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APPLICATION OF APPLICATION OF PULSED DC PULSED DC TO SUPPRESS BUBBLE TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) (EPD) www.manuscriptedit. com Part Part - I - I

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APPLICATION OF PULSED DC TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD)

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Page 1: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous Electrophoretic deposition (epd) : part - 1

APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT BUBBLE INCORPORATION & CONTROL DEPOSIT

MORPHOLOGY DURING AQUEOUS MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) ELECTROPHORETIC DEPOSITION (EPD)

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Part - IPart - I

Page 2: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous Electrophoretic deposition (epd) : part - 1

Page 3: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous Electrophoretic deposition (epd) : part - 1

Application of EPD Process

Page 4: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous Electrophoretic deposition (epd) : part - 1

Advantage of EPD Process

Page 5: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous Electrophoretic deposition (epd) : part - 1

Challenges

Page 6: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous Electrophoretic deposition (epd) : part - 1

Choice of solvent & applied current

Page 7: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous Electrophoretic deposition (epd) : part - 1

Conventional EPD process

Page 8: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous Electrophoretic deposition (epd) : part - 1

Aqueous EPD process

Page 9: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous Electrophoretic deposition (epd) : part - 1

How to control water electrolysis and bubble

incorporation in the deposit ?

Page 10: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous Electrophoretic deposition (epd) : part - 1

Previous attempts to develop Aqueous EPD

Page 11: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous Electrophoretic deposition (epd) : part - 1

APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS BUBBLE TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING

AQUEOUS ELECTROPHORETIC DEPOSITION (EPD)AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) PART – 2 PART – 2 (Coming Soon) (Coming Soon)

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