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AMD64 with Direct Connect Architecture A Solid Foundation for Dense Compute Environments Jeff Underhill HPC Business Development (CPG) August 04

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Page 1: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

AMD64 with Direct Connect ArchitectureA Solid Foundation for Dense Compute Environments

Jeff Underhill

HPC Business Development (CPG)

August 04

Page 2: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

August 13, 2004 Computation Products Group - High Density Data Center Committee 2

Agenda

1. Corporate Overview

2. Dense Computing Overview (some driving factors)

3. What’s AMD’s Role In Dense Compute Environments?

4. AMD64 Product Overview & Positioning

5. What is AMD64 with “Direct Connect Architecture”?

6. Power, Performance & Density – What’s Next?

7. Examples Built On an AMD64 Technology Foundation

8. Q&A – A test that you were all listening!

9. Ed Gasiorowski – AMD Opteron™ – Power Advantage

Page 3: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

Corporate Overview

Page 4: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

August 13, 2004 Computation Products Group - High Density Data Center Committee 4

AMD Overview – 35 years of Innovation

Founded: 1969

Headquarters: Sunnyvale, Calif.

Employees: 14,400 worldwide

Sales Mix: >75% international

Business Units Q2 04 Revenue($M)

• Microprocessors $554

• Flash Memory $673

• Other $34

Total: $1.262 billion

2003 Revenue: $3.5 billion

Major Operations• Sunnyvale, CA • Austin, TX• Dresden, Germany• Penang, Malaysia• Aizu-Wakamatsu,

Japan• Bangkok, Thailand• Singapore• Suzhou, China

Page 5: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

August 13, 2004 Computation Products Group - High Density Data Center Committee 5

AMD Worldwide Operations

Sunnyvale, California

• AMD Global HQ

• Submicron Development Center

• FASL LLC (Spansion™ brand) HQ

Boston, Mass.

Boston Design Center

Austin, Texas

• Fab 25 — Flash Memory

• Computations Product Group

• Personal Connectivity Solutions Group

Frimley, UK

European Service Center

Dresden, Germany

• Fab 30 — Microprocessors• Dresden Design Center

Aizu-Wakamatsu/Tokyo, Japan

• Flash Memory Fabs: JV1, 2, 3

• FASL Japan HQBangkok, Thailand

Flash Memory Assembly and Test

Suzhou, China

Flash Memory Assembly and Test

Penang/Kuala Lumpur, Malaysia

Microprocessor and Flash Assembly, Test and Packaging

Singapore

Microprocessor Assembly, Test and Packaging

Page 6: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

August 13, 2004 Computation Products Group - High Density Data Center Committee 6

AMD Industry Leadership

AMD is a global supplier of integrated circuits for the personal and enterprise computing, communications and

consumer electronic markets

1. CPG - Leading the industry’s transition to pervasive 64-bit computing with the AMD64 family of microprocessors

2. FASL - #1 in NOR Flash memory* with a goal to become the world’s overall Flash memory leader

3. PCSG - Delivering innovative embedded x86 system-on-chipsolutions for internet and wireless applications– Broadens AMD’s product portfolio and access to high-growth and

profitable emerging markets

* iSuppli Corporation, Q303 NOR Flash market share estimate

Page 7: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

August 13, 2004 Computation Products Group - High Density Data Center Committee 7

Transistor Count / Process Migration…

16 32 64 BitsInteger FPU, SIMD Vector1/3 Issue 9 IssueTrivial Cache 1MB CacheCPU SOC

0.8µ200K

transistors48mm2

0.35µ1.2M

transistors35mm2

0.25µ9M

transistors78mm2

0.18µ37M

transistors120mm2

AMD Am386®

ProcessorAMD

Am486®

Processor

AMD K6®-III Processor

AMD Athlon™

Processor

AMD Opteron™Processor

0.13µ100M

transistors193mm2

90nm100M

transistors114mm2

AMD Opteron™Processor

Page 8: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

August 13, 2004 Computation Products Group - High Density Data Center Committee 8

AMD Leads Pervasive 64-bit Computing

Page 9: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

August 13, 2004 Computation Products Group - High Density Data Center Committee 9

AMD is a Product Powerhouse

2002 Samsung Best Supplier Award –AMD Flash

CeBIT Highlights 2002: Hardware Category -AMD Opteron and AMD Athlon 64

2003 INSIGHT Award for Most Innovative Memory Device – AMD MirrorBit

Cisco President's Customer

Satisfaction Award

- 2000 –AMD Flash

2004

2004

2004

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August 13, 2004 Computation Products Group - High Density Data Center Committee 10

Driving AMD Brand Awareness

AMD Product Placement

in Spy Kids III

AMD Product Placement

in Spy Kids III

Page 11: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

Dense Computing OverviewSome Driving Factors

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August 13, 2004 Computation Products Group - High Density Data Center Committee 12

Dense Computing OverviewSome Driving Factors…

•Business functions are increasingly digital & distributed!

– CRM, ERP, Commerce, Communications, Inventory Management, Invoices, Risk analysis, EDA, DCC, ESD, Media Content Delivery (Akimbo, Netflix & Tivo) etc…

•We live in an increasingly digital personal world too– Electronic banking, investing, billing, shopping,

communicating, filing taxes, photography, home movies, MP3’s etc…

– All of these functions require additional resources at the various service providers!

With this migration comes an ever increasing need for storage and compute power!

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August 13, 2004 Computation Products Group - High Density Data Center Committee 13

Dense Computing OverviewA case in point …

Businesses accounting is now subject to the Sarbanes-Oxley Act of 2002 stating: -

The Board must require registered public accounting firms to "prepare, and maintain for a period of not less than 7 years, audit work papers, and other information related to any audit report, in sufficient detail to support the conclusions reached in such report."

