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Manufacturing Case Studies:Manufacturing Case Studies:

Copy Exactly (CE!) and the Copy Exactly (CE!) and the twotwo--year cycle at Intelyear cycle at Intel

Paolo A. GarginiPaolo A. GarginiDirector Technology StrategyDirector Technology Strategy

Intel FellowIntel Fellow

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AgendaAgenda

•• 22--year cycleyear cycle•• Copy ExactlyCopy Exactly•• ConclusionsConclusions

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With respect to the factor contributed by Device and Circuit Cleverness, however, the situation is different. We are approaching a limit that must slow the rate of progress

I see no reason to expect the rate of progressIn the use of smaller dimensions in complexCircuits to decrease in the near future.

Gordon Moore, IEDM 1975

The new slope might approximate a doubling Every two years…….

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…….but Cost of Equipment Continues to Raise.but Cost of Equipment Continues to Raise(ISMT Exposure Tool Cost Survey Results)(ISMT Exposure Tool Cost Survey Results)

Source: ISMT EUV CoO Analysis Update, 1st International EUVL Symposium, October 15th 2002Source: ISMT EUV CoO Analysis Update, 1st International EUVL Symposium, October 15th 2002

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Industry ChallengeIndustry Challenge

•• Introduction of new products into the Introduction of new products into the market place requires very costly market place requires very costly investments in research, development and investments in research, development and manufacturing. manufacturing.

•• How can an IC company optimize the above How can an IC company optimize the above phases and obtain maximum return on phases and obtain maximum return on investment in the shortest time?investment in the shortest time?

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Intel Semiconductor RoadmapIntel Semiconductor Roadmap

“Moore’s Law” is driving semiconductor technology“Moore’s Law” is driving semiconductor technology~ 30% reduction in transistor size with each new technology e~ 30% reduction in transistor size with each new technology every 2 yearsvery 2 years~ 2X more chips per wafer with each new process technology~ 2X more chips per wafer with each new process technology~ 2X improvement in the product price/performance ratio~ 2X improvement in the product price/performance ratio

15nm

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Intel’s Core Competencies Drive Intel’s Core Competencies Drive Processor PerformanceProcessor Performance

Silicon ProcessSilicon ProcessTechnologyTechnology 0.8µ0.8µ 0.6µ0.6µ 0.35µ0.35µ 0.25µ0.25µ 0.18µ0.18µ 0.13µ0.13µ

TransistorsTransistors(Millions)(Millions)

PentiumPentium®®

ProcessorProcessor

PentiumPentium®® IIIIProcessorProcessor

PentiumPentium®® IIIIIIProcessorProcessor

PentiumPentium®® 44ProcessorProcessor

ItaniumItanium®®

ProcessorProcessor

3.33.3

7.57.5

9.5 9.5 -- 2525

4242++

4040+ +

Inte

l Bra

nd

60MHz60MHz

2GHz+2GHz+

MadisonMadisonDeerfieldDeerfield

NorthwoodNorthwood

Process transitions enable:Process transitions enable:2x die per wafer, ½ transistor cost, 2x microprocessor speed2x die per wafer, ½ transistor cost, 2x microprocessor speed

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0.35µm0.35µm 0.25µm0.25µm 0.18µm0.18µm 0.13µm0.13µm

200mm200mm0.13µm0.13µm300mm300mm

Moderate Cost Increase from Moderate Cost Increase from Generation to Generation and Generation to Generation and ……300mm Rolls Cost Back……300mm Rolls Cost Back

Capital costCapital costper unit per unit

wafer areawafer area

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>60X Transistor Cost Drop from 350nm to 90nm Node (Source: Intel ‘03)

>60X Transistor Cost Drop from 350nm >60X Transistor Cost Drop from 350nm to 90nm Nodeto 90nm Node (Source: Intel ‘03)(Source: Intel ‘03)

Cost/Transistor Normalized to 130nm NodeCost/Transistor Normalized to 130nm NodeCost/Transistor Normalized to 130nm Node

20032001199919971995

0.1

1.0

10.0

100.0

350nm 250nm 180nm 130nm 90nm

Technology Node/Introduction Year

Nor

mal

ized

Cos

t/Tra

nsis

tor Cost per Total Trans

25% Savings/Year35% Savings/Year40% Savings/Year

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Transistor Manufacturing Costs Falling (Source: Sematech ‘02)

