lmf4120 boosterpack development.pdf

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EK-LM4F120XL-DG-01 Copyright © 2012 Texas Instruments SPMU288 BoosterPack Development Guide Build your own BoosterPack and take advantage of Texas Instruments’ web site to help promote it! From sharing a new idea or project, to designing, manufacturing, and selling your own BoosterPack kit, TI offers a variety of avenues for you to reach potential customers with your solutions. www.ti.com/stellaris-launchpad Stellaris ® LM4F120 LaunchPad Evaluation Kit

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Page 1: LMF4120 Boosterpack development.pdf

EK-LM4F120XL-DG-01 Copyright © 2012 Texas InstrumentsSPMU288

BoosterPack Development Guide

Build your own BoosterPack and take advantage of Texas Instruments’ web site to help promote it!

From sharing a new idea or project, to designing, manufacturing, and selling your own BoosterPack kit, TI offers a variety of avenues for you to reach potential customers with your solutions.

www.ti.com/stellaris-launchpad

Stellaris® LM4F120 LaunchPad Evaluation Kit

Page 2: LMF4120 Boosterpack development.pdf

Stellaris LaunchPad BoosterPack Design Guide

August 24, 2012 2

CopyrightCopyright © 2012 Texas Instruments, Inc. All rights reserved. Stellaris and StellarisWare are registered trademarks of Texas Instruments. ARM and Thumb are registered trademarks, and Cortex is a trademark of ARM Limited. Other names and brands may be claimed as the property of others.

Texas Instruments108 Wild Basin, Suite 350Austin, TX 78746http://www.ti.com/stellaris

Page 3: LMF4120 Boosterpack development.pdf

Stellaris LaunchPad BoosterPack Development Guide

August 24, 2012 3

Table of ContentsChapter 1: Stellaris® LaunchPad and BoosterPack Expansion Concept and Overview........................... 6BoosterPack Functional Interface....................................................................................................................... 7BoosterPack XL Functional Interface ................................................................................................................. 9LaunchPad Power Interface ............................................................................................................................. 10Special Consideration for Shared Pins ............................................................................................................. 11Stellaris LaunchPad Dimensions and Mating ................................................................................................... 11BoosterPack Design Guidelines ....................................................................................................................... 12

Appendix A: Schematics................................................................................................................................ 13Appendix B: References ................................................................................................................................ 17

Page 4: LMF4120 Boosterpack development.pdf

Stellaris LaunchPad BoosterPack Development Guide

August 24, 2012 4

List of FiguresFigure 1-1. Stellaris® LM4F120 LaunchPad Evaluation Board ......................................................................... 7

Page 5: LMF4120 Boosterpack development.pdf

Stellaris LaunchPad BoosterPack Development Guide

August 24, 2012 5

List of TablesTable 1-1. LaunchPad BoosterPack Compatibility Summary........................................................................... 6Table 1-2. J1Connector .................................................................................................................................... 8Table 1-3. J2 Connector ................................................................................................................................... 8Table 1-4. J3 Connector ................................................................................................................................... 9Table 1-5. J4 Connector ................................................................................................................................... 9Table 1-6. Stellaris® LaunchPad Jumper List ................................................................................................ 11

Page 6: LMF4120 Boosterpack development.pdf

August 24, 2012 6

Stellaris® LaunchPad and BoosterPack Expansion Concept and Overview

The Texas Instruments’ Stellaris® LM4F120 LaunchPad concept is an extremely low-cost, expandable evaluation system for TI microcontrollers. This concept began with the tremendously successful MSP430™ LaunchPad which introduced a large number of engineers to the TI MSP430 family of microcontrollers. The TI Stellaris microcontroller family is expanding on that success by introducing the Stellaris® LM4F120 LaunchPad featuring the Stellaris ARM® Cortex™-M4F LM4F120H5QRFIG microcontroller.

A Stellaris LaunchPad consists of a target microcontroller, an in-circuit debug interface (ICDI) such as JTAG, a regulated power supply, a minimal microcontroller support circuit, a user interface, and a set of expansion headers. The expansion headers are referred to as the BoosterPack interface. A BoosterPack is an expansion card designed for this interface. This interface provides a mechanism for developers to easily extend the Stellaris LaunchPad with application- and user-specific functions.

