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CHIP TECHNOLOGY INNOVATOR World Best CSP LED Platform and Solution Provider High Performance, High Reliability with LM80

Contents

02 About CTLab

03 Product Line Up

05 CSP Product Line Up

SW Series

RW Series

TW Series

CW Series

12 DC LED Product Line Up

DF Series

6W~108W CSPOB

DC015W_R for Down light

DB 200W

19 AC LED Product Line Up

AW Series

20W, 30W, 40W

AW015_Square

22 Model Nomenclature

About CTLab

CEO greeting

Company History

Establishment CEO Website

2015

2012

2014

2013

CTLab is a small but strong venture company, producing semiconductor light sources for BLU, Smart phone,

Indicator, and Lighting. CTLab has developed and produced a variety of LED package and module for IT and

Lighting Application, by using our own CSP (Chip Scale Package) technology. Our miniaturized CSPs have the

more different and innovative structures than other conventional LED Packages, making something NEUH. (NEUH

is the acronym of No bonding & Au wire, Extremely low cost, Ultra small & thin and High Performance &

Reliability) In addition, CTLAB passed the official LM-80 Reliability test (almost 9 months) at the end of 2013.

CTLab’s motto is “share light and miracle with us”. We know that CSP should be much like the filament of an

Edison bulb, so everyone, whoever poor or rich, in the world gets the benefit of light easily and properly. We

believe that our CSP technology is like priming water. We will prime the pump to increase the value of customer

through CTLab’s product. Today and tomorrow, we are always doing our best.

Thanks you very much.

April 19, 2012 Kim, Chang Tae www.chiptechnologylab.com

Key Intellectual property was registered in USA

03/16 Press Release

01/04 New factory set up in Bundang Technopark

Intellectual properties (15 registered and 18 applied in Korea, China, and USA)

01/23 Press Release

02/16 KC&HE Certification begun with KTR

03/25 Patent portfolio (14 registered + 13 applied + 3 ready to apply)

12/04 Mass production of TV BLU

06/01 2nd & 3rd Government-funded R&D projects initiated.

6/20 Facility for LED lighting system(lamp & luminaire) set up at Suwon

09/01 Factory registered by local government

05/01~10/30 CSP Production line installed (Max. Capa 3KK/month for SW1515)

10/06 Press Release

04/16 Corporate R&D Center registered by KOITA

09/06 Capital Investment gained from Strategic Investor

11/01 1st Government-funded R&D project initiated

11/21 Venture Company registered by SMBC

12/07 CSP(1W, IRIS) LM80 Certified by KTR

04/19 CTLab established

10/05 Capital investment gained from 1st angel

2016

2017

Product Line Up

3

SW Series : Stage Lighting

Series Model Pdiss(W) Vop(V) lop(mA) lm(lumen) Lm/W CCT CRI 2Q1/2(o) Comments

SW

SW0909CS 0.35 2.95 120 45 125 5000 80 135 mass

production

SW1111HS 1.0 3.10 350 120 110 5000 80 135 mass

production

SW1515NS 1.0 3.00 350 130 125 5000 80 135 mass

production

SW1515QS 1.0 2.92 350 132 130 5000 80 135 mass

production

SW1717US 3.0 2.83 350 140 140 5000 80 135 mass

production

SW2121WS 5.0 2.77 350 145 150 5000 80 135 mass

production


SW SW1515NS 1.0 2.95 350 90 87 5000 80 135 mass

production


SW SW1313LS 1.0 2.95 350 86 83 0.275/0.24

0 - 135

mass production


RW RW1515NS 1.0 2.95 350 105 100 0.285/0.26

5 - 130

under development


TW TW1515NS 1.0 3.00 350 105 100 0.285/0.26

5 - 130

under development


CW CW1515NS 1.0 2.97 350 130 125 5000 70 130 under

development

SW Series : BLU

RW Series : BLU

TW Series : BLU

CW Series : Mobile Flash

SW Series Lighting


SW SW1313DS 0.42 21 20 35 84 5000 80 135 mass

production

SW Series : Lighting(HV CSP)

Series

Model Pdiss (W)

Vop (V)

