VANESSA L. BELENWoodlands Drive 75, Block 688B Unit# 15-28 732688Singapore IC: S8280165J email: vanbelen26@gmail.comSingapore (+65) 96408222

CAREER OBJECTIVEAn engineering position where I can provide solutions; and support to NPI/Manufacturing

challenges by utilizing my background and experience in Test Engineering, Quality and Manufacturing Operations management.

SUMMARY OF QUALIFICATION A diverse hands on Test and Manufacturing engineer, who actively manages and

contributes to the technical events for high quality engineered systems and sub-systems. Demonstrated success in contributing through the introduction of new products into mass production based on applying the disciplines of classical manufacturing process and test engineering, process mapping and process development. Working on continuous process improvement on yield, quality, and fault-isolation and process optimization.

Consistent work history in manufacturing operations experienced in semiconductor test and assembly, Hewlett Packard Inkjet consumer and business printers running high and low volume production. Recently delved into the field of consumer 3D printing technology.

Excellent communication and interpersonal skills. Possesses good leadership skills and a team player, demonstrated through successful completion of assignments. Independent, analytical and possesses strong enthusiasm in learning new things, particularly in technology. Recognized by superiors and colleagues for outstanding job performance, reliability, multi-task skills, efficiency, accuracy, and timely completion of all assignments. Ability to effectively communicate and interact with cross-functional teams, suppliers and various technical disciplines.

AREAS OF EXPERIENCE: Project Management: Consumer Electronic Products, New Product Introduction, Product

Lifecycle PCBA and System Integration: Test and Manufacturing processes, industry standards,

ICT and Functional Circuit Test Methods Supplier Development: Supplier qualification, Management of CMs (Contract

Manufacturers) Design for Excellence principles: Design for Manufacturing, Assembly, Cost and

Reliability Process tools: SPC, FMEA, DOE, 8D, QC tools, MSA, GRR, Yield and Sigma.

Understanding of RMA, TQM, BKM, LEAN manufacturing and Six Sigma principle. Schematic capture and use of instruments for circuit board troubleshooting and

repairs. Semiconductor Testing, MEMS/ Accelerometers for automotive applications Tooling: Jigs and Fixtures, prototype and production Inkjet printer manufacturing 3D Printing technology (Fused Filament Deposition) Semiconductor Assembly, Electrical Test, Backend Operations & Pack Processes Analog, Power Management, Mixed Signal, RF, MEMS (Microelectronic Mechanical

System) and accelerometer products used for automotive, industrial and commercial applications.

Experience in UNIX and Visual Basic programming languages. Well- versed in the application of Statistical tools and techniques: SAS-JMP, Minitab and

MS Excel Knowledgeable in the Quality Systems: ISO 9000, 14000 and TS16949

KEY ACCOMPLISHMENTS A proven record of completing five NPI projects below budget and meeting schedule.

Activities include planning, analysis, specification preparation, preparing financial justification, establishing budget, developing project schedule, performing design reviews, and supervising fabrication, installation, inspection, and training of manufacturing personnel.

BOM management, Product qualification and transfer implementation at multiple manufacturing sites.

Implement cost reduction strategies through process improvements. Identified yield improvement areas, initiated process improvement actions and cost-reduction plan.

Provide failure mode analysis, trouble shooting guidance, repair/rebuild/replace analysis

Worked with teams in designing assembly and fabrication cells to meet lean manufacturing objectives.

WORK EXPERIENCE

Pirate3D Pte Ltd Singapore June 2, 2014 – PresentSenior NPI and Test Engineer – NPI Operations

Test Engineering Lead and part of the NPI team in bringing up new consumer 3D printer products, enabling manufacturing processes for efficient, high quality product to market.

Develop and execute reliability test plans and procedures to verify product quality.

Handles customer complaints and field quality issues. Provide failure mode analysis, trouble shooting guidance, repair/rebuild/replace analysis.

Drive material-related issues investigation and resolution. Implement production test methods (ICT and FCT), production work

instructions and manage fabrication of test and assembly fixtures. Technical liaison, collaborating with Mechanical, Electronics and Software

engineers providing DFM/x inputs from PCBA to product assembly, to improve product quality and manufacturability.