The Board must require registered public accounting firms to "prepare, and maintain for a period of not less than 7 years, audit work papers, and other information related to any audit report, in sufficient detail to support the conclusions reached in such report."

Think of the storage & retrieval implications of this single accounting act!

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August 13, 2004 Computation Products Group - High Density Data Center Committee 14

Dense Computing OverviewAnother case in point … Transport Security Administration

• The TSA are considering next generation scanning technology that would allow them to dissect baggage in 3D

• They are also considering the need to keep baggage scans on file for ‘some’ period of time in order to review – should the need arise

Again - Think of the storage & retrieval implications …

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August 13, 2004 Computation Products Group - High Density Data Center Committee 15

Dense Computing OverviewAnother case in point … Distribution & security

• More and more business functions require availability on a worldwide scale

• There’s a definite need to securely and reliably process and distribute ever increasing datasets

• This translates into a direct need for large memory models and increased compute power to execute complex encryption & compression algorithms –some at wire speed!

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August 13, 2004 Computation Products Group - High Density Data Center Committee 16

RAS (Reliability, Availability, Serviceability)

•Increasing dependence on these business functions drives RAS requirements – most functions are becoming, or are already - mission critical!

•The promise of increased availability and manageability are among the incentives driving migration to dense rack and blade architectures.

•OEM’s and integrators are layering RAS features on commodity server platforms closing the feature gap on ‘big iron’ systems at a fraction of the cost.

… RAS features are essential and allow vendors to innovate and differentiate their offerings!

Page 17: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

August 13, 2004 Computation Products Group - High Density Data Center Committee 17

Dense Computing OverviewWhat does this mean…?

In order to address increasing demands you can generally: -

Work Harder Faster ComponentsWork Smarter Process InnovationGet Help Scale Out / Parallelize

Over the past decades there have been advances in each of these areas from an electronics perspective, but now more so than ever ‘Get Help’ seems to be ‘required’ to

meet the dramatic increases ahead!

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August 13, 2004 Computation Products Group - High Density Data Center Committee 18

Dense Computing OverviewIn order to ‘Get Help’ …

•More compute devices are required to cooperatively address increasingly complex and sizeable tasks.

•This in turn drives the need to fit more and more compute devices within ideally the same or at least moderately increased space.

•With increased compute devices comes increased power consumption, the increased heat generated demands additional environmental requirements (cooling, filtering etc…)

•Before too long the datacenter infrastructure could be stretched to the point that it’s a limiting factor for the required growth!

Page 19: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

August 13, 2004 Computation Products Group - High Density Data Center Committee 19

Dense Computing OverviewMigration from rack mount to blade servers …?

•There’s a lot of activity within the computer industry to address the infrastructure issues while providing solutions that IT organizations can deploy and manage (virtualization etc…) in order to maximize density and utilization of resources.

•Virtualization of pooled resources with remote management capabilities increase the number of nodes per administrator (30:1 vs. 15:1)

•Reduce cabling by up to 87% - leading to increased reliability at lower cost.

•Improved availability with enough space to include N+1 redundancy within a blade shelf.

•Up to 24% reduction in data center floor space using blades over rack mount servers (48 vs. 30)

Source - HP ProLiant Blade Systems White Paper

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August 13, 2004 Computation Products Group - High Density Data Center Committee 20

Dense Computing OverviewA quick look at the blade market …

•Blades – an explosive growth market …?

Rack 2002 Rack 2008 Blade 2002 Blade 2008

Shipments (000) 1,376 2,896 37 2,671

Dollars ($M) $8,104 $11,261 $91 $7,071

Growth Shipments (000)

110% 6987%

Growth Dollars ($M)

39% 7616%

Linux & Windows Servers – IDC Q4 2003

Page 21: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

What’s AMD’s RoleIn Dense Compute Environments?

Page 22: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

August 13, 2004 Computation Products Group - High Density Data Center Committee 22

AMD’s RoleIn Dense Computing Environments?

• Primarily a component vendor - however advancements in density require that the industry as a whole play their part in addressing the issues.

• CPU and Chipset components play a large role in addressing the needs for ever increasing performance at price and power points that are compelling for next generation compute devices.

• AMD has already made advances in this area and continues to innovate, enhancing the price / power / performance metric that’s so important to realizing the dense data center model.

Page 23: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

AMD64 Product Overview & Positioning

Page 24: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

August 13, 2004 Computation Products Group - High Density Data Center Committee 24

AMD64 – A quick show of hands …

Who’s heard of ...

1. AMD64 or x86-64 Architecture?

2. AMD Opteron™ with Direct Connect Architecture?

3. Hyper Transport?

4. Glue less multi-processing?

5. SMP / CC-NUMA architectures?

6. Intel?

Page 25: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

August 13, 2004 Computation Products Group - High Density Data Center Committee 25

AMD64 Brand Architecture

Customer-Centric Innovation

Your Link To The Future Of Computing

Mobile Athlon64 Athlon64 Athlon64 FX OpteronAthlon32

Leading Mobile Performance

Leading Performance

AMD64 Capable

CinematicComputingon AMD64

Simplifying Business

Leading Value and Performance

x86-32

Page 26: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

August 13, 2004 Computation Products Group - High Density Data Center Committee 26

AMD64 Solutions from Mobile to Server

AMD serves the mid-range, high-volume server space by supporting the best of both scale-up and scale-out approaches

Perf

orm

ance

Price

1P Desktop& Mobile

1P Server& Workstation

2P/4P ServersWorkstation

4P+ Servers/HPCCluster

Provide Server-class CPUs & components to build balanced, high-performance 1P to 8P Scale-Up systems;

Design these CPUs and components to fit in the cost and complexity envelope of simple Scale-Out systems;Lower pricing with “PC” volumes

Remove the complexity and price barrier between Scale-up & Scale-out

Leverage & extend the Industry investment and expertise in x86 while extending it to 64-bit.