Lop (mA)

lm (lumen)

lm/W CCT CRI 2Q1/2(o) LEA_I LEA_O PCB Comments

DF

DF006A 6 34.2 175 748 125 5000 80 135 8.9 10.5 15.85X15.85 mass

production

DF012A 12 35.4 350 1549 125 5000 80 135 8.9 10.5 15.85X15.85 mass

production

DF024C 25 35.4 700 3098 125 5000 80 135 8.9 19 23.85X23.85 mass

production

DF036C 37 35.4 1050 4646 125 5000 80 135 19 19 23.85X23.85 mass

production

DF048E 50 35.4 1400 6195 125 5000 80 135 19 25 27.35X27.35 mass

production

DF060E 62 35.4 1750 7744 125 5000 80 135 19 25 27.35X27.35 mass

production

DF072E 74 35.4 2100 9293 125 5000 80 135 23 25 27.35X27.35 mass

production

DF084G 87 35.4 2450 10841 125 5000 80 135 23 31 34.85X34.85 mass

production

DF096G 99 35.4 2800 12390 125 5000 80 135 23 31 34.85X34.85 mass

production

DF108G 112 35.4 3150 13939 125 5000 80 135 30 31 34.85X34.85 mass

production

AW Series : Lighting

DF Series Lighting

Series Model Pdiss (W)

Vop (V)

Lop (mA)

lm (lumen)

lm/W CCT CRI 2Q1/2(o) Comments

AW

AW020 20 220 90 2300 115 5000 80 57F mass

production

AW030 30 220 136 3450 115 5000 80 57F mass

production

AW040 40 220 182 4400 110 5000 80 57F mass

production

These lm/W are based on 5000K. CTLab all Products are available in 2700K~6500K with ANSI Bin

Customized Product

SPEC

Will be discussed with Customer

4

CSP Product Line Up Rise in LED lighting demands brought new opportunities for the industry,

but low price and low cost trend caused many manufacturers to incur

losses and struggle financially. Chip Scale Packaging (CSP) products are

the industry’s latest attempt to lowering costs, as the technology is able

to eliminate Au wiring, bonding and lead frames during the production

process. With improving CSP technology and rising market acceptance,

CSP developments now are highly anticipated by the LED industry. CTLab

as the world first CSP LED platform and Solution Provider is ready to

meet your purpose, assuring high performance and reliability with LM80

SW0909CS CSP Product Line Up

Product Features

• No die attach, No wire bonding, No substrate

• High Performance; Better Heat Dissipation

• Ag Free Chip & Package

• Size : 0.90 x 0.90 x 0.42

• Application : Signal, Consumer’s Electronics, Lighting

Product Features Package Dimension Ta=25℃

Item Min Typ Max Unit

Pdiss 0.3 [W]

Forward Current 120 240 [mA]

Luminous Flux 45 [lm]

Forward Voltage 2.8 3.1 [V]

CCT 2700 6500 [K]

CRI 80 [Ra]

Viewing Angle 135 []

Rth(Junction to

Board) 20.75 [℃/W]

SW1111HS CSP Product Line Up

Product Features




• Size : 1.10 x 1.10 x 0.32




Pdiss 1.0 [W]




CCT 2700 6500 [K]

CRI 80 [Ra]


Rth(Junction to

Board) 11.6 [℃/W]

0.6

6

1.10±0.02

1.1

0±

0.0

2

[Top View]

0.32±0.02

1.1

0±

0.0

2

[Side View]

0.7

95

[Bottom View]

Cathode(Au) Anode(Au)

0.15 0.3235

0.7

95

0.795

0.279 0.226

0.3

45

0.731

0.0

4

[Recommended PCB Solder PAD] [Recommended Stencil Opening]

[NOTE] 1. Unit : mm 2. STD Tolerance : ± 0.02

0.875

1.1

0±

0.0

2

1.10±0.02

DC L

ED

Pro

duct

Lin

e U

p

0.9±0.02

0.9±

0.0

2

[Top View]

0.32±0.02

0.9±

0.0

2

[Side View]

0.6

0.185 0.15

0.5

2

[Bottom View]

Cathode(Au) Anode(Au)

0.15 0.185 0

.52

0.52

0.19 0.155

0.2

3

0.50

0.0

4

[Recommended PCB Solder PAD] [Recommended Stencil Opening]