Transistor Manufacturing Costs FallingTransistor Manufacturing Costs Falling (Source: (Source: Sematech ‘02)Sematech ‘02)

Accelerated

- 32 % CAGR

Strategic

- 26 % CAGR

Historic

- 26 % CAGR

Wafer Size Blend

125/150mm –200mm

Wafer Size Blend

200mm – 300mm

Source: Goodall,Randall, et.al., “Long-Term Productivity Mechanisms of the Semiconductor Industry,” 9th International Symposium on Semiconductor Silicon 2002, sponsored by ECS, International Sematech

Source: Goodall,Randall, et.al., “Source: Goodall,Randall, et.al., “LongLong--Term Productivity Mechanisms of the Semiconductor Industry,Term Productivity Mechanisms of the Semiconductor Industry,”” 9th 9th International Symposium on Semiconductor Silicon 2002, sponsoredInternational Symposium on Semiconductor Silicon 2002, sponsored by ECS, International Sematechby ECS, International Sematech

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15 years of 15 years of Copy Exactly!

• Copy Exactly! Is a technology transfer methodology pioneered by Intel

• The method ensures consistent yield and quality at any Intel factory making the same products

• The result is highly predictable output from our factories

• Whether this methodology is suitable for other companies or other industries depends on many factors

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• Research Activities are de-centralized• Multiple sites, consortia, universities, etc

• Central Technology Development groups• Logic: Hillsboro, Oregon• Memory: Santa Clara, California• Packaging: Chandler, Arizona

• Copy Exactly! from Development into Manufacturing• Fastest and Highest Volume Manufacturing

Ramp

Intel Research, Development Intel Research, Development and Manufacturingand Manufacturing

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IrelandIrelandFab 14/24Fab 14/24

IsraelIsraelFab 8/18Fab 8/18

OregonOregonDev D1C/D1DDev D1C/D1D

Fab 15/20Fab 15/20CaliforniaCaliforniaDev D2Dev D2

ColoradoColoradoFab 23Fab 23

ArizonaArizonaFab12/22Fab12/22

New MexicoNew MexicoFab 11/11XFab 11/11X

Mass.Mass.Fab 17Fab 17

Costa RicaCosta RicaSan Jose A/TSan Jose A/T

A/T DevA/T Dev MalaysiaMalaysiaPenang A/TPenang A/TKulim A/TKulim A/T

ChinaChinaPudong A/TPudong A/T

PhilippinesPhilippinesManila A/TManila A/TCavite A/TCavite A/T

WashingtonWashingtonSystems Mfg.Systems Mfg.

Board Mfg.Board Mfg.

Kulim Board/Module Mfg.Kulim Board/Module Mfg.BrazilBrazil

SubSub--con Mfg.con Mfg.

ThailandThailandSubSub--con Mfg.con Mfg.

SubSub--con Mfg.con Mfg.

TaiwanTaiwanSubSub--con Mfg.con Mfg.SubSub--con Mfg.con Mfg.

SubSub--con Mfg.con Mfg.

Intel’s High Volume Manufacturing SitesIntel’s High Volume Manufacturing Sites

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Technology Focus: LogicTechnology Focus: LogicActual Forecast

Process Name P858 Px60 P1262 P1264 P1266 P1268 P1270

1st Production 1999 2001 2003 2005 2007 2009 2011

Lithography Node 180 130 90 65 45 32 22nm

Gate Length 130 70 50 30 20 15 10nm

Fab Development Research

Copy Exactly! Pathfinding

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Huge cumulative investments as Huge cumulative investments as volume manufacturing beginsvolume manufacturing begins

Year 1 65432 7 98

Research Development Manufacture

1x

10x

100x

1000x

Engineers

InternalBudget

Wafers/Wk

ExternalBudget

Copy Exactly!Yield EnhancementsYield Enhancements

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DevelopmentDevelopmentCE! FabCE! Fab2nd Fab2nd Fab3rd Fab3rd Fab

First Generation First Generation Copy Copy ExactlyExactly! Results! Results

MonthsMonths

Equi

vale

nt Y

ield

Equi

vale

nt Y

ield