The Stellaris LaunchPad provides a BoosterPack interface that is compatible with the MSP430 LaunchPad. In addition, the Stellaris LaunchPad provides access to additional Stellaris functionality through an extended BoosterPack interface called the BoosterPack XL Interface. BoosterPack interfaces with highly similar functionality for expansion will be available for the Stellaris LaunchPad, in addition to microcontroller-family-specific functionality available on a BoosterPack XL Interface for additional options. Table 1-1 provides a summary of BoosterPack interface compatibility.

This development guide provides necessary design information for developers who want to create BoosterPacks that extend the functionality of the Stellaris® LaunchPad using either the original BoosterPack or the BoosterPack XL Interface. Figure 1-1 on page 7 shows a photo of the Stellaris® LaunchPad.

Table 1-1. LaunchPad BoosterPack Compatibility Summary

LaunchPad

Compatible with...

BoosterPack Interface BoosterPack XL Interface

Stellaris LaunchPad Yes Yes

MSP430 LaunchPad Yes No

Other TI LaunchPads Yes No

C H A P T E R 1

Page 7: LMF4120 Boosterpack development.pdf

Stellaris LaunchPad BoosterPack Development Guide

August 24, 2012 7

Figure 1-1. Stellaris® LM4F120 LaunchPad Evaluation Board

BoosterPack Functional InterfaceThe Stellaris® LaunchPad's BoosterPack Interface provides compatibility with the original MSP430 LaunchPad's BoosterPack interface. This interface consists of the outer 10 pin headers. The pins are spaced 0.10-inch apart with the two headers located 1.8 inches apart.

Table 1-2, ”J1Connector” on page 8 and Table 1-3, ”J2 Connector” on page 8 provide information for which Stellaris microcontroller peripherals are routed to each of the interface pins. The J1 connector is located on the far left side of the Stellaris LaunchPad. The J2 connector is located on the far right side of the Stellaris LaunchPad. Software is used to configure the LM4F120 pin for one of the functions found in the table. Highlighted functions indicate configuration for compatibility with the MSP430 LaunchPad.

Page 8: LMF4120 Boosterpack development.pdf

Stellaris LaunchPad BoosterPack Development Guide

August 24, 2012 8

Table 1-2. J1Connector

J1 Pin GPIO Stellaris PinGPIOPCTL Register Setting

GPIOAMSEL 1 2 3 7 8 9 14

1.01 3.3 V

1.02 PB5 57 AIN11 - SSI2Fss - T1CCP1 CAN0Tx - -

1.03 PB0 45 - U1Rx - - T2CCP0 - - -

1.04 PB1 46 - U1Tx - - T2CCP1 - - -

1.05 PE4 59 AIN9 U5Rx - I2C2SCL - CAN0Rx - -

1.06 PE5 60 AIN8 U5Tx - I2C2SDA - CAN0Tx - -

1.07 PB4 58 AIN10 - SSI2Clk - T1CCP0 CAN0Rx - -

1.08 PA5 22 - - SSI0Tx - - - - -

1.09 PA6 23 - - - I2C1SCL - - - -

1.10 PA7 24 - - - I2C1SDA - - - -

Table 1-3. J2 Connector

J2 Pin GPIO Stellaris PinGPIOPCTL Register Setting

GPIOAMSEL 1 2 3 7 8 9 14

2.01 GND

2.02 PB2 47 - - - I2C0SCL T3CCP0 - - -

2.03 PE0 9 AIN3 U7Rx - - - - - -

2.04a

a. Not recommended for BoosterPack use. J2.04 is a TEST pin on the MSP430 LaunchPad. This signal tied to on-board function via 0-Ω resistor.

PF0 28 - U1RTS SSI1Rx CAN0Rx T0CCP0 NMI C0o -

2.05 RESET

2.06b

b. J2.06 (PB7) is also connected via 0-Ω resistor to J3.04 (PD1) to provide MSP430 LaunchPad Compatible I2C SDA Signal.