Page 27: AMD64 with Direct Connect Architecture - cfroundtable.orgcfroundtable.org/hdcc/081104/DENSE COMPUTE ARCHITECTURES by... · AMD64 with Direct Connect Architecture A Solid Foundation

August 13, 2004 Computation Products Group - High Density Data Center Committee 27

AMD64Innovative Approach to 64-bit Computing

• AMD is leading the way to the 64-bit future with AMD64 technology

• The first platform designed for high-end server, mainstream client, and mobile markets

• With AMD64 technology

• Preserve existing x86 32-bit investment

• Industry leading 32-bit performance

• Evolutionary ability to migrate to 64-bit

HyperTransport™ technologyIncrease overall system performance by reducing I/O bottlenecks and increasing bandwidth

Integrated DDR memory controllerImproved application performance

PowerNow!™ & Cool‘n’Quiet™ technologyPower Management Solutions to reduce power consumption & system noise

Enhanced security technologyvirus protection to prevent “buffer overflow” attacks with Microsoft® Windows® XP SP2

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August 13, 2004 Computation Products Group - High Density Data Center Committee 28

AMD Athlon™ 64 Processor

Replaces Address, Data and Control Bus

72

16

AMD64: Desktop / Mobile Processor

8 Byte memory controller supporting DDR200,

DDR266, DDR333 & DDR400 Memory

Drive up to 4 unbuffered DIMMs

4 DIMMs <=DDR266 (PC2100)

2 DIMMs >=DDR333 (PC2700)

2 DIMMs DDR400 (PC3200)

Future memory support as it is defined

Up to 4GB x4 DRAMS (4GB DIMMs)

One 16-bit non-coherent HyperTransport™ I/O

link

On chip L1 & L2 cache

64KB L1 ICache, 64KB L1 DCache

512K / 1M ECC protected L2 Cache

754-pin µPGA Package

L2Cache

L1Instruction

Cache

L1Data

Cache

AMD64Processor

Core

DDR MemoryController

HyperTransport™

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August 13, 2004 Computation Products Group - High Density Data Center Committee 29

1P Athlon™ 64 System

System Strengths:

Ideal for low cost, small footprint designs that still require excellent compute & I/O performance

Examples:

• Storage / network appliances

• Small form factor modular designs (1P blades)

• Application specific compute products

AMDAthlon™ 64

AMDAthlon™ 64

72b DDRw/ ECC

USB, EIDE, SATAFDC, and GbE I/O

HubI/O

Hub

PCI 33-32

KVMOpt’lBMC

Opt’lBMC SIOSIOTPMTPMBIOSBIOS

PCI-X 2.0

Opt’l SCSIDual GbE

Opt’l SCSIDual GbE

PCI-XBridgePCI-XBridge

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August 13, 2004 Computation Products Group - High Density Data Center Committee 30

AMD Athlon 64 FX

L2Cache

L1Instruction

Cache

L1Data

Cache

AMD64Processor

Core

DDR MemoryController

HyperTransport™

72/144

16

High-end consumer (939 pin – 1xHT)

16 Byte memory controller supporting DDR200,

DDR266, DDR333 & DDR400 Memory

Drive up to 8 DIMMs

8 DIMMs <= DDR266 (PC2100)

4 DIMMs >= DDR333 (PC2700)

4 DIMMs DDR400 (PC3200)

Up to 4GB x4 DRAMS (4GB DIMMs)

One 16-bit non-Coherent HyperTransport™

Technology Link

On chip L1 & L2 cache

64KB L1 ICache, 64KB L1 DCache

Up to 1M ECC protected L2 Cache

939-pin µPGA Package

Replaces Address, Data and Control Bus

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August 13, 2004 Computation Products Group - High Density Data Center Committee 31

1P Athlon™ 64 FX

AMDAthlon™ 64 FX

AMDAthlon™ 64 FX

128b DDRReg ECC System Strengths:

Outright client performance –Lots of compute, memory and I/O bandwidth.

Examples:

• Ultimate Gaming PC• 1P Graphics workstation• Audio / Visual content

creation

I/OHubI/O

Hub

PCI 33-32USB, EIDE, SATA

FDC, and GbE

KVMOpt’lBMC

Opt’lBMC SIOSIOTPMTPMBIOSBIOS

AGP8x

AGP8x

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August 13, 2004 Computation Products Group - High Density Data Center Committee 32

1P AMD Opteron™ 100 Series

L2Cache

L1Instruction

Cache

L1Data

Cache

AMD64Processor

Core

DDR MemoryController

HyperTransport™

72/144

16 16 16

18 CAS lines for 32GB of memoryAMD64: 1 way Value Workstation, storage & networking applications

16 Byte memory controller supporting DDR200,

DDR266, DDR333 & DDR400 Memory

CHIPKILL ECC with x4 DRAMs

Drive up to 8 registered DIMMs

8 DIMMs <= DDR266 (PC2100)

4 DIMMs >= DDR333 (PC2700)

4 DIMMs DDR400 (PC3200)

Up to 4GB x4 DRAMS (4GB DIMMs)

Three 16-bit non-Coherent HyperTransport™

Technology Links

On chip L1 & L2 cache

64KB L1 ICache, 64KB L1 DCache

Up to 1M ECC protected L2 Cache

940-pin µPGA Package

Replaces Address, Data and Control Bus

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August 13, 2004 Computation Products Group - High Density Data Center Committee 33

1P AMD Opteron™ 100

System Strengths:

Ideal for cost sensitive designs system where I/O and memory are critical commodities

Examples:

• Storage servers• Mid-range workstations• Blade server• Network switch / router

AMDOpteron100 Series

AMDOpteron100 Series

128b DDRReg ECC

USB, EIDE, SATAFDC, and GbE I/O

HubI/O

Hub

PCI-X 2.0

PCI 33-32

Opt’l SCSIDual GbE

Opt’l SCSIDual GbE

KVMOpt’lBMC

Opt’lBMC SIOSIOTPMTPMBIOSBIOS

AGP8x

AGP8x

PCI-XBridgePCI-XBridge

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August 13, 2004 Computation Products Group - High Density Data Center Committee 34

2P - AMD Opteron™ 200 Series

72/144

16 16 16

18 CAS lines for 32GB of memoryAMD64: 2 Way Performance Workstation / Server,

high performance storage & networking.

