chapter 18: electrical propertiespioneer.netserv.chula.ac.th/~psuvanch/101/ch18_5-9-54.pdfchapter 18...

Chapter 18 - 1

ISSUES TO ADDRESS...

• How are electrical conductance and resistancecharacterized?

• What are the physical phenomena that distinguishconductors, semiconductors, and insulators?

• For metals, how is conductivity affected byimperfections, temperature, and deformation?

• For semiconductors, how is conductivity affectedby impurities (doping) and temperature?

Chapter 18: Electrical Properties

Chapter 18 - 2

• Scanning electron micrographs of an IC:

Fig. (d) from Fig. 12.27(a), Callister & Rethwisch 3e.(Fig. 12.27 is courtesy Nick Gonzales, National Semiconductor Corp., West Jordan, UT.)

• A dot map showing location of Si (a semiconductor):-- Si shows up as light regions.

(b)

View of an Integrated Circuit

0.5mm

(a)(d)

45m

Al

Si (doped)

(d)

• A dot map showing location of Al (a conductor):-- Al shows up as light regions. (c)

Figs. (a), (b), (c) from Fig. 18.27, Callister & Rethwisch 8e.

Chapter 18 - 3

Electrical Conduction• Ohm's Law: V = I R

voltage drop (volts = J/C)C = Coulomb

resistance (Ohms)current (amps = C/s)

1

• Conductivity,

• Resistivity, : -- a material property that is independent of sample size and

geometry

RA

l

surface areaof current flow

current flow path length

Chapter 18 - 4

Electrical Properties

• Which will have the greater resistance?

• Analogous to flow of water in a pipe

• Resistance depends on sample geometry and size.

D

2D

R1 2

D

2

2

8D2

2

R2

2D

2

2

D2

R1

8

Chapter 18 - 5

Definitions

Further definitions

J = <= another way to state Ohm’s law

J current density

electric field potential = V/

flux a like area surface

current

A

I

Electron flux conductivity voltage gradient

J = (V/ )

Chapter 18 - 6

• Room temperature values (Ohm-m)-1 = ( - m)-1

Selected values from Tables 18.1, 18.3, and 18.4, Callister & Rethwisch 8e.

Conductivity: Comparison

Silver 6.8 x 10 7

Copper 6.0 x 10 7

Iron 1.0 x 10 7

METALS conductors

Silicon 4 x 10-4

Germanium 2 x 10 0

GaAs 10-6

SEMICONDUCTORS

semiconductors

Polystyrene <10-14

Polyethylene 10-15-10-17

Soda-lime glass 10

Concrete 10-9

Aluminum oxide <10-13

CERAMICS

POLYMERS

insulators

-10-10-11

Chapter 18 - 7

What is the minimum diameter (D) of the wire so that V < 1.5 V?

Example: Conductivity Problem

Cu wire I = 2.5 A- +

V

Solve to get D > 1.87 mm

< 1.5 V

2.5 A

6.07 x 107 (Ohm-m)-1

100 m

I

V

AR

4

2D

100 m

Chapter 18 - 8

Electron Energy Band Structures

Adapted from Fig. 18.2, Callister & Rethwisch 8e.

Chapter 18 - 9

Band Structure Representation


Chapter 18 -10

Conduction & Electron Transport• Metals (Conductors):-- for metals empty energy states are adjacent to filled states.

-- two types of band structures for metals

-- thermal energy excites electrons into empty higher energy states.

- partially filled band- empty band that overlaps filled band

filled band

Energy

partly filled band

empty band

GAP

fille

d st

ates

Partially filled band

Energy

filled band

filled band

empty band

fille

d st

ates

Overlapping bands

Chapter 18 - 11

Energy Band Structures: Insulators & Semiconductors

• Insulators:-- wide band gap (> 2 eV)-- few electrons excited

across band gap

Energy

filled band

filled valence band

fille

d st

ates

GAP

empty

bandconduction

• Semiconductors:-- narrow band gap (< 2 eV)-- more electrons excited

across band gap

Energy

filled band

filled valence band

fille

d st

ates

GAP?

empty

bandconduction

Chapter 18 -12

Metals: Influence of Temperature and Impurities on Resistivity

• Presence of imperfections increases resistivity-- grain boundaries-- dislocations-- impurity atoms-- vacancies

These act to scatterelectrons so that theytake a less direct path.

