application of pulsed dc to suppress bubble incorporation & control deposit morphology during...

10
APPLICATION OF APPLICATION OF PULSED DC PULSED DC TO SUPPRESS TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) DEPOSITION (EPD) www.manuscriptedit. com Part Part - 3 - 3

Upload: manuscriptedit-docs

Post on 31-May-2015

94 views

Category:

Education


0 download

DESCRIPTION

Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) Referneces :- * Aqueous electrophoretic deposition (epd) Part - 1 : http://goo.gl/aH06fC * Aqueous electrophoretic deposition (epd) Part - 2 : http://goo.gl/tu9F4Y

TRANSCRIPT

Page 1: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 3

APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT BUBBLE INCORPORATION & CONTROL DEPOSIT

MORPHOLOGY DURING AQUEOUS MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) ELECTROPHORETIC DEPOSITION (EPD)

www.manuscriptedit.com

Part - 3Part - 3

Page 2: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 3

Constant current Continuous DC EPD

Page 3: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 3

Constant current Continuous DC EPD

Page 4: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 3

Constant current Pulsed EPD

Page 5: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 3

Constant current Pulsed EPD

Page 6: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 3

Constant current Pulsed EPD

Page 7: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 3

Constant current Pulsed EPD

Page 8: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 3

Constant current Pulsed EPD

Page 9: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 3

Mechanism

1.How the particles maintain electrophoretic mobility during pulse

OFF time.

2.Why the bubble incorporation decreases at lower pulse widths.

??

Contd….PART - 4

Page 10: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 3

APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS BUBBLE TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING

AQUEOUS ELECTROPHORETIC DEPOSITION (EPD)AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) PART – 4 PART – 4 (Coming Soon) (Coming Soon)

THANK YOU

www.manuscriptedit.comwww.manuscriptedit.com

VISITVISIT