smart solutions to drive the future singulus: your … · singulus technologies november,...

SINGULUS TECHNOLOGIESNovember, 2007

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SMART SOLUTIONS TO DRIVE THE FUTURE

SINGULUS: your guide for the high definition future

Blu-ray Disc SL/DLStephan HotzStephan Hotz

SINGULUS TECHNOLOGIES AG


- 2 -Agenda

-1- Blu-ray Disc

-2- BD SL

-3- BD DL


- 3 -

CROSS INDUSTRY PLATFORM170+ BDA membership

MotionPicture

CE Industry PC IndustryMusicIndustry

MGM

FOX

Media IndustryGame Industry

Warner


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Projected HD-DVD/Blu-ray Disc Supply

1769,52000Disc Output (Million Units)

1211,61500

142 4361,5

689

500

1000

36,7142,4

02006 2007 2008 2009 2010 2011

Blu-ray*29,3 121,8 333 642 1170 1737,5

HD-DVD Video7,4 20,6 28,5 47 41,6 32

* Includes ROM, Video & PS3

©2007 Understanding & Solutions Ltd.

All rights reserved


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Total High Definition Video Sales Forecasts

887,41000(Million Units)

523,9

887,4

600

800

233,1

200

400

600

0,89 11 75,9

0

200

2006 2007 2008 2009 2010 2011Total Blu-rayTitle Sales 0,36 7,7 61,3 205 498 867,1

Total HD-DVDTitle Sales 0 53 3 3 14 6 28 1 25 9 20 30,53 3,3 14,6 28,1 25,9 20,3

©2007 Understanding & Solutions Ltd.

All rights reserved


- 6 -Top Ten Title Sales USA YTD*


- 7 -

Sony

Many Blu-ray players available

SonyBDP-S1€ 748,-BDP-S300€ 417,-

PhilipsBDP7100€ 439,-

BDP-S500€ 713,-

SamsungBD-P1400

LGBH-100 BD / HD DVD€ 1.149,-

€ 444,-BD-P1000€ 399,- Denon

DVD-3800BD€ ???

Sony PS3 80GB€ 399,-Sony PS3 40GB€ 269,-

PanasonicDMP-BD 10€ 489,-DMP-BD30€ 335

€ ???,-DVD-2500BTC€ ???,-

SharpBD HDW20

PioneerBDP-H1€ 1 500

€ 335,- BD-HDW20€ ???,-BD-HP20S€ 417,-

€ 1.500,-BDP-LX70€ 1.399,-

LoeweBluTech Vision€ ???,-


- 8 -Blu-ray / HD DVD Retail Prices


- 9 -BD Disc Industry in Production NOW!

MasteringMasteringFormattingFormattingAuthoringAuthoring ReplicationReplication

InspectionInspection

BCABCASony PicturesSonic Solutions

SINGULUSDCAECLIPSE

SINGULUS SINGULUS

AudioDev DATARIUSDATARIUS Dr. SchenckDr. ShwabBaslerETA-Optik

Tools and equipment available for ReplicatorsTools and equipment available for Replicators

pPulstec IndustrialShibaSoku

* This list is just an example and does not represent the entire industry


- 10 -Agenda

-1- Blu-ray Disc

-2- BD SL

-3- BD DL


- 11 -

BLU-LINE Liquid Resin Technology


- 12 -Milestones BLU-LINE

2004: Cooperation with SONY for BD 25 Film Technology

February 2005: First BLU-LINEs BD 25 Film- and Spin-Technology

April 2005: First playable BD 25

October 2005: Start of delivery first BLU-LINEs BD 25 to customers

March 2006: World premiere of BLU-LINE

Summer 2006 Installed BLU-LINEs dominant at Customer site

2007 First year of Blu-ray Disc Mass Production with Singulus Equipment

March 2007: Start of cooperation with Sony DADC for Embossing Technology

May 2007: Startup embossing process BD 50 in KahlMay 2007: Startup embossing process BD 50 in Kahl


- 13 -

BLULINE Installed Base World Wide

USA EastUSA East5 BLULINE

USA West1 BLULINE

France1 BLULINE

Macao1 BLULINE


- 14 -

Replication Process Steps

Molding of the Substrate

•High demand for pit replication precision

•Smaller tolerances of tilt and deviation as for DVD✤•No optical requirements to the substrate like:

- Transparency- Birefringence✣ Birefringence✣

Disc Quality Triangle at DVD

Optical properties O ti O ti P i t

Disc Quality Line at BD

Optical propertiesBirefringence Optimum Operation Point

Mechanical propertiesTilt

Signal QualityPit Replication

Mechanical propertiesTilt

Signal QualityPit Replication

Tilt Pit Replication


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Metallizing of the Substrate by Sputtering

Possible Metals: • Silver Alloy (preference)

Al i• Aluminum

Layer thickness approx. 35 nm

Similar to DVD✣✣


- 16 -


Applying of Cover LayerApplying of Cover Layer

Hard coat layer

S ifi ti f l Thi k 100 3 i l di h d t

Common technology for the cover layer application is the

Specification for cover layer: Thickness 100µm ± 3µm including hard coat

Common technology for the cover layer application is theliquid resin spin coating technology

It is general sense that a BD-disc requires a more scratch resistantread side surface than a DVD or CD.

