201501 500

Mitsui C

opper Foil for Package substrate

パッケージ基板向け銅箔ロードマップThe Road Map of the Mitsui Copper Foil for Package Substrate

Target μm μm μm μm μm μmμm

Line/Space

Underdevelopment

MT SD-H

MT-Ex

MT-FL

MT-WA

MFG-57A

ULTTM

FSP®-329

FSP®-xxx

ナノアンカー（超微細）表面処理銅箔Nano-anchor surface copper foil

MFG-57A高エッチング性とPSRやEMC（実装時）との密着信頼性を両立。High etching property, Good adhesion between primer and PSR, EMC on assembly

FSP®-329最小限のエッチングにより微細配線形成可能Copper foil and nodule designedto minimize flash etching

Mass productionsample available

ULT超極薄シード層(<1.0μmt)により微細配線形成可能

L/S=2/2Ultimately thin copper foil material to targetL/S 2/2μm

レベルをターゲット

FSP®-xxxコブの微細化により、細線形成可能

樹脂特性向上により、高い回路密着性

Minimum nodule design and upgradedprimer resin realize high reliability forfiner pattern even below L/S=10/10

、信頼性を実現

MultiFoil®G(プライマー付銅箔)

MultiFoil®G(プライマー付銅箔)

MultiFoil®G(プライマー付銅箔)

MT-WA

TM

770307

201501 500

Mit

sui C

opper F

oil

for P

ackage s

ubstrate

MT18-FLNewly Launched the Suitable Material for Fine Pitch Pattern

・Useable for very fine pitch pattern L/S=15/15-20/20 formation by MSAP process.

粗化処理面 Surface Profile

18μm銅箔 Carrier Copper

剥離層 Releasing Layer

銅箔1.5 ～ 3μm Ultra thin Copper

Rz=2.0μm Rz=3.0μm Very Low profile GradeMT18FL

▼ Pattern plating 20μm

Low profile GradeMT18Ex

Standard GradeMT18SD-H

Rz=1.3μm

● MT18FL has an excellent balance between fine patterning and peel strength.

● Patterning example with MT-FL1.5μm by MSAP ● Etching time comparison

StandardLow Profile

Very Low Profile

MT18SD-HMT18ExMT18FL

Rz 3.0Rz 2.0Rz 1.3

1.4kN/m1.1kN/m1.1kN/m

35/35μm25/25μm

15/15～20/20μm●●

●●

●●●

●●

Variations μm P/S(FR-4) Target L/Sby MSAP 1.5 2 3 5

▼ After micro etching process

▶ SEM Image L/S=15/15μm using MT-FL

0

20

40

60

80

100

SD-H Ex

100% 89% 66%%

FL

770307

201501 500

Mit

sui C

opper F

oil

for P

ackage s

ubstrate

MFG（MultiFoil®G）Seriesプライマーレジン付極薄電解銅箔Ultra Thin Copper Foil with a Primer Resin for IC Substrate

・Simplifying customers’ process for ultra fine patterning by SAP.・Reliability on various assembly process/ High heat & chemical resistance.・Compatibility with various low CTE prepregs to relieve warpage issue.

FSPⓇ-329 for SAPKey Features

SVM

・Superior fine pattern ability by MSAP. Track record for LS15/15 devices.・Higher adhesive reliability with SR without any pre-surface treatments on primer.・Reliability on various assembly process/ High heat & chemical resistance.

MFG-57A for MSAPKey Features

HVM

Structure Nodule Designsoptimized for SAP

LS10/10 pattern ability

10μm10μmCarrier foil (18μm)

Smaller typeRz:1.3μm

Larger typeRz:1.9μm

Flat bulk with uniform nodule

Special primer resin

Releasing layer 18μm

Structure Micro Nodule to enhance adhesion to Solder Resist

Carrier foil (18μm)

MFG-MTRz 1.1μm

MFG-57ARz 1.1μm

ref. MT-ExRz 2.0μm

Flat｠bulk｠with｠micro｠nodule

Special primer resin

Releasing layerSolderResist

770307