us cms si tracker project presentation to the program management group at fermilab; 22 october 2004,...

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 1

US CMS Silicon Tracker Project


5.4 m

End Caps (TEC 1&2)

2,4

m

Inner Barrel & Disks

(TIB & TID)

Outer Barrel (TOB)

volume 24.4 m3

running temperature – 10 0C

210 m2 of Silicon Strips


Blue = double sided

Red = single sided

Strip lengths 10 cm (innermost) to 20 cm (outermost)

Strip pitches 80mm (innermost) to 200mm (outermost)

500

mm

hig

h

resi

stiv

ity

320

mm

th

ick

low

res

isti

vity

Silicon Strips


Kapton-bias circuit

Carbon Fiber Frame Silicon Sensors

Front-End Hybrid: Flex-ceramic laminate w/integral Kapton cable

Pitch Adapter

Kapton cable

Pins

Module Components


Single sided p/n • Industry standard

• Mass producible at low cost

Surface radiation damage• Increases strip capacitance (noise)

• p/n ok after inversion if adequately over-depleted

High Breakdown Voltages• Specific design and processing rules for guard & strip geometries

• Al strip layer acts as a field plate to remove high field region from Si bulk to Oxide

Technology

ROD INTEGRATION

AachenKarlsruheStrasbourgZurichWien

PETALS INTEGRATIONAachen

Brussels Karlsruhe

Louvain

Lyon Strasbourg

BrusselsWien Lyon

TEC assemblyTEC assembly

CERN

Frames:

BrusselsSensors:factories

Hybrids:Strasbourg

Pitch adapter:Brussels

Hybrid:CF carrier

TK ASSEMBLYAt CERN

LouvainStrasbourg

Pisa Perugia Wien

BariPerugia

Bari FirenzeTorinoPisaPadova

TIB-TID INTEGRATION

FNAL

UCSB

TOB assembly TIB-ID assemblyAt CERN Pisa Aachen Karlsruhe. --> Lyon

Karlsruhe

Pisa

Sensor QAC

Moduleassembly

Bonding &testing

Sub-assemblies

FNAL

US in the tracker

Integrationinto mechanics

RU

FNAL UCSB

UCSB

UCSB

UCSB


Covered in this talk

Status of Production parts• For Modules – Sensors, Hybrids and Module Frames

• For Rods – Rod Frames

US Readiness• US Group Evolution past year and upcoming year

• Status of all production equipment and manpower

Cost Performance and Schedule


Components Overview

Stockpiling Parts Now ↔ but with some caveats• Sensors (500 m thick)

• SGS Thomson (ST) ↔ Many problems. Production stopped

• Hamamatsu (HPK) ↔ Excellent quality. Deliveries behind expected

• Sensor Frames from Belgium/Pakistan: on track• Problems over the past few years appear to all be worked out for now

• Hybrids from Cicorel/Hybrid SA/CERN ↔ critical path• Several design flaws and processing quality issues uncovered.

• Last one now being resolved

• Rod Frames from Helsinki/CERN ↔ recent mistake found on some• Various residual problems have mostly been found and addressed.

• One found this week but not expected to cause any delays

• More may arise with experience..


• August ‘03 • US uncovered a problem with ST sensors

• December ‘03 (3 day sensor workshop at CERN) • Re-probing ~1000 sensors in US and EU indicates quality has degraded from

original• US group conclusion: degradation in time – possible chemical deterioration.

• January ’04: • Place orders with HPK for masks and prototypes

• February ’04: • ST agrees to significant changes in QC and stable processing with the aim of

being re-qualified at July ‘04 tracker week. Also agrees to cut order from 18,000 to 11,000. CMS places order with HPK for 7000 sensors

• May-July ’04: • ST delivers 1000 qualification sensors. US builds 177 modules. Sees time

evolution in at least 2 modules. Sensor groups see time evolution in 5% of sensors probed.

• Tracker week - July ’04: • probing groups together with ST uncover definitive evidence of corrosion

resulting from large phosphorous content in surface oxide. • ST is not qualified by CMS.