As a result, an additional hard coat shall be applied for surface protection.


- 17 -

Cover Layer Profile100µm one-step-coating

Cover-LayerCover-LayerPrometeus

Cover-LayerPromete sPrometeus

Cover-Layer

Cover-LayerETA-RT

vs ReferencePrometeus


- 18 -

Current Results @ BLU–LINE

• BD ROM SL • Cycle time 3.9s

• Yield > 85%• Cover-Layer < ± 2µm

• Ski-Jump < 40µmp µ


- 19 -

Current Results @ BLU–LINEin Production, USA

• BD ROM SL•Cycle time 3.9s

• Yield > 85%• Cover-Layer < ± 2µm

• Ski-Jump < 40µmp µ


- 20 -Agenda

-1- Blu-ray Disc

-2- BD SL

-3- BD DL


- 21 -

Dual Layer Technology

Dual Layer BD-Disc Structure

Molded Substrate 1 1mm ThicknessMolded Substrate 1.1mm Thickness Reflecting Layer L0 approx. 40nm Ag ThicknessSpacer-Layer 25µm ThicknessReflecting Layer L1 approx. 15nm Ag ThicknessCover Layer 75µm Thickness incl Protective Coating

2 M h d f ibl

Cover Layer 75µm Thickness incl. Protective Coating

2 Methods are feasible:

• Imprinting Pit Structure into the 25 µm Lacquered Spacer-LayerImprinting Pit Structure into the 25 µm Lacquered Spacer Layerwith the Wet-Embossing Process

• Plastic Stamper 2P Process (Polycarbonate, PMMA or Olefin as a Plastic Stamper Material)or Olefin as a Plastic Stamper Material)


- 22 -

Dual Layer Technology Embossing Process

Embossing Processes (Metal Stamper)

Molding of Substrate L0

Metallizing L0

Lacquering L0 with 22µm base-resin

UV-curingUV-curing

Imprinting of Pit Structure from Metal Stamper

Lacquering L0 with 3µm pit-transfer-resin

S ti f M t l St

Imprinting of Pit Structure from Metal Stamper

UV-curing

Separation of Metal Stamper

Metallizing L1

Application of 75µm Cover Layer & Hard Coat


- 23 -

SONY Announcement

Press ReleaseSony DADC Announces Production Technology Initiative for Blu-raySony DADC Announces Production Technology Initiative for Blu ray Disc Dual Layer

Hanau, February 16, 2007 - Sony DADC today announced that it will start an initiative for a production technology alliance for Blu ray Disc dual layerinitiative for a production technology alliance for Blu-ray Disc dual layer.Detailed information will be presented at the European MEDIA-TECH Showcase & Conference 2007 in Barcelona, Spain, at the Congress Center of Hotel Rey Juan Carlos I.

The presentation will start at March 6, 2007, at 5.30 pm in Room "Sala F" and will introduce the partners of the coming production technology alliance. Sony DADC will also present its latest Blu-ray roadshowwill also present its latest Blu-ray roadshow.


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1. Wet Embossing process steps

Embossing Chamber

1. Start

L1 StamperEmbossing Head

Embossing Table Quartz Glas PlateSilicon Mat

Molded Substrate(1.1 mm thick),

L0 Reflecting Layer (35 nm Silver Alloy), Spacer Layer (22 µm

Plastic Center Pin Base Resin, 3 µm Pit Transfer Resin)

UV-Lamp


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2. Closing Process Chamber and evacuating

Embossing Chamber


BD50 discL1 Stamper

Embossing Head

Plastic Center Pin

UV-Lamp


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3. Embossing L1 pits in 3 µm, wet and UV-curable resin

Embossing Chamber


BD50 disc L1 StamperEmbossing Head

Plastic Center Pin

UV-Lamp


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4. Venting by Nitrogen and curing by UV light

Embossing Chamber


BD50 disc L1 StamperEmbossing Head

Plastic Center Pin

UV-Lamp


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5. Embossing Head drives up, disc and stamper are separted

Embossing Chamber


BD50 discL1 Stamper

Embossing Head

Plastic Center Pin

UV-Lamp


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Embossing Chamber

6. Opening Process Chamber

L1 Stamper

Embossing Head

Embossing Chamber


BD50 disc

Plastic Center Pin

UV-Lamp


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2. Wet-Embossing Mechanical setup

Model of Wet Embossing Process UnitModel of Wet Embossing Process Unit


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2. Wet-Embossing Mechanical setup

M d l f W t E b i U itModel of Wet Embossing Unit: Opening mechanism for stamper exchange


