end of life tda80xx migration path to active portfolioan12792 end of life tda80xx migration path to...

AN12792End of life TDA80xx migration path to active portfolioRev. 1.0 — 18 March 2020 Application note

Document informationInformation Content

Keywords TDA, TDA8007, TDA8020, TDA8023, TDA8026, TDA8029, TDA8034,TDA8035, TDA8037, PN7412

Abstract This document describes the path to migrate from an end of life TDA80xx to aTDA80xx or PN7412 from the active portfolio.

NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio

AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.

Application note Rev. 1.0 — 18 March 20202 / 42

Revision HistoryRevision historyRev Date Description

1.0 20200318 Initial version




1 Introduction

The 2nd generations of TDAs are end-of-life by April 2021 (last time supply). This document helps to migrate to a new, active, TDA product by listing possibleconfigurations to replace a 2nd generation device.

Not all TDAs can be replaced with a drop-in replacement and might need software and/or hardware changes. The most crucial differences and advice aredescribed within this document.

1.1 LinecardFollowing table is a list of all TDA products with some of their key functionalities. For their full functionality have a look on the datasheets available at NXP.com.

Table 1. TDA linecard and short overviewProduct Features TDA8020 TDA8023 TDA8024 TDA8026 TDA8034 TDA8035 TDA8037 TDA8007 TDA8029 PN7412

End Of Life EOL EOL EOL Active Active Active Active EOL EOL Active

Analog interfaces 2 1 1 5 1 1 1 2 1 1

ISO 7816 UART - - - - - - - yes yes yes

µC-core - - - - - - - - 80C51RB+ Cortex-M0

ROM(byte) /RAM(byte)

- - - - - - - - 16k / 768 160k / 12k

EMVCo compliance yes yes - yes yes yes yes yes yes yes

NDS compliance - - yes - yes yes - - yes -




2 Replacements

Following table lists various NXP proposed replacement configurations. Other configurations are possible but are not handled within this document.

If no drop-in replacement is available the software and hardware effort to switch can vary depending on the chosen products. Following chapters describe thenecessary software and hardware changes.

Table 2. Replacement overviewPN7412 TDA8034 TDA8035 TDA8037 TDA8026 PN7412 & TDA8034 2xTDA8035 parallel

TDA8007 • Software andhardware adaptationnecessary

See Section 7.3

• Software and hardwareadaptation necessary

See Section 5.5

TDA8020 • Softwarecompatible

• Hardwareadaptationnecessary

See Section 3

• Software and hardwareadaptation necessary

See Section 5.5

TDA8023 • Software andhardware adaptationnecessary

See Section 4

• Software andhardwareadaptationnecessary

See Section 5

• Softwarecompatible


See Section 3

TDA8024 • Software compatible• Hardware adaptation

necessarySee Section 4



See Section 5



See Section 6

TDA8029 • Software examplefor ALPARprotocol available


See Section 7




3 TDA8026

The TDA8026 is a cost-effective, analog interface for addressing multiple smartcard slots in a Point of Sales (POS) terminal. It can address up to two main cards(synchronous or asynchronous smart cards supported) and up to four Security AccessModules (SAMs). The electrical characteristics of the TDA8026 are in accordance withEMV 4.3 requirements and also comply with ISO7816-3 for class A, B, and C cards.

Its packaging supports the latest payment terminal security requirements.

See product data sheet for more information: [DS-TDA8026]

001aal083

STAP5

D1

H7INHIB

A3TESTMODE

H1SPRES

B3CLKIN2

C3CLKIN1

C5I/OUC2

C4I/OUC1

D2INTAUXN

E1A0

E2IRQN

C2SDA

B2SCL

B8DCDC_OFF

A5

A4

A4

SDWNN

A8PORADJ

VDD(INTF)

VDD(INTF)

STAP4

C1

STAP3

B1

TST2

A1

I/O(5)

C7

CLK(5)

B7

RST(5)

B6

VCC(5)

B5

I/O(4)

D7

VCC(2)

GNDC(2)

PRES(2)

I/O(2)

CLK(2)

RST(2)

CLK(4)

C6

RST(4)

D6

VCC(4)

D8

B4 A7 A6

VDD(INTREGD)VDD

I/O(3)

E7

CLK(3)

E6

RST(3)

F6

VCC(3)

E8

G8

GNDSC8

F8

GNDC(1)

PRES(1)H3

H2

F7

G7

G6

G5

VCC(1)

I/O(1)

CLK(1)

RST(1)

E3

F2

G2

G3

C4(1)G1

C8(1)F1

TST1

A2

INTERFACEAND

CONTROLUNIT

SEQUENCER

PRESDETECTION

VCCGENERATOR

RST BUFFER

CLK BUFFER

I/O BUFFER

I/O BUFFER

I/O BUFFER

POWERMANAGEMENT

UNIT STEP UPCONVERTER

SEQUENCER

PRESDETECTION

VCCGENERATOR

RST BUFFER

CLK BUFFER

I/O BUFFER

SEQUENCER

VCCGENERATOR

RST BUFFER

CLK BUFFER

I/O BUFFER

SEQUENCER

VCCGENERATOR

RST BUFFER

CLK BUFFER

I/O BUFFER

SEQUENCER

VCCGENERATOR

RST BUFFER

CLK BUFFER

I/O BUFFER

G4 D3 to D5,E4,E5,F3 to F5, H8

H4 H5

GND2 to GND10GNDPLX VUP

TDA8026

Figure 1. TDA8026 Block diagram




3.1 Feature Comparison

Table 3. Product feature comparison TDA8026, TDA8020, TDA8023, TDA8024Product Features TDA8026 TDA8020 TDA8023

Analog interfaces 5 2 1

ISO 7816 UART - - -

ISO 7816 dedicated timers - - -

µC-core - - -

ROM[kbyte] / RAM[byte] - - -

Host interface I2C I2C I2C

ESD protection on ISO pads [kV] 7 6 6

Auxiliary protected lines for C4 and C8 2 0 2

VCC card power supply [V] 1.8 & 3 & 5 3 & 5 1.8 & 3 & 5

Card supply current @ 5 V VCC [mA] 55 60 55

Card supply current @ 3 V VCC [mA] 55 55 55

Card supply current @ 1.8 V VCC [mA] 35 - 35

Card supply current @ 1.2 V VCC [mA] - - -

Card clock frequency max. [MHz] 20 10 10

Card activation time max. [µs] 135 135 135

Card deactivation time max. [µs] 100 110 100

Protocol Support

Synchronous card management yes - yes

Asynchronous protocl T=0 and T=1 yes yes yes

Security Features

Voltage supervisor and over currentdetection

yes yes yes

Additional product information

Power supply interface VDDI [V] - 1.5 - VDD 1.5 - 6.5

Power supply [V] 2.7 - 5.5 2.5 - 6.5 2.7 - 6.5

Power down current max [µA] 40 150 200

Temperature range [°C] -25 / 85 -25 / 85 -25 / 85

Package TFBGA64 LQFP32 TSSOP28

EVMCo compliance yes yes yes

NDS compliance - - -




3.2 Differences TDA8020 - TDA8026

3.2.1 Summary

Table 4. TDA8020 - TDA8026 differences summaryItem TDA8020 TDA8026 Comments

Package LQFP32 TFBGA64 -

Low-power modes power downinactive mode

shutdown modestandby modeclock-stop mode

TDA8026 has an exclusivepin to enter shut-down mode(SDWNN).

