Tapes for Semiconductor Process

SP Series CP Series

SP Series

CP Series

UV Tape for Wafer Backgrinding

Non-UV Tape for Wafer Backgrinding

Tape SP-594M-130 SP-537T-130 SP-541B-205 SP5156B-130

Backing Film Thickness(µm) 100 100 165 110

Adhesive Thickness(µm) 30 30 40 20

AdhesiveStrength

(N/25mm)

#280-SUSBefore UV 8.6 4.1 2.7 1.4

After UV 0.1 1.6 0.5 0.4

Si-WaferBefore UV 3.3 1.7 1.6 0.6

After UV 0.1 0.1 0.2 0.1

Tensile Strength(N/10mm)

MD 23 18 26 21

TD 22 16 23 17

Elongation(%)

MD 800 550 430 450

TD 930 690 570 620

Features・Standard・Etching-Durable

・Standard・For Sapphire Wafer

・Low Warpage・For Thin Wafer(>100µm)

・Low Warpage・ For Thin Wafer(>75µm)

Tape CP9007B-130 CP9003B-205B CP9079B-200 CP9134M-130

Backing Film Thickness(µm) 100 165 165 100

Adhesive Thickness(µm) 30 40 35 30

AdhesiveStrength

(N/25mm)

#280-SUS 0.9 1.8 0.6 1.7

Si-Wafer 0.7 1.6 0.4 1.2

Tensile Strength(N/10mm)

MD 21 44 34 28

TD 19 34 36 20

Elongation(%)

MD 550 600 500 490

TD 710 710 690 730

Features ・Standard

・�Excellent Absorbing Property of Roughness・�Recommending of

Heat De-Taping

・Low Residue・Low Warpage・ For Thin

Wafer(>100µm)

・�Below tapes are designed for surface protection of semiconductor wafers during backgrinding process.・�Easily de-taped from wafer without stress after UV irradiation.

・�Below tapes are designed for surface protection of semiconductor wafers during backgrinding process.

・�Optimized adhesive strength works easy de-taping without stress.

UC Series FC Series

UC Series

FC Series

UV Tape for Wafer Dicing

UV Tape for Package Dicing

・�Optimized tackiness holds packages during dicing process.

・�Easy die pick up for BGA, QFN, and other package types, after UV irradiation.

Tape UC-353EP-110A UC3026M-110 UC3044M-110B UC-334EP-85

Backing Film Thickness(µm) 100 100 100 80

Adhesive Thickness(µm) 10 10 10 5

AdhesiveStrength

(N/25mm)

#280-SUSBefore UV 7.1 5.0 2.7 2.2

After UV 0.4 0.5 0.2 0.3

Si-WaferBefore UV 2.7 1.6 1.2 1.1

After UV 0.1 0.1 0.1 0.2

Tensile Strength(N/10mm)

MD 49 26 41 22

TD 44 26 39 18

Elongation(%)

MD 750 310 740 360

TD 820 410 800 520

Features・Standard・For Thick Wafer

・Standard・Less Strings Type

・Low Chipping・For In-Line Process・For Thin Wafer (>100µm)

・Low residue�・For Metalized Wafer

Tape FC-217M-170 FC-224M-170 FC2127M-165 FS-8304-170

Backing Film Thickness(µm) 150 150 150 150

Adhesive Thickness(µm) 20 20 15 20

AdhesiveStrength

(N/25mm)

#280-SUSBefore UV 6.7 6.2 8.3 4.7

After UV 0.4 0.4 0.7 0.5

Si-WaferBefore UV 6.6 4.8 8.6 5.5

After UV 0.3 0.3 0.5 0.3

Tensile Strength(N/10mm)

MD 34 44 64 48

TD 32 42 62 46

Elongation(%)

MD 790 340 770 650

TD 920 400 830 680

Features ・Standard・Standard・Less Strings

・Low Residue・Anti-ESD ・Before UV : 9E+10・After UV : 5E+11

・Below tapes are designed for holding semiconductor wafers during dicing process while mounted to ring frames.

・Easy die pick up without stress after UV.