PB7 4 - - SSI2Tx - T0CCP1 - - -

2.07c

c. J2.07 (PB6) is also connected via 0-Ω resistor to J3.03 (PD0) to provide MSP430 LaunchPad Compatible I2C SCL Signal

PB6 1 - - SSI2Rx - T0CCP0 - - -

2.08 PA4 21 - - SSI0Rx - - - - -

2.09 PA3 20 - - SSI0Fss - - - - -

2.10 PA2 19 - - SSI0Clk - - - - -

Page 9: LMF4120 Boosterpack development.pdf

Stellaris LaunchPad BoosterPack Development Guide

August 24, 2012 9

BoosterPack XL Functional InterfaceThe BoosterPack XL Interface consists of the J1 and J2 connectors as well as the inner 10-pin headers spaced 1.6 inches apart directly inside of the MSP430 LaunchPad-compatible BoosterPack interface headers. The pins are spaced on 0.10-inch centers. These inner 10-pin headers (connectors J3 and J4) are not intended to be compatible with other TI LaunchPads or LaunchPad XL's. This is a Stellaris-only interface. TI recommends that LaunchPads provide analog functions on the left side of the BoosterPack XL interface and timer or PWM functions on the right side of the BoosterPack XL interface. Stellaris conforms to these recommendations. No effort has been made to make this interface compatible with any other LaunchPad.

Table 1-4 and Table 1-5 show which Stellaris peripherals are routed to each pin of the Stellaris-only BoosterPack XL Interface pins. J3 is the inner left BoosterPack XL Interface header. J4 is the inner right BoosterPack XL Interface header. Software is used to configure the LMF4120 pin for one of the functions found in the table.

Table 1-4. J3 Connector

J3 Pin GPIO Stellaris PinGPIOPCTL Register Setting

GPIOAMSEL 1 2 3 7 8 9 14

3.01 5.0V

3.02 GND

3.03 PD0 61 AIN7 SSI3Clk SSI1Clk I2C3SCL WT2CCP0 - - -

3.04 PD1 62 AIN6 SSI3Fss SSI1Fss I2C3SDA WT2CCP1 - - -

3.05 PD2 63 AIN5 SSI3Rx SSI1Rx - WT3CCP0 - - -

3.06 PD3 64 AIN4 SSI3Tx SSI1Tx - WT3CCP1 - - -

3.07 PE1 8 AIN2 U7Tx - - - - - -

3.08 PE2 7 AIN1 - - - - - - -

3.09 PE3 6 AIN0 - - - - - - -

3.10a

a. Not recommended for BoosterPack use. This signal tied to on-board function via 0-Ω resistor.

PF1 29 - U1CTS SSI1Tx - T0CCP1 - C1o TRD1

Table 1-5. J4 Connector

J4 Pin GPIO Stellaris PinGPIOPCTL Register Setting

GPIOAMSEL 1 2 3 7 8 9 14

4.01a PF2 30 - - SSI1Clk - T1CCP0 - - TRD0

4.02a PF3 31 - - SSI1Fss CAN0Tx T1CCP1 - - TRCLK

4.03 PB3 48 - - - I2C0SDA T3CCP1 - - -

4.04 PC4 16 C1- U4Rx U1Rx - WT0CCP0 U1RTS - -

4.05 PC5 15 C1+ U4Tx U1Tx - WT0CCP1 U1CTS - -

4.06 PC6 14 C0+ U3Rx - - WT1CCP0 - - -

Page 10: LMF4120 Boosterpack development.pdf

Stellaris LaunchPad BoosterPack Development Guide

August 24, 2012 10

LaunchPad Power InterfaceThe Stellaris LaunchPad has provisions to provide power to a BoosterPack through either the BoosterPack interface or the BoosterPack XL Interface. The configuration of power and ground pins on both of these interfaces must be consistent across LaunchPads from all TI microcontroller families.

The Stellaris LaunchPad draws power from either of the on-board USB interfaces as selected by the power switch in the top left corner of the board. Typically, the USB connection provides 500 milliamps at 5 V to the Stellaris LaunchPad. The selected USB power source is made directly available to the BoosterPack XL Interface on the J3.01 pin. This is a direct connection with only small decoupling capacitors provided on the Stellaris LaunchPad.

