timing analysis and optimization implications of bimodal cd distribution in double patterning...
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Timing Analysis and Optimization Implications of Bimodal CD Distribution
in Double Patterning Lithography
Kwangok Jeong and Andrew B. Kahng
VLSI CAD LABORATORYUC San Diego
http://vlsicad.ucsd.edu/
Research supported by STARC
ASP-DAC Session 5B, January 21, 2009
VLSI CAD LABORATORY, UCSD <2/15>
Motivation
Single exposure lithography All shapes printed by one exposure Adjacent identical features have same mean CD (critical
dimension), and spatially correlated CD variations Double patterning lithography (DPL)
Shapes are decomposed and printed in two exposures Adjacent features can have different mean CD, and
uncorrelated CD variations
New set of ‘bimodal’ challenges for timing analysis and optimization
VLSI CAD LABORATORY, UCSD <3/15>
DPL Approaches
Print lines
Misalignment No CD difference between two adjacent lines
CD control is key factor
Print edges
Exposure difference No CD difference between two adjacent lines
Overlay control is key factor
CD variationw/o misalignment
1st Exp./Etch 2nd Etch
1st Exp./Etch
CD variationw/ misalignment
2nd Etch1st Exp. & Etch
Poly
Hardmask
Final patterns
Resist
2nd Exp.
1st Exp. 2nd Exp.
1st Exp. 2nd Exp.1st Exp.
Final patterns
Poly
2nd Exp.
Resist
CD variationw/o misalignment
CD variationw/ misalignment
VLSI CAD LABORATORY, UCSD <4/15>
Bimodal CD Distribution
Two CD distributions and Two different colorings Two different timings
This Research Assess potential impact of bimodal CD distribution on
timing analysis and guardbanding Cell delay and power, path delay, clock skew, path timing slack
Seek potential solutions to minimize the impact of bimodal CD distribution
M12-type cell M21-type cell
Gates from CD group1Gates from CD group2
VLSI CAD LABORATORY, UCSD <5/15>
Impact on Path Delay Variation
Simulation results Mean and sigma of a long
inverter chain (16 stages)over all process corners (Min and Max combinations)
Alternately-colored paths smaller path delay variation 6.0
8.0
10.0
12.0
14.0
16.0
18.0
M1-M1-… M1-M2-… M2-M1-… M2-M2-…
Sig
ma
/ Mea
n (%
)
Path configurations
0n 1n 2n
3n 4n 5n
6n
16-stage
2-types 2-types 2-types 2-types
Covariance worsens path delay variation
Simulation setup 45nm PTM, Typical corner (TT), 1.0V, 25 °C 16 stages of 45nm INVX4 (Nangate Open Cell Library)
Each cell can have two different colorings Each color (Mask 1 or 2) can have two different process results
(Min or Max)
VLSI CAD LABORATORY, UCSD <6/15>
Impact on Timing Slack (Analysis)
Timing slack calculation Timing slack: Timing slack variation:
Clock skew Especially, clock skew from uncorrelated launching and
capturing clock paths are the major source of timing slack variation.
Example
pathdatacyclepathclockslack TTTT __
pathdatapathclockTTT TTpathdatapathclockslack __
222 ,cov2__
Large correlation is better for timing slack
Data (10 2 = 8~12ns)
Clock (10 2 = 8~12ns)
Worst slack = 5 5 = 0ns
Worst slack = min(clock) – max(data) = 8 12 = 4ns
Worst slack = 15 15 = 0ns
(a) Worst slack in DPLSmall delay variation
but large negative slack
(b) Worst slack in single exp.Large delay variation
but zero slack
Data (10 – 5 = 5ns)
Clock (10 – 5 = 5ns)
Data (10 + 5 = 15ns)
Clock (10 + 5 = 15ns)
BC
WC
VLSI CAD LABORATORY, UCSD <7/15>
Impact on Timing Slack (Simulation Setup) Testcase
AES from Opencores, Nangate 45nm library, PTM 45nm Extracted critical path
Clock launch: 14 stages
Clock capture: 14 stages
Data path: 30 stages
• Exhaustive tests (4 x 254) not feasible, so we fix the data path coloring.
