application of pulsed dc to suppress bubble incorporation & control deposit morphology during...
DESCRIPTION
Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) Referneces :- * Aqueous electrophoretic deposition (epd) Part - 1 : http://goo.gl/aH06fC * Aqueous electrophoretic deposition (epd) Part - 2 : http://goo.gl/tu9F4YTRANSCRIPT
APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT BUBBLE INCORPORATION & CONTROL DEPOSIT
MORPHOLOGY DURING AQUEOUS MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) ELECTROPHORETIC DEPOSITION (EPD)
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Part - 3Part - 3
Constant current Continuous DC EPD
Constant current Continuous DC EPD
Constant current Pulsed EPD
Constant current Pulsed EPD
Constant current Pulsed EPD
Constant current Pulsed EPD
Constant current Pulsed EPD
Mechanism
1.How the particles maintain electrophoretic mobility during pulse
OFF time.
2.Why the bubble incorporation decreases at lower pulse widths.
??
Contd….PART - 4
APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS BUBBLE TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING
AQUEOUS ELECTROPHORETIC DEPOSITION (EPD)AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) PART – 4 PART – 4 (Coming Soon) (Coming Soon)
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