All LaunchPads, including the Stellaris LaunchPad, also provide a 3.3-V supply on pin J1.01 of the BoosterPack interface. On the Stellaris LaunchPad, this is sourced by a TPS73633 LDO voltage regulator which converts the selected 5-V USB power to 3.3 V. The regulator is capable of sourcing 400 milliamps at 3.3 V. This 3.3-V supply is shared between the BoosterPack interface, the in-circuit debug interface (ICDI), and the target microcontroller. Therefore, under normal circumstances, about 300 to 350 milliamps are available to the BoosterPack interface. Detailed power management is left to the BoosterPack developer who must also manage the application to be run on the target microcontroller.

The Stellaris LaunchPad can be powered through an external supply on a BoosterPack. If providing power to the Stellaris LaunchPad from a BoosterPack, move the power select switch to select an unused USB connection to prevent power bus contention between the BoosterPack and the USB connection. Power may be supplied to either the 3.3 V or the 5.0-V system but not both. Providing external power to both 5 V and 3.3 V would result in a contention between the external power supplies and the Stellaris LaunchPad's voltage regulator. Providing only 3.3 V will result in some lost functionality such as the on-board LED’s. It may also result in reverse current leakage through the on-board voltage regulator. Therefore, it is recommended if providing power externally to use either the existing USB connections or an external 5-V supply from a BoosterPack.

Ground connections are available on pins J2.01 and J3.02. These provide a ground connection for both the BoosterPack interface and the BoosterPack XL Interface respectively.

Additional power and ground pins are available through labeled pins located in the extreme lower corners of the Stellaris LaunchPad. These are connected to the same 3.3 V, 5 V, and ground connections as the pins on the BoosterPack interface and the BoosterPack XL Interface.

4.07 PC7 13 C0- U3Tx - - WT1CCP1 - - -

4.08 PD6 53 - U2Rx - - WT5CCP0 - - -

4.09 PD7 10 - U2Tx - - WT5CCP1 NMI - -

4.10a PF4 5 - - - - T2CCP0 - - -

a. Not recommended for BoosterPack use. This signal tied to on-board function via 0-Ω resistor.

Table 1-5. J4 Connector (Continued)

J4 Pin GPIO Stellaris PinGPIOPCTL Register Setting

GPIOAMSEL 1 2 3 7 8 9 14

Page 11: LMF4120 Boosterpack development.pdf

Stellaris LaunchPad BoosterPack Development Guide

August 24, 2012 11

Special Consideration for Shared PinsTo provide compatibility with the MSP430 LaunchPad's BoosterPack interface and to provide a maximum number of signals to the BoosterPack interface and BoosterPack XL Interface, it was necessary to route some signals to more than one pin. In addition, certain on-board functions such as the button and LED signals are available on the BoosterPack interface and BoosterPack XL Interface. A 0-Ω jumper resistor was installed for signals that are used for more than one purpose or routed to more than one GPIO. Removal of this jumper disconnects the functions. All jumpers are installed by default. A listing of these jumpers and their use is provided in Table 1-6.

Stellaris LaunchPad Dimensions and MatingFigure 1-1 on page 7 shows a dimensional drawing of the Stellaris LaunchPad. J1 and J2 are 1.8 inches apart and constitute the BoosterPack interface. J3 and J4 are 1.6 inches apart and constitute the BoosterPack XL Interface. Other major board signals are available on unpopulated headers on a 0.1 inch grid. Dimensions to these signals are provided for convenience. These signals are subject to change or move across revisions of the Stellaris LaunchPad or future LaunchPads. It is recommended that BoosterPacks use only the BoosterPack interface and BoosterPack XL Interface. Use of other pins and signals is acceptable but these pins and signals can change at any time.

Table 1-6. Stellaris® LaunchPad Jumper List

Resistor Primary Function Alternate Function Comments

R1 Right User Switch J2.04 Test pin on MSP430 LaunchPad. This connection along with R13 provides Hibernate wake to BoosterPack interface

R2 Red LED To PF1 and J3.10 If removed: allows extra GPIO to the BoosterPack XL interface. If installed (default): allows booster pack to drive LED or sense LED state.