16 Byte memory controller supporting

DDR200, DDR266, DDR333 & DDR400 Memory

CHIPKILL ECC with x4 DRAMs

Drive up to 8 registered DIMMs

8 DIMMs <= DDR266 (PC2100)

4 DIMMs >= DDR333 (PC2700)

4 DIMMs DDR400 (PC3200)

Up to 4GB x4 DRAMS (4GB DIMMs)

One coherent and two 16-bit non-

Coherent HyperTransport™ Technology Links

On chip L1 & L2 cache

64KB L1 ICache, 64KB L1 DCache

1MB ECC protected L2 Cache

940-pin µPGA Package

L2Cache

L1Instruction

Cache

L1Data

Cache

AMD64Processor

Core

DDR MemoryController

HyperTransport™

Replaces Address, Data and Control Bus

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August 13, 2004 Computation Products Group - High Density Data Center Committee 35

Advanced AMD Opteron™ MP System Architecture

•Scalable memory and I/O bandwidth – Each processor adds up to 32GB of memory– Each processor adds two HyperTransport™ buses for

more PCI-X/PCI Express and other I/O bridges– Fewer chips required

I/OHubI/O

Hub PCIIDE, FDC,USB, Etc.

AMDOpteronAMDAMD

OpteronOpteronAMDOpteronAMDAMD

OpteronOpteron

PCI-XBridgePCI-XBridgePCI-X

DDR DDR

AMD Opteron System

PCI-XBridgePCI-XBridgePCI-X PCI ExpressPCI Exp

BridgePCI ExpBridge

System Strengths:

Ideal for performance dense scale-out systems where node and overall system scalability are important

Examples:

• 1U rack mount server• DCC Workstation• Mid high end network /

storage processor

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August 13, 2004 Computation Products Group - High Density Data Center Committee 36

4P - 8P AMD Opteron™ 800

72/144

16 16 16

AMD64: 4 - 8 Way Performance Server

16 Byte memory controller supporting

DDR200, DDR266, DDR333 & DDR400 Memory

CHIPKILL ECC with x4 DRAMs

Drive up to 8 registered DIMMs

8 DIMMs <= DDR266 (PC2100)

4 DIMMs >= DDR333 (PC2700)

4 DIMMs DDR400 (PC3200)

Up to 4GB x4 DRAMS (4GB DIMMs)

Three 16-bit Coherent HyperTransport™

Technology Links

On chip L1 & L2 cache

64KB L1 ICache, 64KB L1 DCache

1M ECC protected L2 Cache

940-pin µPGA Package

L2Cache

L1Instruction

Cache

L1Data

Cache

AMD64Processor

Core

DDR MemoryController

HyperTransport™

Replaces Address, Data and Control Bus

18 CAS lines for 32GB of memory

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August 13, 2004 Computation Products Group - High Density Data Center Committee 37

Advanced AMD Opteron™ MP System Architecture

•Scalable memory and I/O bandwidth – Multi processor systems without glue logic– Each processor adds 32GB of memory– Fewer chips required

I/OHubI/O

Hub PCIIDE, FDC,USB, Etc.

PCI-XBridgePCI-XBridgePCI-X

OtherBridgeOtherBridge

OtherI/O

AMDOpteronAMDAMD

OpteronOpteron

AMDOpteronAMDAMD

OpteronOpteron

AMDOpteronAMDAMD

OpteronOpteron

AMDOpteronAMDAMD

OpteronOpteron

DDR

DDR

DDR

DDR

AMD Opteron System

PCI ExpressPCI ExpBridge

PCI ExpBridge

System Strengths:

Ultimate performance for scale-up and scale-out systems where density, memory, compute and I/O performance are essential

Examples:

• 4U rack mount server• Ultimate HPC Cluster node• Dedicated network file

server

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August 13, 2004 Computation Products Group - High Density Data Center Committee 38

Contrast to a typical MP system…

AMD Opteron System Typical MP System

• System scalability limited by MCH ports– Maximum of 4 processors

o Processors compete for FSB bandwidth with memory and I/O accesses

– Memory size and bandwidth are limited– Limited number of bridges– Additional chips required

I/OHubI/O

Hub PCIIDE, FDC,USB, Etc.

PCI-XBridgePCI-XBridgePCI-X

OtherBridgeOtherBridge

OtherI/O

AMDOpteronAMDAMD

OpteronOpteron

AMDOpteronAMDAMD

OpteronOpteron

AMDOpteronAMDAMD

OpteronOpteron

AMDOpteronAMDAMD

OpteronOpteron

DDR

DDR

DDR

DDR

I/OHubI/O

Hub PCIIDE, FDC,USB, Etc.

PCI-XBridgePCI-XBridge

MemoryCtlr Hub(MCH)

MemoryCtlr Hub(MCH)

ProcessorProcessorProcessor

ProcessorProcessorProcessor

ProcessorProcessorProcessor

ProcessorProcessorProcessor

PCI-X

PCI-XBridgePCI-XBridge

PCI-XBridgePCI-XBridge

DDR

DDR

MemoryExpanderMemory

Expander

MemoryExpanderMemory

Expander

PCI-X

PCI ExpBridge

PCI ExpBridge

PCI-XPCI Express

AMD Opteron™ with Direct Connect Architecture?Hyper Transport?Glue less multi-processing?SMP / CC-NUMA architectures?