DC-to-DC converter Switched-capacitor Inductor-based switching -

Card class support Classes A and B (5 V and 3V)

Classes A, B, and C (5 V, 3V, and 1.8 V)

-

Supply voltage range 2.7 V to 6.5 V 2.7 V to 5.5 V -

Card clock generation 10 MHz 20 MHz -

Card clock divider 1, 2, 4 and 8 1, 2, 4 and 5 -

I2C Address selection pins 2 1 The TDA8020 has to I2CAddress pins which enablesto address 4 differentTDA8020. Such is not offeredfor the TDA8026.

Presence pin active High active High or active Low Configurable via pin SPRES.

Synchronous cardmanagement

No Yes -

3.2.2 Low-power modes

The TDA8020 only offers one power-down mode, which is similar to the Clock-stop modeof the TDA8026. The TDA8026 in addition as two more low-power modes to increasepower saving.

3.2.2.1 Standby

The TDA8020 does not offer such an option. At the TDA8026 supply voltages are appliedand the DC-to-DC converter is not running and card slots are not activated.

3.2.2.2 Clock-stop

This mode of the TDA8026 is similar to the 'Power down mode' of the TDA8020 whenCLK = STOP LOW or CLK = STOP HIGH. This mode is triggered when a card isactivated without any communication.

3.2.2.3 Shutdown

The shutdown mode is exclusive for the TDA8026 and is the very low powerconsumption mode, typically 25 µA. The TDA8026 enters this mode when the SDWNNpin (exclusive for the TDA8026) is driven LOW.




Only presence monitoring on card slot 1 remains enabled.

3.2.3 DC-to-DC converter

The DC-DC converter is changed from switched-capacitor DC-to-DC on the TDA8020 toinductor-based switching DC-to-DC on the TDA8026. Due to that change, a dedicatedinductance of 10 µH must be placed between VDD and LX. The capacitor between SAMand SAP as well as the pins are removed due to the changed DC-to-DC concept.

See [AN10724 3.2 Using the DC-DC converter] for detailed information.





3.3.1 Summary


Package TSSOP28 TFBGA64 -

DC-to-DC converter Capacitive or inductive inductive

Card Slots 1 5 (2 independent) -

Card clock up to 10 MHz 20 MHz Both dividable by 1, 2, 4 or 5with synchronous frequencychanges

Low-power modes Shutdown modeInactive modePower-down mode

Shutdown modeStandby modeClock-stop mode

-


3.3.2.1 Shutdown Mode

The shutdown modes of both devices, the TDA8023 and TDA8026, are comparable thesame. The TDA8026 has a slightly higher power consumption while being in shutdownmode.

Table 6. Max current on IDD in shutdown modeItem TDA8023 TDA8026

IDD 10 µA 40 µA

3.3.2.2 Inactive Mode

The inactive mode of the TDA8023 is comparable to the standby mode of the TDA8026.The power consumption of the TDA8026 is slightly higher.

Table 7. Maximum current on IDD in inactive mode.Item TDA8023 TDA8026

Power consumption max. 200 µA 450 µA

3.3.2.3 Power-down mode

At both devices in power-down, or clock-stop, mode clocks on card slots are stopped. Atthe TDA8026, supporting several card slots, at maximum two slots can be active at thesame time, the rest is in clock-stop mode.





The TDA8023 supporting inductive and capacitive DC-to-DC converter while theTDA8026 only supports an inductive DC-to-DC converter.

Coming from an inductive DC-to-DC converter setup the inductor has to be changedfrom 6.8 µH to 10 µH.

Table 8. Inductive TDA8026 DC-to-DC compared to inductive TDA8026 DC-to-DC

Figure 2. TDA8023 inductive DC-to-DC converter Figure 3. TDA8026 inductive DC-to-DC converter

Coming from a capacitive DC-to-DC converter setup a 10 µH inductor has to be placedbetween pin VDD and pin LX. The capacitors on SBP to SBM and SAM to SAP areremoved as well as the pins.

Table 9. Capacitive TDA8023 DC-to-DC compared to inductive TDA8026 DC-to-DC

Figure 4. TDA8023 capacitive DC-to-DC converter Figure 5. TDA8026 inductive DC-to-DC converter

See [AN10724 3.2 Using the DC-DC converter] for detailed information.




3.4 Application Information

PORADJA8B4 A7 H5H4G4A6

B8

A5

A4

B2

C2

E2

E1

D2

C4

C5

C3

B3

H1

D3 to D5, E4, E5,F3 to F5, H8A3

H7

A2

A1C1D7

C6

D6D8

B1

E7

E6F6

E8

F8

G8

F7

G7

G6G5

H2

G2

E3

F1

G1F2

H3G3

C8 D1 B5B6B7C7

GN

D1

L1C1

C3

VDD

VDD(INTF)

C2

10 µF10 µH

10 µF1 µF

100 nF

100 nF

100 nF

100 nF

100 nF

100 nF

100 nF

100 nF

100 nF

100 nF

100 nF

100 nF

C4

D1

V DD

V DD

(INTR

EGD

)

GN

DP

LX V UP

GNDC(1)

DCDC_OFFVCC(1)

VDD(INTF)

SDWNNRST(1)

C5C1

CARDCONNECTOR

2

C6C2C7

C6(2)

C8(2)

C5(1)

C7(1)

C9(1)

C13(1)

R5

R2

C3C8C4

VDD(INTF)

C11

R1 100 kΩ

Rpu 3.3 kΩ

Rpu 3.3 kΩ

0 Ω

0 Ω

0 Ω

0 Ω

0 Ω

100 kΩ

100 kΩ

CLK(1)

SCLMICROCONTROLLER

TDA8026

C4(1)

SDA

C8(1)

IRQN

I/O(1)

A0

PRES(1)

INTAUX

GNDC(2)

I/OUC1

VCC(2)

I/OUC2

RST(2)

CLKIN1

CLK(2)

CLKIN2

I/O(2)

SPRES

PRES(2)

RST(3)

CLK(3)

I/O(3)

STAP3

RST(4)

VCC(4)

CLK(4)

I/O(4)

STAP4

GND2 to GND10

VCC(3)

TESTMODE

INHIB

TST1

TST2

GN

DS

STAP

5I/O

(5)

CLK

(5)

RST

(5)

V CC

(5)

R3

R4

C5C6C7

C1

SAM 2C2C3

VDD(INTF)

C10(2)

C5C6C7

C1

SAM 3C2C3

VDD(INTF)

C11(1)

R6

C12(2)

R7

100 kΩ

C5C6C7

C1

SAM 4C2C3

VDD(INTF)

VDD(INTF)

R8

R9

C14(2)

C5

C6

C7

C1

SAM

5C

2C

3

001aal093

Figure 6. TDA8026 Application diagram

3.5 Product Support PackageWebsite: https://www.nxp.com/products/security-and-authentication/contact-readers/multiple-smart-card-slot-interface:TDA8026ET

Product data sheet: [PS_TDA8026]

User Manual: [UM10319]

• This user manual describes how to use the Cake8026_02_D, a demo board used toevaluate the TDA8026 device, a 5 slots smart cardreader.


• This document describes the way to use the Cake80xx_MBA motherboard: powersupply, protocols, plug of the daughter boards, firmware.