Also provides Embedded Trace signal TRD1.

R8 Hibernate Wake To PF0 and J2.04 via R1 Allows user switch 2 to wake device from hibernate. Also ties wake to J2.04 to allow BoosterPack to wake Stellaris LaunchPad from Hibernate.

R9 PB6 SSI2 TX on J2.07

PD0 I2C SCL on J2.07

Routes I2C from PD0 to J2.07 for MSP430 Stellaris LaunchPad compatibility. If using PD0 or PB6, the unused GPIO must be configured as an input or R9 removed.

R10 PB7 SSI2 RX on J2.06 PD1 I2C SDA on J2.06 Routes I2C from PD1 to J2.06 for MSP430 Stellaris LaunchPad compatibility. If using PD1 or PB7, the unused GPIO must be configured as an input or R9 removed.

R11 Blue LED To PF2 and J4.01 If removed: allows extra GPIO to the BoosterPack XL interface. If installed (default): allows BoosterPack to drive LED or sense LED state.

Also provides Embedded Trace signal TRD0.

R12 Green LED To PF3 and J4.02 If removed: allows extra GPIO to the BoosterPack XL interface. If installed (default): allows BoosterPack to drive LED or sense LED state.

Also provides Embedded Trace signal TRDCLK.

R13 Left User Switch To PF4 and J4.10 If removed: allows extra GPIO to the BoosterPack XL interface. If installed (default): allows BoosterPack to simulate switch press or sense switch state.

Page 12: LMF4120 Boosterpack development.pdf

Stellaris LaunchPad BoosterPack Development Guide

August 24, 2012 12

BoosterPack Design GuidelinesFollow these guidelines when designing your BoosterPack:

BoosterPacks should not extend more than 0.350 inches above the center of the top BoosterPack interface pin.

BoosterPacks should not extend more than 0.150 inches below the center of the bottom pin of the BoosterPack interface.

Note: BoosterPacks that extend more than 0.150 inches below the center of the bottom pin will partially cover the Stellaris LaunchPad user switches which can result in lost user access to those user inputs.

BoosterPacks are not restricted in width and may extend as much as desired left and right of the Stellaris LaunchPad.

For BoosterPacks with RF antennas, place the antenna to the left or right of the Stellaris LaunchPad for minimal interference and signal attenuation.

The BoosterPack interface does not provide any means of keying or alignment guidance. It is recommended that visual cues be provided on the BoosterPack to assist user in proper orientation of the BoosterPack.

If possible, design the BoosterPack so that incorrect mating to a Stellaris LaunchPad will not damage the BoosterPack.

Page 13: LMF4120 Boosterpack development.pdf

August 24, 2012 13

SchematicsThis section contains the schematics for the Stellaris® LaunchPad evaluation board:

Microcontroller, USB, Expansion, Buttons, and LED on page 14

Power Management on page 15

Stellaris In-Circuit Debug Interface (ICDI) on page 16

A P P E N D I X A

Page 14: LMF4120 Boosterpack development.pdf

Microcontroller, USB, Expansion, Buttons and LED

Stellaris Launchpad

EK-LM4F120XL

0.1DGTSTELLARIS MICROCONTROLLERS

www.ti.com/stellaris

AUSTIN TX, 78746108 WILD BASIN ROAD, SUITE 350

TEXAS INSTRUMENTS8/23/2012

EK-LM4F120XL Rev A.sch OF1 3SHEETPART NO.

