sony bdp-s500

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Service manual v1.1 du lecteur Blue-Ray.3928Ko.

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SERVICE MANUAL US ModelCanadian ModelAEP ModelUK ModelRussian ModelAustralian ModelBDP-S500RMT-B101A/B101PSPECIFICATIONSVer. 1.1 2008.1SystemLaser: Semiconductor laserOutputs(Jack name: Jack type/Output level/Load impedance)AUDIO OUT L/R:Phono jack/2 Vrms/10 kilohmsDIGITAL OUT (OPTICAL): Optical output jack/18 dBm (wave length 660 nm)DIGITAL OUT (COAXIAL): Phono jack/0.5 Vp-p/75 ohms5.1CH OUTPUT: Phono jack/2 Vrms/10 kilohmsHDMI OUT:HDMI 19-pin standard connectorCOMPONENT VIDEO OUT(Y, PB,PR):Phono jack/Y: 1.0 Vp-p/PB, PR:progressive or interlace = 0.7 Vp-p/75 ohmsVIDEO: Phono jack/1.0 Vp-p/75 ohmsS VIDEO: 4-pin mini DIN/Y:1.0 Vp-p, C: 0.286 Vp-p/75 ohmsGeneralPower requirements:120 V AC, 60 Hz (US, Canadian)220-240 V AC, 50/60 Hz (Except US, Canadian)Power consumption: 33 WDimensions (approx.):430 99.2 361 mm (17 4 141/4in.) (width/height/depth) incl. projecting partsMass (approx.): 4.8 kg (103/4lb)Operating temperature:5 C to 35 C (41F to 95F)Operating humidity:25 % to 80 %Supplied accessoriesSpecifications and design are subject to change without notice. Video cord (phono plug 1) (1) Stereo audio cord (phono plug 2) (1) Power cord (1) Remote commander (remote) (1) Size AA (R6) batteries (2) GNU License Information (English only) (1)(Except US, Canadian)BLU-RAYDISCPLAYERTM 2 WARNING!!WHENSERVICING,DONOTAPPROACHTHELASEREXITWITHTHEEYETOOCLOSELY.INCASEITISNECESSARYTOCONFIRMLASERBEAMEMISSION,BESURE TOOBSERVEFROMADISTANCEOFMORE THAN 25cmFROMTHESURFACEOFTHEOBJECTIVELENSONTHEOPTICALPICK-UPBLOCK.CAUTIONUse of controls or adjustments or performance of proceduresother than those specified herein may result in hazardous ra-diation exposure.SAFETY-RELATEDCOMPONENTWARNING!!COMPONENTSIDENTIFIEDBYMARK0ORDOTTEDLINEWITHMARK0ONTHESCHEMATICDIAGRAMSANDINTHEPARTSLISTARECRITICAL TOSAFEOPERATION.REPLACETHESECOMPONENTSWITHSONYPARTSWHOSEPARTNUMBERSAPPEARASSHOWNINTHISMANUALORINSUPPLEMENTSPUBLISHEDBYSONY.Fig. A. Using an AC voltmeter to check AC leakage.1.5 k 0.15 FACvoltmeter(0.75 V)To Exposed MetalParts on SetEarth GroundLEAKAGE TESTThe ACleakagefromanyexposedmetalparttoearthgroundandfromallexposedmetalpartstoanyexposedmetalpart having a return to chassis, must not exceed 0.5 mA (500 mi-croamperes).Leakagecurrentcanbemeasuredbyanyoneofthree methods.1. A commercial leakage tester, such as the Simpson 229 or RCAWT-540A.Follow the manufacturers' instructions to use theseinstruments.2. A battery-operated AC milliammeter.The Data Precision 245digital multimeter is suitable for this job.3. MeasuringthevoltagedropacrossaresistorbymeansofaVOM or battery-operated AC voltmeter.The limit indica-tionis0.75V,soanalogmetersmusthaveanaccuratelow-voltage scale.The Simpson 250 and Sanwa SH-63Trd are ex-amples of a passive VOM that is suitable.Nearly all batteryoperated digital multimeters that have a 2V AC range are suit-able.(See Fig. A)1. Checktheareaofyourrepairforunsolderedorpoorly-sol-dered connections.Check the entire board surface for soldersplashes and bridges.2. Checktheinterboardwiringtoensurethatnowiresarepinched or contact high-wattage resistors.3. Look for unauthorized replacement parts, particularly transis-tors, that were installed during a previous repair.Point themout to the customer and recommend their replacement.4. Look for parts which, though functioning, show obvious signsof deterioration.Point them out to the customer and recom-mend their replacement.5. Check the line cord for cracks and abrasion. Recommend thereplacement of any such line cord to the customer.6. Check the B+ voltage to see it is at the values specified.7. Check the antenna terminals, metal trim, metallized knobs,screws,andallotherexposedmetalpartsforACleakage.Check leakage as described below.SAFETY CHECK-OUTAfter correcting the original service problem, perform the followingsafety checks before releasing the set to the customer:CAUTION:The use of optical instrument with this product will increase eyehazard.Unleaded solderBoards requiring use of unleaded solder are printed with the lead-free mark (LF) indicating the solder contains no lead.(Caution: Some printed circuit boards may not come printed withthe lead free mark due to their particular size.) : LEAD FREE MARKUnleaded solder has the following characteristics. Unleaded solder melts at a temperature about 40C higher thanordinary solder.Ordinary soldering irons can be used but the iron tip has to beapplied to the solder joint for a slightly longer time.Soldering irons using a temperature regulator should be set toabout 350C.Caution: The printed pattern (copper foil) may peel away if theheated tip is applied for too long, so be careful! Strong viscosityUnleaded solder is more viscous (sticky, less prone to flow) thanordinarysoldersousecautionnottoletsolderbridgesoccursuch as on IC pins, etc. Usable with ordinary solderIt is best to use only unleaded solder but unleaded solder mayalso be added to ordinary solder.ATTENTIONAUCOMPOSANTAYANTRAPPORTLASCURIT!LESCOMPOSANTSIDENTIFISPARUNEMARQUE0SURLESDIAGRAMMESSCHMATIQUESETLALISTEDESPICESSONTCRITIQUESPOURLASCURITDEFONCTIONNEMENT.NEREMPLACERCESCOM-POSANTSQUEPARDESPICESSONYDONTLESNUMROSSONTDONNSDANSCEMANUELOUDANSLESSUPPLMENTSPUBLISPARSONY.This label is located on the laser protective housing inside the enclosure.This appliance is classified as a CLASS1 LASER product. The CLASS1 LASER PRODUCT MARKING is located on the laser protective housing inside the enclosure. 