digital integrated circuits - ele.uri.edu · © digital integrated circuits ee141 2nd manufacturing...
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EE141© Digital Integrated Circuits2nd Manufacturing1
Digital Integrated
CircuitsA Design Perspective
Manufacturing
Process
Jan M. Rabaey
Anantha Chandrakasan
Borivoje Nikolic
July 30, 2002
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EE141© Digital Integrated Circuits2nd Manufacturing2
CMOS Process
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EE141© Digital Integrated Circuits2nd Manufacturing3
A Modern CMOS Process
p-well n-well
p+
p-epi
SiO2
AlCu
poly
n+
SiO2
p+
gate-oxide
Tungsten
TiSi2
Dual-Well Trench-Isolated CMOS Process
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EE141© Digital Integrated Circuits2nd Manufacturing4
Circuit Under Design
VDD VDD
VinVout
M1
M2
M3
M4
Vout2
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EE141© Digital Integrated Circuits2nd Manufacturing5
Its Layout View
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EE141© Digital Integrated Circuits2nd Manufacturing6
The Manufacturing Process
For a great tour through the IC manufacturing process
and its different steps, check
http://www.fullman.com/semiconductors/semiconductors.html
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EE141© Digital Integrated Circuits2nd Manufacturing7
oxidation
opticalmask
processstep
photoresist coatingphotoresistremoval (ashing)
spin, rinse, dryacid etch
photoresist
stepper exposure
development
Typical operations in a single
photolithographic cycle (from [Fullman]).
Photo-Lithographic Process
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EE141© Digital Integrated Circuits2nd Manufacturing8
Patterning of SiO2
Si-substrate
Si-substrate Si-substrate
(a) Silicon base material
(b) After oxidation and depositionof negative photoresist
(c) Stepper exposure
Photoresist
SiO2
UV-light
Patternedoptical mask
Exposed resist
SiO2
Si-substrate
Si-substrate
Si-substrate
SiO2
SiO2
(d) After development and etching of resist,chemical or plasma etch of SiO
2
(e) After etching
(f) Final result after removal of resist
Hardened resist
Hardened resist
Chemical or plasmaetch
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EE141© Digital Integrated Circuits2nd Manufacturing9
CMOS Process at a Glance
Define active areas
Etch and fill trenches
Implant well regions
Deposit and patternpolysilicon layer
Implant source and drainregions and substrate contacts
Create contact and via windowsDeposit and pattern metal layers
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EE141© Digital Integrated Circuits2nd Manufacturing10
CMOS Process Walk-Through
p+
p-epi (a) Base material: p+ substrate with p-epi layer
p+
(c) After plasma etch of insulatingtrenches using the inverse of the active area mask
p+
p-epiSiO
2
3SiN
4
(b) After deposition of gate-oxide andsacrificial nitride (acts as abuffer layer)
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EE141© Digital Integrated Circuits2nd Manufacturing11
CMOS Process Walk-ThroughSiO
2
(d) After trench filling, CMPplanarization, and removal of sacrificial nitride
(e) After n-well and V
Tpadjust implants
n
(f) After p-well andV
Tnadjust implants
p
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EE141© Digital Integrated Circuits2nd Manufacturing12
CMOS Process Walk-Through
(g) After polysilicon depositionand etch
poly(silicon)
(h) After n+ source/drain andp+source/drain implants. These
p+n+
steps also dope the polysilicon.
(i) After deposition of SiO2insulator and contact hole etch.
SiO2
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EE141© Digital Integrated Circuits2nd Manufacturing13
CMOS Process Walk-Through
(j) After deposition and patterning of first Al layer.
Al
(k) After deposition of SiO2insulator, etching of via’s,
deposition and patterning ofsecond layer of Al.
AlSiO
2
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EE141© Digital Integrated Circuits2nd Manufacturing14
Advanced Metallization
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EE141© Digital Integrated Circuits2nd Manufacturing15
Advanced Metallization
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EE141© Digital Integrated Circuits2nd Manufacturing16
Design Rules
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EE141© Digital Integrated Circuits2nd Manufacturing17
3D Perspective
Polysilicon Aluminum
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EE141© Digital Integrated Circuits2nd Manufacturing18
Design Rules
Interface between designer and process
engineer
Guidelines for constructing process masks
Unit dimension: Minimum line width
scalable design rules: lambda parameter
absolute dimensions (micron rules)
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EE141© Digital Integrated Circuits2nd Manufacturing19
CMOS Process Layers
Layer
Polysilicon
Metal1
Metal2
Contact To Poly
Contact To Diffusion
Via
Well (p,n)
Active Area (n+,p+)
Color Representation
Yellow
Green
Red
Blue
Magenta
Black
Black
Black
Select (p+,n+) Green
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EE141© Digital Integrated Circuits2nd Manufacturing20
Layers in 0.25 mm CMOS process
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EE141© Digital Integrated Circuits2nd Manufacturing21
Intra-Layer Design Rules
Metal24
3
10
90
Well
Active3
3
Polysilicon
2
2
Different PotentialSame Potential
Metal1
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EE141© Digital Integrated Circuits2nd Manufacturing22
Transistor Layout
1
2
5
3
Tra
nsi
sto
r
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EE141© Digital Integrated Circuits2nd Manufacturing23
Vias and Contacts
1
2
1
Via
Metal toPoly ContactMetal to
Active Contact
1
2
5
4
3 2
2
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EE141© Digital Integrated Circuits2nd Manufacturing24
Select Layer
1
3 3
2
2
2
WellSubstrate
Select3
5
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EE141© Digital Integrated Circuits2nd Manufacturing25
CMOS Inverter Layout
A A’
np-substrate Field
Oxidep+n+
In
Out
GND VDD
(a) Layout
(b) Cross-Section along A-A’
A A’
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EE141© Digital Integrated Circuits2nd Manufacturing26
Layout Editor
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EE141© Digital Integrated Circuits2nd Manufacturing27
Design Rule Checker
poly_not_fet to all_diff minimum spacing = 0.14 um.
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EE141© Digital Integrated Circuits2nd Manufacturing28
Sticks Diagram
1
3
In Out
VDD
GND
Stick diagram of inverter
• Dimensionless layout entities
• Only topology is important
• Final layout generated by
“compaction” program
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EE141© Digital Integrated Circuits2nd Manufacturing29
Packaging
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EE141© Digital Integrated Circuits2nd Manufacturing30
Packaging Requirements
Electrical: Low parasitics
Mechanical: Reliable and robust
Thermal: Efficient heat removal
Economical: Cheap
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EE141© Digital Integrated Circuits2nd Manufacturing31
Bonding Techniques
Lead Frame
Substrate
Die
Pad
Wire Bonding
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EE141© Digital Integrated Circuits2nd Manufacturing32
Tape-Automated Bonding (TAB)
(a) Polymer Tape with imprinted
(b) Die attachment using solder bumps.
wiring pattern.
Substrate
Die
Solder BumpFilm + Pattern
Sprocket
hole
Polymer film
Lead
frame
Test
pads
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EE141© Digital Integrated Circuits2nd Manufacturing33
Flip-Chip Bonding
Solder bumps
Substrate
Die
Interconnect
layers
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EE141© Digital Integrated Circuits2nd Manufacturing34
Package-to-Board Interconnect
(a) Through-Hole Mounting (b) Surface Mount
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EE141© Digital Integrated Circuits2nd Manufacturing35
Package Types
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EE141© Digital Integrated Circuits2nd Manufacturing36
Package Parameters
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EE141© Digital Integrated Circuits2nd Manufacturing37
Multi-Chip Modules