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2009 TLMI Technical Conference2009 TLMI Technical Conference2009 TLMI Technical Conference
SmartTLMI Technical Conference
SmartTLMI Technical Conference
Printed Circuit Applications
Daniel GamotaPrintovate, [email protected]
SmartTLMI Technical Conference
Fabrication Techniques Used for Printed ElectronicsFabrication Techniques Used for Printed Electronics
§Thin Film Deposition– Physical Vapor Deposition (sputtering, pulsed laser, etc.)– Chemical Vapor Deposition (PECVD)– Molecular Beam Epitaxy (MBE)– Atomic Layer Deposition (ALD)– Spin coating
§Pattern Transfer– Photolithography– Nanolithography– Soft Lithography– Liquid Imaging
§Implantation– Ion Implantation– Diffusion Furnace
§Removal– Reactive Ion Etch– Dry Etch, Wet Etch– Plasma Ashing– Chemical Mechanical Planarization
An all-printed or a hybrid manufacturing platform may be optimal for a particular process flow (cost, yield, scalability, product design flexibility).
§Gravure
§Flexography
§Screen
§Jetting
§Embossing
Traditional Electronics Processes Emerging Electronics Processes
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Intel 4044 Processor Intel 4044 Processor –– Silicon Integrated Circuit HistorySilicon Integrated Circuit History
Image courtesy: Intel website
• Introduced in Nov, 1971 • 2300 transistors• 10µm channel length• Composed of 5 layers• Four-bit microprocessor
• Four-bit adder for doing additions• An accumulator for keeping track of partial sums• 16 registers for temporary storage.
Image courtesy: Technologyevalngelist.com
Image courtesy: Intel website
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Evolution Evolution -- IP LandscapeIP Landscape
Source: USPTO
0
200
400
600
800
1000
1200
1400
1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008
Filed and Granted Granted
Increasing IP Trend Fueled by• Startups• Increased activities in Asia • Focused efforts in Europe
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Industry ParticipantsIndustry Participants
SmartTLMI Technical Conference
Commercial High Volume ProductionCommercial High Volume Production
Printed Traces on Flex
Solder Interconnects
Encapsulation and Fluxing
§ Printed Conductive Traces– Screen– Stencil
§ Printed Electrical Interconnects– Screen– Stencil– Micro-dispensing– Jetting
§ Printed RFID Antenna – Screen– Flexo
§ Microelectronics Encapsulation and Flux Dispensing– Micro-dispensing– Jetting
Printed RFID Antenna
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““NearNear”” Commercial High Volume ProductionCommercial High Volume Production
Printed Photovoltaics§ Printed Energy
- Screen - Flexo - Litho
§ Printed Displays- Screen - Inkjet- Laser induced forward transfer
§ Printed Lighting- Screen- Inkjet
Printed Lighting
Printed Displays
Printed Batteries
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Printed Electronics Key Attributes & OpportunitiesPrinted Electronics Key Attributes & Opportunities
§Conformal
§ Large area
§Distributed
§ Low cost
§ Low profile
§Drop resistant
§Easy integrationLogic
Sensors
PowerDisplays
SignageLighting
$300B opportunity by 2025. (Nanomarkets, IDTechEx)
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Industry Technology Development EffortsIndustry Technology Development Efforts
• Etched Channel Gap
• Channel
Gap
Oversized
Undersize
d
Tolerance Limitation±5 um
0
10
20
30
40
50
60
0 10 20 30 40 50 60
Etch
ed G
ap[u
m]
Designed Gap [um]
Gravure CylindersNanoscale Inorganic Materials
Grasshopper Test Vehicle
RFID Circuit Design
Higher Performance Inks
Finer Printed Channels
Increased Circuit Density
SmartTLMI Technical Conference
AllAll--Printed Field Effect Transistor Structure Printed Field Effect Transistor Structure ––Building Block for Printed Integrated CircuitBuilding Block for Printed Integrated Circuit
Flexible Substrate• Plastic• Paper
G
Conductors• PTF conductors• Conductive polymers• Organo-metallics• Nanoparticle inks• Metal foils
Dielectrics• PTF dielectrics• Polymer• Oxides
S D
Actives• Polymers• Oligomers• Inorganics
Active
SubstrateDielectric
Conductor
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Large Area Printed Electronic SystemsLarge Area Printed Electronic Systems
§ System Elements (Devices and Components)– Power§ Solar/PV§ Primary/Secondary batteries§ Wireless charging - Inductive coupling
– Energy Storage§ Super capacitors
– Input/Output§ Displays§ Keyboard, touchpanel
– Memory§ ROM
– Computation and Processing§ Integrated circuits§ Passive components (resistors, capacitors, inductors)
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Cost ModelCost Model
Equipment• Number of cells / line balancing
• Custom tooling• Testing• Scribing• Integration• Reclamation cells
• Static assist• Tool life
Planarize Electrode Dielectric Electrode Active Test
Facilities• Area• Power• Plumbing• Environmental control (O2, RH, temperature)
Labor• Cycle time• Number of workers
Design• Usable image carrier size
• Layer-layer registration• Design rules• Interconnect structures
Process flow• Set-up time• Processing time • Clean-out time• Materials replenishment• Scrap rate
Product• Quantity• Production volume
Materials• Active materials
• Consumables• Pot life• Shelf life• Storage
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Roadmap Roadmap –– Working Group (> 100 Participants)Working Group (> 100 Participants)
• Engaged printers, printing equipment, electronic equipment, and materials suppliers to build a supply chain based roadmap for Large Area Flexible Electronics
• Completed 2nd Large Area Printed Electronics Roadmap September ‘08
• Released Roadmap January ‘09 (http://www.inemi.org/)
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Next Cycle of Roadmap Next Cycle of Roadmap –– 33rdrd Release of RoadmapRelease of Roadmap
• Join the iNEMI Large Area Electronics Working Group – requesting individual contributors and new leaders
• Working Group will explore the need/likelihood of creating collaborative projects in this emerging space e.g. printing displays, printing PV, printing lighting
• For more information contact: Jim McElroy - [email protected] Gamota - [email protected]
http://www.inemi.org/
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Convergence of Two Worlds Convergence of Two Worlds -- Birth of a New IndustryBirth of a New Industry
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AcknowledgementsAcknowledgements
• Printovate Team