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August 13, 2004 Computation Products Group - High Density Data Center Committee 39

Advanced AMD Opteron™ 8P System Architecture

•Scalable memory and I/O bandwidth – Up to 8 processors without glue logic– Each processor adds 32GB of memory– Fewer chips required

I/OHubI/O

Hub PCIIDE, FDC,USB, Etc.

PCI-XBridgePCI-XBridgePCI-X

OtherBridgeOtherBridge

OtherI/O

AMDOpteronAMDAMD

OpteronOpteron

AMDOpteronAMDAMD

OpteronOpteron

AMDOpteronAMDAMD

OpteronOpteron

AMDOpteronAMDAMD

OpteronOpteron

DDR

DDR

DDR

DDR

AMD Opteron System

AMDOpteronAMDAMD

OpteronOpteron

AMDOpteronAMDAMD

OpteronOpteron

AMDOpteronAMDAMD

OpteronOpteron

AMDOpteronAMDAMD

OpteronOpteron

DDR

DDR

DDR

DDR

PCI ExpressPCI ExpBridge

PCI ExpBridge

System Strengths:

Ultimate performance for dense scale-up and scale-out systems where memory, compute and I/O performance are essential

Enough memory (256GB), compute and I/O bandwidth to accommodate even the most intense applications

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August 13, 2004 Computation Products Group - High Density Data Center Committee 40

AMD Athlon™ 64 and Opteron™ FeatureEnhanced Virus Protection with AMD64

VIRUS ENHANCED ENHANCED VIRUS VIRUS

PROTECTIONPROTECTIONX+

Upcoming

Enhanced Virus Protection–Helps prevent “buffer overflow” virus attacks from harming the PC

and spreading through the network• Activated in 32-bit Windows® XP with Service Pack 2 – Just Released!• Designed to be native to 64-bit Windows XP and Windows “Longhorn”

client OS

Service Pack 2

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August 13, 2004 Computation Products Group - High Density Data Center Committee 41

Register Extension

• AMD6464-bit integer registers

40-bit Physical Address

48-bit Virtual Address

• Register ExtensionsSixteen 64-bit integer registers

Sixteen 128-bit SSE registers

• Vector Math Instruction Set3DNow!™

SSE & SSE2 support

• Done in such a way as to not alter the IA32 instruction set.

RAX

63

GGPPRR

xx8877

079

31

AHEAX AL

0715In x86

XMM0SSSSEE

127 0

XMM7

EIP

EDI

Added by x86-64

EAX

XMM8XMM8

XMM15

R8

R15

http://www.x86-64.org

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August 13, 2004 Computation Products Group - High Density Data Center Committee 42

AMD’s Solution is an Evolutionary Approach:Backward compatible to IA32

AMD: Single PlatformAMD: Single Platform Designed to maintain legacy Designed to maintain legacy compatibility …compatibility …

…… and obey the Immutable Laws.and obey the Immutable Laws.

(< 3GB Limit) (4GB Limit)Leverage existing infrastructure – thermal, enclosures, power, and BIOS

Run existing 32-bit applications natively

Allow 64-bit migration according to your schedule

Low learning curve for users and support staff

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August 13, 2004 Computation Products Group - High Density Data Center Committee 43

AMD OpteronTM Software A Word on Architectural Feedback

• Code size is only up about 5%– Mostly due to 64-bit literals

• Instruction count is down about 15%– Additional registers really paying off– Many spill/fill memory references eliminated– Call-Exit sequences vastly improved

• Reduced instruction count and increased Instructions Per Cycle (IPC) mean substantial performance gains

– AMD Opteron™ IPC improves about 5%– AMD64 instruction count down about 15%– Net improvement about 20%– Your mileage will vary

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AMD64 With Direct Connect Architecture

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August 13, 2004 Computation Products Group - High Density Data Center Committee 45

Advanced AMD Opteron™ Direct Connect Architecture

The AMD64 family of products leverage the low latency high bandwidth HyperTransport bus to

achieve a distributed architecture

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August 13, 2004 Computation Products Group - High Density Data Center Committee 46

HyperTransport™ Technology Consortium

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August 13, 2004 Computation Products Group - High Density Data Center Committee 47

Advanced AMD Opteron™ Direct Connect Architecture

The AMD Opteron™ provides three 16-bit HyperTransportlinks providing 6.4GB/s bandwidth per link + dual

channel DDR400 memory interfaces!

800MHz * 2(DDR) * 16(width) * 2(Bi-directional) = 51.2Gb/s /8 = 6.4GB/s

2 x PC3200 DDR interface = 6.4GB memory bandwidth

3 x HT links = 19.2GB/s Total I/O bandwidth

+ 6.4GB/s (memory bandwidth) = 25.6GB/s total CPU bandwidth!

and Increasing!

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August 13, 2004 Computation Products Group - High Density Data Center Committee 48

Advanced AMD Opteron™ Direct Connect Architecture

AMD Opteron System

AMDOpteron™

•Scalable memory and I/O bandwidth – Up to 8 processors without glue logic– Each processor adds 32GB of memory– Fewer chips required– Each HT link provides 6.4GB/s of I/O bandwidth

I/OHubI/O

Hub PCIIDE, FDC,USB, Etc.

PCI-XBridgePCI-XBridgePCI-X

OtherBridgeOtherBridge

OtherI/O

DDR

DDR

DDR

DDR

PCI ExpressPCI ExpBridge

PCI ExpBridge

–CPUs are connected directly to CPUs for more linear symmetrical multiprocessing

–Memory is connected directly to the CPU optimizing memory performance

–I/O is directly connected to the CPU for balanced throughput and scaleable I/O

Addresses and helps eliminate the real

challenges and bottlenecks of a complete system

architecture

AMDOpteron™

AMDOpteron™

AMDOpteron™

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August 13, 2004 Computation Products Group - High Density Data Center Committee 49

Advanced AMD Opteron™ Direct Connect Architecture

Ease of design & layout

AMDOpteron™

I/OHubI/O

Hub PCIIDE, FDC,USB, Etc.