Application Note: [AN10724]

https://www.nxp.com/products/security-and-authentication/contact-readers/multiple-smart-card-slot-interface:TDA8026ET

https://www.nxp.com/products/security-and-authentication/contact-readers/multiple-smart-card-slot-interface:TDA8026ET




• This application note describes the smart card interface integrated circuit TDA8026ET.This document helps to design the TDA8026 in an application. The generalcharacteristics are presented and different application examples are described.


• This product gives a summary of all available product support packages for the contactreader ICs, the TDA family.




4 TDA8034

The TDA8034HN is a cost-effective analog interface for asynchronous and synchronoussmart cards operating at 5 V, 3 V, and 1.8 V. Using few external components, theTDA8034HN provides all supply, protection, and control functions between a smart cardand the microcontroller.


001aal136

100 nF100 nF

100 nF

470 nF 220 nF

10 µF

INTERNALOSCILLATOR

THERMALPROTECTION

CRYSTALOSCILLATOR

RESETGENERATOR

VCCLDO

CLOCKGENERATOR

I/OTRANSCEIVER

I/OTRANSCEIVER

I/OTRANSCEIVER

CLOCKCIRCUITLEVEL

SHIFTER

C5

CARDCONNECTOR

C1

C6 C2

C7 C3

C8 C4

SEQUENCER

SUPPLY

INTERNALREFERENCE

VOLTAGESENSE

12GND

EN1ALARMN

PRESN 8

PORADJ 18

RSTIN3

CMDVCCN5

OFFN19

CLKDIV1 6

CLKDIV2 7

VCC_SEL2 2

VCC_SEL14

I/OUC20

21

22

CLKUP

EN4

1 2423

XTAL2

AUX2UC

AUX1UC

XTAL1

VDD(INTF)

EN3

EN2CLK

PVCC

I/O9

CLK13

RST14

VCC15

AUX110

AUX211

17VDD

16VDDP

R2

R1

VDD(INTF)

(1)

TDA8034HN



Table 10. Product feature comparison TDA8034, TDA8023, TDA8024Product Features TDA8034 TDA8023 TDA8024


ISO 7816 UART - - -




Product Features TDA8034 TDA8023 TDA8024


µC-core - - -


Host interface I/O lines I2C I/O lines

ESD protection on ISO pads[kV]

8 6 6

Auxiliary protected lines forC4 and C8

2 2 2

VCC card power supply [V] 1.8 & 3 & 5 1.8 & 3 & 5 3 & 5

Card supply current @ 5 VVCC [mA]

65 55 80


65 55 65

Card supply current @ 1.8 VVCC [mA]

65 35 -

Card clock frequency max.[MHz]

20 10 26

Card activation time max.[µs]

4160 135 220

Card deactivation time max.[µs]

250 100 100

Protocol Support


yes yes -

Asynchronous protocl T=0and T=1

yes yes yes

Security Features

Voltage supervisor and overcurrent detection

yes yes yes

Current protection on VCC, I/O, RST, CLK

yes yes yes


Power supply interface VDDI[V]

1.6 - 3.6 1.5 - 6.5 -

Power supply [V] 3 - 5.5 2.7 - 6.5 2.7 - 6.5

Power down current max [µA] 12 2 -


Package HVQFN24 & SO16 &TSSOP16

TSSOP28 SO28 & TSSOP28

EVMCo compliance yes yes -

NDS compliance yes - yes





4.2.1 Summary


Package TSSOP28 HVQFN32 -

Supply voltage min. 2.7 V 3 V For class A cards (5 V),the supply voltage at theTDA8034 must be at least4.85 V.

DC-to-DC converter Capacitive or inductivefollower, doubler, tripler

Low Drop-Off voltageregulator

-

Clock input max. 20 MHz 26 MHz -

ESD protection 6 kV 8 kV -

Card clock generation up to 10 MHzDivider: 1, 2, 4 or 5

up to 20 MHzDivider: 1, 2, 4 or 8

-

I2C configuration interface Yes No The TDA8034 is notconfigurable by any interface.


Shutdown modeDeep shutdown mode


The shutdown mode of the TDA8023 is comparable the same as the shutdown modeof the TDA8034. Also the inactive mode of the TDA8023, with a slightly higher powerconsumption, is comparable to the deep shutdown mode of the TDA8034.

4.2.3 PRES

The presence pin connection of TDA8034 designs must be switched. Depending on thesmart card connector type: normally open or normally closed. The difference coming froma TDA8023 and going to a TDA8034 is displayed below.

Table 12. Presence pin change - Card connector normally open

Card connector

Presence switch(normally open)

TDA8023

PRES

VDD

Figure 8. TDA8023 PRES normally open

Card connector


TDA8034

PRESN

Figure 9. TDA8034 PRESN normally open




Table 13. Presence pin change - Card connector normally closed

Card connector

Presence switch(normally closed)

TDA8023

PRES

10k

VDD

Figure 10. TDA8023 PRES normally closed

Card connector

Presence switch(normally close)

TDA8034

PRESN

VDD(INTF)

R

Figure 11. TDA8034 PRESN normally closed

4.2.4 DC-to-DC to LDO

The TDA8023 card power supply is either a capacitive or inductive DC-to-DC converter.The TDA8034 has an LDO for the card supply. Two capacitors, 10 µF and 100 nF, mustbe placed close to the LDO of the TDA8034. All other components for the supply of VDDPhave to be removed.

Table 14. TDA8023 DC-to-DC to TDA8034 LDO

Figure 12. TDA8023 capacitive DC-to-DC Figure 13. TDA8034 LDO





001aal142

100 nF

C1

VDD(INTF)

VDD(INTF) MICROCONTROLLER

PORADJ

XTAL

2

181VDD

XTAL

1AU

X2U

C

172VDDP

VDD(INTF)

163VCC

VCC_SEL2

1514

13

4RST

RSTIN

5CLK

VCC_SEL1

67

GND

8 9 10 11 12

24 23 22 21 20 19

TDA8034HN100 nF

C2

C3100 nF

C410 µF

R40 Ω

R1

R2

VDD

VDD

C5470 nF

C6220 nF

VDDPCMDVCCN

CLKDIV1

AUX1

UC

I/OU

CO

FFN

CLK

DIV

2

PRES

N I/O

AUX1

AUX2

GN

D

C5

CARDCONNECTOR

C1

C6 C2

C7 C3

C8 C4


4.4 Product Support PackageWebsite: https://www.nxp.com/products/security-and-authentication/contact-readers/low-power-smart-card-interface:TDA8034

Product Data Sheet: [TDA8034HN]


• This application note describes the smart card interface integrated circuit TDA8034HN.This document helps to design the TDA8034HN in an application. The generalcharacteristics are presented and different application examples are described.



https://www.nxp.com/products/security-and-authentication/contact-readers/low-power-smart-card-interface:TDA8034

https://www.nxp.com/products/security-and-authentication/contact-readers/low-power-smart-card-interface:TDA8034





• This application note describes the smart card interface integrated circuit TDA8034T/AT/BT. This document helps to design the TDA8034T, TDA8034AT, or TDA8034BTin an application. The general characteristics are presented and different applicationexamples are described.


• The application note describes the Cake8034_01_D Cake8034_02_D demo boards forTDA8034: schematics, layout, and use of this board.


• This document describes the way to use the Cake80xx_MBA mother board: powersupply, protocols, plug of the daughter boards, firmware.




5 TDA8035

The TDA8035 is the cost efficient successor of the established integrated contact smartcard reader IC TDA8024. It offers a high level of security for the card by performingcurrent limitation, short-circuit detection, ESD protection as well as supply supervision.

