application of pulsed dc to suppress bubble incorporation & control deposit morphology during...
DESCRIPTION
Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd)TRANSCRIPT
APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT BUBBLE INCORPORATION & CONTROL DEPOSIT
MORPHOLOGY DURING AQUEOUS MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) ELECTROPHORETIC DEPOSITION (EPD)
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Objectives
Develop a generic aqueous EPD process applicable to all types of suspension and substrates by use of pulsed DC.
Control the extent of gas bubble incorporation and the morphology of the deposit.
Study and optimize the process parameters to obtain smooth, homogeneous and bubble-free deposits.
Develop understanding on the involved mechanism.
Experimental
Zeta potentialZeta potential
Constant voltage Continuous Constant voltage Continuous DC EPDDC EPD
Constant voltage Pulsed DC EPD
Conventional EPD process
Constant voltage Pulsed DC EPD
Constant voltage Pulsed DC EPD
APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS BUBBLE TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING
AQUEOUS ELECTROPHORETIC DEPOSITION (EPD)AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) PART – 3 PART – 3 (Coming Soon) (Coming Soon)
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