DATEREVISIONDESIGNER

FILENAME

DESCRIPTION

PROJECTR

J1 and J2 provide compatability withBooster Packs designed for MSP430 Launchpad

Used for VBUS detection whenconfigured as a self-powered USB Device

J3 and J4 sit 100 mils inside J1 and J2 to provide extended functions specific to this board.See the board user manual for complete table of pin mux functions

1VB

2D

-3

D+

4ID

5G 68

9 7

J9CON-USB-MICROB

12345678910

J1

CON_110_100

123456789

10

J2

CON_110_100

SW1

SW2

R6 10k

R7 1M

R8

330

12345678910

J3

CON_110_100

123456789

10

J4

CON_110_100

1PB6 4PB7

5PF46 PE37 PE28 PE19 PE0

10PD713 PC714 PC615 PC516 PC4

17 PA018 PA119 PA220 PA321 PA422 PA523 PA624 PA7

28PF0 29PF1 30PF2 31PF3

43PD4 44PD5

45PB0 46PB1 47PB2 48PB3

49 PC350 PC251 PC152 PC0

53PD6

58PB4 57PB5

59 PE460 PE5

61PD0 62PD1 63PD2 64PD3

U1-A

LM4F120

1A2 R3 G4 B

D1

RGB_LED_0404_COMA

R9

0

R10

0

R10R20R110R120R130

R14

0

R15

0

R4

330

B

E

C

Q2DTC114EET1G

R3

330

B

E

C

Q1DTC114EET1G

R5

330

B

E

C

Q3DTC114EET1G

USB_DM

USB_DP

DEBUG/VCOM

GPIO

GPIO

PA2PA3PA4PA5PA6PA7

PB0PB1PB2PB3PB4PB5PB6PB7

PC4PC5PC6PC7

PD0PD1PD2PD3

PD6PD7

PE0PE1PE2PE3PE4PE5

PA0/U0RX_VCP_TXDPA1/U0TX_VCP_RXD

DEBUG_PC0/TCK/SWCLKDEBUG_PC1/TMS/SWDIODEBUG_PC2/TDIDEBUG_PC3/TDO/SWO

USB_DMUSB_DP

USR_SW2

USR_SW1

GPIO

PB0PB1

PB4PB7PB6

+3.3V

USR_SW2

USR_SW1

+USB_VBUS+USB_VBUS

WAKE

PB6

PB7TARGETRST

PF4PF3PF2PF1PF0

PF4PD7

+VBUS

PF2PF3

PB2

+VBUS

LED_B

PB5

PE4PE5

PA6PA2PA3PA4

PF0PE0

PF1

PB3PC4PC5PC6PC7PD6

PA5

PA7

PD0PD1PD2PD3PE1PE2PE3

PD0

PD1

LED_G

LED_R

LED_RLED_BLED_G

Microcontroller, USB, Expansion, Buttons, and LED

Page 15: LMF4120 Boosterpack development.pdf

Power Management

Stellaris Launchpad

EK-LM4F120XL

0.1DGTSTELLARIS MICROCONTROLLERS

www.ti.com/stellaris

AUSTIN TX, 78746108 WILD BASIN ROAD, SUITE 350

TEXAS INSTRUMENTS8/23/2012

EK-LM4F120XL Rev A.sch OF2 3SHEETPART NO.