BOM management and supplier/ part qualification. Work closely with the PCBA manufacturing partners in Malaysia, to develop,

evaluate and implement process control techniques and procedures. Support manufacturing operations, to compile, assess and analyze

production test data. Suggest corrective action for procedures and product deficiencies.

Recommend new processes to enhance overall product line efficiency. Define test strategies, analyze new product testability and deliver test

solutions to manufacturing partner. Drive software, hardware and manufacturing issues investigation and

resolution.

Hewlett Packard Singapore January 24, 2011 – May 30, 2014Manufacturing Engineer - NPI Operations

Managed and lead the Manufacturing Operations of Electrical and Electronics engineering subsystem of assigned projects, from PCBA to Final Product assembly.

Worked with EE and ME R&D teams in bringing up new consumer and business inkjet printer products, implementing manufacturing processes for efficient, high quality production to market.

Travelled to work closely with the manufacturing partners in Malaysia, Thailand and China, to develop, evaluate and implement process control techniques and procedures for inkjet printer manufacturing.

BOM management and EE parts/ supplier qualification Provided DFM inputs, analyzed PCBA and product assembly manufacturing

process flows to enhance quality, reduce cost and increase throughput. Managed installation of PCBA and final product assembly and test (ICT and

FCT) line tooling requirements, and relative costs to provide data for operational decisions.

Collaborated with manufacturing partners in equipment installation and

purchase of materials adhering to quality standards and specifications. Provided engineering guidance to production to troubleshoot and resolve

technical problems. Provided visibility to management and product development teams on

technical issues that restrain volume production and escalate any issues as appropriate to drive resolution.

Drive cost- saving opportunities on both parts usage and line process.

Amkor Technology Singapore November 27, 2006 – January 4, 2011Amkor Technology Taiwan (Short-term assignee ) June – December 2010Product Engineer – Semiconductor Wafer Sort and Final Test

Line- sustaining engineering support responsible for low yield lot disposition and immediate response to production line issues to provide real-time analysis and problem resolution, for wafer-bumped microprocessor and microcontroller products and high-volume module RF technology devices designed for computer and communication applications.

Drive implementation of test process requirements and conformance to quality standards.

Perform evaluation and qualification of new product transfers, test programs and hardware.

Maintain and review line manufacturing procedures Control Plan, OCAP and FMEA

Perform data collection, fault isolation, test correlation, and initial verification of massive fallouts.

Generate yield reports to analyze data and recommend solutions to the identified problems.

Support customers and engineers in Yield, Cycle Time enhancement and Test Time reduction.

Work with Maintenance Engineering in carrying out equipment troubleshooting and repairs.

Ensure proper documentation of test specification and operating procedures.

Developed Microsoft excel scripts for yield report generation

Developed and implemented a process tools using Visual Basic, to easily identify batch of problematic lots reducing occurrences of unnecessary tester downtime caused by known material issues.

Developed an internal dynamic website for Wafer Sort to provide as central reference and management of line procedures.

Fairchild Semiconductor Philippines May 2006 – November 2006Test and Product Engineer – Semiconductor Final Test

Provided product support for testing of voltage regulators, operational amplifiers, converters, load switch and power management devices used for commercial and industrial applications, shipping over 1 Million units per week.

Spearheaded the modification/ refurbishment of production DUT boards, eliminating false rejects and improving the first pass yield of the affected products by 5%.

Implemented device-level correlation test programs ensuring test system integrity prior start of production testing.

Performed verification and defect failure analysis of rejects and recommended proper disposition on lot/s in question.

Initiated and completed statistical studies on yield improvement; thereafter implemented several changes to test methods (test time reduction and guard banding adjustments) resulting to increase in product yield without compromising product quality.

Tracked and improved manufacturing operation effectiveness and yield, resolved manufacturing problems involving test resources and systems.

Approved test programs, tools and resources.

Troubleshoot and repaired test DUT boards and load boards with faults extending beyond line maintenance capability.