[NOTE] 1. Unit : mm 2. STD Tolerance : ± 0.02

SW1515NS CSP Product Line Up

Product Features




• Size : 1.50 x 1.50 x 0.42




Pdiss 1.0 [W]




CCT 2700 6500 [K]

CRI 80 [Ra]


Rth(Junction to

Board) 7.8 [℃/W]

SW1515QS CSP Product Line Up

Product Features




• Size : 1.50 x 1.50 x 0.42




Pdiss 1.0 [W]




CCT 2700 6500 [K]

CRI 80 [Ra]


Rth(Junction to

Board) 6.85 [℃/W]

7

DC L

ED

Pro

duct

Lin

e U

p

SW1717US CSP Product Line Up

Product Features




• Size : 1.70 x 1.70 x 0.32




Pdiss 3.0 [W]



Forward Voltage 2.8 [V]

CCT 2700 6500 [K]

CRI 80 [Ra]


Rth(Junction to

Board) 5.21 [℃/W]

SW2121WS CSP Product Line Up

Product Features




• Size : 2.10 x 2.10 x 0.32




Pdiss 5.0 [W]




CCT 2700 6500 [K]

CRI 80 [Ra]


Rth(Junction to

Board) 4.14 [℃/W]

8

DC L

ED

Pro

duct

Lin

e U

p

SW1313LS CSP Product Line Up

Product Features




• Size : 1.30 x 1.30 x 0.32

• Application : BLU



Pdiss 1.0 [W]




CCT Will be discussed with

Customer


Rth(Junction to

Board) 9.2 [℃/W]

DC L

ED

Pro

duct

Lin

e U

p

SW1313DS CSP Product Line Up

Product Features




• Size : 1.30 x 1.30 x 0.40




Pdiss 0.42 [W]

Forward Current 20 [mA]


Forward Voltage 21 [V]

CCT 2700 6500 [K]

CRI 80 [Ra]


Rth(Junction to

Board) [℃/W]

9

RW1515NS CSP Product Line Up

Product Features




• Size : 1.50 x 1.50 x 0.32




Pdiss 1.0 [W]





customer


Rth(Junction to

Board) 7.8 [℃/W]

10

DC L

ED

Pro

duct

Lin

e U

p

TW1515NS CSP Product Line Up

Product Features




• Size : 1.50 x 1.50 x 0.32




Pdiss 1.0 [W]





customer


Rth(Junction to

Board) 7.8 [℃/W]

CW1515NS CSP Product Line Up

Product Features




• Size : 1.50 x 1.50 x 0.32

• Application : Flash



Pdiss 1.0 [W]




CCT 7000 [K]

CRI 70 [Ra]


Rth(Junction to

Board) 7.8 [℃/W]

11

DC L

ED

Pro

duct

Lin

e U

p

DC LED Product Line Up

The DC modules(CSP array) are not COB type, but innovative POB

type. They are specifically designed for applications requiring high

flux packages. They deliver optimized combinations of light quality

and light output needed in lighting applications. They are based on

our own world first true CSP technology protected by CTLAB’s own

intellectual properties. These revolutionary packages combined with

PCB circuit design enable CTLab to meet various desire of our

customers.

DF006A DC LED Product Line Up

Product Features

• Not Chip On Board, Package On Board

• Higher luminous efficiency

• Lower thermal resistance

• Size : 15.85 x 15.85 x 1.1 (LEA_I : Φ10.5)

• Application : Lighting

Product Features Module Dimension Ta=25℃


Power Dissipation

6 [W]


Forward Voltage 34 36 [V]


CCT 2700 6500 [K]

CRI 80 [Ra]

Rth(Junction to

Board) 1.8 [℃/W]


DF012A DC LED Product Line Up

Product Features



Power Dissipation

12 [W]




CCT 2700 6500 [K]

CRI 80 [Ra]

Rth(Junction to

Board) 0.87 [℃/W]


13




• Size : 15.85 x 15.85 x 1.1 (LEA_I : Φ10.5)


DC L

ED

Pro

duct

Lin

e U

p

-

+

DF006A

CTLAB

15

.85

15.85

2.8

6

LEA ?10.50

?4.002.86

0.3

2±

0.0

2

1.1±

0.2

2.86

15.85

15

.85

2.8

6

[Note]

