jrs products ic test/burn-in/programming socket

Contact:Jerry Yan +8615361023836 Email:[email protected] http://www.jrs-icsocket.com

SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER

SPECIFICATION

Insulation Resistance:

Dielectric Withstanding Voltage:

Contact Resistance:

Operating Temperature Range:

Mating Cycles:

MATERIALS & FINISH

Housing:

Contacts:

Plating:

FEATURES

0.8mm pitch,78 pin & 96 pin

Identical PCB footprint to the package;

Without a lid, easy probing, scoping and troubleshooting;

Short signal path, low inductance and low insertion loss

JRS Electronics Series overview DDR

Note: There are different sizes location

frame to accommodate various sizes IC

package. For further information please

contact JRS Electronics

1,000MΩ min. @ 100V DC

100V AC for 1 minute

20mΩ max. @ 10mA/20mV max.

-50⁰C~+150⁰C

10,000 insertions min.

LCP

Beryllium Copper (BeCu)

Gold over Nickel



IC Package Size

78pin 96pin

Outline Socket Dimensions

78pin 96pin



Contact

SPECIFICATION



Contact Resistance:


Mating Cycles:

MATERIALS & FINISH

Housing:

Contacts:

Plating:

JRS Electronics Series overview HFBGA

Contact IC with or without solder ball;

2-point contacts per solder ball

Bending technique makes the contact more flexible;

Short signal path achieves high frequency transmission

THE MECHANICAL LIFE

SPAN OF OUR BGA

SOCKETS IS OVER

100,000 INSERTIONS!

1,000MΩ min. @ 100V DC



-50⁰C~+150⁰C


PEI


Gold over Nickel



Typical IC Package Size

IC with solder ball IC without solder ball


Clamshell Open Top

0.5 MM PITCH CL=Clamshell OT=Open Top

0.65x0.8MM PITCH

Tables only show a selection of sockets available. For customized or other socket types, please contact JRS

Electronics.



Contact

SPECIFICATION:



Contact Resistance:


Mating Cycles: .

MATERIALS & FINISH:

Housing:

Contacts:

Plating:

Contact IC with or without solder ball

‘S’-shape contact spring, 2-point

contacts per solder ball, highly

reliable

JRS Electronics Series overview BGA

THE MECHANICAL LIFE

SPAN OF OUR BGA

SOCKETS IS OVER

100,000 INSERTIONS!

PEI


Gold over Nickel

1,000MΩ min. @ 100V DC



-50⁰C~+150⁰C




Typical IC Package Size

IC with solder ball IC without solder ball


Clamshell Open Top




0.5 MM PITCH

0.65 MM PITCH

0.8 MM PITCH

Tables only show a selection of sockets available. For customized or other socket types, please contact JRS

Electronics.



IC Package Size

Even row, even number of pins Odd row, odd number of pins

SPECIFICATION



Contact Resistance:


Mating Cycles:

MATERIALS & FINISH

Housing:

Contacts:

Plating:

FEATURES

0.4MM & 0.5MM PITCH

Clamshell & open top types

Odd row, odd number of pins & Even row, even number of pins

Package outline size in the range 3~12 sqmm (excluding 11 sqmm)

Package thickness in the range of 0.5~1.2 mm (over 1.2mm can be

customized)

JRS Electronics Series overview QFN

1,000MΩ min. @ 100V DC



-40⁰C~+150⁰C


PEI


Gold over Nickel




Clamshell Open Top


0.5 MM PITCH



Contact

Clamshell Open Top

SPECIFICATION



Contact Resistance:


Mating Cycles:

MATERIALS & FINISH

Housing:

Contacts:

Plating:

JRS Electronics Series overview QFP

PEI


Gold over Nickel

1,000MΩ min. @ 500V DC



-65⁰C~+150⁰C




IC Package Size


Clamshell Open Top

CL=Clamshell OT=Open Top



Contact

SPECIFICATION



Contact Resistance:


Mating Cycles:

MATERIALS & FINISH

Housing:

Contacts:

Plating:

Contact terminal radian greater

than 270⁰, strong clamp force;

2-Point pinch contact design to

enhance electrical contact

Note: There are 2 sizes of TSOP48. They

accommodate the same pin counts IC

and the only difference is the width of

the IC body.

JRS Electronics Series overview TSOP48

1,000MΩ min. @ 500V DC



-65⁰C~+150⁰C


PEI


Gold over Nickel



IC Package Size




Contact

SPECIFICATION



Contact Resistance:


Mating Cycles:

MATERIALS & FINISH

Housing:

Contacts:

Plating:

JRS Electronics Series overview SOP

PEI


Gold over Nickel

1,000MΩ min. @ 500V DC


700V AC for 1 minute (for 1.27 pitch)


-65⁰C~+150⁰C




IC Package Size


Table only shows the maximum IC pin count. Please contact JRS Electronics for further available pin counts or

custom sockets.



IC Package Size

SPECIFICATION



Contact Resistance:


Mating Cycles:

MATERIALS & FINISH

Housing:

Contacts:

Plating:

JRS Electronics Series overview SOP Clip

1,000MΩ min. @ 500V DC



-40⁰C~+150⁰C


PEI

Brass, SELECTIVE Au-Au FLASH OVER NI PLATING

Gold over Nickel



Clip Outline Dimensions

jrs products ic test/burn-in/programming socket

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