the drive to improved performance/watt and increasing compute density steve pawlowski intel senior...

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The Drive to The Drive to Improved Improved Performance/watt and Performance/watt and Increasing Compute Increasing Compute Density Density Steve Pawlowski Steve Pawlowski Intel Senior Fellow Intel Senior Fellow GM, Architecture and GM, Architecture and Planning Planning CTO, Digital Enterprise CTO, Digital Enterprise Group Group Intel Corporation Intel Corporation

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Page 1: The Drive to Improved Performance/watt and Increasing Compute Density Steve Pawlowski Intel Senior Fellow GM, Architecture and Planning CTO, Digital Enterprise

The Drive to The Drive to Improved Improved

Performance/watt Performance/watt and Increasing and Increasing

Compute DensityCompute Density

Steve Pawlowski Steve Pawlowski Intel Senior FellowIntel Senior Fellow

GM, Architecture and PlanningGM, Architecture and PlanningCTO, Digital Enterprise GroupCTO, Digital Enterprise Group

Intel CorporationIntel Corporation

Page 2: The Drive to Improved Performance/watt and Increasing Compute Density Steve Pawlowski Intel Senior Fellow GM, Architecture and Planning CTO, Digital Enterprise

22

Legal DisclaimerLegal DisclaimerINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL® PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO RELATING TO SALE AND/OR USE OF INTEL® PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS. SAVING, OR LIFE SUSTAINING APPLICATIONS. Intel may make changes to specifications and product descriptions at any time, without notice.Intel may make changes to specifications and product descriptions at any time, without notice.All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.notice.Intel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the Intel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.product to deviate from published specifications. Current characterized errata are available on request.This document may contain information on products in the design phase of development. The information here is subject to This document may contain information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information. change without notice. Do not finalize a design with this information. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.from future changes to them.Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.property rights.Wireless connectivity and some features may require you to purchase additional software, services or external hardware. Wireless connectivity and some features may require you to purchase additional software, services or external hardware.

Nehalem, Penryn, Westmere, Sandy Bridge and other code names featured are used internally within Intel to identify Nehalem, Penryn, Westmere, Sandy Bridge and other code names featured are used internally within Intel to identify products that are in development and not yet publicly announced for release. Customers, licensees and other third parties products that are in development and not yet publicly announced for release. Customers, licensees and other third parties are not authorized by Intel to use code names in advertising, promotion or marketing of any product or services and any such are not authorized by Intel to use code names in advertising, promotion or marketing of any product or services and any such use of Intel's internal code names is at the sole risk of the user use of Intel's internal code names is at the sole risk of the user

Performance tests and ratings are measured using specific computer systems and/or components and reflect the Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. design or configuration may affect actual performance. Intel, Intel Inside, Pentium, Xeon, Core and the Intel logo are trademarks of Intel Corporation in the United States and other Intel, Intel Inside, Pentium, Xeon, Core and the Intel logo are trademarks of Intel Corporation in the United States and other countries. countries. *Other names and brands may be claimed as the property of others.*Other names and brands may be claimed as the property of others.Copyright © 2008 Intel Corporation.Copyright © 2008 Intel Corporation.

Page 3: The Drive to Improved Performance/watt and Increasing Compute Density Steve Pawlowski Intel Senior Fellow GM, Architecture and Planning CTO, Digital Enterprise

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Green IT - #1 IT IssueGreen IT - #1 IT Issue

Energy Costs and Cooling #1 Growth Limiters…Energy Costs and Cooling #1 Growth Limiters…

Power and Cooling Capacity Limiting Growth

Source: Liebert Data Center User Group, Spring 2008

0% 20% 40% 60%

Cooling

Power Density

Availability Requirements

Data Center Monitoring

Energy Efficiency

Space

Consolidation “Intel and Google Join with Dell, EDS, EPA, HP, IBM, Lenovo, Microsoft, PG&E, World Wildlife Fund and Others to Launch Climate Savers Computing Initiative”

