The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

the product:the product:

ALPHA®

EF-2210product guide

Balance your concern for worker safety and environmental care with soldering performance and electrical reliability

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

Contents

TOPIC PAGE

Introduction/Features-Benefits 3Health, Safety and Environment 4Soldering Performance: 5-10

SMT – SACX 5-6SMT - SAC305 7Through Hole - SACX 8Through Hole – SAC305 9Through Hole – Tin Lead 10

Pin Test Yield 11Electrical Reliability 12Product Data 13Flux Residue and Joint Cosmetics 14Application Guidelines 15Summary of Properties 16Technical Data Sheet & MSDS 17

EF-2210

2

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

Introduction

ALPHA EF-2210 is a newly designed VOC-Free, Rosin-Free, No-Clean Flux that uses the latest innovations to deliver best in class soldering performance and reliability. EF-2210 performs well with either tin-lead or lead-free alloys and a variety of machine configurations using eitherconventional or ultrasonic sprayers. Users enjoy excellent performance with the added benefit of knowing that EF-2210 is good for the environment and safe to use!

3

EF-2210

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 4

VOC-Free FormulaSafe for Human Health and the Environment

EF-2210

• Non-Flammable, Non-Combustible

• No need to control VOC emissions

• Non-toxic• Odor Free• Does not contain

“sensitizing” agents

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 5

EF-2210Next Generation VOC-Free FormulaEnabling Lead-Free Soldering – SACX – Low Silver Alloy“Best-in-Class” performance on the surface

PROCESS CONDITIONS SACX LOW SACX MEDIUM SACX HIGHConveyor Speed (ft./min): 6 4.5 3Board Type / Finish: FR4 / Entek HT FR4 / Entek Plus FR4 / Entek HTThermal Profile: Glue cure Glue cure + 1 LF Reflow Glue cure + 1 LF ReflowPot Temperature: 255°C 260°C 265°CTop-Side Preheat: 105°C 110°C 120°CFlux Loading (µg/in2): 1600 1800 1900

Best-in-class bridging performance.Consistently out-performs the leading competitor for all process / temperature conditions 0.00

0.10

0.20

0.30

0.40

0.50

0.60

0.70

Average Number of

Bridges per AGP

connector

Low Medium High

Process Conditions

EF-2210 Leading Competitor

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 6

EF-2210Next Generation VOC-Free FormulaEnabling Lead-Free Soldering – SACX – Low Silver Alloy“Best-in-Class” performance on the surface

PROCESS CONDITIONS SACX LOWConveyor Speed (ft./min): 6Board Type / Finish: FR4 / Entek HTThermal Profile: Glue curePot Temperature: 255°CTop-Side Preheat: 105°CFlux Loading (µg/in2): 1600

Superior resistance to bridgingwith QFP components

0.001.002.003.004.005.006.00

Average Number of

Bridges per 0.8mm QFP

Low

Process Conditions

EF-2210 Leading Competitor

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 7

EF-2210Next Generation VOC-Free FormulaEnabling Lead-Free Soldering – SAC305“Best-in-Class” performance on the surface

MinimalMicro-Solder Balling

0.00

10.00

20.00

30.00

40.00

50.00

Average Number of

Solder balls per AGP

connector

Medium - Entek HT Medium - Entek Plus

Process Conditions

EF-2210 Leading Competitor

PROCESS CONDITIONS SAC305 MEDIUM SAC305 MEDIUMConveyor Speed (ft./min): 4.6 4.6Board Type / Finish: FR4 / Entek HT FR4 / Entek PlusThermal Profile: Glue cure + 1 LF Reflow Glue cure + 1 LF ReflowPot Temperature: 265°C 265°CTop-Side Preheat: 112°C 112°CFlux Loading (µg/in2): 1500 1500

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 8

EF-2210Next Generation VOC-Free FormulaEnabling Lead-Free Soldering – SACX“Best-in-Class” performance in the holes

Alloy SACX0307Wave (single/Dual) DualPWB Type FR4Pad Finish Entek HTThermal Profile Glue CureConveyor speed 6.0'/minPot temperature 255°CTop-side preheat 105°CFlux loading (ug/in2) 1600

ALPHA EF-2210 exhibits

Superior Hole FillFor the most popular hole

sizes using SACX0

20

40

60

80

100

% H

ole

Fill

Avg 20mil Hole-Fill Avg 40mil Hole-Fill

ALPHA EF-2210 Leading Competitor

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 9

EF-2210Next Generation VOC-Free FormulaEnabling Lead-Free Soldering – SAC305 Alloy“Best-in-Class” performance in the holes

Alloy SAC305Wave (single/Dual) DualPWB Type FR4Pad Finish Entek HTThermal Profile GC + 1

Lead-free Conveyor speed 4.59'/minPot temperature 265°CTop-side preheat 112°CFlux loading (ug/in2) 1500

With SAC305 ALPHA EF-2210 also exhibits Superior Hole Fill

0

20

40

60

80

100

Ave

rage

Hol

e-Fi

ll (%

)

10mil 15mil 20mil 40mil

Hole Diameter

EF-2210 Leading Competitor

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

50556065707580859095

Hole Fill %

Avg 15mil Hole-Fill Avg 20mil Hole-Fill Avg 40mil Hole-Fill

ALPHA EF-2210 Hole Fill Results SnPb

10

EF-2210Next Generation VOC-Free FormulaEnabling Tin Lead Soldering – SnPb“Best-in-Class” performance on the surface

