fvtx wedge assembly wbs 1.4.1.3.3, 1.4.1.3.4, 1.4.1.3.5, 1.4.1.3.6, 1.4.1.3.7, 1.4.1.3.8

FVTX Wedge AssemblyWBS 1.4.1.3.3, 1.4.1.3.4, 1.4.1.3.5, 1.4.1.3.6,

1.4.1.3.7, 1.4.1.3.8

David WinterColumbia University

FVTX Wedge Manager

WinterFVTX Review November 2008

2

Talk Outline• Scope

– WBS 1.4.1.3.3 Attach HDI/Backplane– WBS 1.4.1.3.7 Bond Chips– WBS 1.4.1.3.8 Test Chips and HDI– WBS 1.4.1.3.4 Attach Sensor– WBS 1.4.1.3.5 Wire bond Assembly– WBS 1.4.1.3.6 Test Assembly

• Wedge Schedule• Prototyping

– Assembly Procedure – Assembly Fixtures

• QA Testing and Manpower• Summary

HDIDetector

FPHX Chips

Backplane

Thermally conductive adhesive

Thermally and electrically conductive adhesives

~10 cm


3

Scope

• Prepare assembly lab(s)• Develop assembly procedure• Receive backplanes, high-density interconnects (HDIs), sensors

– All components arrive tested and qualified– HDIs populated with passive components

• Assemble received components into wedges• Execute QA and testing procedures• Enter QA/Test results into database• Store assembled units• Deliver assembled wedges to detector assembly facility at BNL


4

Wedge ScheduleHighlights of Dates Important to Assembly• Prototyping and design of components, fixtures: In progress• Procure and Test sensors: 2/11/09 9/8/09• Procure HDI: 1/2/09 3/12/09• Fabrication of backplanes: 20/2/09 6/19/09• Procure Wedge Assembly fixtures: 9/26/08 11/6/08• FNAL testing of production run of FPHX: 4/1/10 6/23/10• Wedge assembly: 6/22/09 3/04/11

– WBS 1.4.1.3.3 Attach HDI to Backplane: 6/22/09 1/15/10– WBS 1.4.1.3.7 Bond FPHX chips: 6/24/10 1/19/11– WBS 1.4.1.3.8 Test chips and HDI: 7/1/10 1/26/11– WBS 1.4.1.3.4 Attach sensor: 7/8/10 2/2/11– WBS 1.4.1.3.5 Wire bond: 7/12/10 2/4/11– WBS 1.4.1.3.6 Testing Assembly: 8/9/10 3/4/11

• Endcap assembly (into cage structure): 9/6/10 6/1/11

Important dependencies• Critical path components: FPHX, HDI prototype• Sensor development and production


5

Prototype Assembly

• Sidet at FNAL has been contracted to do prototype assembly– Provide feedback to develop assembly procedure

and assembly fixtures– Build prototype wedge with mockup parts– Mount sample FPHXs to test boards for testing– Assemble prototype HDI + sample of FPHX chips

for testing– Build full prototype wedge– Gain knowledge of tolerances and adhesives

needed• Ultimate goal is estimate of preproduction

and production costs and schedule


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Prototype Assembly Procedure1. Bond HDI to backplane2. Inspect assembly and test HDI3. Bond FPHX readout chips to HDI4. Wire bond FPHX output pads to HDI5. Inspect assembly and test HDI + FPHXs6. Bond sensor to HDI7. Wire bond sensor output pads to FPHX

input pads8. Inspect and test assembly9. Encapsulate wire bonds

• Additional technical details:– Arclad 8026 adhesive tape for non-conducting bonds– Sensor bonded in two ways:

• Arclad for baseline bonding• Silver epoxy for sensor bias connection

– Assembly includes traveler documents for each module

Mock FPHXs diced for prototype assembly

Dummy Mockup @ Sidet

• Blank Si sensor, chips

• 4 mil Kapton tape for mock HDI


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Getting a feel for what the wedge will look like


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Prototype Assembly Fixtures

• Prototype fixtures have been designed by HYTEC incorporating feedback from Sidet

• Order cut to fabricate by shop near HYTEC

• Two sets costing $9144/total

• Expecting delivery at beginning of Dec


9

Assembly fixtures: Backplane and HDI

• Carbon fiber backplane positioned on fixture• HDI positioned on backplane, bonded• Dowel-pin placement used