Timeline of ST Sensor Issue


CMN effect features: • Group of noisy strips with a “turn-on”

voltage at which all 128 channels show high noise

• can appear after thermal cycles

• often accompanied by other types of degradation such as pinhole development, more CMN

• Often correlated with high current

Later: a second chip develops a high noise channel which causes common mode noise

Channel previously only had a slightly higher noise (0.3 ADC)

Situation as of early‘04

1. Common Mode Noise (CMN)


100 200 300 400 500 6000,0

5,0x10-6

1,0x10-5

1,5x10-5

2,0x10-5

2,5x10-5

3,0x10-5

30210934875819 30210934875819novac

Leak

age

Cur

rent

[A

]

Voltage [V]

Strip 420 & 421 (4µA 15µA).Switching probe chuck vacuum on and off switches these strips on and off.Effect is reproducible.No visible defect seen.

without vacuum

with vacuum As of early‘04

2. Vacuum effect ↔ single strips !


OB2 sensors

“It’s like no diode I’ve ever seen Gromit” - Wallace

late ’03 early ’04

3. Peculiar IV Curves


As of early‘04

30211334388607

4. Long term instability


Good sensor

As of early‘04

5. Structure in leakage current


initial

3 hrs, no hum.nothing more

1h30, 40% RH Þnew stains on bias(not always visible on video, see later)

30 min, 40% RH Þ stainson guard first usually

As of July ’04 tracker week

6."Dots and Stains" development


Investigation by Strasbourg and Karlsruhe (with help of the Fraunhofer Institute Chemische Technologie)

The ratio of elements in white areas of stainsindicates the existence of Aluminum-oxide

Corrosion !

As of July ’04

"Dots and Stains" origin


Confirmation by ST

Passivation (1 µm)

Aluminum (2 µm)

Triple oxide layer (1.5 µm)

Aluminum corrosion

As of July ’04

Both dots and stains are micro-corrosions of the aluminum surface. The mechanism that drives this phenomenon can be the following:

Humidity reacts with Phosphorus (present in a 4% concentration into the passivation oxide) and forms an acid (probably H3PO4), that corrodes a superficial layer of Aluminum.

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 18As of July ’04

Failure rate of qualification sensors in 72 h period is 5%

233 sensors tested 72h (room temeperature, r.h.=25-30%)

7a. Long term sensor tests


7b. Long term TOB module tests

sec

Maxed out ADCBits at this pointnA After 7 hours, bias

current started to increase

New high noise channels seen in subsequent tests

Dark marks on bias ring occur near high noise channels


22 modules tested1 module with current increase during LT test

As of July ’04

7c. Long term TEC module tests


The Current Situation

Need 18,200 thick sensors installed in CMS tracker• 20,000 total (10% spares) originally all ST

• Shifted orders to HPK: • Winter ’04: 7,000

• Summer ’04: 4,500

• Autumn ’04: 5,200

• TOTAL of 16,700: (1,500 short of installation requirement)

• Agree to accept ~3,000 sensors from ST • Installation of at least 1,500

HPK Shipments • Started on schedule in June ’04

• Did not yet reach levels expected


Original Schedule

Jan-04 Feb-04 Mar-04 Apr-04 May-04 Jun-04 Jul-04 Aug-04 Sep-04 Oct-04

Mask Production

Sensor Pre-Production

Sensor Qualification 240

Sensor Production 540 1000 1500 1500 1500 1500

Cumulative Production 540 1540 3040 4540 6040 7540

Sensor Acceptance 500 1000 1500 1500 1500

Initial plan showed 1st 7000 sensors delivered by November Current: ~4000 delivered. Met with Yamamoto (v.pres.HPK) Oct. 11 at CERN (JI on video:

• 3 problems identified: (One month lost while analyzing problems)1. Poly Silicon – operator error caused over-etching2. Backside SiO2 too thin – caused high leakage currents3. Scratches – due to a problem with automated handling devices

• Recent batches have ~75% yield allowing ~1300/mo. rate• If achieve 85-90% then will deliver ~1500/mo.

