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DESCRIPTION
Taiwan laying-open applicationTRANSCRIPT
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Composition and method for cleaning semiconductor substrates
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The compositions and methods herein relate to the method for the removal of residues
and contaminants from metal or dielectric surfaces. Particularly, a composition and method of
cleaning residues after chemical mechanical polishing of a copper or aluminum surface of the
semiconductor substrates. A method of cleaning semiconductor substrates comprising contacting
the substrates with a solution of water, and sufficient amount of alkyl diphosphonic acid
comprising alkyl diphosphonic acid selected from the group of 1 hydroxyethane 1,1
diphosphonic acid, methylene diphosphonic acid, hydroxymethylene diphosphonic acid,
dichloromethylene diphosphonic acid, hydroxycyclohexylmethylene diphosphonic acid, 1
hydroxy-3-aminopropane 1,1 diphosphonic acid, l-hydroxy-4-aminobutane 1,1 diphosphonic
acid mixed with dodecylbenzenesulfonic acid, xylenesulfonic acid, toluenesulfonic acid,
phosphonoformic acid, sulfamic acid, 2-amino ethane sulfonic acid, or fluoroboric acid or an
organic carboxylic acid and pH is adjusted to from greater than 6 to about 10 with a metal ion
free base, and a surfactant.
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