• Resistivityincreases with:

=

Adapted from Fig. 18.8, Callister & Rethwisch 8e. (Fig. 18.8 adapted from J.O. Linde, Ann. Physik 5, p. 219 (1932); and C.A. Wert and R.M. Thomson, Physics of Solids, 2nd ed., McGraw-Hill Book Company, New York, 1970.)

T (ºC)-200 -100 0

1

2

3

4

5

6

Res

istiv

ity,

(10

-8O

hm-m

)

0

d-- %CW

+ deformation

i

-- wt% impurity

+ impurity

t

-- temperature

thermal

Chapter 18 -13

Estimating Conductivity

Adapted from Fig. 7.16(b), Callister & Rethwisch 8e.

• Question:-- Estimate the electrical conductivity of a Cu-Ni alloy

that has a yield strength of 125 MPa.

mOhm10 x 30 8

16 )mOhm(10 x 3.31

Yie

ld s

tren

gth

(MP

a)

wt% Ni, (Concentration C)0 10 20 30 40 50

6080

100120140160180

21 wt% Ni


wt% Ni, (Concentration C)R

esis

tivity

,

(10

-8O

hm-m

)

10 20 30 40 500

10203040

50

0

125

CNi = 21 wt% Ni

From step 1:

30

Chapter 18 -14

Charge Carriers in Insulators and Semiconductors

Two types of electronic charge carriers:

Free Electron – negative charge – in conduction band

Hole– positive charge– vacant electron state in

the valence band

Adapted from Fig. 18.6(b), Callister & Rethwisch 8e.

Move at different speeds - drift velocities

Chapter 18 -15

Intrinsic Semiconductors

• Pure material semiconductors: e.g., silicon & germanium

– Group IVA materials

• Compound semiconductors

– III-V compounds• Ex: GaAs & InSb

– II-VI compounds• Ex: CdS & ZnTe

– The wider the electronegativity difference between the elements the wider the energy gap.

Chapter 18 -16

Intrinsic Semiconduction in Terms of Electron and Hole Migration


electric field electric field electric field

• Electrical Conductivity given by:

# electrons/m3 electron mobility

# holes/m3

hole mobilityhe epen

• Concept of electrons and holes:

+-

electron holepair creation

+-

no applied applied

valence electron Si atom

applied

electron holepair migration

Chapter 18 -17

Number of Charge Carriers

Intrinsic Conductivity

)s/Vm 45.085.0)(C10x6.1(

m)(10219

16

hei e

n

For GaAs ni = 4.8 x 1024 m-3

For Si ni = 1.3 x 1016 m-3

• Ex: GaAs

he epen

• for intrinsic semiconductor n = p = ni

= ni|e|(e + h)

Chapter 18 -18

Intrinsic Semiconductors: Conductivity vs T

• Data for Pure Silicon:-- increases with T-- opposite to metals


materialSiGeGaPCdS

band gap (eV)1.110.672.252.40

Selected values from Table 18.3, Callister & Rethwisch 8e.

ni eEgap / kT

ni e e h

Chapter 18 -19

• Intrinsic:-- case for pure Si-- # electrons = # holes (n = p)

• Extrinsic:-- electrical behavior is determined by presence of impurities

that introduce excess electrons or holes-- n ≠ p

Intrinsic vs Extrinsic Conduction

3+

• p-type Extrinsic: (p >> n)

no applied electric field

Boron atom

4+ 4+ 4+ 4+

4+

4+4+4+4+

4+ 4+ hep

hole

• n-type Extrinsic: (n >> p)

no applied electric field

5+

4+ 4+ 4+ 4+

4+

4+4+4+4+

4+ 4+

Phosphorus atom

valence electron

Si atom

conductionelectron

een

Adapted from Figs. 18.12(a) & 18.14(a), Callister & Rethwisch 8e.