PCI-XBridgePCI-XBridgePCI-X

OtherBridgeOtherBridge

OtherI/O

DDR

DDR

DDR

DDR

PCI ExpressPCI ExpBridge

AMDOpteron™

AMDOpteron™

AMDOpteron™

AMDOpteron™

PCI ExpBridge

- 1P done in 4 layers 4.7mil nominal (FR4 2116 ply) dielectric- 2P in as little as 6 layers!

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Power, Performance & DensityWhat’s Next?

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August 13, 2004 Computation Products Group - High Density Data Center Committee 51

Low Power AMD Opteron™ Processors Overview

•Lower wattage processors are expected to enable dense platforms where lower power requirements are essential.

•AMD launched low power parts in February 2004. This is enabling vendors to effectively service additional market segments:

–Standard servers and Blades: In rack-mount chassis, lower power is needed to enable 1U/2P, 1U/4P, 2U/4P and other dense designs to meet end-user needs for overall lower power consumption

–Embedded controllers: In networking, mass storage, telecommunications and other markets low power is needed:

• Network attached storage (NAS) market needs full microprocessor capability with less power than standard parts consume

• Storage area networks (SAN) devices demand very high I/O bandwidth but cannot make provisions for custom thermal solutions

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August 13, 2004 Computation Products Group - High Density Data Center Committee 52

Low Power AMD Opteron™ Processors Overview (con’t)

• These low power parts are bringing AMD64 technology to a broad range of server, workstation and non-traditional enterprise products.

• These new products extend the current AMD Opteron product line– The full-power CPU roadmap is 89 watts 95 watts– The mid-power CPU roadmap is 55 watts– The low-power CPU roadmap is 30 watts

• There is no performance penalty when using low power parts.– Low power parts perform exactly to equivalent speed grade full power

parts

• Lower power AMD Opteron processors leverage today’s current infrastructure.

– Continuing the architecture (940 pin socket)– 1xx, 2xx & 8xx parts are available in 55watt and 30watt today!– Leverages existing infrastructure: MB, Cooling, Software

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August 13, 2004 Computation Products Group - High Density Data Center Committee 53

Low Power Product Positioning

•Rack Dense and Blade Servers (55 watt)–Where performance per watt is a key criteria–Designed for high-density without sacrificing high-

performance–Many end-user computing facilities cannot support full racks of

full power processors

•Modular Environments (30 watt)–Where I/O’s per watt is a key criteria–3 HyperTransport™ links enable substantial I/O for demanding

markets–The AMD Opteron feature set is a perfect fit for non-standard

servers, networking, storage and appliances

•One architecture for all AMD Opteron implementations–89w, 55w and 30w processors all leverage existing 940

infrastructure• Layout design, thermal solutions, software, etc.

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August 13, 2004 Computation Products Group - High Density Data Center Committee 54

AMD Opteron Processor™ HE (55 watt):Leading Performance Per Watt

SPECcpu®2000 Performance

1335 13391354 1394

0

400

800

1200

1600

SPEC®int_peak2000 SPEC®fp_peak2000

SPECcpu®2000 Performance/Watt

15.0 15.0

24.6 25.3

0

10

20

30

SPEC®int_peak2000/Watt SPEC®fp_peak2000/Watt

AMD Opteron™ Model 146 (89W)

AMD Opteron Model 146 HE (55W)

The AMD Opteron Processor Model 146 HE provides equivalent performance at almost 40% lower wattage compared to the full power AMD Opteron

Processor Model 146

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August 13, 2004 Computation Products Group - High Density Data Center Committee 55

Typical Server Architecture

Fire

wal

lFi

rew

all

Cache Cache serversservers

Load Load Balancing Balancing

serversserversWeb Web

serversservers(1(1--2P)2P)

Java Java Application Application

serversservers(2(2--4P)4P)

Database Database serversservers(4(4--8P)8P)

StorageStorage

Tier 1Tier 1 Tier 2Tier 2 Tier 3Tier 3Basic web contentBasic web content Transactional content Transactional content

ClientsClients

Inte

rnet

/

Inte

rnet

/

Intr

anet

Intr

anet

Enterprise View

File & Print File & Print serverserver(1(1--2P)2P)

NetworkNetwork Enterprise KeySMB View

Clie

nts

Clie

ntsClientsClients

InternetInternet PrinterPrinter

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August 13, 2004 Computation Products Group - High Density Data Center Committee 56

AMD64 architecture performance?

Application-specific benchmarks demonstrate the value of the AMD Opteron™ processor in:

–File and print – Netbench

–Web infrastructure – HP’s published WebBench™ 5.0 benchmark shows one AMD Opteron processor can outperform two Xeon processors!

–Web security - SpecWeb99_SSL

–Data Warehousing – TPC-H demonstrates an AMD Opteron processor-based cluster outperforms a Xeon processor-based cluster costing three timesmore!!!

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August 13, 2004 Computation Products Group - High Density Data Center Committee 57

Veritest File Serving Performance …

April 2004 - AMD commissioned VeriTest to conduct a series of tests comparing File Serving performance of AMD and Intel-based

servers running Windows 2003 Server, Standard Edition.

