l foundry gmb h rev1.7.1

© 2010 LFoundry GmbH. All rights reserved.

LFoundry

… the customer-specific manufacturer of choice for analog, mixed-signal and

specialized technologies

© 2010 LFoundry GmbH. All rights reserved.2

Outline

Company & Business Update

Foundry Service

Manufacturing

Technology


LFoundry Facts

Business Model

Providing dedicated foundry capacity and

services for

Specialized analog, mixed signal designs

Customer specific technologies

Joint technology developments

Offering worldwide customers advanced

process technologies and a robust portfolio

of IP, innovative technology extensions and

certifications.

LFoundry “Sicherheit” for

Reliable supply and delivery

Superior-price performance

Protection of Customer Design and IP

Stay leading-edge in analog mixed signal and customized technologies

Sustainable, dedicated technology and foundry partner


LFoundry Profile… the customer-specific manufacturer of choice

… ensuring “Sicherheit”

reliability, security and

protection for customers,

their designs and their IP

… offering worldwide customers advanced process technologies and a robust portfolio of

IP, innovative technology extensions and certifications

… featuring unparalleled flexibility,

speed and

reliability to meet

aggressive on-time

delivery demands


LFoundry Organisation

CEOM. Lehnert

CFODr. H.- M.

Dudenhausen

CTOG. Spitzlsperger

President FranceJean-Pierre Delesse

Operations

Purchasing I.T.

V.P. QualityGerhard Weindl

Finance

V.P. Sales&MarketingMichael Hösl

H.R.

LFoundryRoussetS.A.S.

LandshutSilicon

Foundry GmbH

T.D. / R&D

COOG. Ernst


LFoundry Worldwide Organization

HeadquarterFabs

Sales

UK 2

Germany 4

France 2

USA 4

Korea/Taiwan 1

Israel 1

Japan 1

SalesForce

Fabs

Landshut 330 employees

Rousset 750 employees


LFoundry Corporate Headquarter

Landshut Silicon Foundry

wafer size: 200 mm

capacity 8“: up to 12k wspm

cleanroom area (CR): 5000 m²

330 employees, >18y experience

Technology

0.35µm, 0.15µm PDK, 0.11µm i.D.

0.35µm … 0.13µm customer specific

MEMS, Opto processes

7

Landshut, Germany

LFoundry Rousset

wafer size: 200 mm

capacity 8“: >20k wspm

cleanroom area: 11000 m²

750 employees, >10y experience

Technology

0.15µm/0.11µm PDK i.D.

0.18/ 0.15/ 0.13/ 0.11µm customer specific

Path to 0.08µm (tools available)

Rousset, France

LFoundry at a Glance


LFoundry Milestones

1H 20111H 2009 1H 20102H 2009 2H 20102H 2008LFoundry

Foundation

Development of open access based PDK

Development cooperation with IHP Microelectronics

150nm CMOS PDKrelease and MPW start

Open UK office

Join IPL Alliance to develop iPDK

SST Flash in 150nm

Start manufacturing of Automotive design for MAS Oy

Acquisition of Atmel’s Fab in Rousset (F)

Ramp RF MEMS for EPCOS

Collaboration with TESAT Spacecom

Development start of 110nm


LIFE (LFoundry integrated Foundry Ecosystem)

LFoundry wants to interact with the customer


LFoundry Revenue Share

by Region

LFoundry Customers Target Market [%]

European market dominated by

Germany and France

Overall healthy worldwide share

Our Customers serve the global market

Worldwide Market [%]

Europe

USA

Asia

Germany 32,2%

France 12,0%

United Kingdom 3,4%

Israel 3,0%

Europe 4,1%

USA 30,0%

Asia 15,2%


LFoundry Revenue by Market

LFoundry markets reflects worldwide analog/mixed signal market

Security

Utilisation of

security and IP

protection strength

Medical

New CMOS

applications

CMOS Opto

Automotive

Automotive Certified

High Voltage LDMOS

Communication

RF applications

with high integration

Customer specific

processes

Consumer

Customer specific processes SoC, Technology Extensions

Various fabless companies

Industry/Energy

CMOS Opto

Power management

Aerospace

Radiation hard

150nm

Communication 26,6%

Consumer 51,6%

Industry/ Energy 1,7%

Automotive 2,1%

Medical 6,3%

Security 11,4%

Aerospace 0,3%


Outline


Foundry Service

Manufacturing

Technology


Prototyping Services

Full Mask Set

Full flexibility in timing and volume

Reasonable NRE cost

MLM (Multi Layer Mask)

Full flexibility in timing for small

volume production

Significantly reduced NRE costs

MPW (Multi Project Wafer)

Ideal solution for prototyping and low

volume production

Lowest NRE costs

Monthly MPW runs for every PDK technology

Flexible Manufacturing options with superior price performance


LFoundry Customer's Timing

Advantage


LFoundry EDA


Outline


Foundry Service

Manufacturing

Technology


Manufacturing Facts

16000 m² class 1 clean-room

32000 wafer starts per month

Automatic transportation system

Automatic Recipe Download

EDP Lot Dispatch System

98% yield performance

fast cycle time: 1.2dpm


Key Performance Data

Benchmark line speed as key

enabler for time to market

Excellent process yield performanceas key enabler for cost efficiency


Quality Assurance

Certification:

QMS & Automotive QS9000 (TS 16949)

Environment (ISO 14001)

Smart Card Security ISO15408

Standard:

JEDEC JP001.01 Level 1 wafer level reliability performed by LFoundry

(<10ppm fails; 10 years; max. temp. 125°C) Level 2 device level reliability performed by our customers

AEC Automotive Electronics Council Q100 Ref-FGrade 0 -40°C to 150°C under preparationGrade 1 -40°C to 125°C preparedGrade 2 -40°C to 105°C

Initially LFoundry developed the LF150 (0.15µm) technology, which is again based on the long time experienced similar RENESAS process (Secure MCU / Automotive).


