application of pulsed dc to suppress bubble incorporation & control deposit morphology during...
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APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT BUBBLE INCORPORATION & CONTROL DEPOSIT
MORPHOLOGY DURING AQUEOUS MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) ELECTROPHORETIC DEPOSITION (EPD)
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Part - IPart - I
Application of EPD Process
Advantage of EPD Process
Challenges
Choice of solvent & applied current
Conventional EPD process
Aqueous EPD process
How to control water electrolysis and bubble
incorporation in the deposit ?
Previous attempts to develop Aqueous EPD
APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS BUBBLE TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING
AQUEOUS ELECTROPHORETIC DEPOSITION (EPD)AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) PART – 2 PART – 2 (Coming Soon) (Coming Soon)
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