Case Launch Capture1 M12+M12… M12+M12…
2 M21+M21… M21+M21…
3 M12+M12… M21+M21…
4 M21+M21… M12+M12…
5 M12+M21… M12+M21…
M1 M2
Mean 3s Mean 3s
CD Mean
Uni-modal
50.00 2.00 - -
0nmPooled 50.00 2.00 - -
Bimodal 50.00 2.00 50.00 2.00
1nmPooled 50.00 2.50 - -
Bimodal 49.50 2.00 50.50 2.00
2nmPooled 50.00 3.61 - -
Bimodal 49.00 2.00 51.00 2.00
3nmPooled 50.00 4.92 - -
Bimodal 48.50 2.00 51.50 2.00
4nmPooled 50.00 6.32 - -
Bimodal 48.00 2.00 52.00 2.00
5nmPooled 50.00 7.76 - -
Bimodal 47.50 2.00 52.50 2.00
6nmPooled 50.00 9.22 - -
Bimodal 47.00 2.00 53.00 2.00
VLSI CAD LABORATORY, UCSD <8/15>
Impact on Timing Slack (Simulation Results)
Clock skew Even for the zero mean
difference case, clock skew exists and increases with mean difference
Pooled unimodal can not distinguish this clock skew
Timing slack Originally zero slack turns
out to have significant negative slack
Pooled unimodal shows very pessimistic slack
Timing slack (s) for MAX-MAX combination
-3.00E-10
-2.50E-10
-2.00E-10
-1.50E-10
-1.00E-10
-5.00E-11
0.00E+00
5.00E-11
1.00E-10
0nm 1nm 2nm 3nm 4nm 5nm 6nm
Mean difference (nm)
Sla
ck (
s)
Unimodal (Pooled)
Bimodal (case1)
Bimodal (case2)
Bimodal (case3)
Bimodal (case4)
Bimodal (case5)0.00E+00
1.00E-11
2.00E-11
3.00E-11
4.00E-11
5.00E-11
6.00E-11
0nm 1nm 2nm 3nm 4nm 5nm 6nm
Mean difference (nm)
Clo
ck s
kew
(s)
Launch (G12+G12...), Capture (G12+G12...)
Launch (G21+G21...), Capture (G21+G21...)
Launch (G12+G12...), Capture (G21+G21...)
Launch (G21+G21...), Capture (G12+G12...)
Launch (G12+G21...), Capture (G12+G21...)
22ps
53ps
Cases 1, 2, 5
VLSI CAD LABORATORY, UCSD <9/15>
Possible Solutions for Timing Optimization Self-compensation
Alternative coloring of timing paths reduce variation Same coloring sequence for clock network reduce clock skew But: restricted coloring can increase coloring conflicts
Solutions for coloring conflicts Candidate1: large sized cells to prevent conflicts between cells
Candidate2: Placement legalization after coloring (like UCSD *Corr)
2dpb Resmin
(a) Conflict (b) No conflict
2dpb Resmin
dpb
dpb: distance from poly center
to cell boundary
Resmin: minimum resolution
(a) Original placement (b) Alternative coloring
Coloring-fixed cells
Logical connection
Coloring conflict
(c) Conflict Removal
> Resmin
VLSI CAD LABORATORY, UCSD <10/15>
Self-Compensation Is Not Enough Self-compensation in path coloring reduces delay
variation, but bimodal CD impact is still significant
CD Mean Diff
Rise delay (ps)
Path1 Path2
0n 646.7 646.7
2n 615.4 671.3
4n 587.0 705.0
6n 550.4 736.1
CD Mean Diff
Rise delay (ps)
Path1 Path2
0n 646.7 646.7
2n 630.0 656.4
4n 614.5 674.8
6n 604.6 679.4Better, but can still have timing violations
After self-compensation
path1
path2
Two 9-stage timing paths
path1
path2
Each stage-FO4 model-50um wire
140nm
70nm
70nm
VLSI CAD LABORATORY, UCSD <11/15>
BEOL Compensation of Measured FEOL CD
UCSD: “Design-Aware Process Adaptation” FEOL metrology intentional BEOL CD biasing
DPL allows wire segments in different masks to change CD independently
Color interconnects differently for different CD groups F-factor = (in)flexibility factor for interconnect coloring, e.g., F=1,
All wire segments connected to CD_group1 gates must be in INT_MASK1 All wire segments connected to CD_group2 gates must be in INT_MASK2
path1
path2
path1
path2
VLSI CAD LABORATORY, UCSD <12/15>
Compensation with BEOL Biasing Small CD gates thick interconnect (large cap.) Large CD gates thin interconnect (small cap.) Example for F=0.8 (80% of interconnects colored according to the gate CD groups)
CD Mean Diff
Rise delay (ps)
InterconnectModel
Path1 Path2
Nominal (nm)
Width Space
0n 646.7 646.7 0.07 0.07
2n 630.0 656.4 0.07 0.07
4n 614.5 674.8 0.07 0.07
6n 604.6 679.4 0.07 0.07
CD Mean Diff
Rise delay (ps)
InterconnectModel (biasing)
Path1 Path2
INT1 (80%)
INT2(20%)
Space
Width Width
0n 646.7 646.7 0.07 0.07 0.07
2n 618.2 646.7 0.071 0.063 0.073
4n 601.6 646.7 0.072 0.058 0.075
6n 585.1 652.3 0.075 0.053 0.076
meet timing Change metal/ILD thickness?