1. Unit : mm

2. STD Tolerance : ± 0.02

2.86

15.85

15

.85

2.8

6

0.3

2±

0.0

2

1.1±

0.2

[Note]

1. Unit : mm


DF024C DC LED Product Line Up

Product Features




• Size : 23.85 x 23.85 x 1.1 (LEA_I : Φ19)




Power Dissipation

25 [W]




CCT 2700 6500 [K]

CRI 80 [Ra]

Rth(Junction to

Board) 0.42 [℃/W]


DF036C DC LED Product Line Up

Product Features



Power Dissipation

37 [W]




CCT 2700 6500 [K]

CRI 80 [Ra]

Rth(Junction to

Board) 0.35 [℃/W]


14




• Size : 23.85 x 23.85 x 1.1 (LEA_I : Φ19)


DC L

ED

Pro

duct

Lin

e U

p

[Note]

1. Unit : mm


23.85

23

.85

2.8

6

0.3

2±

0.0

2

1.1±

0.2

2.86

[Note]

1. Unit : mm


2.86

23.85

23

.85

2.8

6

0.3

2±

0.0

2

1.1±

0.2

DF048E DC LED Product Line Up

Product Features




• Size : 27.35 x 27.35 x 1.1 (LEA_I : Φ23)




Power Dissipation

50 [W]




CCT 2700 6500 [K]

CRI 80 [Ra]

Rth(Junction to

Board) 0.25 [℃/W]



Product Features



Power Dissipation

62 [W]




CCT 2700 6500 [K]

CRI 80 [Ra]

Rth(Junction to

Board) 0.22 [℃/W]


15




• Size : 27.35 x 27.35 x 1.1 (LEA_I : Φ23)


DC L

ED

Pro

duct

Lin

e U

p

27.35

27

.35

2.8

6

0.3

2±

0.0

2

1.1±

0.2

2.86

[Note]

1. Unit : mm


[Note]

1. Unit : mm


27.35

27

.35

2.8

6

0.3

2±

0.0

2

1.1±

0.2

2.86


Product Features




• Size : 27.35 x 27.35 x 1.1 (LEA_I : Φ23)




Power Dissipation

74 [W]




CCT 2700 6500 [K]

CRI 80 [Ra]

Rth(Junction to

Board) 0.20 [℃/W]


DF084G DC LED Product Line Up

Product Features



Power Dissipation

87 [W]




CCT 2700 6500 [K]

CRI 80 [Ra]

Rth(Junction to

Board) 0.18 [℃/W]


16




• Size : 34.85 x 34.85 x 1.1 (LEA_I : Φ31)


DC L

ED

Pro

duct

Lin

e U

p

27.35

27

.35

2.86

27.35

2.8

6

0.3

2±

0.0

2

1.1±

0.2

[Note]

1. Unit : mm


34

.85

2.8

6

0.3

2±

0.0

2

1.1±

0.2

2.86

34.85

[Note]

1. Unit : mm



Product Features




• Size : 34.85 x 34.85 x 1.1 (LEA_I : Φ31)




Power Dissipation

99 [W]




CCT 2700 6500 [K]

CRI 80 [Ra]

Rth(Junction to

Board) 0.16 [℃/W]



Product Features



Power Dissipation

112 [W]




CCT 2700 6500 [K]

CRI 80 [Ra]

Rth(Junction to

Board) 0.12 [℃/W]


17




• Size : 34.85 x 34.85 x 1.1 (LEA_I : Φ31)


DC L

ED

Pro

duct

Lin

e U

p

34

.85

2.8

6

0.3

2±

0.0

2

1.1±

0.2

2.86

34.85

34

.85

2.8

6

0.3

2±

0.0

2

1.1±

0.2

2.86

34.85

[Note]

1. Unit : mm


[Note]

1. Unit : mm


DC015_R DC LED Product Line Up

Product Features




• Size : Φ100




Power Dissipation

15 [W]




CCT 2700 6500 [K]

CRI 80 [Ra]


DC L

ED

Pro

duct

Lin

e U

p

DB200W DC LED Product Line Up

Product Features




• Size : 65.0 x 65.0 (LEA_I : Φ41)

• Application : Broadcast Lighting


Item Chanel Min Typ Max Unit

Power Dissipation #Ch1 / #CH2 200 [W]

