graphene transistors : study for analog and digital applications

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Graphene Based Transistors For Digital And Analog Application - A Simulation Study Vishal Anand Agam Gupta Abhishek Anand 1204059 1204056 1204055 Project Supervisor: Dr. M. W. Akram

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Graphene Based Transistors For Digital And Analog Application - A Simulation Study Vishal Anand Agam Gupta Abhishek Anand 1204059 1204056 1204055

Project Supervisor: Dr. M. W. Akram

Contents:-Motivation

Project Roadmap

Introduction

Basics of Graphene

Structure of GFET

Software Introduction

Software Simulation

Parametric Results

Comparisons

Conclusion

Conclusion

Project Roadmap

7Th Semester

Motivation:-Gordon Moore suggested that the number of transistors get doubled approximately every two years.

The devices have become smaller.

The introduction of new channel material, device performance can be optimized.

Ref:[1].www.intelcorporations.com

Beyond C-MOS

Ref[2]:- Roadmap for 22 nm and beyond H. Iwai * Frontierl Research Center, Tokyo Institute of Technology, 4259-J2-68, Nagatsuta, Midori-ku, Yokohama 226-8502, Japan

Ref[3] :- Carbon Nanotubes and Graphene Nanoribbons: Potentials for Nanoscale Electrical Interconnects .Caterina Soldano , Saikat Talapatra and Swastik Kar

So Whats The Way Out ??? GRAPHENE SHEET FinFETRef:-[4] www.google.com

What Is Graphene ?

Thermodynamically stable graphene sheet was first discovered in 2004 by Giem and Novoselov.

Graphene is a two dimensional sheet of sp2 bonded carbon atoms arranged ina honeycomb crystal structure with two carbon atoms in each unit cell.

Ref:- [5]Fabrication and Characterization of Graphene Field Effect Transistors by Sam Vaziri

GraphiteSingle-layer GrapheneSingle-wall Carbon NanotubRef:- [6] K. S. Novoselov et al., Electric Field Effect in Atomically Thin Carbon Films, Science, 306 (2004) 666.

Types of Graphene structures

Ref:-[13]Characterization of Graphene Field Effect Transistors by Sam Vaziri

GNR Width(nm)The variation of bandgaps of Arm-chair GNRs with width(W)

How to fabricate GNR ?

We can divide the GNR fabrication in two different methods :

Chemical method: It involves assembling the small molecules into GNRs.Many groups have reported the chemical fabrication of GNRs with small molecules.

Physical methods :- By gradual unzipping of one wall of a carbon nanotube to form a nanoribbon

Ref[7]:-Representation of the gradual unzipping of one wall of a carbon nanotube to form a nanoribbon (Kosynkin et al, 2009)

Graphene Electronic Properties :

Semi-metal or zero-gap semiconductor Linear dispersion relation Optoelectronics Massless dirac fermions, v ~ c/300 Intrinsic carrier mobility (suspended graphene in vacuum 2,00,000 cm2 V-1s-1

Carrier mobility of graphene on SiO2 at room-temperature 10,000- 20,000 cm2 V-1s-1 Maximum current density J > 108 A/cm2

Velocity saturation vsat = 5 x 107 cm/s (10 x Si, 2 x GaAs)

Fig:-Dispersion relation of graphene in fist Brillouin zoneRef:-[8] Fabrication and Characterization of Graphene Field Effect Transistors by Sam Vaziri

Mechanical properties

Youngs modulus: ~1.10 TPa (Si ~ 130 GPa)Elastically stretchable by 20%Strongest material knownFlexible

2. Thermal conductivity

5000 W/mK at room temperature Diamond: 2000 W/mK, 10 x higher than Cu, Al

3. Transparent (only 1 atom thin) Transparent flexible conductive electrodes High surface to volume ratio

Most important advantage of Graphene technology is that it is compatible with standard sillicon technology making it easy and cost effective to integrate with the existing CMOS fabrication plants.

Simulation SideOur simulation software=> NanoTCAD ViDES

Our documentation software=>Origin8, Plot Digitizer

OS required=>Linux

Languages=>Python, C.

Equations used=>Solution of Poisson & Schrodinger equations, NEGF(Non-Equilibrium Greens Function )

Modules required=>Pylab, NumPy, SciPy.

Why device simulation???They allow to:

predict the device behaviour

understand the physical mechanisms underlying the device operation

test the impact of device design parameters on the device performance (device optimization)

Ref:-[9] User Manual of NanoTcad Vides.

Mathematics Involved

Newton Raphson Method of iterationJacobian Method

Ref:-[10] Ryaben'kii, Victor S.; Tsynkov, Semyon V. (2006),A Theoretical Introduction to Numerical Analysis,.

Template of 2D Metal Field Effect Transistor.

Ref:-[11] User Manual of NanoTcad Vides.

