jianling weng - hardware design and development for wearables

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Hardware Design and Development for Wearable Technologies Developing World’s First Smart Clasp - LINK™

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Page 1: Jianling Weng - Hardware design and development for wearables

Hardware Design and Development for Wearable TechnologiesDeveloping World’s First Smart Clasp - LINK™

Page 2: Jianling Weng - Hardware design and development for wearables

Introduction Who are we?

Wearetec Inc is a Canadian startup company based in Toronto Ontario

Page 3: Jianling Weng - Hardware design and development for wearables

Introduction What are we developing?

LINK – world’s first smart clasp

Page 4: Jianling Weng - Hardware design and development for wearables

Topics Mechanical Design of LINK LINK Design Strategy Hardware Design Considerations Software Design Considerations

Page 5: Jianling Weng - Hardware design and development for wearables

Mechanical Design of LINK Bi-folding Clasp Pushbutton Locking Mechanism Worn Interior of the Wrist Curved Surface for Comfort Stainless Steel Casing/ Curved Sapphire

Glass for Toughness

Page 6: Jianling Weng - Hardware design and development for wearables

Mechanical Design of LINK PMOLED full color display Capacitive, Multi-touch touch screen RF connectivities Heptic Feedback Motor Battery aiming 3~400mAh

Page 7: Jianling Weng - Hardware design and development for wearables

Mechanical Design of LINK Typical smart watches are designed

from the electronics out LINK need to be highly miniaturized

Page 8: Jianling Weng - Hardware design and development for wearables

Hardware Design Strategy Stage 1: Hardware concept proofing

prototype Stage 2: Device concept proofing

prototype Stage 3: Production ready prototype

Page 9: Jianling Weng - Hardware design and development for wearables

Stage 1 of LINK Design 4-layer, standard density PCBA QFN package ICs(MCU, BLE SoC, etc) Fine Pitch/Low Profile Connectors Debugging/Programming Interface

Page 10: Jianling Weng - Hardware design and development for wearables

Stage 2 of LINK Design 6-layer Very High Density PCB Provision of Bendable/Partial Flexible

PCB WLCSP IC and 0201 Discrete Packaging Fine Pitch/Low Profile Connector FPC Cables

Page 11: Jianling Weng - Hardware design and development for wearables

Stage 3 of LINK Design Bendable Very High Density PCB Integrated FPC cables for Display and

Touch Screen Customized Battery Pack

Page 12: Jianling Weng - Hardware design and development for wearables

Hardware Design Considerations Graphic User Interface System MCU and Peripherals Battery and Power Management Sensors Bluetooth/NFC Connectivity EMC, Usability and Reliability

Page 13: Jianling Weng - Hardware design and development for wearables

Display Interfaces MIPI Intel 8080 SPI

Page 14: Jianling Weng - Hardware design and development for wearables

Touch Screen Interface I2C Protocol Multi Touch and Gesture Recognition

Page 15: Jianling Weng - Hardware design and development for wearables

Battery and Power Management 300mAh Li-ion Battery Power Saving Modes BLE SoC + Main MCU Duo Processor

Structure

Page 16: Jianling Weng - Hardware design and development for wearables

Bluetooth Connectivity Bluetooth Low Power Notification from Smartphone App Quick Response to Smartphone App Distance Monitoring/Alarm Audio Streaming Other Data Exchanging

Page 17: Jianling Weng - Hardware design and development for wearables

NFC Connectivity Mobile Payment Solution Secure Access Control Contactless Control

Page 18: Jianling Weng - Hardware design and development for wearables

Sensors/Peripherals Ambient Light Sensor 6-DOF Motion Sensor

3-axis Accelerometer and 3-axis Gyroscope Optional 3-axis Magnetometer

Audio interface Optional Image Sensor Optional Health Monitor

Body Temperature, Pulse Rate, Blood Pressure and Oxygen Saturation

Page 19: Jianling Weng - Hardware design and development for wearables

Related Software Design in LINK Smart Watch Fitness Band Smart Phone Accessary

Page 20: Jianling Weng - Hardware design and development for wearables

Software Design Challenges and Solutions Multicore Processing (Main MCU + BLE

SOC) GUI (PMOLED + Multi-Touch Screen) RTOS+API Low Power Software Design Memory Size Constraints (Flash and

RAM) Multi Platform API Support (Android, IOS

and Windows)

Page 21: Jianling Weng - Hardware design and development for wearables

LINK Specific Challenges Small Screen Size Graphics Small Screen Size Gesture Recognition Low Power RTOS and APIs with Limited Memory

Resources Firmware Over-the-Air Upgradable

Page 22: Jianling Weng - Hardware design and development for wearables

LINK Software Design Considerations Main Processor

FreeRTOS emWin Middleware LINK APIs

BLE SoC BLE stack LINK Battery and Power Management BLE LINK APIs

Page 23: Jianling Weng - Hardware design and development for wearables

APP Development Wearatec Inc. is seeking partnership

with software developers or software developing companies

Page 24: Jianling Weng - Hardware design and development for wearables

Thank You! Questions?