Outline


Foundry Service

Manufacturing

Technology


Foundry Technology Roadmap

Strong development force for innovative technology applications


Voltage domains

Core MOS

Common voltage1.8V low leak

HVMOS – LDMOS

1.8V high speed3.3V

5V

8V

40V

60V

80V

>100V

•Home Entertainment

•Medical appliances

•Power devices

•Automotive Electronics

•Energy Harvesting

•Consumer Electronics

•Mobile Systems

•Aerospace

•Industrial

characterised

at 1.2V

ultra low leak

digital lib

(in discussion)

1.2V core

2.5V

3.3V

5V

1.2V low Vt

1.2V high Vt


LF150 Modularisation


0.15µm Foundry Technology

Poly-, Metal- and Diffusion Resistors

MIM Capacitors

Diodes

NPN-Bipolartransistor (within the standard CMOS

Process), PNP with C on ground

RF-Devices like Transistors, Resistors,

Capacitors, Inductors and Varactors

GPIO library 3.3V, 1.8V and 5V

Full Analog PDK for Cadence Virtuoso 6.1.x

Full Analog PDK for Tanner including >20 digital

standard cells

Digital standard cells library (>400 cells for low

power and high performance applications)

prepared for Cadence, Mentor and Synopsys

Gate-Density 110 kGates/mm²

Variety of memory options: SRAM, OTP, NVM

Constantly incrasing IP Portfolio: µController,

ADC, LDO, POR, OTA, Bandgap, Charge Pump,

Interface buses, …

… integrated into the user-friendly, all-in-one Process Design Kit (PDK)

LF150 is a 0.15µm modular CMOS process:

- 19 Mask for standard Process

- shallow trench isolation (STI)

- deep N-Well (NISO)

- 1-2 Poly layers

- gate oxide thickn.[nm]: 2.8/6.8/16.0

- cobalt salicidation

- up to 6 level of Al (330nm, 800nm)

- extra Thick Top Metal (2-6µm Al)

intermetal dielectric: HDP

Core voltage: 1.8V

Design rules:

- Physical Gate length: 150nm

- Contact/Via size: 180/240nm

- Metal pitch: 0.48µm

MOS Transistors:

- 1.8V low leakage NMOS/PMOS

- 1.8V high speed NMOS/PMOS

- 3.3V NMOS/PMOS

- 5V NMOS/PMOS


0.15µm Foundry Technology


IP Portfolio

LFoundry and our worldwide partners offer a top class Intellectual Property (IP) Portfolio to

support the design needs of our customers. With our long time experience we offer on the one

side proven IP to accelerate customers time-to-market, on the other side LFoundry support by

creating customised IP in time with outstanding quality.

Memory IPSRAM (Mobile Semi)

EEPROM (LFoundry)

Flash (SST)

OTP (NSCore)

MTP (NSCore)

Cell Librarylow leak standard library

high speed standard library

elements such as Buffer,

Latches, Flip-Flop, Physical

Delay, Tristate, ...

Mixed-signal IPsADC, DAC, LDO, PLL, Bandgap,

Bias Generator, Charge Pump,

Oscillator, OP Amps, OTA, POR, ... Cores8051 until high end

8b to 32b also as RISC

low leak to high performance

well known partners as

COrtus, Ensilica, Evatronix,

Innopower, ...

InterfacesGPIO library, Serial,

SPI Interface bus, I2C,

USB, ...

Detectors / Securitytemperature sensor, AES/DES, ...

... whatever you need for your SOC,

we have it


aSi

LFoundry Technology Extensions -CMOS-based MEMS Processing

Tapered processing

5µm

Thick metalThick layer processing (AlCu up to 7µm, resist up to10µm)

Special Polymer processing (IVD, PBO, …)

Stress engineering (for various materials: nitrides, …)

Strongly tapered processing / etching profiles

Sacrificial layer process (oxide, a-silicon)

Backside processing (PVD, PECVD, Implant, …)


LFoundry Technology Extensions -Opto CMOS Processing

High sensitivity photosensors, integrated in CMOS

light exposure from backside, enabled

through LFoundry backside

& thin wafer processing

CMOS based Optofilter

customized wavelenth filter thru modified

structured layers integrated in CMOS

for i.e. multi spectral cameras,

ambient light sensors, …

CMOS Imager for special applications

MBPD (modified buried photo-diode)

for l = 450-1100nm

Focus on spezialized applications,

i.e. large image sensors with

stitching requirementsStandard, high volume

Light sensors


Conclusion

LFoundry is

the reliable, fast and flexible customer-specific manufacturer of choice,

providing leading-edge specialized technology capacity,

advanced analog and mixed-signal process technologies and

“Sicherheit” reliability, security and protection for customers, their designs and IP.

l foundry gmb h rev1.7.1

Documents

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