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Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems Design Group University of Southampton, UK Nicola Nicolici Electrical and Computer Engineering McMaster University, Canada

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Page 1: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing

Paul Theo Gonciari

Bashir Al-Hashimi

Electronic Systems Design

Group

University of

Southampton, UK

Nicola Nicolici

Electrical and Computer

Engineering

McMaster University,

Canada

Page 2: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Overview

• Low-cost system-on-a-chip test

• Single vs. multiple scan chains compression

• Proposed add-on architecture– TAM add-on architecture

• Core wrapper design• Reduce control and area overhead

– Design flow integration

• Experimental results

• Conclusion

Page 3: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Low-cost SOC test

• Problems– High volume of test data– Increased chip/ATE frequency ratio– Increased chip/ATE pin number ratio– Increased scan-power dissipation

High ATE costs and yield loss

Page 4: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Low-cost SOC test

• Solutions– Test data reduction– Reuse existing ATE technology– Exploit chip/ATE frequency ratio– Reduce pin count testing (RPCT)– Scan chain partitioning

Page 5: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

TAM add-on architecture

Core Core

SOC

Low-cost solution for core based SOC test

TAM add-on

Page 6: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Overview

• Low-cost system-on-a-chip test

Single vs. multiple scan chains compression

• Proposed add-on architecture– TAM add-on architecture

• Core wrapper design• Reduce control and area overhead

– Design flow integration

• Experimental results

• Conclusion

Page 7: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Single scan chain TDC

si

so

Core

sync

AT

E H

ead

decoder

5 FF

SISR

counter

SOC

Page 8: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Single scan chain TDC (cont)

• Exploit test set regularities (e.g., runs of 0s)

• Based on coding schemes

• Exploit frequency ratio

• Synchronization overhead – temporal deserialization [Gonciari, ETW02]

– External clock synchronization– FIFO like structures

• High scan power due to the long scan chain

Page 9: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Multiple scan chain TDC

SIS

R

scan chain

scan chainscan chain

Core

WSC

XORNetwork

Core

scan chain

data in

ctrl

Page 10: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Multiple scan chain TDC (cont)• Exploit care bits sparseness

• Uses XOR based spreading networks

• Temporal pattern lockout– Extra control line– Doubles the volume of test data– Influences test application time

• Structural Pattern lockout – can influence fault coverage

• High scan power due to driving of all scan chains

Extend single scan chain TDC to multiple scan chains

Page 11: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Extend single scan chain TDC …

Use one decoder and shift register [Chandra, DATE02]

de

co

de

r

sh

ift reg

iste

r

scan chain

scan chain

scan chainCore

Page 12: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Use one decoder and shift register

• Loosened the ATE timing constraint – Exploitation of frequency ratio

• Reduce peek scan-power – Shift register buffering

• Synchronization overhead

• Decrease in compression ratio

– Unbalanced scan chains

– Test set rotation

Page 13: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Extend single scan chain TDC … (cont)Use one decoder per scan chain

[Chandra, TCAD01] [Gonciari, ETW02]

ctrl

ctrl

ctrl

dis

tr

dec1

dec2

dec3

scan chain

scan chain

scan chain

Core

Page 14: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Use one decoder per scan chain• Loosened the ATE timing constraint

– Exploitation of frequency ratio

• Reduced scan-power – Scan chain partitioning

• Good compression ratio– No test set rotation

• Reduced synchronization overhead

Increased area and control overhead

Large number of scan chains

Unbalanced scan chains

Page 15: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Low-cost SOC test• Solutions

– Test data reduction– Reuse existing ATE technology– Exploit chip/ATE frequency ratio– Reduce pin count testing (RPCT)– Scan chain partitioning

Use one decoder per scan chainIncreased area and control overhead

Large number of scan chains

Unbalanced scan chains

Page 16: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Overview

• Low-cost system-on-a-chip test

• Single vs. multiple scan chains compression

Proposed add-on architecture– TAM add-on architecture

• Core wrapper design• Reduce control and area overhead

– Design flow integration

• Experimental results

• Conclusion

Page 17: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

TAM add-on architecture

Core Core

SOC

Low-cost solution for core based SOC test

TAM add-on

Page 18: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Core wrapper design

WSC2

WSC3

WSC1

WSC4Core

tb2tb3

tb4

tb1

Why core wrapper design ?

• WSC partitioning [Gonciari, VTS02]– Useless memory reduction– Easy control

Page 19: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Reducing control and area overhead

ctrl

ctrl

ctrl

ctrl

dis

tr

dec1

dec2

dec3

WSC

WSC

WSC

Coredec4 WSC

Instead of

Page 20: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Reducing control and area overhead …

WSC

WSC

WSC

WSC

Core

• WSC partitioning– 2 partitions– 1 control unit per partition– 1 decoder per partition

Exploit WSC partitioning for area and control reduction

Page 21: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Reducing control and area overhead …

WSCWSC

WSCWSC

• Control– Length of max scan chain– No of scan chains– Diff of partitions length

Easy control per partition

diff

length

no

WS

Cs

Page 22: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

WSC

WSCdec1

Extended decoder (xDec) – input

decscan clk

data

length no WSCs

diff

Page 23: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Extended decoder (xDec) – output

WSC

WSC

dec

no WSCs

mu

x SISR

Page 24: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Extended distribution architecture

distr

xDec1m

ux SISR

Core

WSC

WSC

WSC

WSCxDec2

mu

x SISR

mu

x

xDistr

Page 25: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Extended distribution architecture …

Core

WSC

WSC

WSC

WSC

Core

WSC

WSC

WSC

WSC

Unequal partition size for some cores !!