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Script

Ref:-[12] ViDES Graphical User InterfaceFig. showing graph between Id-Vgs-VdsFig.showing graph between id-T-VdsResults Obtained:-

8Th semester

GNR FET OUTPUT MODEL : -

CaliberationTurn-on characteristics at Vds=0.3VOutput characteristics at Vgs=0.6VBlue:-By nanoTcadVidesRed:- By papers=Performance comparison of graphene nanoribbon FET and MOSFET by Gianluca Fiori and Giuseppe Iannaccone.

Parameters:-W=1.5 nmL=14nmBoth gate sweep

Conclusion:-As Vds is increased , current increases as it is directly proportional to Vds and Vgs.

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Parameters:-W=1.5 nmL=14nmBoth gate sweep

Conclusion:-At particular value of Vds as different Vgs are applied, current increases to a large extent.

Parameters:-Vg1=1.0V=Vg2L=14nm

Conclusion:-

The width(W) of GNR is inversely proportional to its bandgap(eV).

Therefore as W increases bandgap decreases and the device shows metallic characteristics as the device enters into saturation at lower value of Vds.

Parameters:-Vds=1.5VBoth gates sweep.L=14nm

Parameters:-

W=1.5nmVg1=Vg2=1.0V

Conclusion:-

Length(L) is inversely proportional to the drain current(Ids).

Therefore as the length is increased, the drain current starts to decrease.

Parameters:-

W=1.5nmVg1=Vg2=1.0Both gate sweep

Conclusion:-

Capacitance is inversely prop. to oxide thickness.

Ids is directly prop. to the capacitance.

Therefore as the oxide thickness is increased, the capacitance decreases and the over all current decreases.

Parameters:-

W=1.5nmVg1=1.0=Vg2(both gate sweep)L=14nm

Conclusion:-As the doping increases while keeping the channel length same, the increased no. of carriers result in the increase of particle-to-particle collision and hence the mobility decreases and the resultant value of current is less.

Parameters:-

W=1.5nmL=14nmVg1=Vg2=1.0(both gates sweep)

Conclusion:-

Capacitance of the device is directly proportional to the relative di-electric constant.

As the di-electric constant increases, capacitance increases and hence the Ids value increases.

Analog & Digital Parameters Calculation for GNRFETs

Graphs Used :

Id vs Vgs for different VdsId vs Vgs for different GNR width Id vs Vds for different Vgs Id vs Vds for different GNR width

Digital Parameters: Analog Parameters: ION/IOFF ratio Trans-conductance (gm) Subthreshold Swing (SS) Drain Resistance (rd) DIBL (mV/V) Amplification factor ()

Digital Parameters

ION/IOFF ratio: It is the figure of merit for having high performance (more ION) and low leakage power (less IOFF) for the CMOS transistors. Typically more gate control leads to more ION/IOFF ratio.

Subthreshold Swing (SS): Thesubthreshold swingis defined as the gate voltage required to change the drain current by one order of magnitude, 1 decade. In the MOSFET, the subthreshold swingis limited to (kT/q) ln10 or 60 mV/dec at room temperature. SS= Vgs / (log10 Id

DIBL (mV/V): Drain-induced barrier loweringorDIBLis aShort channel effect inMOSFETsreferring originally to a reduction ofthreshold voltageof thetransistor at higher drain voltages.

Analog Parameters

Trans-conductance (gm): It is very often denoted as a conductance,gm, with a subscript, m, formutual. Trans-conductance is defined as follows:

Drain Resistance (rd): It is given by rd = Vds / Id

Amplification factor (): It is given by gm * rd

Digital Parameters Calculation

For different values of Vds

ION/IOFF ratio= (1*10^-6) / (1*10^-10) =1*10^4SS= Vgs / (log10 Id) =60 mV/dec

Fig Id vs Vgs at Vds=0.6V

Id vs Vgs curve at Vds=0.6V Id vs Vgs curve at Vds=0.8VION/IOFF ratio= (6.5*10^-6) / (2*10^-8) =325

SS= Vgs / (log10 Id) = 210 mV/dec

ION/IOFF ratio= (6.5*10^-6) / (2.8*10^-8)=232SS= Vgs / (log10 Id) = 190 mV/dec

For different GNR width

Id vs Vgs curve for W=1.5nm Id vs Vgs curve for W=2nmION/IOFF ratio= (9*10^-6) / (7*10^-7) =13

SS= Vgs / (log10 Id) =175 mV/decION/IOFF ratio= (6.5*10^-6) / (3.8*10^-7) =17SS= Vgs / (log10 Id) = (0.4-0.3) / (3*10^-6- 8*10^-7) = 450

Id vs Vgs curve for DIBL calculationVthDD (by red curve) = 0.18VVthLOW (by black curve) = 0.3VVDD = 1VVDLow = 0.05VDIBL= - (0.18- 0.3) / (1-0.05) = 126 mV/V

Analog Parameters:

