APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT BUBBLE INCORPORATION & CONTROL DEPOSIT

MORPHOLOGY DURING AQUEOUS MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) ELECTROPHORETIC DEPOSITION (EPD)

www.manuscriptedit.com

Part - 4Part - 4

Mechanism

1.How the particles maintain electrophoretic mobility during pulse

OFF time.

2.Why the bubble incorporation decreases at lower pulse widths.

??

Mechanisms

Mechanism

Mechanisms

Pulsed EPD in High Magnetic Field

Pulsed EPD in High Magnetic Field

Pulsed EPD in High Magnetic Field

Anodic pulse EPD

Summary

Application of Pulse voltage/current of suitable width and duty cycle enabled smooth, bubble-free deposit by EPD

from aqueous suspension.

Yield from pulsed –EPD is generally less than continuous DC EPD. Yield decreases with decrease in pulse width.

A narrow window exists in the Voltage/current vs. pulse width plot within which bubble-free deposit is obtained.

There is no deposition at pulse widths below the window.

Deposit with incorporated bubbles form at pulse widths above the window.

The window is wider and lies at higher pulse widths for low applied potential/currents compared to higher

potential/currents.

Decrease in bubble incorporation at lower pulse widths is due to low discrete amount of H2 generation per pulse and

its uniform dissipation as micro and nano-bubbles which dont coalesce to form macro-bubbles.

Pulsed EPD will enable reduction in cost of EPD as it promises to use aqueous suspension and replace the

conventionally used organic solvents which are expensive and not environmental friendly.

Acknowledgements

Prof. Y. Sakka for giving me an opportunity to work in this Group.

Dr. T. Uchikoshi for being my host researcher.All the researchers in the group for their invaluable help and discussion.

Ms. Miki, Ms. Kon and Ms.Nakaizumi for help in experiments.

Ms. Tamiya & Ms. Yamaguchi for the administrative help.NIMS for the Post-doctoral fellowship.All the friends for making my time in Japan a memorable one.

APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS BUBBLE TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING

AQUEOUS ELECTROPHORETIC DEPOSITION (EPD)AQUEOUS ELECTROPHORETIC DEPOSITION (EPD)

THANK YOU

www.manuscriptedit.comwww.manuscriptedit.com

VISITVISIT