The current consumption during the standby mode of the contact reader is very low as itoperates in the 3 V supply domain. The TDA8035 is therefore the ideal component for apower efficient contact reader.


001aan745

10 F

1 F

2 ×220 nF

100 nF

100 nF

100 nF330 nF

CMDVCCN

EN_5V/3VNEN_1.8VN

RSTINCLKDIV1CLKDIV2

I/OUCAUX1UCAUX2UC

OFFN

INTERNALREGULATOR

SUPERVISORINPUT SENSE

DEEP SHUTDOWN

deepshutdown DEEP

SHUTDOWN

BANDGAP

HOSTINTERFACE

LATCH

CS

configurationsbus for smartcardreader interface

interuption

reset andsupalarm

HZ

HZ

VDD(INTF)

INTERNALOSCILLATOR

THERMALPROTECTION

DIGITALSEQUENCER

TDA8035

DCDCCONVERTER

GNDPGND VDDPVREGPORADJVDD(INTF)

VDD(INTF) VDDP

SAM

VCC

GNDC

RSTCLKAUX1AUX2

XTAL1

XTAL2

PRESN

I/O

SAP

330 nF

SBM

VUP

C1

SBP

ISO7816READER

INTERFACE

CRYSTALOSCILLATOR

UCC5

C2C6

C3C7

C4C8



Table 15. Product feature comparison TDA8035, TDA8023, TDA8024Product Features TDA8035 TDA8023 TDA8024


ISO 7816 UART - - -


µC-core - - -





Product Features TDA8035 TDA8023 TDA8024

Host interface I/O lines I2C I/O lines

ESD protection on ISO pads[kV]

8 6 6

Auxiliary protected lines forC4 and C8

2 2 2

VCC card power supply [V] 1.8 & 3 & 5 1.8 & 3 & 5 3 & 5


65 55 80


65 55 65


35 35 -


- - -

Card clock frequency max.[MHz]

20 10 26

Card activation time max.[µs]

3400 135 220

Card deactivation time max.[µs]

250 110 100

Protocol Support


yes yes -

Asynchronous protocl T=0and T=1

yes yes yes

Security Features

Voltage supervisor and overcurrent detection

yes yes yes

Current protection on VCC, I/O, RST, CLK

yes yes yes


Power supply interface VDDI[V]

1.6 - 3.6 1.5 - 6.5 -

Power supply [V] 2.7 - 5.5 2.7 - 6.5 2.7 - 6.5

Power down current max [µA] 3 2 -


Package HVQFN32 TSSOP28 SO28 & TSSOP28

EVMCo compliance yes yes -

NDS compliance yes - yes





5.2.1 Summary

Table 16. TDA8023 - TDA8035 difference summaryItem TDA8023 TDA8035 Comment

Package TSSOP28 HVQFN24 -

DC-to-DC Converter capacitive doubler,tripler, follower, orinductive

capacitive doubler,tripler, or follower

-

I²C-bus controlled ICcard interface

Yes No The TDA8035 does notoffer any configurationinterface.


Deep shutdown modeShutdown mode

-


5.2.2.1 Deep Shutdown Mode

The TDA8035 deep shutdown mode can be compared to the shutdown mode of theTDA8023. The smart card reader is inactive and the supervisors are turned off, but thepresence detection is still available: The OFFN pin follows the status of presence.

To enter, or leave, the deep shutdown mode the host microcontroller has to change thestate of the control pins.

Table 17. Deep shutdown mode current consumption comparisonItem TDA8023 TDA8035

Power supply current 10 µA 3 µA

5.2.2.2 Shutdown mode

The TDA8035 shutdown mode can be compared to the inactive mode of the TDA8023.This mode is the default mode when no card is active. Supervisors are active, cardpresence detection is available.

Table 18. Shutdown mode current consumption comparisonItem TDA8023 TDA8035

Power supply current 200 µA 500 µA

5.2.3 PRES

The PRESN pin on the TDA8035 is active low and the circuitry around it must bechanged coming from TDA8023.




Table 19. Presence pin change - Card connector normally open

Card connector


TDA8023

PRES

VDD

Figure 16. TDA8023 PRES normally open

Card connector


TDA8035

PRESN

R

VDD(INTF)

Figure 17. TDA8035 PRESN normally open

Table 20. Presence pin change - Card connector normally closed

Card connector


TDA8023

PRES

10k

VDD

Figure 18. TDA8023 PRES normally closed

Card connector


TDA8035

PRESN

VDD(INTF)

Figure 19. TDA8035 PRESN normally closed


While the TDA8023 offices the choice between a capacitive or inductive driven DC-to-DC converter the TDA8035 only can be driven capacitive. Coming from the TDA8023with a capacitive DC-to-DC converter only the capacitor values have to be changed.Changing from an inductive DC-to-DC converter to a capacitive DC-to-DC converterinvolves slightly more effort in redesign.




Table 21.

Figure 20. TDA8023 capacitive DC-to-DC Figure 21. TDA8035 capacitive DC-to-DC

5.3 Differences TDA8024 - TDA8035For this transition, consult following Application Note [AN11058 - Design migration fromTDA8024 to TDA8035].





001aan759

0

C2100 nF(1)

C9(4)220 nFC8

220 nF(3)

R2(5)

R1(5)

C10

56 pF

C1

100 nF(1)

C4

330 nF

C5

R

1 F(2)

C3

330 nF

C6(2)100 nF

C7(2)10 F

I/OUC1 24

CLK

PORADJ2 23

RST

CMDVCCN3 22

VCC

VDD(INTF)

VDD(INTF)

VDD(INTF)

4 21VUP

C5 C1

CARDCONNECTOR

C6 C2

C7 C3

C8 C4

CLKDIV15 20

SAP

CLKDIV26 19

SBP

EN_5V/3VN7 18

VDDPVDD

EN_1.8VN8 17

SBM

RS

TIN

MIC

RO

CO

NTR

OLL

ER

932

AUX2

UC

OFF

N10

31AU

X1U

C

GN

D11

30PR

ESN

XTAL

112

29C

S

XTAL

213

28I/O

V REG

1427

AUX2

SAM

1526

AUX1

GN

DP

1625

GN

DC

TDA8035

VDD(INTF)

VDD(INTF)

VDD(INTF)





5.5 Two TDA8035 parallelIt is possible to cascade several devices using the same connection pins by driving itschip select (CS) pin. For further information check following application note [AN10997]chapter [4. Chip select].

Following schematic is an example on how to connect 2 TDA8035 to a single host.