Liaised with customers and NPI engineering on resources set up of new products for mass production. Issuance of PCN, carry out FAI and maintained BOM.

Generated and maintained engineering process specifications and schematics.

Supervised engineering assistants performing Production support.

Generated and presented product and process performance reports.

Developed and revised work modules, instructions and other technical documents as part of continuous improvement.

Amkor Technology Philippines May 2003 – April 2006Test Product/Process Engineer – Final Test/ Backend Operations

Engineering support for Analog Devices MEMS (Microelectronic Mechanical System) and accelerometer products used for automotive and commercial applications, shipping over 1 Million units per week.

Performed electrical qualification of new products prior release to mass production.

Successfully lead and passed customer audits resulting to customer appreciation of company objectives and stronger partnership.

Provided resolution to manufacturing issues, liaised with customer and cross-functional groups on product test yield and performance.

Tracked and improved manufacturing Backend operations: Bake and Burn-in, Laser Marking, Hermetic, Tape and Reel vision-system inspection, Final Visual Inspection and Packing processes.

Improved Hermetic test sampling specifications for Analog Devices to improve cycle time of mature products.

Improved Tape and Reel yield for Analog Devices automotive line by 3% after implementing process enhancements in both Assembly and Electrical Test.

Ensured handled processes meet SPC requirements.

Performed Process Mapping in relation to isolating process faults. Provided 8D reports and documented analyses on investigation of RMA.

Reviewed, maintained and approved process material specifications.

Coordinated with Planning and Manufacturing with regards to production loading, inventory management and on-time delivery of tested products.

Provided training and certification of Backend Operators and QC Inspectors.

Conducted internal audits to check quality performance and verify the effectiveness of improvement actions.

EDUCATIONRegistered Electronics and Communications Engineer, PRC-0033721 November 2004 Electronics and Communications Engineering – Licensure Exam

Completed degree in Bachelor of Science in Electronics and Communications Engineering Central Philippine University, Philippines - March 2003

SKILLS / KNOWLEDGE

Laboratory/ diagnostics instruments such as Function generator, Oscilloscope, Digital voltmeters, LCR meter and Parametric Analyzer

MS-DOS, Microsoft Windows, NT, Linux (Solaris/ Red Hat), Mac Operating Systems

Knowledgeable in the requirements and implementation of ISO 9000, 14000 and TS16949

PSPICE, Express PCB and Engineering Work Bench (EWB), Promis, Data Tool, SAS-JMP, Lotus Notes, MS Outlook, X-windows, Microsoft Office Suite, AutoCAD 2007 and Adobe Creative Suite

Languages: C/ C++, UNIX, Excel VBA, Visual Basic 6.0, RDBMS Oracle 10g/ SQL

Web Development languages (HTML/XHTML, XML, CSS, JavaScript, Java/ JSP)

TRAININGS / SEMINARS

Failure Mode and Effect Analysis - Amkor Technology Philippines, Philippines, 2003

Statistical Process Control - Amkor Technology Philippines, Philippines, 2003

Design of Experiment - Amkor Technology Philippines, 2004

Component Test System Tester training - Amkor Technology Philippines, 2004

Multi-Test Handler training - Amkor Technology Philippines, 2004

Yield and Sigma - Amkor Technology Philippines, 2004

Problem Solving Methodology - Amkor Technology Philippines, 2004

Root Cause Analysis - Amkor Technology Philippines, 2005

Fundamentals of Digital Testing - Amkor Technology Philippines, 2006

The Theory of Semiconductor Physics - Fairchild Semiconductor, 2006

Semiconductor Failure Analysis - Fairchild Semiconductor, 2006

Fundamentals of RF Testing - Amkor Technology Singapore, 2007

Fundamentals of Teradyne Flex/Micro Flex IG-XL Programming, 2009

Web Applications Development, Singapore Polytechnic (SPUR) 2010

PERSONAL DATA

Date of Birth: January 26, 1982Status: SingleNationality: FilipinoSingapore Status: Permanent Resident Languages: English/ Filipino