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3. Wet-Embossing Cycle time

No. 1 2 3 4 5 6 7 8

Disc transport Closing Pumping process Pressing UV Release and

Cycle time Process and handling

steps

transport by

indexing table

Closing process chamber

chamber down to approx. 1 mbar and approach

between stamper and disc

Pressing stamper on disc

lamp On

delay

UV lamp ON opening process chamber

N2 valve closed N2 valve open N2 valve closed

Current BD DL Production

(of format/process developer)

1,60 1,50 0,25

1,40

0,45 5,900,60 1,50

Singulus 0 30Singulus(target for

BLU LINE DL 2007)0,30 0,40 0,80 0,20

0,300,70 4,50

0,60 1,50

Singulus (next target for BLU LINE DL)

0,20 0,30 0,60 0,150,30

0,65 3,000,30 0,80


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3. Cycle Time

Base Resin (BR) and Pit Transfer Resin (PTR) process times CL Process

Step Process Time [sec]

1 BR dosing 3 9

Step Process Time [sec]

1 CL dosing 6.01 BR dosing 3.9

2 BR spinning off with IR lamp 4.0

3 Xenon UV lamp for ski jump on BR 2.6

4 PTR dosing 3.3

5 PTR i i ff 3 3

2 CL spinning off with IR lamp 3.8

3 Xenon UV lamp for ski jump on CL 1.4

4 CL spinning off 0.1

5 UV curing 2.05 PTR spinning off 3.3

6 PTR centre curing 2.0

7 Embossing 3.7

5 UV curing 2.0

All process times for BR, PTR and CL are ready for cycle time < 4.0 sec.


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4. Process results

Base ResinAlmost flat BR layer up to r = 58.8 mm (upward peak would influences BR and PTR uniformity after(upward peak would influences BR and PTR uniformity after embossing)

P fil f PCSurface profile

Profile of PC surface

with BR


- 35 -

4. Process results

Thickness of BR and PTR after embossing

Improved thickness variation and bubble-free outer edge by preventing an increase of BR atouter edge by preventing an increase of BR at the outer edge and optimized PTR thickness

±4 µm ±1,5 µm


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4. Process results

Inline scanner results by Dr. Schwab

Total (TS0) 100 ± 2.5 µm Each coating process needs further opti-mization, however

CL (TS1) 75 ± 2 5 µmSL 25 ± 1 5 µm

uniformity of all layers is o.k. so far.

CL (TS1) 75 ± 2.5 µmSL 25 ± 1.5 µm

SINGULUS target:

± 1.0 µm for each layer

± 2.0 µm for TS0


- 37 -

4. Process results

• Spacer-Layer uniformity2µm + 23µm < ± 1µm

• Cover-Layer uniformity75 < ± 275µm < ± 2µm

• Local Defects < 180µm


- 38 -

4. Process results

Replication

Replication measured pby AFM is very good:


- 39 -

4. Process results

Radial Run Out

Results: RRO = 20 µm … 70 µm (specification: < 75 µm)(specification: < 75 µm)

Further improvements: - Improved tool for stamper exchangep p g- It will be necessary for very good RRO to install the stamper in an optimized orientation relative to the pembossing head


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4. Process results

AudioDev B600 BDR Pro: Jitter

Reference Disc SINGULUS

Only leading and trailing jitter of L0 is a little bit above specification limit of 6.5 %.specification limit of 6.5 %.


- 41 -

BLULINE II


- 42 -

Design


- 43 -

Design


- 44 -

Design


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Size Comparison BLU-LINE I vs BLULINE II

Lenght 6.6mWidth 4.9m Lenght 3.2m

Width 3.6m


- 46 -

Material flow BLULINE II SL


- 47 -

BLULINE II DL Material Flow


- 48 -

Production Methods for BD DL

Requirement for spin coated layer +- 1µm

• 22µm base-resin• 3µm pit-transfer-resinµ p• 72µm cover-layer• 3µm hard-coat-resin

Requirement for the BLULINE DL

• Controlled temperature in production cell• Uniform and constant disc temperature• Controlled IR exposure over radius of disc


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BLULINE II Conclusion

• New Cooling Conveyor with Target Temp. of 30°C at the Exit Position

• Internal Temp. Conditioning for Further Temp. Homogeneity Across the Disc

I d UV S i C T h l ith Di t M t D i• Improved UV-Spin-Cure Technology with Direct Motor Drive

• Nearly 100% Lacquer Recycling and Pressure Dispense System Integrated

• New and Smaller IR-Lamps for Optimized cl Homogeneity p p g y

• SiN Metallizer Integrated on Last Position Prior Inline Scanning

• Sputtering of Full-Reflective- and Semi-Reflective Layer with 1 Metallizer

• BD DL Lacquering Stations are Identical to cl Stations

• BD DL Wet-Embossing Station in Cooperation with Sony

• Layout on smallest Footprint to Produce BD SL/DL Products

• Inline BCA Optional Available


- 50 -

YOUR TOTAL SOLUTION FOR BD

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