Id vs Vds for W=1.5nm Id vs Vds for W=2.0 nmgm = Id / Vgs = (4*10^-6 2.2*10^-6)/(0.4- 0.3) = 18 * 10^-6 -1

rd = Vds / Id = (0.7-0.5) / (4.8*10^-6 3.8*10^-6) = 200 *10^3

= gm * rd = (18 * 10^-6 ) * (200 *10^3) = 3.6gm = Id / Vgs = (3*10^-6 0.8*10^-6)/(0.4- 0.3) = 22 * 10^-6 -1

rd = Vds / Id = (0.3-0.1) / (2.5*10^-6 1.55*10^-6) = 210 *10^3

= gm * rd = (22 * 10^-6 ) * (210 *10^3) = 4.62

Vds (volts)Ion/Ioff ratioSS(mV/dec)0.0510000600.63252100.8232190

DIGITAL PARAMETERSFor different VdsFor different GNR widthGNR Width(nm)Ion/Ioff ratioSS(mV/dec)1.5131752.017450

ANALOG PARAMETERS

For different GNR width

GNR Width(nm)gm (-1) (*10-6)rd () (*103)1.5182003.62.0222104.62

Conclusion :

A model for the graphene FET using NEGF written in GUI Nano TCAD ViDES has been reported. The top-gated graphene FET has been simulated.Typical simulations is then successfully performed for various parameters of the grapheme FET. The modeling results agree with the experimental data. The model is not only able to accurately describe ID-VG, ID-VD characteristics of the graphene FET, but also affects of channel materials, gate materials, size of graphene FET, Doping,Channel width ,Channel length and Dielectric material on the characteristics.

POSITIVES:According to scaling theory, as noted previously, a thin channel region allows short-channel effects to be suppressed and thus makes it feasible to scale MOSFETs to very short gate lengths. The two- dimensional nature of graphene means it offers us the thinnest possible channel, so graphene MOSFETs should be more scalable than their competitors.High velocity is observed in case of GNR FET ,which results in fast switching of the device and it gives better performance compared to silicon based or GaAs device.

CHALLENGES :

CMOS logic requires both n-channel and p-channel FETs with well-controlled threshold voltages, and graphene FETs with all these properties have not yet been reported.

These devices had relatively thick back-gate oxides, so voltage swings of several volts were needed for switching, which is significantly more than the swings of 1 V and less needed to switch Si CMOS device

Nanoribbon graphene, which does have a bandgap and results in transistors that can be switched off, has serious fabrication issues because of the small widths required and the presence of edge disorder

Note : The latest ITRS road- map strongly recommends intensified research into graphene and even contains a research and development schedule for car- bon-based nanoelectronics2. The race is still open and the pros- pects for graphene devices are at least as promising as those for alternative concepts.

References:

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[7] A. Obraztsov, E. Obraztsova, A. Tyurnina, and A. Zolotukhin, Chemical VaporDeposition of thin graphite films of nanometer thickness, Carbon, vol. 45, Sep. 2007, pp.2017-2021.[8] A. Reina, X. Jia, J. Ho, D. Nezich, H. Son, V. Bulovic, M.S. Dresselhaus, and J. Kong,Large area, few-layer graphene films on arbitrary substrates by Chemical VaporDeposition. Nano letters, vol. 9, Jan. 2009, pp. 30-5.[9] J. Coraux, A.T. NDiaye, C. Busse, and T. Michely, Structural Coherency of GrapheneOn Ir (111)., Nano letters, vol. 8, Feb. 2008, pp. 565-70.[10] Kan, E; Xiang, H.; Yang, J. & Hou, J. (2007a). Electronic structures of atomic Ti chains on graphene Nano ribbons: A first-principles study. The Journal of Chemical Physics, Vol.127, No. 16, 164706, ISSN: 0021-9606.[11] K.S. Novoselov, a K. Geim, S.V. Morozov, D. Jiang, Y. Zhang, S.V. Dubonos, I.V.Grigorieva, and a Firsov, Electric field effect in atomically thin carbon films. Science(New York, N.Y.), vol. 306, Oct. 2004, pp. 666-9.[12] Kan, E; Li, Z.; Yang, J. & Hou, J. (2007b). Will zigzag graphene nanoribbon turn to half metal under electric field ? Applied Physics Letters, Vol. 91, No. 24, 243116, ISSN: 0003-6951

[13] G. H. Wannier, The structure of electronic excitation levels in insulating crystals, Phys. Rev., vol. 52, pp. 191197, Aug. 1937.

[13] G. H. Wannier, The structure of electronic excitation levels in insulating crystals, Phys. Rev., vol. 52, pp. 191197, Aug. 1937.[14] W. Kohn, Analytic properties of Bloch waves and Wannier functions, Phys. Rev., vol. 115, pp. 809821, Aug. 1959.[15] J. D. Cloizeaux, Orthogonal orbitals and generalized Wannier functions, Phys. Rev., vol. 129, pp. 554566, Jan. 1963.[16] Youngki Yoon1,a, Gianluca Fiori2,b, Seokmin Hong1, Giuseppe Iannaccone2, and Jing Guo Performance comparision of Graphene Nanoribbon FETs with Schottky contact and doped reservior