1200 v, 25 a npt trench igbt

©20FG

FGA

25N120A

NTD

TU —

1200 V, 25 A N

PT Trench IGB

T

April 2014

FGA25N120ANTDTU1200 V, 25 A NPT Trench IGBT

Features • NPT Trench Technology, Positive Temperature Coefficient

• Low Saturation Voltage: VCE(sat), typ = 2.0 V @ IC = 25 A and TC = 25°C

• Low Switching Loss: Eoff, typ = 0.96 mJ @ IC = 25 A and TC = 25°C

• Extremely Enhanced Avalanche Capability

Applications• Induction Heating, Microwave Oven

DescriptionUsing Fairchild's proprietary trench design and advanced NPT technology, the 1200V NPT IGBT offers superior conduction and switching performances, high avalanche ruggedness and easy parallel operation. This device is well suited for the reso-nant or soft switching application such as induction heating, microwave oven.

G

C

E

G

C

EG C ETO-3P

Absolute Maximum RatingsSymbol Description Ratings Unit

VCES Collector-Emitter Voltage 1200 V

VGES Gate-Emitter Voltage ± 20 V

ICCollector Current @ TC = 25°C 50 A

Collector Current @ TC = 100°C 25 A

ICM (1) Pulsed Collector Current 90 A

IFDiode Continuous Forward Current @ TC = 25°C 50 A

Diode Continuous Forward Current @ TC = 100°C 25 A

IFM Diode Maximum Forward Current 150 A

PDMaximum Power Dissipation @ TC = 25°C 312 W

Maximum Power Dissipation @ TC = 100°C 125 W

TJ Operating Junction Temperature -55 to +150 °C

Tstg Storage Temperature Range -55 to +150 °C

TLMaximum Lead Temp. for soldering Purposes, 1/8” from case for 5 seconds 300 °C

Notes:(1) Repetitive rating: Pulse width limited by max. junction temperature

Thermal CharacteristicsSymbol Parameter Typ. Max. Unit

RθJC(IGBT) Thermal Resistance, Junction-to-Case -- 0.4 °C/W

RθJC(DIODE) Thermal Resistance, Junction-to-Case -- 2.0 °C/W

RθJA Thermal Resistance, Junction-to-Ambient -- 40 °C/W

06 Fairchild Semiconductor Corporation 1 www.fairchildsemi.comA25N120ANTDTU Rev. C2

FGA

25N120A

NTD

TU —

1200 V, 25 A N

PT Trench IGB

T

©20FG

Package Marking and Ordering Information

Part Number Top Mark Package PackingMethod Reel Size Tape Width Quantity

FGA25N120ANTDTU_F109 FGA25N120ANTDTU TO-3PN Tube N/A N/A 30

Electrical Characteristics of the IGBT TC = 25°C unless otherwise noted

Symbol Parameter Test Conditions Min. Typ. Max. Unit Off Characteristics

ICES Collector Cut-Off Current VCE = VCES, VGE = 0 V -- -- 3 mA

IGES G-E Leakage Current VGE = VGES, VCE = 0 V -- -- ± 250 nA

On Characteristics

VGE(th) G-E Threshold Voltage IC = 25 mA, VCE = VGE 3.5 5.5 7.5 V

VCE(sat)Collector to Emitter Saturation Voltage

IC = 25 A, VGE = 15 V -- 2.0 -- V

IC = 25 A, VGE = 15 V, TC = 125°C

-- 2.15 -- V

IC = 50 A, VGE = 15 V -- 2.65 -- V

Dynamic Characteristics

Cies Input Capacitance VCE = 30 V, VGE = 0 V, f = 1 MHz

-- 3700 -- pF

Coes Output Capacitance -- 130 -- pF

Cres Reverse Transfer Capacitance -- 80 -- pF

Switching Characteristics

td(on) Turn-On Delay Time

VCC = 600 V, IC = 25 A,RG = 10 Ω, VGE = 15 V,Inductive Load, TC = 25°C

-- 50 -- ns

tr Rise Time -- 60 -- ns

td(off) Turn-Off Delay Time -- 190 -- ns

tf Fall Time -- 100 -- ns

Eon Turn-On Switching Loss -- 4.1 -- mJ

Eoff Turn-Off Switching Loss -- 0.96 -- mJ

Ets Total Switching Loss -- 5.06 -- mJ