Special Application

UV Tape for Special Application

【Adhesive Strength Test Conditions】Substrate : Mirror-Polished Silicon Wafe r(Si-wafer), #280-Polished Stainless Steel Plate(♯280-SUS) Peeling Angle : 90° Peeling Speed : 50mm/min (SP, UC, FC Series) Peeling Angle : 180° Peeling Speed : 300mm/min (CP Series)

【Tensile Strength Test Conditions】Sampling : Before UV, Stretching Speed : 300mm/min, Specimen Cutting : Class 1 Dumbbell (Conforming to JIS K 6301)

Tape UC-228W-110 UC3004M-80 SP-537T-230 SP-544T-265

Backing Film Thickness(µm) 70 70 100 100

Adhesive Thickness(µm) 20+20 10 130 165

AdhesiveStrength

(N/25mm)

#280-SUSBefore UV 11 1.3 5.0 7.3

After UV 0.2 0.3 0.7 0.5

Si-WaferBefore UV 3.3 1.0 1.9 5.5

After UV 0.1 0.2 0.1 0.3

Features・�Double Side Adhesive

Tape・�Dicing Tape for DAF

Process・�Tape for Bumped

Wafer(<100µm)・�Tape for Bumped

Wafer(<150µm)

Core MaterialTechnologies

UV Tape for Wafer Dicing UC Series

UV Tape forWafer Backgrinding SP Series

Dicing Tape for DAF Process

Double SideAdhesive Tape

Backgrinding Tapefor Bumped Wafer

Non-UV Tape forWafer Backgrinding CP SeriesUV Tape for

Package Dicing FC Series

UV Tape is adhesive tape for semiconductor process. Major application is for semiconductor process

during the backgrinding process, wafers and packages dicing process. It is used in wide-area material, not

only semiconductor wafer, but also ceramics, glass, sapphire and so on.

Tape structure is shown in below figure. Tape have a two-ply construction of backing film and adhesive

layer. And the surface of the adhesive layer is covered with a release film.

Mainly, backing film is made by Polyolefin. However that, other material is used for backing film depending

on the situation. About adhesive, it is made by Acrylic material. And Release film is made by PET.

Propose Backgrinding Dicing

Tape SP Series CP Series UC Series FC Series

Features UV Type Non-UV Type UV Type UV Type

Release Film PETPET

PolypropylenePET PET

Adhesive Acrylic Acrylic Acrylic Acrylic

Backing Film Polyolefin Polyolefin Polyolefin Polyolefin

UV tape have strong adhesive strength. Then, tape holds wafer strongly in wafer grinding process or wafer dicing process.On the other hand, adhesive strength becomes lower when UV(Ultraviolet light) is irradiated. So, wafer or chip is easily removed after UV irradiation.

Adh

esiv

e S

treng

th

High

Low

Before UV After UV

GrindingDicing

De-tapingPick up

UVIrradiation

Backing Film

Adhesive

Release Film

About UV Tape

Structure

＊ �Technical information and data which shown in the catalog should be considered representative or typical only and should not be used for specification purposes.

＊ In case of special application, please contact representatives.

Acquirement of ISO 9001 Certification　　　　����AT Products Department

Acquirement of ISO 14001 Certification　　　Hiratsuka Works, Mie Works

Furukawa Electric AT products Department acquired the ISO 9001 certification for Global Quality Management System about design, development and manufacture of tapes for semiconductor processing.

Furukawa Electric recognizes that preservation of the global environment is a critical issue for society, and shall incorporate consideration of environmental preservation issues into every phase of corporate activity, to contribute forwards the sustainable development of prosperous and bright society.

Japan

Europe Furukawa Electric Europe Ltd.(FEEL)

USAAmerican Furukawa, Inc.(AFI)

Singapore, Malaysia and Thailand

Philippines

Taiwan

Kaohsiung Office

Taichung Office

China

Korea

5-1-9, Higashi-yawata, Hiratsuka, 254-0016, Japan Tel:81-463-24-8333 Fax:81-463-24-8338 18F-8, 295, Sec. 2 KuangFu Road, HsinChu 300, Taiwan, R.O.C.

Tel:886-3-5725325 FAX:886-3-5727017

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8-H,World plaza,No.855 PudongSouth Road, Shanghai 200120, P.R. China Tel:21-58881786 Fax:21-58888170

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Furukawa House 77-85 FulhamPalace Road LondonW6 8JD, United KingdomTel:44-20-7313-5300 Fax:44-20-7313-5310

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JIPAL Corporation HsinChu Office

http://www.furukawa.co.jp/uvtape/en/E-mail : at-tape@hira.furukawa.co.jp

JIPAL Corporation Shanghai Office

MICRO TECH CO., LTD.

Toyo Adtec Inc.

Hibex Singapore Pte Ltd.

PE-046 2G8 TR 100

The products and their appearances, as described in this brochure, are subject to change for improvement without prior notice. Company and product names appearing in this publication are registered trademarks or trademarks of respective companies.

Export Control RegulationsThe products and/or technical information presented in this publication may be subject to the application of the Foreign Exchange and Foreign Trade Act and other related laws and regulations in Japan.In addition, the Export Administration Regulations (EAR) of the United States may be applicable.In cases where exporting or reexporting the products and/or technical information presented in this publication, customers are requested to follow the necessary procedures at their own responsibility and cost.Please contact the Ministry of Economy, Trade and Industry of Japan or the Department of Commerce of the United States for details about procedures.