DATEREVISIONDESIGNER

FILENAME

DESCRIPTION

PROJECTR

+3.3V 400mA Regulator

Power Select

RESETH24 and H25 installed as a single 1x2header on 100 mil center with jumper

8 IN5 EN

1OUT3NR

4

GND

9

PAD

U8TPS73633DRB

C180.01uF

D4

Gre

en

R27

330

C3

0.01uF

C4

0.1uF

C5

0.01uF

C6

0.1uF

C8

0.01uF

C100.1uF

C110.1uF

R31

1M

H1

C3110pF

C3210pF

Y216MHz C

2924

pF

C28

24pF

R2810k

RESET

C130.1uFOMIT

H2

C222.2uFH17

H18

H19

H20

H21

2VDDA

3 GNDA

11VDD

12 GND25VDDC

26VDD

27 GND

32WAKE33HIB

34 XOSC035 GNDX36 XOSC1

37VBAT

38 RESET

39 GND

40 OSC041 OSC1

42VDD 54VDD

55 GND 56VDDC

U1-B

LM4F120Y132.768Khz

12

3

45

6

SW3

H22H23

R26 0

R30

0

OMIT

H11 H12H10H13

H24 H25

1A

2A3K

D2

R1710k

1GND

2RESET3 VDD

U4

TLV803

C7

1.0uF

C12

1.0uF

C14

1.0uF

+3.3V

+VBUSWAKE

TARGETRST+USB_VBUS

+ICDI_VBUS

+VBUS

+MCU_VDDC

+MCU_PWR

+3.3V

HIB

TARGETRST

ICDI_RST

+3.3V

+VBUS

+MCU_PWR

Power Management

Page 16: LMF4120 Boosterpack development.pdf

SStellaris In Circuit Debug Interface

Stellaris Launchpad

EK-LM4F120XL

0.1 8/23/2012DGTSTELLARIS MICROCONTROLLERS

www.ti.com/stellaris

AUSTIN TX, 78746108 WILD BASIN ROAD, SUITE 350

TEXAS INSTRUMENTS

EK-LM4F120XL Rev A.sch OF3 3SHEETPART NO.

DATEREVISIONDESIGNER

FILENAME

DESCRIPTION

PROJECTR

ICDI JTAG

Stellaris In-Circuit Debug Interface (ICDI)

54321

678910

J5

TC2050-IDC-NL

C15

0.01uF

C17

0.1uF

C19

0.01uF

C20

0.1uF

C21

0.01uF

C230.1uF

C240.1uF

C2510pF

C2610pF

Y516MHz

R1910k

C340.1uFOMIT

R2110k

R2210k

C92.2uF

R1810k

R2310k

H14

1 VB

2 D-

3 D+

4 ID

5 G

68 9

7

J11

CO

N-US

B-M

ICRO

B

R24

330

H15

1PB6 4PB7

5PF46 PE37 PE28 PE19 PE0

10PD713 PC714 PC615 PC516 PC4

17 PA018 PA119 PA220 PA321 PA422 PA523 PA624 PA7

28PF0 29PF1 30PF2 31PF3

43PD4 44PD5

45PB0 46PB1 47PB2 48PB3

49 PC350 PC251 PC152 PC0

53PD6

58PB4 57PB5

59 PE460 PE5

61PD0 62PD1 63PD2 64PD3

U2-A

LM4F120

2VDDA

3 GNDA

11VDD

12 GND25VDDC

26VDD

27 GND

32WAKE33HIB

34 XOSC035 GNDX36 XOSC1

37VBAT

38 RESET

39 GND

40 OSC041 OSC1

42VDD 54VDD

55 GND 56VDDC

U2-B

LM4F120

R16

0

C1

1.0uF

C2

1.0uF

R20 0

ICDI_TMS

ICDI_TCKICDI_TDO

ICDI_TDI

ICDI_RST+3.3V

+3.3V

+3.3V

ICDI_TCKICDI_TMSICDI_TDI

ICDI_TDO

ICDI_RST

+3.3V

DEBUG/VCOM

PA1/U0TX_VCP_RXDPA0/U0RX_VCP_TXD

DEBUG_PC0/TCK/SWCLKDEBUG_PC1/TMS/SWDIODEBUG_PC3/TDO/SWODEBUG_PC2/TDI

TARGETRSTEXTDBG

DEBUG_PC3/TDO/SWO

DEBUG_PC1/TMS/SWDIODEBUG_PC0/TCK/SWCLK

+3.3V +ICDI_VBUS

+MCU_PWR

Stellaris In-Circuit Debug Interface (ICDI)

Page 17: LMF4120 Boosterpack development.pdf

August 24, 2012 17

ReferencesIn addition to this document, the following references are included on the Stellaris LaunchPad Evaluation Kit CD and are also available for download at www.ti.com.

Stellaris LaunchPad (EK-LM4120XL) User's Manual, publication EK-LM4F120-XL

Stellaris LM4F120H5QRFIG Microcontroller Data Sheet, publication DS-LM4F120H5QR

StellarisWare® Driver LibraryStellarisWare® Driver Library User’s Manual, publication SW-DRL-UG

Information on development tool being used:Texas Instruments’ Code Composer Studio™ IDE web site, www.ti.com/ccs

A P P E N D I X B

Page 18: LMF4120 Boosterpack development.pdf

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. Allsemiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the timeof order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.

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