3 TABLEOFCONTENTSSection Title Page Section Title PageSERVICE NOTE1. DISC REMOVAL PROCEDURE IF THE TRAYCANNOT BE EJECTED (FORCED EJECTION) .......... 42. TEST DISC.................................................................... 43. POSITION OF COUNTERMEASUREPARTS ............ 171. GENERALGetting Started .............................................................. 1-2Basic Operations ........................................................... 1-5Watching Movie Files .................................................... 1-8Listening to Music Files ................................................. 1-9Viewing Photo Files ....................................................... 1-10Changing the Initial Settings ......................................... 1-11Additional Information ................................................... 1-132. DISASSEMBLY AND REASSEMBLY2-1. Disassembly Flow ......................................................... 2-12-2. Upper Case ................................................................... 2-12-3. Front Display Block Assy............................................... 2-22-4. Tray Cover Assy ............................................................ 2-22-5. BD Drive (Service Use) ................................................. 2-32-6. MAIN Board ................................................................... 2-32-7. AU-258 Board ................................................................ 2-42-8. Power Block ................................................................... 2-42-9. Circuit Boards Location ................................................. 2-53. BLOCK DIAGRAMS3-1. Main Block Diagram ...................................................... 3-13-2. Audio Block Diagram..................................................... 3-33-3. FL/FR Block Diagram .................................................... 3-53-4. Power 1 Block Diagram ................................................. 3-73-5. Power 2 Block Diagram ................................................. 3-93-6. Power 3 Block Diagram ................................................. 3-114. SCHEMATIC DIAGRAMS AND PRINTED WIRINGBOARDS4-1. Frame Schematic Diagram............................................ 4-14-2. Printed Wiring Boards and Schematic Diagrams ......... 4-5AU-258 (ANALOG AUDIO) Schematic Diagram........... 4-5AU-258 Printed Wiring Board ........................................ 4-7FL-180 (1/2) (INDICATOR DRIVE)Schematic Diagram ....................................................... 4-11FL-180 (2/2) (DOOR DRIVE)Schematic Diagram ....................................................... 4-13FL-180 Printed Wiring Board ........................................ 4-15FR-276 Printed Wiring Board ........................................ 4-19FR-276 (LED DRIVE, FUNCTION KEY)Schematic Diagram ....................................................... 4-23IR-063 (CONNECTOR)Schematic Diagram ....................................................... 4-25IR-063 Printed Wiring Board ......................................... 4-265. TROUBLESHOOTINGMain Set, Power Supply Section................................... 5-1Operation&Display Section ........................................... 5-9Audio Section ................................................................ 5-13FL Section ..................................................................... 5-146. REPAIR PARTS LIST6-1. Exploded Views ............................................................. 6-16-1-1. Case Assy ................................................................ 6-16-1-2. Main Chassis Block .................................................. 6-26-1-3. Main Block ................................................................ 6-36-2. Electrical Parts List ....................................................... 6-4 4 cliptray2. TESTDISCPart No. Description LayerJ-6090-199-A BLX-104 Single LayerJ-6090-200-A BLX-204 Dual Layer3-702-101-01 CD (YEDS-18)J-6090-088-A HLX-504 Single Layer (NTSC)J-6090-089-A HLX-505 Dual Layer (NTSC)J-6090-077-A HLX-506 Single Layer (PAL)J-6090-078-A HLX-507 Dual Layer (PAL)2-1. Operation and DisplayCheck Items1) BLX-1041. Select 23.976Hz 1080p2. Play 4.Motion pictures3. Check whether player can play back or not4. Check each outputsVideo:Composite/S Video/ component/HDMIAudio:Digital out(Coaxial/Optical)/Audio out/5.1Ch output* When 1080/24p monitor is nothing, 1080i(59.94Hz or 50Hz) can use instead of 1080/24p.However this is temporary correspondence.2) BLX-2041. Select 1080i(59.94Hz or 50Hz)2. Play 4.M