10

Assembly Fixtures: FPHX chips

• Chips positioned on positioning fixture, held in place with vacuum

• Transfer fixture placed over chips– Held with vacuum– Positioning vacuum released– Clear acrylic to enable optical inspection throughout process

• Transfer fixture placed onto assembly fixture, chips bonded

Positioning Transfer Placement


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Assembly Fixtures: Sensor

• Sensor placed on positioning fixture, held in place with vacuum

• Transfer fixture placed on sensor– Held on with vacuum– Vacuum released from positioning fixture– Clear acrylic to enable optical inspection throughout process

• Transfer fixture placed onto assembly fixture, bonded

Positioning Transfer Placement


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Proposed QA and Testingof Wedge Units

Procedure includes (but is not limited to):• Power up to verify low voltage and bias channels are operational• Download of configuration to the FPHX chips• Read back of configuration from the FPHX chips• Threshold and noise measurements of the FPHX chips• Injection of test pulses and test patterns. • Readout of strips in response to external source (laser diodes and/or

radioactive sources)• Record results in database

Plan also for testing at various stages of assemblyExact test details will be developed as assembly procedure is understood

Final qualification to be perform after assembly completed and before shippingList of tests will evolve as we gain experience with prototype wedges


13

Proposed Manpower Needs• Assembly performed by Sidet senior technicians and

technicians– As production proceeds, manhours will shift from senior to junior

individuals– Level of expertise chosen (by Sidet) to optimize the tradeoff

between successful assembly and cost of manhours• FVTX collaborators:

– Subsystem managers in charge of assembly and Physicist liaisons– Perform testing (on location) at required times– Graduate students and Postdocs available from several institutions

to perform on-site testing– Subsystem manager stationed on-site to oversee production

• Assembly steps to be identified that can be assigned to FVTX collaborators in order to reduce cost– Most likely steps are the initial lamination (Backplane and HDI)


14

Facilities• Requirements

– Clean room/tent at Class 10k level – Room for 2-3 people to work– Storage for components and completed units (dry enclosures/shelving)

• Identified labs– SIDET– Others

• Nevis: 300 sq ft of self-contained clean room• UNM: Clean room and tent (similar total size)• LANL

• Required equipment– High-precision positioning equipment– Assembly fixtures– Adhesive dispensing system– Testing

• Dark boxes (i.e.. Enclose units for response tests)• Low- and Bias-voltage supplies• Mini-DAQ (e.g. turnkey version of FVTX readout)

• On-project funds are allocated for equipment– Up to $100k budgeted– Wherever possible borrow equipment

Summary

• Wedge assembly comprises WBS items 1.4.1.3.3 –1.4.1.3.8

• Production schedule: 6/22/09 to 3/4/11• Prototyping in progress

– Fixtures designed and in process of procurement

– Sidet developing procedure with mockups


15

Backup slides


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Silicon Detector Center @ FNAL

• Primier facility for building and testing vertex detectors for HEP experiments

• Five large-scale clean rooms for assembly and testing

• Several wirebonding stations

• Wide expertise with Silicon and CCD technology– CDF, D0, CMS, SNAP

among others


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Summary:WBS 1.4.1.3.3/4/5/6 - Cost and Schedule

• Cost (AY$) 1.4.1.3.3 $ 32k1.4.1.3.4 $ 32k1.4.1.3.5 $ 208k1.4.1.3.6 $ 38k

• R&D needed Assy fixtures, adhesives, procedures• Cost Basis vendor and engineering quotes• Cost Contingency 1.4.1.3.3 22%

1.4.1.3.4 22%1.4.1.3.5 26%1.4.1.3.6 22%

• Schedule Start and Complete 6/22/09 - 3/4/11• Schedule Contingency FPHX, HDI is critical path• Risk Low


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Summary:WBS 1.4.1.3.3/4/5/6 – Technical

• Specification Document TDR, Draft Doc

• Prototype status Draft

• Number of wedges 110 small, 330 large

• Spares 8 small, 25 large

• Manpower (on-project) $100k (FY07$), 1.0 FTE

• Institutions Involved Columbia, NMSU, UNM, LANL

• Infrastructure Defined Draft

• QA procedures in place Done

fvtx wedge assembly wbs 1.4.1.3.3, 1.4.1.3.4, 1.4.1.3.5, 1.4.1.3.6, 1.4.1.3.7, 1.4.1.3.8

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