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August 13, 2004 Computation Products Group - High Density Data Center Committee 58

AMD Opteron™ ProcessorFile & Print Serving Performance

•File and print performance:–Heavily I/O dependent

•AMD Opteron™ edge:–HyperTransport™ technology delivers superior I/O performance to make AMD Opteron processor one of the best performing file and print servers

•Key take away:–In the dual processor test, AMD Opteron 248 CPUs outperformed Xeon 3.2GHz by 35%

–For price sensitive file server needs, a single AMD Opteron processor is competitive with a dual Xeon configuration

NetBench 7.02

Samba Server File Sharing (Linux v2.4.23 kernel)

MB/s

41.12

38.86

49.37

Itanium 2 1.5GHz

Xeon 3.06GHz

AMD Opteron 248

100%

106%

127%64-bit

32-bit

64-bit

InfoWorld - January 30, 2004

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August 13, 2004 Computation Products Group - High Density Data Center Committee 59

Clie

nts

Clie

nts

AMD Opteron™ ProcessorWeb Infrastructure Performance

WebBench 5.0(Windows Server 2003 Standard, 1-2P Servers)

0500

10001500200025003000350040004500

1 4 8 12 16 20 24 28 32 36 40 44 48 52 56 60

Number of Clients

Req

uest

s P

er S

econ

d

AMD Opteron 248 2P AMD Opteron 248 1PXeon 3.2GHz 2P Xeon 3.2GHz 1P

Hewlett-Packard Results

All scores 32-bit

AMD Opteron 2P wins by 57%

HP ProLiant DL140 (Xeon) vs. DL145 (AMD Opteron)

1P AMD Opteron processor can outperform 2P Xeon by over 20%

2P AMD Opteron processor can outperform 2P Xeon by 57%

• Web server performance: – Highly dependent on memory

response and I/O performance

• AMD Opteron™ processor edge:– HyperTransport™ technology and

the integrated memory controller of AMD Opteron processors help to deliver great I/O performance and memory response time in handling large numbers of user connections and response times both on static and dynamic web pages.

• Key take away:– AMD Opteron processor’s Direct

Connect Architecture is perfect for web serving, delivering industry-leading performance that is sustained as the client load increases.

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August 13, 2004 Computation Products Group - High Density Data Center Committee 60

Clie

nts

Clie

nts

AMD Opteron™ ProcessorWeb Security Performance

• Web security performance:– Highly dependent on memory latency– As encryption gets more complex, 64-bit

processing will become necessary

• AMD Opteron™ edge: – The integrated memory controller of

AMD Opteron processor enhances the caching of secure data

– RSA Software is optimized for the AMD Opteron processor to enable fast transaction response

– AMD64™ technology enables seamless transition to 64-bit computing as encryption algorithms increase in complexity

• Key take away: – Web security requirements will drive a

migration to more complex algorithms best served by 64-bit technology

– The AMD Opteron processor outperforms Xeon in today’s 32-bit secure Web serving environment and helps make the transition to 64-bit computing easy

1304138214401475

19302000

2340

Xeon 3.06GHz

Xeon 3.06GHz 1MB L3

Xeon 3.2GHz 1MB L3

Xeon 3.2GHz 2MB L3

Itanium 2 1.5GHz 6MB L3

AMD Opteron 246

AMD Opteron™ 248 117%

100%

72%

69%

65%

97%

74%

SPECweb®99_SSL(2P Servers)

AMD Opteron™ and Itanium 2 scores 64-bit

Xeon scores 32-bit

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August 13, 2004 Computation Products Group - High Density Data Center Committee 61

AMD Opteron™ ProcessorApplication Server

• Application Server Performance– Highly dependent on memory

response and I/O sub system performance

• AMD Opteron™ processor edge:– HyperTransport™ technology and the

integrated memory controller of AMD Opteron processor delivers fantastic I/O performance and memory response time in handling large numbers of user connections and response times both on static and dynamic Web pages.

• Key take away:– AMD Opteron processors are cost-

effective for application servers– AMD Opteron processor’s Direct

Connect Architecture is able to drive high application server performance TOPS: Total Operations Per Second

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August 13, 2004 Computation Products Group - High Density Data Center Committee 62

Clie

nts

Clie

nts

AMD Opteron™ ProcessorData Warehousing Performance

•Data Warehousing performance:

–Highly dependent on server scalability, efficiency and data throughput capacity

•AMD Opteron™ edge:–Direct Connect Architecture offers

scalable memory bandwidth with very low latency for better data throughput as data requirements increase

•Key take away:–Datasets are increasing at huge

rates requiring more efficient data warehousing systems

–AMD Opteron processor-based clusters can outperform a Xeon processor-based cluster at one third the cost!

12216AMD Opteron™ 246

12995

13194

Pentium® III Xeon 900MHz (64CPUs)

AMD Opteron™ 246 (16 CPUs)

TPC-H™(clustered 2P Servers)

100GB Database

300GB Database

100%

102%$863,410

$2,636,750

AMD Opteron scores 64-bit

Xeon score 32-bit

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August 13, 2004 Computation Products Group - High Density Data Center Committee 63

AMD Opteron™ Dual Core

AMD Announces Technology Milestone With Its Multiple-Core Strategy

— First AMD64 dual-core solutions planned to be available in mid-2005 —

SUNNYVALE, CALIF. -- June 14, 2004 --Today AMD (NYSE: AMD) announced a technology milestone with the completed design of its AMD64 dual-core processors. AMD plans to deliver high-performance dual-core products to the x86 server market in mid-2005 and introduce dual-core solutions for high-end client PCs in the second half of 2005.

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August 13, 2004 Computation Products Group - High Density Data Center Committee 64

AMD Opteron™ Dual Core Highlights

• Dual core parts will launch in the AMD Opteron processor line in 2005 and will enable AMD to continue to drive technology leadership in the server and workstation market.

–These processors can be inserted into 90nm AMD Opteron 940-pin sockets with a BIOS update, saving time and costs while increasing performance and value.

–Completely compatible with x86 and AMD64 applications while benefiting multi-threaded environments.

–CPU intensive applications will experience the greatest performance advantage. Examples include: Business Processing, Technical Computing, Network processing and Web Infrastructure.

–AMD Opteron with dual core processing is another example of how AMD is extending it’s Direct Connect Architectureleadership and increasing density by connecting two CPUs on die.

