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  • SERVICE MANUAL US Model AEP Model

    UK Model E Model

    Russian Model Australian Model Singapore Model

    Thai Model BDP-S300

    BDP-S300/S301 RMT-B101A/B101P

    SPECIFICATIONS

    Ver. 1.1 2007.07

    Photo: BDP-S300

    System Laser: Semiconductor laser

    Outputs (Jack name: Jack type/Output level/ Load impedance) AUDIO OUT L/R:

    Phono jack/2 Vrms/10 kilohms DIGITAL OUT (OPTICAL):

    Optical output jack/−18 dBm (wave length 660 nm)

    DIGITAL OUT (COAXIAL): Phono jack/0.5 Vp-p/75 ohms

    5.1CH OUTPUT: Phono jack/2 Vrms/10 kilohms

    HDMI OUT: HDMI 19-pin standard connector

    COMPONENT VIDEO OUT(Y, /PB/CB, PR/CR):

    Phono jack/Y: 1.0 Vp-p/PB/CB, PR/CR: progressive or interlace = 0.7 Vp-p/75 ohms

    VIDEO: Phono jack/1.0 Vp-p/75 ohms S VIDEO: 4-pin mini DIN/Y:

    1.0 Vp-p, C: 0.286 Vp-p/75ohms (US, CND)

    1.0 Vp-p, C: 0.3 Vp-p (PAL)/75ohms (Except US, CND, SP)

    (SP)

    1.0 Vp-p, C: 0.3 Vp-p (PAL)/Y: 1.0 Vp-p, C: 0.286 Vp-p (NTSC)/75ohms

    General Power requirements:

    120 V AC, 60 Hz (US, CND) 110–240 V AC, 50/60 Hz (E32) 220–240 V AC, 50/60 Hz

    (Except US, CND, E32) Power consumption: 33 W Dimensions (approx.):

    430 × 79 × 375 mm (17 × 3 1/8 × 14 7/8 in.) (width/height/depth) incl. projecting parts

    Mass (approx.): 4.5 kg (10 lb) Operating temperature:

    5 °C to 35 °C (41°F to 95°F) Operating humidity:

    25 % to 80 %

    Supplied accessories

    Specifications and design are subject to change without notice.

    • Video cord (phono plug × 1) (1) • Stereo audio cord (phono plug × 2) (1) • HDMI cord (1)

    (supplied with BDP-S301 only) • Power cord (1) • Remote commander (remote) (1) • Size AA (R6) batteries (2) • Plug Adaptor (1) (E32) • GNU License Information (1)

    (Except US, CND)

    BLU-RAY DISC PLAYERTM

    • Abbreviation CND : Canadian model E32 : Latin American model SP : Singaporean model

    Canadian Model BDP-S300/S301

  • – 2 –

    WARNING!!

    WHEN SERVICING, DO NOT APPROACH THE LASER EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS NECESSARY TO CONFIRM LASER BEAM EMISSION, BE SURE TO OBSERVE FROM A DISTANCE OF MORE THAN 25 cm FROM THE SURFACE OF THE OBJECTIVE LENS ON THE OPTICAL PICK-UP BLOCK.

    CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure.

    SAFETY-RELATED COMPONENT WARNING!!

    COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

    Fig. A. Using an AC voltmeter to check AC leakage.

    1.5 kΩ0.15 µF AC voltmeter (0.75 V)

    To Exposed Metal Parts on Set

    Earth Ground

    LEAKAGE TEST The AC leakage from any exposed metal part to earth

    ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 mi- croamperes). Leakage current can be measured by any one of three methods.

    1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers' instructions to use these instruments.

    2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job.

    3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The “limit” indica- tion is 0.75V, so analog meters must have an accurate low- voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex- amples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suit- able. (See Fig. A)

    1. Check the area of your repair for unsoldered or poorly-sol- dered connections. Check the entire board surface for solder splashes and bridges.

    2. Check the interboard wiring to ensure that no wires are “pinched” or contact high-wattage resistors.

    3. Look for unauthorized replacement parts, particularly transis- tors, that were installed during a previous repair. Point them out to the customer and recommend their replacement.

    4. Look for parts which, though functioning, show obvious signs of deterioration. Point them out to the customer and recom- mend their replacement.

    5. Check the line cord for cracks and abrasion. Recommend the replacement of any such line cord to the customer.

    6. Check the B+ voltage to see it is at the values specified.

    7. Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below.

    SAFETY CHECK-OUT

    After correcting the original service problem, perform the following safety checks before releasing the set to the customer:

    CAUTION: The use of optical instrument with this product will increase eye hazard.

    Unleaded solder Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.)

    : LEAD FREE MARK Unleaded solder has the following characteristics. • Unleaded solder melts at a temperature about 40°C higher than

    ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!

    • Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.

    • Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

    ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ!

    LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

    This label is located on the laser protective housing inside the enclosure.

    This appliance is classified as a CLASS1 LASER product. The CLASS1 LASER PRODUCT MARKING is located on the laser protective housing inside the enclosure.

  • – 3 –

    TABLE OF CONTENTS

    Section Title Page Section Title Page

    SERVICE NOTE 1. DISC REMOVAL PROCEDURE IF THE TRAY

    CANNOT BE EJECTED (FORCED EJECTION) .......... 4 2. INSTALLATION METHOD OF EARTH SPRING

    (FRONT) ........................................................................ 4 3. INSTALLATION METHOD OF REAR GASKET ............ 4 4. INSTALLATION METHOD OF NON-HALOGENE

    TAPE .............................................................................. 5 5. TEST DISC .................................................................... 5

    1. GENERAL

    This Player Can Play the Following Discs and Files .... 1-1 Main Features ................................................................ 1-1 Getting Started .............................................................. 1-2 Basic Operations ........................................................... 1-4 Watching Movie Files .................................................... 1-7 Listening to Music Files ................................................. 1-8 Viewing Photo Files ....................................................... 1-9 Changing the Initial Settings ......................................... 1-10 Additional Information ................................................... 1-13

    2. DISASSEMBLY AND REASSEMBLY

    2-1. DISASSEMBLY .............................................................. 2-1 2-1-1. Disassembly Flow ......................................................... 2-1 2-1-2. Upper Case ................................................................... 2-1 2-1-3. Tray Cover Assy ............................................................ 2-2 2-1-4. BD Drive (Service Use) ................................................. 2-2 2-1-5. MAIN Board ................................................................... 2-3 2-1-6. AU-258 Board ................................................................ 2-3 2-1-7. Power Block ................................................................... 2-4 2-1-8. Circuit Boards Location ................................................. 2-4 2-2. REASSEMBLY ............................................................... 2-5 2-2-1. Upper Case ................................................................... 2-5 2-2-2. Tray Cover Assy ............................................................ 2-5 2-2-3. BD Drive (Service Use) ................................................. 2-6 2-2-4. MAIN Board ................................................................... 2-6 2-2-5. FL-176 Board/FR-271 Board ........................................ 2-7 2-2-6. DC FAN.......................................................................... 2-7

    3. BLOCK DIAGRAMS

    3-1. Main Diagram ................................................................ 3-1 3-2. Audio Block Diagram .............