019aac072

I/OUC

AUX2

UC

AUX1

UC

PRES

N

CS

I/O AUX2

AUX1

GN

DC

PORADJ

TDA8035

CMDVCCN

VDD(INTF)

CLKDIV1CLKDIV2

EN5V_3VN

EN_1.8V

I/OUC

CMDVCCN

CLKDIV1CLKDIV2

EN5V_3VN

EN_1.8V

132 31 30 29 28 27 26 25

9 10 11 12 13 14 15 16

2

3

45

6

78

2423

22

2120

19

1817

CLK

RSTVCC

VUP

SAPSBP

VDDP

SBM

RST

IN

OFF

N

RSTIN

OFFN

AUX1UC

AUX2UC

GN

D

XTAL

1

XTAL

2VR

EG

SAM

GN

DP

I/OUC

AUX2

UC

AUX1

UC

PRES

N

CS

I/O AUX2

AUX1

GN

DC

PORADJ

TDA8035

CMDVCCN

VDD(INTF)

CLKDIV1CLKDIV2

EN5V_3VN

EN_1.8V

I/OUC

CMDVCCN

CLKDIV1CLKDIV2

EN5V_3VN

EN_1.8V

132 31 30 29 28 27 26 25

9 10 11 12 13 14 15 16

2

3

45

6

78

2423

22

2120

19

1817

CLK

RSTVCC

VUP

SAPSBP

VDDP

SBM

RST

IN

OFF

N

RSTIN

OFFN

AUX1UCIOUC

MICROCONTROLLER

AUX1UC

CS1

CS2

AUX2UC

CMDVCCNCLKDIV1

CLKDIV2

EN5V/3VNEN1V8N

RSTIN

OFFN

AUX2UC

GN

D

XTAL

1

XTAL

2VR

EG

SAM

GN

DP

Figure 23. Two cascaded TDA8035 devices

5.6 Product Support PackageWebsite: https://www.nxp.com/products/security-and-authentication/contact-readers/high-integrated-and-low-power-smart-card-interface:TDA8035HN

Product data sheet: [TDA8035]

https://www.nxp.com/products/security-and-authentication/contact-readers/high-integrated-and-low-power-smart-card-interface:TDA8035HN

https://www.nxp.com/products/security-and-authentication/contact-readers/high-integrated-and-low-power-smart-card-interface:TDA8035HN





• This application note describes the smart card interface integrated circuit TDA8035HN.This document helps to design the TDA8035HN in an application. The generalcharacteristics are presented and different application examples are described.




• The application note describes the Cake8035 demo board for TDA8035: schematics,layout, and use of this board.


• This application note describes how to migrate a design from TDA8024 toTDA8035: SW updates, HW differences, and an example based on a double layoutimplementation.






6 TDA8037

The TDA8037 is the cost efficient successor of the established integrated contact smartcard reader IC TDA8035. Operating only in the 3 V supply domain and supporting onlyClass B cards it reduces complexity and costs. If the target system operates only withClass B cards. Due to the very low power consumption in shutdown mode, it is the idealcomponent for a power efficient contact reader.

aaa-011372

UC HZ

CMDVCCN

CLKDIV

RSTIN

LATCH

INTERNALREGULATOR

ISO7816READER

INTERFACE

CARDCONNECTOR

SUPERVISOR

BANDGAP

inputsense

reset andsupalarm

HOSTINTERFACE

CS

VDD

VDDhost

GNDPORADJ

TDA8037

VDD

VDD

10 µF 100 nF

TEST

HZ

I/OUC

AUX1UC

AUX2UC

OFFN

CLKIN

I/O

AUX2

AUX1

CLK

RST

2 x220 nF

VCC

VDD

PRESN

INTERNAL OSCILLATOR

THERMAL PROTECTION

DIGITALSEQUENCER

configurationsbus for smartcardreader interface

interruption

CLOCK CIRCUITRY

c5 c1

c6 c2

c7 c3

c8 c4

Figure 24. Block diagram


Table 22. Product feature comparison TDA8035, TDA8023, TDA8024Product Features TDA8023 TDA8024 TDA8035 TDA8037

Analog interfaces 1 1 1 1

ISO 7816 UART - - - -

ISO 7816 dedicatedtimers

- - - -

µC-core - - - -

ROM[kbyte] /RAM[byte]

- - - -




Product Features TDA8023 TDA8024 TDA8035 TDA8037

Host interface I2C I/O lines I/O lines I/O Lines

ESD protection on ISOpads [kV]

6 6 10 8

Auxiliary protectedlines for C4 and C8

2 2 2 3 (C8)

VCC card powersupply [V]

1.8 & 3 & 5 3 & 5 1.8 & 3 & 5 3

Card supply current @5 V VCC [mA]

55 80 65 -

Card supply current @3 V VCC [mA]

55 65 65 65

Card supply current @1.8 V VCC [mA]

35 - 35 -

Card supply current @1.2 V VCC [mA]

- - - -

Card clock frequencymax. [MHz]

10 26 20 10

Card activation timemax. [µs]

135 220 3400 554

Card deactivation timemax. [µs]

100 100 250 250

Protocol Support


yes - yes yes

Asynchronous protoclT=0 and T=1

yes yes yes yes

Security Features

Voltage supervisor andover current detection

yes yes yes yes

Current protection onVCC, I/O, RST, CLK

yes yes yes yes


Power supply interfaceVDDI [V]

1.5 - 6.5 - 1.6 - 3.6 -

Power supply [V] 2.7 - 6.5 2.7 - 6.5 2.7 - 5.5 3 - 3.6

Power down currentmax [µA]

2 - 1 400

Temperature range[°C]

-25 / 85 -25 / 85 -25 / 85 -25 / 85

Package TSSOP28 SO28 & TSSOP28 HVQFN32 SO28 & TSSOP16

EVMCo compliance yes - yes yes

NDS compliance - yes yes -




6.2 Differences TDA8024 - TDA8037For the transition from TDA8024 to TDA8037, consult following application noteAN11460.

6.3 Product Support Package

Website: https://www.nxp.com/products/security-and-authentication/contact-readers/low-power-3v-smart-card-interface:TDA8037

Product data sheet: [TDA8037]

Application Note: [AN11458] Design guideline for TDA8037

• This document helps to design the TDA8037 in an application. The generalcharacteristics are presented and different application examples are described.

Application Note: [AN11460] Design migration from TDA8024 to TDA8037T

• This application note describes how to migrate a design from TDA8024 toTDA8037: SW updates, HW differences, and an example based on a double layoutimplementation.

Application Note: [AN11459] Application with TDA8037 - Demonstration boarddescription

• The application note describes the Cake8037 demo boards for TDA8037T andTDA8037TT: schematics, layout, and use of this board.



https://www.nxp.com/products/security-and-authentication/contact-readers/low-power-3v-smart-card-interface:TDA8037

https://www.nxp.com/products/security-and-authentication/contact-readers/low-power-3v-smart-card-interface:TDA8037




7 PN7412

The PN7412 is part of the PN7462 family having a 32-bit Cortex-M0-basedmicrocontroller, offering high performance, and low power consumption. The contactinterfaces offer a high level of security for the card by performing current limiting, short-circuit detection, ESD protection as well as supply supervision. An additional UARToutput is also implemented to address applications where more than one contact cardslot is needed. It enables an easy connection to multiple smart card slot interfaces likeTDA8026, TDA8034, and others.

It provides thermal and short-circuit protection on all card contacts. It also providesautomatic activation and deactivation sequences initiated by software or hardware.