Chapter 18 -20

Extrinsic Semiconductors: Conductivity vs. Temperature

• Data for Doped Silicon:-- increases doping-- reason: imperfection sites

lower the activation energy toproduce mobile electrons.

• Comparison: intrinsic vsextrinsic conduction...

-- extrinsic doping level:1021/m3 of a n-type donorimpurity (such as P).

-- for T < 100 K: "freeze-out“,thermal energy insufficient toexcite electrons.

-- for 150 K < T < 450 K: "extrinsic"-- for T >> 450 K: "intrinsic"

Adapted from Fig. 18.17, Callister & Rethwisch 8e. (Fig. 18.17 from S.M. Sze, Semiconductor Devices, Physics, and Technology, Bell Telephone Laboratories, Inc., 1985.)

Con

duct

ion

elec

tron

conc

entr

atio

n (1

021 /

m3 )

T (K)6004002000

0

1

2

3

free

ze-o

ut

extr

insi

c

intr

insi

c

doped

undoped

Chapter 18 -21

• Allows flow of electrons in one direction only (e.g., usefulto convert alternating current to direct current).

• Processing: diffuse P into one side of a B-doped crystal.

-- No applied potential:no net current flow.

-- Forward bias: carriersflow through p-type andn-type regions; holes andelectrons recombine atp-n junction; current flows.

-- Reverse bias: carriersflow away from p-n junction;junction region depleted of carriers; little current flow.

p-n Rectifying Junction

++

++

+- ---

-p-type n-type

+ -

++ +

++

--

--

-

p-type n-typeAdapted from Fig. 18.21 Callister & Rethwisch 8e.

+++

+

+

---

--

p-type n-type- +

Chapter 18 -22

Properties of Rectifying Junction

Fig. 18.22, Callister & Rethwisch 8e. Fig. 18.23, Callister & Rethwisch 8e.

Chapter 18 -23

Junction Transistor

Fig. 18.24, Callister & Rethwisch 8e.

Chapter 18 -24

MOSFET Transistor Integrated Circuit Device

• Integrated circuits - state of the art ca. 50 nm line width

– ~ 1,000,000,000 components on chip

– chips formed one layer at a time


• MOSFET (metal oxide semiconductor field effect transistor)

Chapter 18 -

Capacitance (C)

25

Chapter 18 -

26

Chapter 18 -

Electric Dipole Moment (p)

27

Chapter 18 -

Surface charge density (D)

28

Chapter 18 -

Effect of Polarization

29

Chapter 18 -30

Chapter 18 -

Example

31

Chapter 18 -32

Chapter 18 -

Types of Polarization

33

Chapter 18 -

Frequency dependence of Dielectric Constant

34

Chapter 18 -35

Ferroelectric Ceramics

• Experience spontaneous polarization


BaTiO3 -- ferroelectric below its Curie temperature (120ºC)

Chapter 18 -36

Piezoelectric Materials

stress-free with applied stress

Adapted from Fig. 18.36, Callister & Rethwisch 8e. (Fig. 18.36 from Van Vlack, Lawrence H., Elements of Materials Science and Engineering, 1989, p.482, Adapted by permission of Pearson Education, Inc., Upper Saddle River, New Jersey.)