Page 26: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Extended distribution architecture

xDec1 mu

x

xDec2

mu

x

add-on-xDistrm

ux

Core

WSC

WSC

WSC

WSC

WSC

WSC

WSC

WSC

Core

Page 27: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Multiple TAM SOC test

Core Core

2xSIS

R2xS

ISR

add

-on

add

-on Core Core

SOC

Page 28: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Design flow integration

Constr ?

TAM DesignTAM width

VTD constraints

Simulate

Extend CW

Change CW

NO

YES

1:k add-on-xDistr

Page 29: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Overview

• Low-cost system-on-a-chip test– Test data reduction– Synchronization overhead

• Single vs. multiple scan chains compression

• Proposed add-on architecture– TAM add-on architecture

• Core wrapper design• Reduce control and area overhead

– Design flow integration

Experimental results

• Conclusion

Page 30: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Minimum VTD vs. equal partitions

0

20000

40000

60000

80000

100000

120000

s13207 s15850 s35932 s38584

Vo

lum

e o

f te

st d

ata

Minimum VTD Equal partitions

Test bus = 16 Frequency ratio 2

Page 31: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

0

20000

40000

60000

80000

100000

s13207 s35932 s38417 s38584

Vo

lum

e o

f te

st d

ata

Minimum VTD Equal partitions

Minimum VTD vs. equal partitions

Test bus = 16 Frequency ratio 4

Page 32: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

add-on-xDistr vs. SSC

0

5000

10000

15000

20000

25000

4 8 16 24 32

Vo

lum

e o

f te

st d

ata

add-on-xDistr Single scan chain

Core s35932 Frequency ratio 2

Page 33: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

add-on-xDistr vs. SSC

Core s35932 Frequency ratio 4

13000

14000

15000

16000

17000

4 8 16 24 32

Vo

lum

e o

f te

st d

ata

add-on-xDistr Single scan chain

Page 34: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

add-on-xDistr vs. SSCSystem 1 Frequency ratio 2

Test bus 24 Reduction 19.29%

0

40000

80000

120000

160000

Vo

lum

e o

f te

st d

ata

Single scan chain add-on-xDistr

Page 35: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

add-on-xDistr vs. SSCSystem 2 Frequency ratio 2

Test bus 24 Reduction 26.88%

0

40000

80000

120000

160000

Vo

lum

e o

f te

st d

ata

Single scan chain add-on-xDistr

Page 36: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Conclusion

• Low-cost solution for core based SOC test

• TAM add-on architecture

• Design flow integration

• Exploited core wrapper design features– Reduced control overhead– Reduced area overhead

• Reduced scan power through partitioning

• Small area overhead (3-4%) for System1,2

Page 37: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Test data reduction

dec

DIB

SO

SOCATE

CUTHead

• Aims– Volume of test data– Area overhead– Test application time

Page 38: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Generic on-chip decoder

CI

PG

ATE

scan clk

data in

ate clkData out

sync

• Serial decoder– PG and CI can not work independently– Implicit communication between PG and CI

• Parallel decoder– PG and CI can work independently– Explicit communication between PG and CI

Page 39: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Synchronization overhead

• Extensions to the DIB– Multiple ATE channels– Deserialization units– Latency FIFOs– Clock synchronization

Page 40: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Synchronization overhead (cont)

dec

DIB

SOCATE

CUTS

O

• New ATEs

Source synchronous buses

Require programming

Page 41: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Synchronization overhead (cont)

dec

DIB

SOCATE

CUTSO

Page 42: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Synchronization overhead (cont)

• Low-cost test through ATE reuse– Small area overhead increase

– Solution for entire chip test– Test application time reduction

dec

DIB

SOCATE

CUTSO

Page 43: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

Synchronization overhead

• Old ATEs– Latency FIFO – Clock synchronization

0 2 3 4 5 6 71

PG

CI CISTOP CI

ATE clk

Chip clk

PG PG

Page 44: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

On-chip SO solution 0 2 3 4 5 6 71

PG

CI CISTOP CI

ATE clk

Chip clk

PG PG

Page 45: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

On-chip SO solution (cont)

Increased VTD and TAT

Exploit DUMMY bits and reduce VTD and TAT

0 2 3 4 5 6 71

PG

CI CIDUMMY CI

ATE clk

Chip clk

PG PG

Page 46: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

On-chip SO solution (cont)

• Distribution unit

– Any number of cores

– Self synchronous architecture

PG2

0 2 3 4 5 6 71

PG1

CI1 CI1CI2 CI1

ATE clk

Chip clk

PG1 PG1

dis

tr

dec1

dec2

Page 47: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

XOR-network %tpl

0

10

20

30

40

50

60

70

80

90

0 5 10 15 20 25

Care bit density

% t

em

po

ral p

atte

rn lo

cko

uts

W=8 W=16 W=24 W=32

Page 48: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

S38417: VTD / TAT for w = 32

0

100000

200000

300000

400000

500000

600000

700000

800000

900000

1000000

0 5 10 15 20 25Care bit density

VT

D/T

AT

add-on-xDistr(32,6) XOR-network(32) VTD XOR-network(32) TAT

Page 49: Integrated Test Data Compression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing Paul Theo Gonciari Bashir Al-Hashimi Electronic Systems

S35932: VTD / TAT for w = 32

0

20000

40000

60000

80000

100000

120000

0 20 40 60 80Care bit density

VT

D/T

AT

add-on-xDistr(32,6) XOR-network(32) VTD XOR-network(32) TAT