See product data sheet for more information: [DS-PN7412]

aaa-030118

ARM-CORTEX M0

systembus

slave slave

slavemastermaster

slave

SRAM12 kB

EEPROM4 kB

AHB LITE

FLASH160 kB

ROM40 kB

CODE PATCH

AHB

TOAP

B

HOST INTERFACES

USB

HSU

SPI

I2C

SPI MASTER

I2C MASTER

RNG

POWER, CLOCKAND RESET GPIO

XTAL

TIMERSTIME 0, 1, 2, 3WATCHDOG

PMU

CRCI/O AUX

CTIF ISO7816 UART

MAIN LDO PVDD LDO

TX LDO VCC LDO

SC LDO

TEMPERATURE SENSOR

CLOCK GENERATORS

HFO LFO

USB PLL

DC-DC

AHB

LITE

BUFF

ERM

ANAG

EMEN

T

SWD

Figure 25. PN7412 Block diagram





Table 23. Product feature comparison PN7412, TDA8007, TDA8020, TDA8029Product Features PN7412 TDA8029

Analog interfaces 1 1

ISO 7816 UART yes yes

ISO 7816 dedicated timers yes yes

µC-core Cortex-M0 80C51RB+

ROM[kbyte] / RAM[byte] 160 / 12000 16 / 768

Host interface SPI, UART, I2C, USB serial or I2C

ESD protection on ISO pads [kV] 8 6

Auxiliary protected lines for C4 and C8 2 0

VCC card power supply [V] 1.8 & 3 & 5 1.8 & 3 & 5

Card supply current @ 5 V VCC [mA] 60 65

Card supply current @ 3 V VCC [mA] 55 50

Card supply current @ 1.8 V VCC [mA] 35 30

Card supply current @ 1.2 V VCC [mA] - -

Card clock frequency max. [MHz] 13.56 20

Card activation time max. [µs] 2200 225

Card deactivation time max. [µs] 250 100

Synchronous card management yes yes

Asynchronous protocl T=0 and T=1 yes yes

Voltage supervisor and over currentdetection

yes yes

Current protection on VCC, I/O, RST,CLK

yes yes

Power supply [V] 2.3 - 5.5 2.7 - 6.0

Power down current max [µA] 20

Temperature range [°C] -40 / +85 -25 / +85

Package HVQFN64 LQFP32

EVMCo compliance yes yes

NDS compliance - yes

7.2 Differences TDA8029 - PN7412

7.2.1 Summary




Table 24. TDA8029 - PN7412 differences summaryItem TDA8029 PN7412 Comments

Package LQFP32 HVQFN64 -

DC-to-DC converter doubler, tripler, or follower doubler or follower -

Inactive Modes 4 modes available:Stop clock, Shut-down,Power-down, and Sleepmode

2 modes available:Standby and Hard PowerDown

-

ALPAR Protocol Fully implemented Demo example -

Activation time 130 µs up to 22 ms -

Maximum card clock 20 MHz 13.56 MHz -

WakeUpSlave INT1_N Configurable The PN7412 wake-up sourcecan be configured to nearlyevery pin.

SlaveI2CMute P27 Configurable Any GPIO of the PN7412 canbe utilized for this matter.

Power-On Reset delay CDEL pin configurable percapacitor value.

Not offered -


7.2.2.1 Hard Power Down

This hard power-down mode is the deepest power-down mode and consumes the leastamount possible. The PN7412 hard power-down mode is similar to the Shut-down modeof the TDA8029. The card is deactivated, all clocks are stopped, all LDOs are turned off,except the MLDO which is set to low-power mode.

The behavior of RST_N and SDW_N in this case is the same. If the supply voltage issufficient and RST_N gets high the PN7412 exits the Hard Power-down mode.

7.2.2.2 Standby

The PN7412 deactivates a contact card before entering standby. This mode is in contrastof the TDA8029 sleep mode which holds the card active via clock-stop. While being instandby, several wake-up sources can be set. Such as the insertion of a contacted cardor activity on the host interface.

7.2.3 ALPAR protocol

As host communication protocol the TDA8029 implements 'ALPAR'. For the PN7412, asoftware example with a few mandatory commands implemented is available on request.The PN7412 with Cortex-M0 and 160 kByte flash opens up the possibility to implementadditional commands and logic.

The ALPAR protocol is explained in AN [AN10207].




Table 25. PN7412 implemented commandsCommand Code Expected command [hex]

power_up_5V 6Eh 60 00 01 6E 01 0E

power_off 4Dh 60 00 00 4D 2D

check_pres_card 09h 60 00 00 09 69

card_command (APDU) 00h 60 xx xx 00 xx xx .

Table 26. PN7412 implemented error codesStatus code Meaning Complete Frame [hex]

55h Unknown command E0 00 00 55 B5

80h Card mutes E0 00 01 6E 80 0F

00h Activation failed E0 00 01 6E 00 8F




7.3 PN7412 and TDA80XXThe PN7412 family can handle more than one smart card by controlling an extra contactinterface front-end (TDA). Consolidate User Manual [UM10858] chapter [13.5 Connect anexternal TDA] for further information.

For one additional slot, the TDA8034 or TDA8035 can be used.

ISO7816T = 0, T = 1 protocols

Cortex-M0 CPU

PN7412

ISO7816DigitalUART

ISO7816Electricalinterface

TDA80xxISO7816 AUX line

ISO7816 pins

GPIO or I2C

ISO7816Electricalinterface

Smart Card 1

Smart Card 2

Smart Card 3

Figure 26. PN7412 with TDA80xx

Are several interfaces required the TDA8026 would be the correct choice.

ISO7816T = 0, T = 1 protocols

Cortex-M0 CPU

PN7412

ISO7816DigitalUART

TDA8026

IO_AUX

I2CM_SDA SDA

Smart Card 2

Smart Card 3

PVDD_IN

PVDD

IOUC1

IOUC2

I2CM_SCL SCL

INT_AUX IRQN

GPIOx SDWNN

VDDI

PVDD

GND

GND

GND

GND

CLK_AUX CLKIN1

CLKIN2

Figure 27. PN7412 with TDA8026





aaa-021148

PN7412

PRES

AUX1

CLK

RST

GNDC

C1 C2 C3 C4

C5 C6 C7 C8

VPVDD_IN

PRES

C = 470 nF(2)

R = 0 Ω

C = 100 nF(1)

VCC

IO

AUX2

Figure 28. PN7412 Application diagram

7.5 Product Support PackageWebsite: https://www.nxp.com/products/rfid-nfc/nfc-hf/nfc-readers/nfc-cortex-m0-all-in-one-microcontroller-with-optional-contact-interface-for-access-control:PN7462

Product data sheet: [PN7412]


• How to use contact smart card interface on PN7462AU.


• The following document describes steps required for integration of RTOS withPN7462AU Firmware.


• This document describes PN7462 Controller Development Kits. It also describesPN7462 software stack, gives directions to run example application using theMCUXpresso IDE. Document provides PN7462 customer board configurationinstructions, board hardware overview, and provides basic steps how to use NFCCockpit application.


• This document briefs the setup environment required for PC CCID Reader use casedemo on PN7462 Board.


https://www.nxp.com/products/rfid-nfc/nfc-hf/nfc-readers/nfc-cortex-m0-all-in-one-microcontroller-with-optional-contact-interface-for-access-control:PN7462

https://www.nxp.com/products/rfid-nfc/nfc-hf/nfc-readers/nfc-cortex-m0-all-in-one-microcontroller-with-optional-contact-interface-for-access-control:PN7462




• This document describes how to use the PN7462 family.


• This document describes how to manage EEPROM of PN7462 family.