Agreed: if order placed by Jan. HPK can deliver all 16,700 by Oct. 2005• Also discussed option to extend quantity by 3,000


Summer 2003 US finds broken cable traces• US reviews handling and studies alternative handling schemes• CERN finds breaks are widespread• Vendor says design is fatally flawed

• New design implemented after only 2 months delay

Winter 2004 US finds strange failure mode in modules• US traces the problem to the hybrid• CERN responds instantaneously – halts all hybrid production

• Find vias are not properly plated, with breaks occurring at unknown rate• US Halts production of TOB and TEC modules except for ST qualification• Many TEC & TIB modules already done in EU (small radius HPK thin sensor

modules)• EU continues building

Summer 2004: Vendor bought out. • Management serious about solving this problem, with better resources. • 4 variations of design processed

Autumn 2004: QC Engineer at vendor - all trials are highly successful!• Week October 15 2004 CMS qualifies substrate• Week October 22 – CMS to qualify fully loaded hybrids

Timeline of Hybrid Issues


Flex cable fragility

• Problem was quickly solved • Good US/CERN relationship

• CERN relationship with vendor

1.Hybrid Cable Problem


CuExample of a good via

Example of a bad via

2.Good Vias and Bad Vias


US Hybrids Delivery Schedule

Oct. ’04: 200 TB hybrids • old processing, known via prob. – hesitant to use with HPK sensors

Nov.’04: 270 TOB hybrids • not the most recent design but all passed the testing, and fraction

was test with all passing extreme thermal testing

Jan.’05: 200 TOB + 100 TEC hybridsRamping up to Apr. ’05

• Monthly rates ~700 TOB, ~500 TEC• Half of the TEC will be sent back to Europe after they are wire-bonded

and tested at FNAL/UCSB/MEX

• Each of the 3 North American hybrid processing centers has a minimum sustainable capacity of > 24/d > 1600/mo

• We can lose a hybrid processing center at any time without loss of hybrid throughput


Winter-Spring ’03: CERN reports that modules arriving from US have huge numbers of damaged wirebonds

• US proposes a successful solution (encapsulate joints)

• CERN confirms

Winter-Spring ’04: Rochester studies find flexible mother cable in rod can damage module wirebonds in transport

• CERN/US engineers study problem and design Al stabilizers.

Autumn ’04: US Discovered error in cross-bar placement on roughly 50% of rod frames (type-H).

• Helsinki developing the repair method.

• US will ship back ~40 type H rod frames for repair

Large numbers of rods will be stockpiled in advance of full production of modules

Module and Rod Transportation


US CMS Tracker Group

• Brown University• R. Hooper, G. Landsberg, C. Nguyen, H. Nguyen

• University of California, Riverside (UCR)• P. Gartung, G. Hanson, G.Y. Jeng, G. Pasztor

• University of California, Santa Barbara (UCSB)• A. Affolder, S. Burke, C. Campagnari, F. Garberson, D. Hale, J. Incandela, • P. Kalavase, S. Kyre, J. Lamb, R. Taylor, D. White + technicians

• University of Illinois, Chicago (UIC)• E. Chabalina, C. Gerber, L. Nigra, T. Ten

• Fermilab (FNAL)• M. Demarteau, A. Ronzhin, K. Sogut, L. Spiegel, S. Tkaczyk + technicians

• University of Kansas (KU)• P. Baringer, A. Bean, L. Christofek, D. Coppage

• Mexican Consortium: • Cinvestav: H. Castilla, R. Perez, A. Sanchez• Puebla: E. Medel, H. Salazar• San Luis Potosi: A. Morelos

• University of Rochester (UR)• R.Demina, R. Eusebi, E. Halkiadakis, A. Hocker, S. Korjenevski, P. Tipton

19 joined group this past year (includes 3 UCSB technicians)- now adding a few more post-docs & students

9 left the group (includes KSU plus several from UCSB)


Preparations

Good parts in large quantities are coming in• Deliveries will not be smooth• Meeting the schedule will require