Piezoelectricity– application of stress induces voltage– application of voltage induces dimensional change

Chapter 18 -37

• Electrical conductivity and resistivity are:-- material parameters-- geometry independent

• Conductors, semiconductors, and insulators...-- differ in range of conductivity values-- differ in availability of electron excitation states

• For metals, resistivity is increased by-- increasing temperature-- addition of imperfections-- plastic deformation

• For pure semiconductors, conductivity is increased by-- increasing temperature-- doping [e.g., adding B to Si (p-type) or P to Si (n-type)]

• Other electrical characteristics-- ferroelectricity-- piezoelectricity

Summary

Chapter 18 -

From Principles of Electronic Materials and Devices, Second Edition, S.O. Kasap (© McGraw-Hill, 2002)http://Materials.Usask.Ca

(b) Multilayer ceramic capacitor(stacked ceramic layers)

Metal termination

Metal electrode

CeramicEpoxy

Leads

(a) Single layer ceramic capacitor(e.g. disk capacitors)

Fig. 7.29: Single and multilayer dielectric capacitors

Chapter 18 -

Al metallizationPolymer film

(a)

(b)

Fig. 7.30 Two polymer tapes in (a) each with a metallized film electrodeon the surface (offset from each other) can be rolled together (like aSwiss roll-cake) to obtain a polymer film capacitor as in (b). As the twoseparate metal films are lined at oppose edges, electroding is done overthe whole side surface.From Principles of Electronic Materials and Devices, Second Edition, S.O. Kasap (© McGraw-Hill, 2002)http://Materials.Usask.Ca

Chapter 18 -

(a)

Al foils

Al case

Al2O3Anode Cathode

(b)

Electrolyte

Al Al

Fig. 7.31: Al electrolytic capacitor.


Electrolyte: Sodium Borate

Chapter 18 -

Piezoelectricity: Pressure Electricity

• When material is under stress, it generates Dipole in the material.• Amount of Dipole is linearly proportional of applied stress.• On the other hand, when applying voltage, it generate stress in the material, and may cause change of shape of material. • Application: ultrasonic device, microphone, phonograph cartridge, accelerometer, strain gauges, sonar devices, actuator

Chapter 18 -

• With appropriate applied force in a direction, it will generate Dipole in the unit cell of Piezoelectric ceramic, causing voltage in the material.• On the other hand, applied voltage causing distortion of unit cell.

Chapter 18 -

Chapter 18 -

Fig. Edison cylinder phonograph: 1899

Source:http://en.wikipedia.org/wiki/Phonograph

Air pressure from wave of sound is store as roughness on the surface of the wax.

Roughness causes vibration at stylus (pen) and causes stress to the piezoelectric ceramic.

Chapter 18 -

Voltage signal from amplifier cause contraction and expansion of the piezoelectric ceramic.

That causes vibration of the diaphragm of the speaker of the headphone.

Chapter 18 -

Hydrophone is a device for listening to sound under water.

Accelerometer is a device for measuring mass movement or acceleration.

Chapter 18 -

Chapter 18 -

Fig. 7.38: Piezoelectric transducers are widely used to generateultrasonic waves in solids and also to detect such mechanicalwaves. The transducer on the left is excited from an ac sourceand vibrates mechanically. These vibrations are coupled to thesolid and generate elastic waves. When the waves reach theother end they mechanically vibrate the transducer on the rightwhich converts the vibrations to an electrical signal.

Oscillator

Elasticwaves in thesolid Oscilloscope

A B

Mechanicalvibrations

Piezoelectrictransducer


Piezoelectric detector

Chapter 18 -Source: http://www.nec-toki

Chapter 18 -Source: http://www.nec-toki

Configuration is similar to a capacitor. The input is voltage, the output is small movement due to distortion of crystal.

Chapter 18 -

Piezoelectric Multilayer Bender Actuator• Positioning Range up to 2 mm • Fast Response ( 10 msec) • Nanometer Scale Resolution • Low Operating Voltage (0 to 60 V) • Low Temperature Compatible

Chapter 18 -

A piezoelectric nozzle [above] works when a current bends a piezoelectric crystal, forcing the fluid down and out of the nozzle. To heat and expand the fluid, instead of a crystal. Piezoelectric nozzles create very smaller droplets.

Source: www.popsci.

Inkjet head

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