td(on) Turn-On Delay Time

VCC = 600 V, IC = 25 A,RG = 10Ω, VGE = 15 V,Inductive Load, TC = 125°C

-- 50 -- ns

tr Rise Time -- 60 -- ns

td(off) Turn-Off Delay Time -- 200 -- ns

tf Fall Time -- 154 -- ns

Eon Turn-On Switching Loss -- 4.3 -- mJ

Eoff Turn-Off Switching Loss -- 1.5 -- mJ

Ets Total Switching Loss -- 5.8 -- mJ

Qg Total Gate ChargeVCE = 600 V, IC = 25 A,VGE = 15 V

-- 200 -- nC

Qge Gate-Emitter Charge -- 15 -- nC

Qgc Gate-Collector Charge -- 100 -- nC


FGA

25N120A

NTD

TU —

1200 V, 25 A N

PT Trench IGB

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©20FG

Electrical Characteristics of DIODE TC = 25°C unless otherwise noted

Symbol Parameter Test Conditions Min. Typ. Max. Unit

VFM Diode Forward Voltage IF = 25 A TC = 25°C -- 2.0 3.0

VTC = 125°C -- 2.1 --

trr Diode Reverse Recovery Time

IF = 25 AdiF/dt = 200 A/μs

TC = 25°C -- 235 350ns

TC = 125°C -- 300 --

IrrDiode Peak Reverse Recovery Cur-rent

TC = 25°C -- 27 40A

TC = 125°C -- 31 --

Qrr Diode Reverse Recovery ChargeTC = 25°C -- 3130 4700

nCTC = 125°C -- 4650 --


FGA

25N120A

NTD

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1200 V, 25 A N

PT Trench IGB

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Typical Performance Characteristics

Figure 1. Typical Output Characteristics Figure 2. Typical Saturation Voltage

0 1 2 3 4 50

20

40

60

80

100

120Common EmitterVGE = 15VTC = 25°C TC = 125°C

Col

lect

or C

urre

nt, I

C [A

]

Collector-Emitter Voltage, VCE [V]

0 2 4 6 8 100

20

40

60

80

100

120

140

160

180

10V

9V

8V

7V

20V17V

15V 12V

VGE = 6V

TC = 25°C

Col

lect

or C

urre

nt, I

C [A

]


Characteristics

Figure 3. Saturation Voltage vs. Case Figure 4. Saturation Voltage vs. VGETemperature at Variant Current Level

25 50 75 100 1251.5

2.0

2.5

3.0Common EmitterVGE = 15V

40A

IC = 25A

Col

lect

or-E

mitt

er V

olta

ge, V

CE [V

]

Case Temperature, TC [°C]

0 4 8 12 16 200

4

8

12

16

20

40A25A

Common EmitterTC = -40°C

IC = 12.5A

C

olle

ctor

-Em

itter

Vol

tage

, VC

E [V

]

Gate-Emitter Voltage, VGE [V]

Figure 5. Saturation Voltage vs. VGE

0 4 8 12 16 200

4

8

12

16

20

40A25A

Common EmitterTC = 125°C

IC = 12.5A

Col

lect

or-E

mitt

er V

olta

ge, V

CE [V

]


0 4 8 12 16 200

4

8

12

16

20

40A25A

Common EmitterTC = 25°C

IC = 12.5A

Col

lect

or-E

mitt

er V

olta

ge, V

CE [V

]


Figure 6. Saturation Voltage vs. VGE


FGA

25N120A

NTD

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1200 V, 25 A N

PT Trench IGB

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©20FG

Typical Performance Characteristics (Continued)

Figure 7. Capacitance Characteristics Figure 8. Turn-On Characteristics vs. Gate Resistance

0 10 20 30 40 50 60 7010

100

Common EmitterVCC = 600V, VGE = ±15VIC = 25ATC = 25°C TC = 125°C

td(on)

tr

Sw

itchi

ng T

ime

[ns]

Gate Resistance, RG [Ω]

1 100

500

1000

1500

2000

2500

3000

3500

4000

4500

5000

Ciss

Coss

Common EmitterVGE = 0V, f = 1MHzTC = 25°C

Crss

Cap

acita

nce

[pF]


Figure 9. Turn-Off Characteristics vs. Figure 10. Switching Loss vs. Gate ResistanceGate Resistance