8 References

[1] Product data sheet - TDA8026 - Multiple smart card slot interface IChttp://www.nxp.com

[2] Product data sheet - TDA8034HN - Low-power smart card interfacehttps://www.nxp.com/docs/en/data-sheet/TDA8034HN.pdf

[3] Product data sheet - TDA8035 - High integrated and low-power smart card interfacehttps://www.nxp.com/docs/en/data-sheet/TDA8035.pdf

[4] Product data sheet - PN7462 family - NFC Cortex-M0 microcontrollerhttp://www.nxp.com

[5] AN10724 - TDA8026ET - 5 slots smart card interfacehttps://www.nxp.com/docs/en/application-note/AN10724.pdf

[6] AN11079 - Contact reader ICs - TDA product support packageshttps://www.nxp.com/docs/en/application-note/AN11079.pdf

[7] UM10319 - Cake8026_02_Dhttps://www.nxp.com/docs/en/user-guide/UM10319.pdf

[8] UM10349 - Contact smart card reader chips evaluation with CAKE80xx_MBAhttps://www.nxp.com/docs/en/user-guide/UM10349.pdf

[9] AN10792 - TDA8034HN - Smart Card reader interfacehttps://www.nxp.com/docs/en/application-note/AN10792.pdf

[10] AN10807 - TDA8034T/AT/BT - Smart Card reader interfacehttps://www.nxp.com/docs/en/application-note/AN10807.pdf

[11] AN10794 - Application with TDA8034 - Demonstration boards descriptionhttps://www.nxp.com/docs/en/application-note/AN10794.pdf

[12] AN10997 - TDA8035 Smart Card Readerhttps://www.nxp.com/docs/en/application-note/AN10997.pdf

[13] AN10999 - Application with TDA8035 - Demonstration board descriptionhttps://www.nxp.com/docs/en/application-note/AN10999.pdf

[14] AN11058 - Design migration from TDA8024 to TDA8035https://www.nxp.com/docs/en/application-note/AN11058.pdf

[15] AN11738 - PN7462AU - Contact Smart Card applicationhttps://www.nxp.com/docs/en/application-note/AN11738.pdf

[16] AN11784 - PN7462AU How to integrate RTOShttps://www.nxp.com/docs/en/application-note/AN11784.pdf

[17] UM10883 - PN7462 family Quick Start Guide - Development Kithttps://www.nxp.com/docs/en/user-guide/UM10883.pdf

[18] UM10915 - PN7462AU PC CCID Reader User Manualhttps://www.nxp.com/docs/en/user-guide/UM10915.pdf

[19] UM10858 - PN7462 family HW user manualhttps://www.nxp.com/docs/en/user-guide/UM10858.pdf

[20] UM10948 - EEPROM Management of PN746X and PN736Xhttps://www.nxp.com/docs/en/user-guide/UM10948.pdf

[21] AN10207 - Smart Card reader application with TDA8029 Mask 06 and Mask 07https://www.nxp.com/docs/en/application-note/AN10207.pdf

[22] AN11460 - Design migration from TDA8024 to TDA8037Thttps://www.nxp.com/docs/en/application-note/AN11460.pdf

[23] Product data sheet - TDA8037 - Low-power 3 V smart card interfacehttps://www.nxp.com/docs/en/data-sheet/TDA8037.pdf

[24] AN11458 - Design guideline for TDA8037

http://www.nxp.com

https://www.nxp.com/docs/en/data-sheet/TDA8034HN.pdf

https://www.nxp.com/docs/en/data-sheet/TDA8035.pdf

http://www.nxp.com

https://www.nxp.com/docs/en/application-note/AN10724.pdf


https://www.nxp.com/docs/en/user-guide/UM10319.pdf
















https://www.nxp.com/docs/en/data-sheet/TDA8037.pdf




https://www.nxp.com/docs/en/application-note/AN11458.pdf[25] AN11459 - Application with TDA8037 - Demonstration board description







9 Legal information

9.1 DefinitionsDraft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodifications or additions. NXP Semiconductors does not give anyrepresentations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequencesof use of such information.

9.2 DisclaimersLimited warranty and liability — Information in this document is believedto be accurate and reliable. However, NXP Semiconductors does notgive any representations or warranties, expressed or implied, as to theaccuracy or completeness of such information and shall have no liabilityfor the consequences of use of such information. NXP Semiconductorstakes no responsibility for the content in this document if provided by aninformation source outside of NXP Semiconductors. In no event shall NXPSemiconductors be liable for any indirect, incidental, punitive, special orconsequential damages (including - without limitation - lost profits, lostsavings, business interruption, costs related to the removal or replacementof any products or rework charges) whether or not such damages are basedon tort (including negligence), warranty, breach of contract or any otherlegal theory. Notwithstanding any damages that customer might incur forany reason whatsoever, NXP Semiconductors’ aggregate and cumulativeliability towards customer for the products described herein shall be limitedin accordance with the Terms and conditions of commercial sale of NXPSemiconductors.

Right to make changes — NXP Semiconductors reserves the right tomake changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,authorized or warranted to be suitable for use in life support, life-critical orsafety-critical systems or equipment, nor in applications where failure ormalfunction of an NXP Semiconductors product can reasonably be expectedto result in personal injury, death or severe property or environmentaldamage. NXP Semiconductors and its suppliers accept no liability forinclusion and/or use of NXP Semiconductors products in such equipment orapplications and therefore such inclusion and/or use is at the customer’s ownrisk.

Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. NXP Semiconductors makesno representation or warranty that such applications will be suitablefor the specified use without further testing or modification. Customersare responsible for the design and operation of their applications andproducts using NXP Semiconductors products, and NXP Semiconductorsaccepts no liability for any assistance with applications or customer productdesign. It is customer’s sole responsibility to determine whether the NXPSemiconductors product is suitable and fit for the customer’s applicationsand products planned, as well as for the planned application and use ofcustomer’s third party customer(s). Customers should provide appropriatedesign and operating safeguards to minimize the risks associated withtheir applications and products. NXP Semiconductors does not accept anyliability related to any default, damage, costs or problem which is basedon any weakness or default in the customer’s applications or products, orthe application or use by customer’s third party customer(s). Customer isresponsible for doing all necessary testing for the customer’s applications

and products using NXP Semiconductors products in order to avoid adefault of the applications and the products or of the application or use bycustomer’s third party customer(s). NXP does not accept any liability in thisrespect.

Export control — This document as well as the item(s) described hereinmay be subject to export control regulations. Export might require a priorauthorization from competent authorities.

Evaluation products — This product is provided on an “as is” and “with allfaults” basis for evaluation purposes only. NXP Semiconductors, its affiliatesand their suppliers expressly disclaim all warranties, whether express,implied or statutory, including but not limited to the implied warranties ofnon-infringement, merchantability and fitness for a particular purpose. Theentire risk as to the quality, or arising out of the use or performance, of thisproduct remains with customer. In no event shall NXP Semiconductors, itsaffiliates or their suppliers be liable to customer for any special, indirect,consequential, punitive or incidental damages (including without limitationdamages for loss of business, business interruption, loss of use, loss ofdata or information, and the like) arising out the use of or inability to usethe product, whether or not based on tort (including negligence), strictliability, breach of contract, breach of warranty or any other theory, even ifadvised of the possibility of such damages. Notwithstanding any damagesthat customer might incur for any reason whatsoever (including withoutlimitation, all damages referenced above and all direct or general damages),the entire liability of NXP Semiconductors, its affiliates and their suppliersand customer’s exclusive remedy for all of the foregoing shall be limited toactual damages incurred by customer based on reasonable reliance up tothe greater of the amount actually paid by customer for the product or fivedollars (US$5.00). The foregoing limitations, exclusions and disclaimersshall apply to the maximum extent permitted by applicable law, even if anyremedy fails of its essential purpose.

Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancybetween the translated and English versions.