• Higher than expected peak production rates• Extremely robust and stable production lines• Well trained personnel

Previous proven capacity in US is 15 modules/day/site• Further capacity expansions

• Almost no further fabrication equipment needed and no expansion in test equipment required

• UCSB and FNAL have already completed these changes

• Achieve by extending work day (split shifts) and/or adding support personnel to major production tasks

Rates now possible:• FNAL: 18/day sustainable and 21-24/d peak• UCSB: 21/d sustainable and 27-30/d peak


Assembly Plates

UCSB Plates # Fabricated (parts made)

# Commissioned (ready to be used)

plates used in module production so far

TOB R-phi 7 7 7

TOB Stereo 3 3 3

TEC R5 R-phi 2 2 2

TEC R5 Stereo 2 2 2

TEC R6 5 5 5

TEC R7* 2 2 2

FNAL Plates

TOB R-phi 5 5 5

TOB Stereo 3 3 3

Total 29 29 29

Total of 29 plates in the US (capacity of 3 modules per plate)UCSB setup to do TEC.OR.TOB in any given day

All have been exercised and are ready for use.


US Production Steps/Status

Task Capacity Manpower issues Software

Issues?

Hardware

IssuesHybrid Bonding & Thermal Cycle

84/d Mexico not yet online No No

Module Assembly >50/d None No No

Module Bonding >50/d None No No

ARC Testing >50/d None No No

LT Testing 200/wk UCR post-doc search No No

ARC LED >50/d None No No

Module Reinforcing

>50/d None No No

Rod Assembly >6/d None No No

Single rod test >6/d UCSB post-doc search Yes Possibly

Multi-rod burn-in 32/wk


97% modules meet the current stringent geometric specs• Few failures are just outside the

relative angular requirement

US now applies 2nd order corrections • No new modules outside specs

Production quality excellent!• Single Sensor Modules

• 0.20% Faulty strips• Introduced faults < 0.1% rate

• Two Sensor Modules• 0.55% Faulty Strips

• Introduced faults < 0.1% rate

• Will be much lower w/HPK

Dx(Frame-Sensor) (mm)

Dx(Sensor-Sensor) (mm)

Dq(Frame-Sensor) (mdeg)

Dq(Sensor-Sensor) (mdeg)

Module Mechanical Precision


MC Study of effect of misalignments

on pt resolution:

single sample, pT=100 GeV

Recent US modules

Mean 0.0RMS 3.5 mMin -7 mMax +7 m

Misalignments and PT Resolution


Hybrid Thermal Cycler/ARCS Status

Recently upgraded code• PLL forcing

• Drifting pedestal check

• Added xml file auto-upload

UCSB, FNAL and Mexico City test stands are commissioned and ready

SetSet--up in Clean Roomup in Clean Room

SetSet--up in Clean Roomup in Clean Room

ChillerChiller

Cold BoxCold Box

PC for MonitoringPC for Monitoring+ Controlling+ Controlling

ElectronicsElectronics

Gas/Water Flow ControlGas/Water Flow Control

We have all ARCS equipment+spares we need


DAQ Equipment Status

2 fully equipped Vienna boxes at UCSB and FNALUCR Vienna box has enough DAQ equipment for 4 slot stand

• TPO needed for 6 slots2 single-rod stands

• Just received enough oMUX cards so re-cabling between rod types unnecessary

2 multi-rod thermal cyclers

• Both MUXs have been used to test 5 rods tested simultaneously

• Have enough equipment to fully commission system

• Only 5 MUX cards + DAQ spares missing

To instrument UCR Repair Center & have all critical spare components required in the US we need:

• 2 TSC – in production?

• 3 TPO – in production?