0 10 20 30 40 50 60 70

1

10


Eon

Eoff

S

witc

hing

Los

s [m

J]


0 10 20 30 40 50 60 7010

100

1000


td(off)

tf

Sw

itchi

ng T

ime

[ns]


Figure 11. Turn-On Characteristics vs. Figure 12. Turn-Off Characteristics vs.Collector Current Collector Current

10 20 30 40 50

100

Common EmitterVGE = ±15V, RG = 10Ω

TC = 25°C TC = 125°C

tr

td(on)

Sw

itchi

ng T

ime

[ns]

Collector Current, IC [A]

10 20 30 40 50

100


TC = 25°C TC = 125°C

td(off)

tf

Sw

itchi

ng T

ime

[ns]



FGA

25N120A

NTD

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1200 V, 25 A N

PT Trench IGB

T

©20FG


Figure 13. Switching Loss vs. Collector Current Figure 14. Gate Charge Characteristics

10 20 30 40 500.1

1

10


TC = 25°C TC = 125°C

Eon

Eoff

Switc

hing

Los

s [m

J]


0 20 40 60 80 100 120 140 160 180 2000

2

4

6

8

10

12

14

16

600V

400V

Common EmitterRL = 24Ω

TC = 25°C

Vcc = 200V

Gat

e-E

mitt

er V

olta

ge, V

GE [V

]

Gate Charge, Qg [nC]

Figure 15. SOA Characteristics Figure 16. Turn-Off SOA

1 10 100 10001

10

100

Safe Operating AreaVGE = 15V, TC = 125°C

Col

lect

or C

urre

nt, I

C [A

]


0.1 1 10 100 10000.01

0.1

1

10

10050μs

100μs

1ms

DC Operation

Ic MAX (Pulsed)

Ic MAX (Continuous)

Single NonrepetitivePulse TC = 25°CCurves must be deratedlinearly with increasein temperature

Col

lect

or C

urre

nt, I

c [A

]

Collector - Emitter Voltage, VCE [V]

Figure 17. Transient Thermal Impedance of IGBT

1E-5 1E-4 1E-3 0.01 0.1 1 10

1E-3

0.01

0.1

1

10

0.1

0.5

0.2

0.05

0.02

0.01single pulse

Therm

al Response [Zthjc]

Rectangular Pulse Duration [sec]

Pdm

t1

t2

Duty factor D = t1 / t2Peak Tj = Pdm × Zthjc + TC


FGA

25N120A

NTD

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1200 V, 25 A N

PT Trench IGB

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Figure 18. Forward Characteristics Figure 19. Reverse Recovery Current

0.1

1

10

50

0.0 0.4 0.8 1.2 1.6 2.0

TC = 125° )Χ

TC = 25° )Χ

TJ = 25° )Χ

TJ = 125° )Χ

Forward Voltage , VF [V]

Forw

ard

Cur

rent

, I F [A

]

5 10 15 20 250

5

10

15

20

25

30

diF/dt = 100A/μs

diF/dt = 200A/μs

Rev

erse

Rec

over

y C

urrn

et ,

I rr [A

]

Forward Current , IF [A]

Figure 20. Stored Charge Figure 21. Reverse Recovery Time

5 10 15 20 250

100

200

300

diF/dt = 100A/μs

diF/dt = 200A/μs

Rev

erse

Rec

over

y Ti

me

, trr [n

s]

Forward Current , IF [A]5 10 15 20 250

1000

2000

3000

4000

diF/dt = 100A/μs

diF/dt = 200A/μs

Sto

red

Rec

over

y C

harg

e , Q

rr [n

C]

Forward Current , IF [A]


FGA

25N120A

NTD

TU —

1200 V, 25 A N

PT Trench IGB

T

©2006 Fairchild Semiconductor Corporation 8 www.fairchildsemi.comFGA25N120ANTDTU Rev. C2

Mechanical Dimensions

Figure 22. TO3PN, 3-Lead, Plastic, EIAJ SC-65Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-ically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT3PN-003

FGA

25N120A

NTD

TU —

1200 V, 25 A N

PT Trench IGB

T

©2006 Fairchild Semiconductor Corporation 9 www.fairchildsemi.comFGA25N120ANTDTU Rev. C2

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1200 v, 25 a npt trench igbt

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