property rights.Wireless connectivity and some features may require you to purchase additional software, services or external hardware. Wireless connectivity and some features may require you to purchase additional software, services or external hardware.
Nehalem, Penryn, Westmere, Sandy Bridge and other code names featured are used internally within Intel to identify Nehalem, Penryn, Westmere, Sandy Bridge and other code names featured are used internally within Intel to identify products that are in development and not yet publicly announced for release. Customers, licensees and other third parties products that are in development and not yet publicly announced for release. Customers, licensees and other third parties are not authorized by Intel to use code names in advertising, promotion or marketing of any product or services and any such are not authorized by Intel to use code names in advertising, promotion or marketing of any product or services and any such use of Intel's internal code names is at the sole risk of the user use of Intel's internal code names is at the sole risk of the user
Performance tests and ratings are measured using specific computer systems and/or components and reflect the Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. design or configuration may affect actual performance. Intel, Intel Inside, Pentium, Xeon, Core and the Intel logo are trademarks of Intel Corporation in the United States and other Intel, Intel Inside, Pentium, Xeon, Core and the Intel logo are trademarks of Intel Corporation in the United States and other countries. countries. *Other names and brands may be claimed as the property of others.*Other names and brands may be claimed as the property of others.Copyright © 2008 Intel Corporation.Copyright © 2008 Intel Corporation.
33
Green IT - #1 IT IssueGreen IT - #1 IT Issue
Energy Costs and Cooling #1 Growth Limiters…Energy Costs and Cooling #1 Growth Limiters…
Power and Cooling Capacity Limiting Growth
Source: Liebert Data Center User Group, Spring 2008
0% 20% 40% 60%
Cooling
Power Density
Availability Requirements
Data Center Monitoring
Energy Efficiency
Space
Consolidation “Intel and Google Join with Dell, EDS, EPA, HP, IBM, Lenovo, Microsoft, PG&E, World Wildlife Fund and Others to Launch Climate Savers Computing Initiative”
- Intel News Release, June 12, 2007
44
CERN’s Projected Computing Need vs. Power DensityCERN’s Projected Computing Need vs. Power Density
00
3000030000
4000040000
5000050000
2000020000
1000010000
6000060000
7000070000
8000080000
20082008 20092009 20102010
73000
63000
54000
16000
33000
20112011 20122012Source: “Strategies for increasing data centre power efficiency,” Dr. Andreas Hirstius, Sverre Jarp, Andrzej Nowak. CERN Openlab, 19 February 2008
kSPECInt2000Power (MW)
1.51.5
2.02.0
2.5 2.5 (CERN (CERN limit)limit)
2.5 or 2.5 or 5.0 ?5.0 ?
2008 to 2012:2008 to 2012: 4.5X (35% CAGR) computing density increase, but with 4.5X (35% CAGR) computing density increase, but with thermal limit of 2.5 MW to possible 5 MW (requires new facility)thermal limit of 2.5 MW to possible 5 MW (requires new facility)
55
Limitations Driving Server Compute Improvements Limitations Driving Server Compute Improvements
00
33
44
55
22
11
66
77
88
20082008 20092009 20102010
1.72.1
1
20112011 20122012
2.73.6
Nor
mal
ized
Que
ry P
er S
econ
d /
w
20132013 20142014
99
1010
5.3
7.6
11.7
5.1
7.8
13
2.1 2.73.6
5.2 5.6
Bandwidth with 2Level Memory
Constrained Memory Bandwidth
Unconstrained Memory Bandwidth
Intercept CERN’s Density Requirement for 4.5X compute @ 2.5MW
Assume: Constrained memory BW is pin limited with planned memory technology and frequency of the time frame: DDR3 speed up to 2133 MHz and 4 memory channels
Source: Intel, future computing density projection
66
Technology ConceptsTechnology Concepts
‘New Interface’Multiples of DDR3
BW
2Level memory provides potential TCO improvement 2Level memory provides potential TCO improvement
CPU
High density solutions for scale out workloadsHigh density solutions for scale out workloads
30-40W Low Power µBlade concept30-40W Low Power µBlade concept
Memory 1 Memory 2
Standard Memory Interface
77
Data Center InnovationsData Center Innovations
High density data centersHigh density data centers
Containerized data centersContainerized data centers
88
Innovations to Increase Compute DensityInnovations to Increase Compute Density
SiliconProcessSilicon
Process
Target 50% yearlyimprovements inperformance/watt
Target 50% yearlyimprovements inperformance/watt
YearYearCom
pute
Den
sity
Com
pute
Den
sity
Data CenterInnovation
Data CenterInnovation
PowerManagement
PowerManagement
SmallForm Factor
SmallForm Factor
NewTechnology
NewTechnology++ ++ ++ ++
Datacenter of the FutureDatacenter of the Future
Source: Intel, based on Intel YoY improvement with SpecPower Benchmark
99
BackupBackup