plans for the next year a short report on hft/pxl plans for post may 2012

L. Greiner 1IPHC meeting – May 7, 2012

STAR HFTSTAR HFT

Plans for the next year

A short report on HFT/PXL plans for post May 2012

TPC – Time Projection Chamber(main tracking detector in STAR)

HFT – Heavy Flavor Tracker SSD – Silicon Strip Detector

r = 22 cm LBNL – Jim Thomas

IST – Inner Silicon Tracker r = 14 cm MIT – Bernd Surrow

PXL – Pixel Detector r = 2.5, 8 cm LBNL – Leo Greiner

2IPHC meeting – May 7, 2012L. Greiner

STAR HFTOutline

• Existing HFT/PXL status and schedule• Engineering run tasks and status• Issues

3IPHC meeting – May 7, 2012L. Greiner

STAR HFTExisting PXL status and schedule

• We are ~ 1 year into the construction project.• Many thanks to IPHC group for years of collaboration, support and

help including during reviews.• Significant management overhead, reports, reviews, etc.• The RHIC engineering run was delayed until the end of February

2013.• The new IDS pieces and new beam pipe were installed over the

summer.• The installation for the PXL prototype detector is scheduled for the

end of February 2013.• The SSD and IST detectors are not scheduled to be installed until

summer 2013.• The main task for 2012 / early 2013 is the construction and delivery

of a three sector prototype detector by January of 2013. • The full detector will be installed in September 2013.

4IPHC meeting – May 7, 2012L. Greiner

STAR HFTPXL engineering run tasks

We have a deliverable of a working prototype detector (3-4 sectors) to be installed in early 2013. Thus we need to produce first articles of all of the production stages for the final detector.

Tasks for 2012:• Production probe testing working for Ultimate sensors• Cable design complete with Cu conductors• New pre-production RDO (all boards) system working• Full firmware and software for data-taking• All mechanical designs complete and tested.• Mechanical structures fabricated.• Ladders => sectors fabricated + full scripted testing.• Metrology• Slow control system• Software for tracking using metrology data• Software for cosmic ray / beam testing tracking.• etc.

5IPHC meeting – May 7, 2012L. Greiner

STAR HFTSteps to Prototype Detector

Fix cable design (width)

Fabricate cables Fix mechanical designFabricate mech pieces

Probe test sensors

Fabricate ladders

Fabricate sectors

Testing and metrology

Test ladder cable design

Deliver to STAR, test and install

Sensor and mechanical only. RDO, slow control, etc. not shown.

Prototype detector planned to be fabricated with Ultimate 1 and Ultimate 2 sensors.

In progress

In progress

In progress

6IPHC meeting – May 7, 2012L. Greiner

STAR HFTNext Steps

• Fabricate ladders from the 5 wafers of Ultimate-2 sensors. • Place order for production run of Ultimate-2 sensors –

completed 1/17/2013• Fabricate ~ 4 sectors from these ladders.• Metrology – first sector is in progress.• Finalize and produce MTBs.• Test detector.• Install at BNL and test.• All interfaces to the STAR experiment.• Goals for the engineering run can be found at http://

rnc.lbl.gov/hft/hardware/docs/ultimate/PXL_engineering_run_testing.docx

7IPHC meeting – May 7, 2012L. Greiner

STAR HFTCable StructurePreliminary Design: Hybrid Copper / Aluminum conductor flex cable

There are two cable regions joined by wire bonds

Outer ladders have a simple rectangular driver region PCB.

Inner ladders have a complex driver region PCB that incorporates a kapton flex region to allow the ladder interface connector to be routed to the top of the sector.

8IPHC meeting – May 7, 2012L. Greiner

STAR HFTProduction ladders

9IPHC meeting – May 7, 2012L. Greiner

STAR HFTSector Production

10IPHC meeting – May 7, 2012L. Greiner

STAR HFTProduction sectors

Production sector on metrology stage

11IPHC meeting – May 7, 2012L. Greiner

STAR HFTSelected Issues• Probe testing –

– The probe pins were making intermittent contact with the pads– We re-designed the probe card to have probes only on the digital side of the

sensor and modified the probe pin mechanism to have greater travel range for the same contact force.

– This has been tested and is now working well with the Ultimate-2 sensors.

• Aluminum conductor cables – – CERN PCB shop is having trouble with the aluminum delaminating during

processing. – They will be unable to deliver any cables for the engineering run.– The problem is understood but will require vapor deposition for the full aluminum

thickness. This is more expensive and time consuming.– We are working with another vendor (Hughes) to develop an aluminum

fabrication process.– Some progress has been made. Please see report at http://

rnc.lbl.gov/hft/hardware/docs/ultimate/Hughes_al_cond_cable_progress_2012_12_14.docx