future test solution korea test conference september 1, 2015 james j. ko
TRANSCRIPT
Future Test Solution Korea Test Conference September 1, 2015
James J. Ko
Teradyne Proprietary Information2
Semiconductor Innovation Drivers
• Mobile Computing Revolution• Higher Bandwidth/Complexity/Performance• Lower power• Smaller Footprint• Lower cost• “The Internet of Everything”
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Semiconductor Growth Drivers
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Semiconductor Innovation challenges
• Shrinking Litho• Greater sensitivity to atomic level
defects• Decrease signal/noise• Increasing complexity• Flat Clock Frequency• High MPU data volume
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Test technique Progression and Future
a
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3D-IC Device Market Drivers
Performance
SizeCost3D vs.
Lithography Improvements
Electrical performance• Lower Power• High Speed• Heterogeneous integration
- RF, Logic, Memory, MEMS
Density
Future device testing 3D-ICWhat is Driving this Innovation ?
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2D vs. 3D Manufacturing Flow
Final Test
Stack/PackageDie 1,2,3
Scrap
3D IC 3 Die Stack
Scrap
StackDie 1 and
Die 2
KGSTest
KGD
KGD
2D IC
AssemblePkg Test
FABWafer Test
Scrap Scrap
Scrap
FabDie 3
Wafer Test
FabDie 1
Scrap
Wafer Test
FabDie 2
Wafer Test
Scrap
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ATE SLT Into the 3D-IC Manufacturing Flow
SLT Final Test
Stack/PackageDie 1,2,3
Scrap
3D IC 3 Die Stack
Scrap
StackDie 1 and
Die 2
KGSTest
KGD
KGD
Scrap
FabDie 3
SLT Wafer Test
FabDie 1
Scrap
SLT Wafer Test
FabDie 2
SLT Wafer Test
Scrap
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More Test Challenges
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Test Innovations and Future Solution?