VLSI CAD LABORATORY, UCSD <13/15>
Conclusions
Analytical and empirical assessments of DPL potential impact on timing analysis error and design guardband
Traditional ‘unimodal’ analysis may not be viable for DPL
Our analysis: 20% or greater change in timing
Self-compensation strategies, along with BEOL biasing, can reduce impact of bimodal CD variation
Work at UCSD: “Design-Aware Process Adaptation”
Ongoing work: more accurate, efficient and practical solutions to ‘bimodal-awareness’ challenges in timing analysis and circuit optimization
BACKUP
VLSI CAD LABORATORY, UCSD <15/15>
Impact on Cell Delay and Power Monte Carlo simulations : #10K
DPL1: (2n-1)-th gate is group1 and 2n-th gate is group2 DPL2: 2n-th gate is group1 and (2n-1)-th gate is group2 Unimodal: CD distribution covers CDgroup1 CDgroup2
Unimodal representation is too pessimistic Characteristics of DPL1 and DPL2 are very different!
Delay (mean)
4.65E-11
4.70E-11
4.75E-11
4.80E-11
4.85E-11
4.90E-11
4.95E-11
5.00E-11
DPL1 DPL2 DPL1 DPL2
Bimodal Unimodal Bimodal Unimodal
Delay (sigma)
0
5E-13
1E-12
1.5E-12
2E-12
2.5E-12
DPL1 DPL2 DPL1 DPL2
Bimodal Unimodal Bimodal Unimodal
Leakage (mean)
0.00E+00
1.00E-08
2.00E-08
3.00E-08
4.00E-08
5.00E-08
DPL1 DPL2 DPL1 DPL2
Bimodal Unimodal Bimodal Unimodal
Leakage (sigma)
0.00E+00
5.00E-07
1.00E-06
1.50E-06
2.00E-06
DPL1 DPL2 DPL1 DPL2
Bimodal Unimodal Bimodal Unimodal
risefall
risefall
Input 1Input 0
Input 1Input 0605954 61
Bimodalgroup1
Bimodalgroup2
Worst CDBest CD
Unimodal
56 64 66
nmσnmMean
nmσnm, Mean
nmσnm, Mean
uniuni
GG
GG
63 ,60
53 61
53 59
22
11
2n
VLSI CAD LABORATORY, UCSD <16/15>
Impact on Design Guardband
Comparison of required design guardband
Unimodal approximation: conservative but easy Lead to over-design But can use conventional flow
Bimodal-aware: realistic but complex method New bimodal-aware timing analysis and new timing-driven
design optimizations are required
0.00E+00
5.00E-12
1.00E-11
1.50E-11
2.00E-11
2.50E-11
3.00E-11
1 nm 2 nm 3 nm 4 nm 5 nm 6 nm
De
lay
(s)
Mean Difference
Worst case: Large CD groupBest case: Large CD groupWorst case: Small CD groupBest case: Small CD groupWorst case: Pooled CDBest case: Pooled CD
Timing guardbandfor large CD group
Timing guardbandfor small CD group
Timing guardbandfor pooled-unimodal