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August 13, 2004 Computation Products Group - High Density Data Center Committee 65

AMD Opteron™ ProcessorSingle Core vs. Dual Core Performance Estimates

FREQUENCY

PER

FOR

MA

NC

E

Single CoreDual Core

Note the rate of incline is steeper with dual core as each speed increase benefits 2 CPU’s!

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Examples Built On an AMD64 Technology Foundation

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August 13, 2004 Computation Products Group - High Density Data Center Committee 67

Rackable Cx000 Servers…

•High density with 176 processors per cabinet

•2U half-depth chassis enables back-to-back mounting for double density

•Front-facing I/O for easiest serviceability

•Choice of AC or DC power

•Supports fastest 64-bit processors

•Total component choice and flexibility

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August 13, 2004 Computation Products Group - High Density Data Center Committee 68

Sun Microsystems V20z…

• One or two AMD Opteron 200 Series processors (models 242, 244, 248)

• Up to 16 GB of registered DDR1-333 SDRAM (4 DIMM slots per processor for a total of 8 DIMM slots; 128 bit plus ECC databus)

• Two 10/100/1000-Mbps BaseT Ethernet ports

• Two 64-bit PCI-X slots: – One full-length at 133 MHz – One half-length at 66 MHz

• One or two 36 GB, 73 GB, or 146 GB Ultra320 SCSI disk drives (Internal)

• Operating System: – Solaris 9 4/04 x86 Platform Edition (32-bit) – Red Hat Enterprise Linux 3 for AMD Opteron (32-

bit/64-bit) – SUSE Linux Enterprise Server 8 for AMD Opteron

(64-bit) – SUSE Linux 9 Professional (64-bit)– Microsoft Windows 2000– Microsoft Windows Server 2003

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August 13, 2004 Computation Products Group - High Density Data Center Committee 69

HP ProLiant DL585…

• AMD Opteron™ Model 850 (2.4GHz/ 1MB), Model 848 (2.2GHz/ 1MB), Model 844 (1.8GHz/1MB), or Model 842 (1.6GHz/1MB)

• Up to 64GB of dual channel PC2100 DDR

• Smart Array 5i Plus controller, with 64MB memory and battery-backed write cache

• HP embedded NC7782 dual port PCI-X Gigabit Server Adapter

• 8 I/O slots: 6 x 64-bit/100 MHz PCI-X expansion slots and 2 x 64-bit/133MHz PCI-X slots

• HyperTransport (processor interconnect) runs at 800MHz with 6.4GB of bandwidth

• On-die memory controller which runs at processor core frequency

• 5.3 GB per processor of memory bandwidth

Best in class 4-way 32-bit performance supports the most complex, compute-intensive application environments

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August 13, 2004 Computation Products Group - High Density Data Center Committee 70

IBM eServer 325 …

•1U rack-optimized chassis

•Up to 2 AMD OpteronTMprocessors

•1GB standard up to 12GB max PC2700 ECC DDR SDRAM memory

•Open-bay hot-swap Ultra320 SCSI or 40GB IDE drive standard; supports up to 2 hard disk drives

•Two 64-bit PCI-X slots

•Integrated dual Gigabit Ethernet ports

•Integrated systems management processor

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August 13, 2004 Computation Products Group - High Density Data Center Committee 71

Cray XD1 … Exceptional Performance

Chassis Each Rack

Compute Processors 12 144

Performance 53 GFLOPS* 633 GFLOPS*

Aggregate Switching Capacity 96 GB/s 1152 GB/s

Interprocessor Latency 1.6 µsec 1.8 µsec

Aggregate Memory Bandwidth 77 GB/s 922 GB/s

Maximum Memory 96 GB 1.2 TB

Maximum Disk Storage 2 TB 24 TB

* Peak theoretical performance with 2.2 GHz AMD Opteron

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August 13, 2004 Computation Products Group - High Density Data Center Committee 72

AMD Opteron™ ProcessorThermally Tested Server Solutions

Some Thermally Tested Server Barebones Solutions:

AW171* (Pedestal 1P)•BBATOA100-A01(1U/2P)•BBATOC100-A01(1U/2P Half Depth)•BBATOM208S-A01 (2U/2P)•BBATOM510S-A01 (5U/2P)

•Tyan S2880(Pedestal/2P)•Arima HDAMA(Pedestal/2P)•MSI 9131(Pedestal/2P)R3122 (1U)

•Transport GX28 (B2882) •TS-1881 (1U/2P)

K1-1000 (1U/2P)•Clusteron D (1U)•RC-0103 (1U 1+1Power Supplies)•RC-0104 (1U)•RC-0222 (2U)

Appro 1100H (1U/2P)

R4280A (2U/4P)•2100 (1U/2P)•4300 (3U/4P)

*Available only in EuropeGreen font = passed AMD Thermal Test

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August 13, 2004 Computation Products Group - High Density Data Center Committee 73

Validated Server Program

A8440

•Designed by AMD manufactured by Celestica

•Available through the channel or direct (depending on volume). Current distributors in both NA and Europe.

•Validated for AMD Opteron X50 series

•Support for 256MB up to 2GB memory modules

US Support/Sales Phone: 1-866-350-8475Support Email: [email protected]: +44 1952 230 415

By email: [email protected] AMD Contact: Jon Green ([email protected])By phone: (512) 658-1498

A8440

A2210

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August 13, 2004 Computation Products Group - High Density Data Center Committee 74

Infrastructure Information

• We encourage our customers & partners to visit AMD’s public website for infrastructure items including:

–Recommended Motherboards –Thermal Solution Guidelines –Thermally Tested Server Solutions –Memory Guidelines –Power Supply Guidelines –Tower Chassis Guidelines –Support Components

http://www.amd.com/configuration

-Online Processor Quick Reference Guidehttp://www.amd.com/processorquickrefguide

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Q&AA test that you were all listening!

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Thank you!

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