Luminous Flux #Ch1 / #CH2 19000 [Lm]

Forward Voltage #Ch1 / #CH2 42 [V]

Forward Current #Ch1 / #CH2 4770 [mA]

CCT #Ch1 / #CH2 2700 6500 [K]

CRI #Ch1 / #CH2 80 [Ra]

18

AC LED Product line Up

The Concept of an AC LED is an elegant one. Because you can

eliminate the AC to DC Converter and several other electronic

components that DC LEDs require, the electronics are simplified

between the AC power source and the LED. AW series is a

combination of Drive on Board and CSP products. If you just put AW

series into your lamp or luminaire, you can experience low cost but

high performance solution with design flexibility in Lighting

business.

AW020H AC LED Product Line Up

Product Features

• Not AC to DC converter type, AC Direct type

• No Chip On Board, Package On Board

• No emission of harmful short wavelength light

• Size : Φ 57 (LEA_I : Φ20)




Power Dissipation

18 20 22 [W]


Forward Voltage 200 220 240 [V]


Efficiency 115 [lm/W]

CCT 2700 6500 [K]

CRI 80 [Ra]

Operating Frequency 50/60 [Hz]

Power Factor Over 0.99


Product Features



Power Dissipation

28 30 32 [W]





CCT 2700 6500 [K]

CRI 80 [Ra]



20




• Size : Φ 57 (LEA_I : Φ20)


AC L

ED

Pro

duct

Lin

e U

p

Φ 26.43

Φ 20

Φ 2.5

Φ 57

35 35

Φ 26.43

Φ 20

Φ 2.5

Φ 57

35


Product Features




• Size : Φ 57 (LEA_I : Φ20)




Power Dissipation

38 40 42 [W]





CCT 2700 6500 [K]

CRI 80 [Ra]



AW015_Square AC LED Product Line Up

Ta=25℃

21

Cust

om

ized

Pro

duct

Lin

e U

p

Φ 26.43

Φ 20

Φ 2.5

Φ 57

35

Product Features




• Size : 44 x 32 (LEA_I : Φ13)



Power Dissipation

14 15 16 [W]





CCT 2700 6500 [K]

CRI 80 [Ra]



Module Dimension Product Features

22

Model Nomenclature

CSP Part No. System

1 2 3 4 5 6 7 8

S W 1 5 1 5 N S

CSP Type Package Size Chip Size Chip Q’ty

SW Simple White

RW Reflective White

TW True White

CW Clear Window White

Package Type Chip Q’ty

1 chip S

2 chip D

3 chip T

4 chip Q

5~ chip & Module M

Chip Size (mil)

2424 C

3210 F

3030 E

3535 H

4545 N

5252 Q

6060 U

7676 W

Module Part No. System

1 2 3 4 5 6

A W 0 2 0 H

Module Type Pdiss PCB Size

1 2 3 4 5 6

D F 0 4 8 E

Module Type PKG Q’ty PCB Size

DF Daffodil Flat

DC Daffodil Customized

DB Daffodil Bi-Color

AW AC LED White

Module Type

H 57Φ

AC Module Size (Circle PCB Size – Φ)

006A 6W / 15.85 x 15.85

012A 12W / 15.85 x 15.85

024C 25W / 23.85 x 23.85

036C 37W / 23.85 x 23.85

048E 50W / 27.35 x 27.35

Module Size (Watt / Square PCB Size – mm)

060E 62W / 27.35 x 27.35

072E 74W / 27.35 x 27.35

084G 87W / 34.85 x 34.85

096G 99W / 34.85 x 34.85

108G 108W / 34.85 x 34.85

3

Company Address :

Head Office : C-Dong 501, (BUNDANG TECHNOPARK), 744 Pangyo-ro, Bundang-gu, Seongnam-si, Gyeonggi-do, Korea 경기도 성남시 분당구 판교로 744, 분당테크노파크 C동 501호 Head office : (TEL) 82-70-7842-9222, (FAX) 82-70-7842-9225 Ted DH Oh / 오대훈 : 82-10-9010-6324, [email protected] Website : www.chiptechnologylab.com

CTLab 2018Catalog Version 1.2

chip technology innovatorchiptechnologylab.com/catalog/catalog.pdf · chip technology innovator...

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