Security — While NXP Semiconductors has implemented advancedsecurity features, all products may be subject to unidentified vulnerabilities.Customers are responsible for the design and operation of their applicationsand products to reduce the effect of these vulnerabilities on customer’sapplications and products, and NXP Semiconductors accepts no liability forany vulnerability that is discovered. Customers should implement appropriatedesign and operating safeguards to minimize the risks associated with theirapplications and products.

9.3 Licenses

Purchase of NXP ICs with NFC technology

Purchase of an NXP Semiconductors IC that complies with one of theNear Field Communication (NFC) standards ISO/IEC 18092 and ISO/IEC 21481 does not convey an implied license under any patent rightinfringed by implementation of any of those standards. Purchase of NXPSemiconductors IC does not include a license to any NXP patent (or otherIP right) covering combinations of those products with other products,whether hardware or software.

9.4 TrademarksNotice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.




TablesTab. 1. TDA linecard and short overview ...................... 3Tab. 2. Replacement overview ...................................... 4Tab. 3. Product feature comparison TDA8026,

TDA8020, TDA8023, TDA8024 .........................6Tab. 4. TDA8020 - TDA8026 differences summary .......7Tab. 5. TDA8023 - TDA8026 differences summary .......9Tab. 6. Max current on IDD in shutdown mode ............. 9Tab. 7. Maximum current on IDD in inactive mode. .......9Tab. 8. Inductive TDA8026 DC-to-DC compared to

inductive TDA8026 DC-to-DC ......................... 10Tab. 9. Capacitive TDA8023 DC-to-DC compared to

inductive TDA8026 DC-to-DC ......................... 10Tab. 10. Product feature comparison TDA8034,

TDA8023, TDA8024 ........................................13Tab. 11. TDA8023 - TDA8034 differences summary .....15Tab. 12. Presence pin change - Card connector

normally open ..................................................15Tab. 13. Presence pin change - Card connector

normally closed ............................................... 16Tab. 14. TDA8023 DC-to-DC to TDA8034 LDO ............16

Tab. 15. Product feature comparison TDA8035,TDA8023, TDA8024 ........................................19

Tab. 16. TDA8023 - TDA8035 difference summary .......21Tab. 17. Deep shutdown mode current consumption

comparison ......................................................21Tab. 18. Shutdown mode current consumption

comparison ......................................................21Tab. 19. Presence pin change - Card connector

normally open ..................................................22Tab. 20. Presence pin change - Card connector

normally closed ............................................... 22Tab. 21. .......................................................................... 23Tab. 22. Product feature comparison TDA8035,

TDA8023, TDA8024 ........................................27Tab. 23. Product feature comparison PN7412,

TDA8007, TDA8020, TDA8029 .......................31Tab. 24. TDA8029 - PN7412 differences summary .......32Tab. 25. PN7412 implemented commands ................... 33Tab. 26. PN7412 implemented error codes ...................33




FiguresFig. 1. TDA8026 Block diagram ................................... 5Fig. 2. TDA8023 inductive DC-to-DC converter ......... 10Fig. 3. TDA8026 inductive DC-to-DC converter ......... 10Fig. 4. TDA8023 capacitive DC-to-DC converter ........10Fig. 5. TDA8026 inductive DC-to-DC converter ......... 10Fig. 6. TDA8026 Application diagram .........................11Fig. 7. TDA8034 Block diagram ................................. 13Fig. 8. TDA8023 PRES normally open .......................15Fig. 9. TDA8034 PRESN normally open .................... 15Fig. 10. TDA8023 PRES normally closed .................... 16Fig. 11. TDA8034 PRESN normally closed ..................16Fig. 12. TDA8023 capacitive DC-to-DC ....................... 16Fig. 13. TDA8034 LDO .................................................16Fig. 14. TDA8034 Application diagram .........................17

Fig. 15. TDA8035 Block diagram ................................. 19Fig. 16. TDA8023 PRES normally open .......................22Fig. 17. TDA8035 PRESN normally open .................... 22Fig. 18. TDA8023 PRES normally closed .................... 22Fig. 19. TDA8035 PRESN normally closed ..................22Fig. 20. TDA8023 capacitive DC-to-DC ....................... 23Fig. 21. TDA8035 capacitive DC-to-DC ....................... 23Fig. 22. TDA8035 Application diagram .........................24Fig. 23. Two cascaded TDA8035 devices ....................25Fig. 24. Block diagram ................................................. 27Fig. 25. PN7412 Block diagram ................................... 30Fig. 26. PN7412 with TDA80xx .................................... 34Fig. 27. PN7412 with TDA8026 ....................................34Fig. 28. PN7412 Application diagram ...........................35


Please be aware that important notices concerning this document and the product(s)described herein, have been included in section 'Legal information'.

© NXP B.V. 2020. All rights reserved.For more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: [email protected]

Date of release: 18 March 2020Document identifier: AN12792

Contents1 Introduction ......................................................... 31.1 Linecard ............................................................. 32 Replacements ...................................................... 43 TDA8026 ...............................................................53.1 Feature Comparison ..........................................63.2 Differences TDA8020 - TDA8026 ......................73.2.1 Summary ............................................................73.2.2 Low-power modes ............................................. 73.2.2.1 Standby ..............................................................73.2.2.2 Clock-stop ..........................................................73.2.2.3 Shutdown ...........................................................73.2.3 DC-to-DC converter ...........................................83.3 Differences TDA8023 - TDA8026 ......................93.3.1 Summary ............................................................93.3.2 Low-power modes ............................................. 93.3.2.1 Shutdown Mode .................................................93.3.2.2 Inactive Mode .................................................... 93.3.2.3 Power-down mode .............................................93.3.3 DC-to-DC converter ......................................... 103.4 Application Information .................................... 113.5 Product Support Package ................................114 TDA8034 .............................................................134.1 Feature Comparison ........................................ 134.2 Differences TDA8023 - TDA8034 .................... 154.2.1 Summary ..........................................................154.2.2 Low-power modes ........................................... 154.2.3 PRES ............................................................... 154.2.4 DC-to-DC to LDO ............................................ 164.3 Application Information .................................... 174.4 Product Support Package ................................175 TDA8035 .............................................................195.1 Feature Comparison ........................................ 195.2 Differences TDA8023 - TDA8035 .................... 215.2.1 Summary ..........................................................215.2.2 Low-power modes ........................................... 215.2.2.1 Deep Shutdown Mode .....................................215.2.2.2 Shutdown mode ...............................................215.2.3 PRES ............................................................... 215.2.4 DC-to-DC converter ......................................... 225.3 Differences TDA8024 - TDA8035 .................... 235.4 Application Information .................................... 245.5 Two TDA8035 parallel ..................................... 255.6 Product Support Package ................................256 TDA8037 .............................................................276.1 Feature Comparison ........................................ 276.2 Differences TDA8024 - TDA8037 .................... 296.3 Product Support Package ................................297 PN7412 ............................................................... 307.1 Feature Comparison ........................................ 317.2 Differences TDA8029 - PN7412 ...................... 317.2.1 Summary ..........................................................317.2.2 Low-power modes ........................................... 327.2.2.1 Hard Power Down ........................................... 32

7.2.2.2 Standby ............................................................327.2.3 ALPAR protocol ............................................... 327.3 PN7412 and TDA80XX ....................................347.4 Application Information .................................... 357.5 Product Support Package ................................358 References ......................................................... 379 Legal information ..............................................39

end of life tda80xx migration path to active portfolioan12792 end of life tda80xx migration path to...

Documents