APImRAllUS FOR M t C R O f ~ ~

US. Patent 6,270,671. Aug. 7, 2001 J. Shorr and J.R Toohil, assignors to United State Filter Corp., Palm Desert, Calif. A method comprising flowing pressurized water including a precipitate through a substantial- ly tubular semipermeable mem- brane comprising sub-micron fil- t ra t ion media and having an inner surface and an outer sur- face, wherein the flow of the water is turbulent; and collecting a filtrate from the outer surface of the membrane, wherein the fil- t rate contains a concentration of dissolved precipitate below the solubility limit of the precipitate.

RECOVERING METALS FROM

WASTE STREAMS

US. Patent 6,270,679. Aug. 7, 2001

L. Kreisler, c/o KBF Pollution Management Inc., Paterson, N.J. A process for separa t ing and recovering metals from acidic waste streams comprising adding a complexing agent to cause met- als to precipitate in the form of a sludge, said complexing agent being a mixture of water, an inor- ganic base, and a thiocarbamate or dithiocarbamate selected from the group consisting of sodium dimethyldi th iocarbamate , zinc d imethyldi th iocarbamate , and mixture thereof; dewatering and drying the sludge to a substan- tially anhydrous state; and melt- ing to recover the metals there- from.

POWDER COATING COMPOSITION US. Patent 6,270,855. Aug. 7, 2001 R. Jung and C. Schmid, assignors to

The Valspar Corp., Minneapolis A composition comprising 50 to 100% of a blend of polyesters; 0 to 25% of a modifying resin selected from the group consisting of an epoxy or phenoxy resin; 0 to 25% of an inorganic filler; 0 to 4% of a flow control agent; and 0 to 50% of a second modifying polymer, the composition having a particle size of 100 microns or less.

WATER-REDUCIBLE COATING

C O M P O S I T I O N

U.S. Patent 6,270,884. Aug. 7, 2001 D.J. Guhde et al., assignors to Metal Coatings International Inc., Chardon, Ohio A stable water-reducible, chrome- free, and resin-free coating com- position for application to, and hea t curing on, a subst ra te for providing corrosion protection

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August 2002 69

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ELECTROLESS COMPOSITE PLATING SOLUTION US. Patent 6,273,943. Aug. 14, 2001 T Chiba and K. Monden, assignors to C. Uyemura & Co. Ltd., Osaka, Japan An electroless composite plating solution comprising metal ions, a complexing agent, a hypophos- phite reducing agent, a surface active agent, and a water-insolu- ble composite material, said sur- face active agent comprising a quaternary ammonium salt sur- face active agent, which has two

or more ethylene oxide groups and an alkyl group or a fluorine- subs t i tu ted alkyl or alkenyl group, the agent being cationic in nature or exhibiting substantially cationic properties.

ELECTROPLATING APPARATUS US. Patent 6,274,010. Aug. 14, 2001 P. Henington et al., assignors to Process Automation International Ltd., Hong Kong An appara tus for electroplating at least one substrate comprising at least one anode member, at least one blocking member, at least one container, and means adapted to support the substrate.

APPARATUS FOR ELECTROPLATING WAFERS US. Patent 6,274,023. Aug. 14, 2001 R. Kaufman and G.C. Downes, assig-

nors to Technic Inc., Cranston, R.I. In a plating apparatus compris- ing a container, a cathode elec- trode, an anode electrode si tuated at a higher position wi thin the container, and an in termedia te electrode situated at an interme- diate position within the contain- er below the higher position, a method of plating an article situ- ated at a lower position and hav- ing a metal seed layer in electri- cal contact with the cathode electrode comprising forming a negative voltage potential from the intermediate electrode to the cathode electrode when plat ing fluid is in contact with the inter- mediate and anode electrodes, wherein the negative voltage potential reduces a plating rate at a desired region above the metal seed layer.

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70 Metal Finishing