- Intel News Release, June 12, 2007

Page 4: The Drive to Improved Performance/watt and Increasing Compute Density Steve Pawlowski Intel Senior Fellow GM, Architecture and Planning CTO, Digital Enterprise

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CERN’s Projected Computing Need vs. Power DensityCERN’s Projected Computing Need vs. Power Density

00

3000030000

4000040000

5000050000

2000020000

1000010000

6000060000

7000070000

8000080000

20082008 20092009 20102010

73000

63000

54000

16000

33000

20112011 20122012Source: “Strategies for increasing data centre power efficiency,” Dr. Andreas Hirstius, Sverre Jarp, Andrzej Nowak. CERN Openlab, 19 February 2008

kSPECInt2000Power (MW)

1.51.5

2.02.0

2.5 2.5 (CERN (CERN limit)limit)

2.5 or 2.5 or 5.0 ?5.0 ?

2008 to 2012:2008 to 2012: 4.5X (35% CAGR) computing density increase, but with 4.5X (35% CAGR) computing density increase, but with thermal limit of 2.5 MW to possible 5 MW (requires new facility)thermal limit of 2.5 MW to possible 5 MW (requires new facility)

Page 5: The Drive to Improved Performance/watt and Increasing Compute Density Steve Pawlowski Intel Senior Fellow GM, Architecture and Planning CTO, Digital Enterprise

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Limitations Driving Server Compute Improvements Limitations Driving Server Compute Improvements

00

33

44

55

22

11

66

77

88

20082008 20092009 20102010

1.72.1

1

20112011 20122012

2.73.6

Nor

mal

ized

Que

ry P

er S

econ

d /

w

20132013 20142014

99

1010

5.3

7.6

11.7

5.1

7.8

13

2.1 2.73.6

5.2 5.6

Bandwidth with 2Level Memory

Constrained Memory Bandwidth

Unconstrained Memory Bandwidth

Intercept CERN’s Density Requirement for 4.5X compute @ 2.5MW

Assume: Constrained memory BW is pin limited with planned memory technology and frequency of the time frame: DDR3 speed up to 2133 MHz and 4 memory channels

Source: Intel, future computing density projection

Page 6: The Drive to Improved Performance/watt and Increasing Compute Density Steve Pawlowski Intel Senior Fellow GM, Architecture and Planning CTO, Digital Enterprise

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Technology ConceptsTechnology Concepts

‘New Interface’Multiples of DDR3

BW

2Level memory provides potential TCO improvement 2Level memory provides potential TCO improvement

CPU

High density solutions for scale out workloadsHigh density solutions for scale out workloads

30-40W Low Power µBlade concept30-40W Low Power µBlade concept

Memory 1 Memory 2

Standard Memory Interface

Page 7: The Drive to Improved Performance/watt and Increasing Compute Density Steve Pawlowski Intel Senior Fellow GM, Architecture and Planning CTO, Digital Enterprise

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Data Center InnovationsData Center Innovations

High density data centersHigh density data centers

Containerized data centersContainerized data centers

Page 8: The Drive to Improved Performance/watt and Increasing Compute Density Steve Pawlowski Intel Senior Fellow GM, Architecture and Planning CTO, Digital Enterprise

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Innovations to Increase Compute DensityInnovations to Increase Compute Density

SiliconProcessSilicon

Process

Target 50% yearlyimprovements inperformance/watt

Target 50% yearlyimprovements inperformance/watt

YearYearCom

pute

Den

sity

Com

pute

Den

sity

Data CenterInnovation

Data CenterInnovation

PowerManagement

PowerManagement

SmallForm Factor

SmallForm Factor

NewTechnology

NewTechnology++ ++ ++ ++

Datacenter of the FutureDatacenter of the Future

Source: Intel, based on Intel YoY improvement with SpecPower Benchmark

Page 9: The Drive to Improved Performance/watt and Increasing Compute Density Steve Pawlowski Intel Senior Fellow GM, Architecture and Planning CTO, Digital Enterprise

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