PROCESS CONDITIONS SnPb MEDIUMConveyor Speed (ft./min): 4.5Board Type / Finish: FR4 / Entek OSPThermal Profile: Glue cure + 1 SnPb ReflowPot Temperature: 245°CTop-Side Preheat: 105°CFlux Loading (µg/in2): 1300

DefectEF-2210

Leading Competitor

Avg Bridges/Connector 0.00 0.30Average Bridges/0.8mm QFP 0.00 0.00Ave SBs/per PCI connector 59.05 65.15

AlloySn63Pb37

Tin Lead (SnPb) Capable

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 11

• 100% First Pass Yield after 12,000 Contacts in both Tin-Lead and Lead-Free Applications

• Worry Free In-Circuit Pin Testing

EF-2210Next Generation VOC-Free FormulaPin Test Data

Note: FNV0603A is lab name for ALPHA EF-2210

After 4,000 probes After 12,000 probes

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 12

EF-2210Next Generation VOC-Free FormulaThe most reliable VOC-Free, Rosin-Free flux on the market

FAILBased on independent 3rd party

tests

PASSComb Down 2.1 x 10¹¹

Comb Up 2.3 x 10¹¹Bellcore GR-78-CORE SIR test

PASS

PASS

PASS

PASS

EF-2210

PASSIPC SIR Testing / Bellcore EM•J-STD-004A and J-STD-001D

Low CorrosionCopper Corrosion Test

IPC-TM 650 Test Method 2.6.15

Low BreakthroughCopper Mirror Tests

IPC-TM 650 Test Method 2.3.32

PASSSilver Chromate Paper

IPC-TM 650 Test Method 2.3.33

Leading CompetitorReliability Test

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 13

EF-2210Next Generation VOC-Free FormulaProduct Data

Physical Properties Typical Values Parameters/Test Method Typical ValuesAppearance Clear, Colorless Liquid pH 2.2Solids Content, wt/wt 4.0 Recommended Thinner DI WaterSpecific Gravity @ 25°C (77°C)

1.015 ± 0.003 Shelf Life 18 months

Acid Number (mg KOH/g) 31.5 ± 2.0 VOC content <1%

Flash Point (T.C.C.) None IPC J-STD-004 Designation ORL0

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 14

Flux Residue Cosmetics: Clear, colorless, non-tacky flux residues uniformly spread over the surface of the board.

Solder Joint Cosmetics: Smooth solder joints typical of both tin-lead and lead-free alloys

EF-2210Next Generation VOC-Free FormulaFlux Residue and Joint Cosmetics

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 15

Next Generation VOC-Free FormulaApplication Guidelines

EF-2210

GENERAL GUIDELINES FOR MACHINE SETTINGS

These are general guidelines which have proven to yield excellent results; however, depending upon your equipment, components, and circuit boards, your optimal settings may be different. In order to optimize your process, it is recommended to perform a design experiment, optimizing the most important variables (amount of flux applied, conveyor speed, topside preheat temperature, solder pot temperature and board orientation).

255 - 270°C (500 - 520°F) Lead-Free Alloys (99.3Sn/0.7Cu, 96.5/3.5Ag, SAC305 & SAC405)

235 - 260°C (460 - 500°F) Sn63/Pb37 AlloySolder Pot Temperature:

2 - 7 seconds (3 - 5 seconds most common)Contact Time in the Solder (includes Chip Wave and Primary Wave)

2.0 - 6.5 feet/minute Conveyor Speed5 - 8° (6° most common)Conveyor Angle

2°C/second (3.5°F/second) maximumMaximum Ramp Rate of Topside Temperature (to avoid component damage)

Straight ramp to desired top-side temperatureRecommended Preheat Profile0 to +22°C (0 to +40°F) vs. Top-SideBottom side Preheat Temperature

95 - 115°C (220 - 240°F)Top-Side Preheat TemperatureSpray: <2000 μg/in2 of solidsAmount of Flux Applied

TYPICAL LEVELOPERATING PARAMETER

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

Application Bulletin

• Distributed with launch• Guidance for Sls / Apps

personnel when performing trial on site

255-260°CSolder Pot Temperature: Lead-Free Alloys

4-8 Seconds depending on Pad Finish and Board Thickness (see AB)

Contact Time in the Solder (includes Chip Wave and Primary Wave)

60-80 secondsTotal Pre-heat Time110-120°C for 15-25 secondsBottom side Preheat Temperature95-105°C for 15-25 secondsTop-Side Preheat Temperature

Spray: 1000-1300 μg/in2 of solidsFlux LoadingTYPICAL LEVELOPERATING PARAMETER

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 16

Next Generation VOC-Free FormulaSummary of PropertiesCompatibility with most popular PC fabrication materials:

• All leading pad finishes including - Entek® Plus and Entek® HT OSP, Immersion Silver, HASL and Rosin-coated finishes• FR4 and FR2 board types• Taiyo PSR4000 and Enthone LPI solder masks

Electrical Reliability• Telecordia (Bellcore) SIR and IPC SIR Compliant • Meets Telecordia (Bellcore) and IPC Electromigration (EM) Requirements• ORL0 Classification per IPC J-STD-004

Process Applications• Tin-Lead or Lead-Free Alloys• Spray Fluxing• Minimal Equipment Maintenance vs. Rosin-Bearing Fluxes• Highly Compatible with Pallets/Selective Soldering • Consistent deposition volumes vs. alcohol (loss from alcohol volatilization)

EF-2210

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

Click on the links below to view documents

Next Generation VOC-Free FormulaTechnical Bulletin and MSDS

EF-2210

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