silicon photomultiplier readout electronics for the gluex tagger microscope hall d electronics...

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Silicon Silicon Photomultiplier Photomultiplier Readout Electronics Readout Electronics for the GlueX for the GlueX Tagger Microscope Tagger Microscope Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007 Richard Jones, Igor Senderovich and Brendan Krueger Richard Jones, Igor Senderovich and Brendan Krueger University of Connecticut University of Connecticut

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Silicon Photomultiplier Silicon Photomultiplier Readout ElectronicsReadout Electronics

for the GlueXfor the GlueX

Tagger MicroscopeTagger Microscope

Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007

Richard Jones, Igor Senderovich and Brendan KruegerRichard Jones, Igor Senderovich and Brendan KruegerUniversity of ConnecticutUniversity of Connecticut

Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007 22

OutlineOutline

1.1. Detector overview and requirementsDetector overview and requirements

2.2. Silicon photomultipliersSilicon photomultipliers

3.3. Signal pathwaysSignal pathways

4.4. Detector electronics requirementsDetector electronics requirements

5.5. Conceptual designConceptual design

6.6. ImplementationImplementation

7.7. Project status and plansProject status and plans

Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007 33

Detector overviewDetector overviewradiator

quadrupole

dipole 1dipole 2

photon beamfull-energy electrons

focal planemicroscope

bird’s eye view

beam’s eye view

u

v

tagged photon energy9.0 GeV8.4 GeV

beam stripe2mm x 2mm x 20mm scintillating fibers, head-on

c[0] c[99]

Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007 44

Detector overview, cont.Detector overview, cont.

electrons

microscope assembly, exploded

Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007 55

Readout requirementsReadout requirements

1.1. < 200 ps time resolution< 200 ps time resolution

2.2. 3 MHz per energy channel max.3 MHz per energy channel max.

3.3. average 1000 photons / pulse in the average 1000 photons / pulse in the

range 450 – 530 nm (BCF-20)range 450 – 530 nm (BCF-20)

4.4. Landau edge 700 photons / pulseLandau edge 700 photons / pulse

5.5. channel threshold 300 – 500 photonschannel threshold 300 – 500 photons

6.6. dark rate < 3 KHz over thresholddark rate < 3 KHz over threshold (1% (1%

@ 10@ 1077 tags/s) tags/s)

Good match to silicon photomultiplier technology

Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007 66

Silicon photomultipliersSilicon photomultipliers commercially available commercially available

from Photonique (CPTA) from Photonique (CPTA)

and now Hamamatsuand now Hamamatsu

intrinsic time resolution intrinsic time resolution

~100 ps for 1 p.e. pulse~100 ps for 1 p.e. pulse

Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007 77

Silicon photomultipliers, cont.Silicon photomultipliers, cont.Measurements at UConn on Photonique 4mm2 SiPM

Gain and PDE Gain and PDE vary withvary with VVbiasbias

temperaturetemperature

VVbiasbias referenced with referenced with respect to break-respect to break-down voltage Vdown voltage Vbdbd

Vbd varies ±0.5V between devicesindividual control over Vbias required, similar to case of PMT (but no HV).

Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007 88

Signal pathwaysSignal pathways

+

SiPMV

b[0]

E[0]SiPM

SiPMSiPM

SiPM

...

...

...V

b[4]

cfd

fadc[0]

f1tdc[0]

EnergyBins scint. clear

Fibers: Biasvoltages Detector DAQ Rack

+

SiPM

E[99]SiPM

SiPM

SiPM

SiPM

...

...

...V

b[499]

.

.

.

...

.

.

.

.

.

cfd

fadc[119]

f1tdc[119]

95 Echan @ 1 daqchan/Echan + 5 Echan @ 5 daqchan/Echan = 120 daqchan

Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007 99

Signal pathways, cont.Signal pathways, cont.

dim box digital electronics external connections moderately light tight

dark box scintillating fibers PCB-mounted SiPMs signal preamps and

sum circuitry Vbias for each

channel received from digital board

interconnect plane PCB

Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007 1010

Detector electronics requirementsDetector electronics requirements

1.1. preamps mounted on the PCB together with the preamps mounted on the PCB together with the

SiPM – noise immunitySiPM – noise immunity

2.2. preamp transimpedence gain 3Kpreamp transimpedence gain 3K

3.3. rise time 1-2 ns, fall time 10-20 nsrise time 1-2 ns, fall time 10-20 ns

4.4. formation of individual and 5-way sum analog formation of individual and 5-way sum analog

signals driven into 50signals driven into 50

5.5. VVbiasbias programmable in steps of 0.1 V individually programmable in steps of 0.1 V individually

for each SiPMfor each SiPM

6.6. VVbias bias programmable range must coverprogrammable range must cover 0 V – enable selective enabling of rows of pixels 0 V – enable selective enabling of rows of pixels

20 V – Vbd of current preferred photonique SiPM20 V – Vbd of current preferred photonique SiPM

70 V – Vbd of attractive alternative Hamamatsu SiPM70 V – Vbd of attractive alternative Hamamatsu SiPM

an

alo

g c

ircu

itry

dig

ital ci

rcuit

ry

Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007 1111

Conceptual design IConceptual design I

basic preamp design, recommended by Photonique

Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007 1212

Conceptual design IIConceptual design II

16-channel DAC provides V16-channel DAC provides Vbiasbias

Vbias readback using mulitplexed ADCVbias readback using mulitplexed ADC

temperature monitoring (for free)temperature monitoring (for free)

FPGA provides interfaceFPGA provides interface

Embedded ethernet Embedded ethernet technologytechnologyprovides cheap and flexibleprovides cheap and flexiblecommunications buscommunications bus

Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007 1313

ImplementationImplementation

1.1. Xilinx FPGAXilinx FPGA

2.2. external components modeled in VHDLexternal components modeled in VHDL

3.3. detailed simulation during and after detailed simulation during and after design using Xilinx development toolsdesign using Xilinx development tools

4.4. robust set of test sequences to exercise robust set of test sequences to exercise major functionsmajor functions

5.5. ethernet complexity handled by ethernet ethernet complexity handled by ethernet controller – only host bus side simulatedcontroller – only host bus side simulated

Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007 1414

ImplementationImplementation

Example: Addressing and initialization schemeExample: Addressing and initialization scheme

Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007Hall D Electronics Meeting, Newport News, Oct. 23-24, 2007 1515

Project status and plansProject status and plans

1.1. Project started by 1 undergraduate student Project started by 1 undergraduate student

summer 2007summer 2007

2.2. Taken over fall 2007 by graduate student Taken over fall 2007 by graduate student

3.3. VHDL design of digital side 70% finishedVHDL design of digital side 70% finished

4.4. Single channel of preamp passed tests on benchSingle channel of preamp passed tests on bench

5.5. PADS PCB layout software PADS licenced PADS PCB layout software PADS licenced

installed at Uconn for layoutinstalled at Uconn for layout

6.6. Design (analog+digital) expected to be ready for Design (analog+digital) expected to be ready for

prototyping summer 2008prototyping summer 2008