• 2 eMUX boards – “ “

• 7 oMUX boards – “ “

• 5 VUTRI - in production

• 10 PAACB – half are built, half being assembled now

• 10 hybrid-to-utri adaptors – in production


DAQ Equipment Status II

With current TPOs :• With 1 failure we lose either:

• 70% capacity of a Vienna box• 1 single rod system • 1 multi-rod system

• Cannot run more than 16 APVs in UCR stand

Without the additional MUX, VUTRI, PAACB, hybrid-to-utri adapter boards

• Can’t run UCR LT at full capacity which is crucial to ops of US Repair center

With current TSC complement:• With 1 failure we lose either:

• 1 Vienna box• 1 single rod stand, or• 1 rod thermal cycler

Component shortages and failures ↔ potential to severely limit production testing capacity


Backup Equipment

Spare sensor and hybrid tools were produced at UCSB for UCSB, FNAL and Brussels.

Upgraded OGP computer OS and OGP software• Automated routine occasionally missed fiducial marks. The new

software fixes this problem.

Set up back-up gantry computers with spare U600 controllers and expansion cards already installed.

We purchased backup components for every piece of production equipment or tooling that, if it were to fail, would cause a reduction in production rates.


US Module Types


6 R6 modules built using new HPK sensors

All 6 modules are perfect• Not a single flaw

IV profile as expected• Turn-on at low voltage

• Plateau bias current ~ 600-700 nA

HPK R6 Module I-V

0

100

200

300

400

500

600

700

800

0 50 100

150

200

250

300

350

400

450

Bias Voltage (V)

Bia

s C

urr

ent

(nA

) 29587

29589

29592

27627

27628

27629

First HPK Module Results From UCSB


UCSB TEC Production

Miscellaneous info• Have built all required types successfully: R5S, R5N, R6, R7• 25 shipping boxes (20 modules each) built • All carrier plates (100 per type) and all wirebond fixtures complete

Capacity • Could saturate UCSB production capacity with TEC modules

• Will depend on need and availability of parts as well as TOB production parts availability and schedule

• Another step higher in production capacity (by extending work day via overlapped shifts):

• Bonding and Testing capacity adequate• LT testing capacity limit is ~100 per week • Eventually will be mostly TEC (TOB burn-in shifted to rods) or sampled


Outstanding problems/issues

DB stability• For our production rates, we must automate all DB queries.

• Need to standardize and maintain stable all data structures

• We rely on data to be accurate and complete from all preceding processing of components and structures.

• Successfully collaborating with our int’l colleagues

Old or un-installable components• Prefer to remove them physically from our production sites and to

have them properly marked in DB

Rods• We have recently achieved major milestones with rods but we are

not out of the woods. See below


Rods

Rod assembly understoodRod Testing

• Single rod testing is under control

• Multi-rod• Had many problems with software and hardware

• Recently achieved major milestone at FNAL• Can now run maximum at capacity (8 SS rods or 6 DS rods – i.e. up to 72

modules) for 3 days with thermal cycles!

Remaining• Get UCSB multi-rod test stand operational at same level as FNAL

• Had problems with some hardware- now fixed

• To finalize fault finding tests

• Finalize Database info and transfer methods

Need experience with many rods to determine if there are issues with components.


Mechanics:Tracker Outer Barrel

0.9 m0.9 m

Full Prototype Wheel(for MSGCs)

Final Cylinders at CERN

Rods before/after modules installed


Support mechanics : Support mechanics : CF space frames CF space frames

and/or Honeycomb and/or Honeycomb structuresstructures

Mechanics: Tracker Inner Barrel


Digital Optical Hybrid

Interconnect Board

Analogue Optical Hybrid

Frontend Hybrid R#2

R#4

R#6

Mechanics:Tracker End Caps


May 2003 Beam Test (Bunched 25 ns beams of muons and pions)

• Systems of 6-10 TIB, TEC, TOB modules

Detector performance as expected!

May 2004 Beam Test• Multiple rods, petals, and shells

• Larger system integration tests

• Tracking tests• Position resolution, hit efficiency

Beam Direction

Substructures in Test Beams

Michael Eppard Test General Meeting 23.07.2004

The TOB Cosmic rack

in the test beamin June 2004

Michael Eppard (CERN)on behalf of TOB CERN

23rd July 2004

http://cms-ul-tmb.web.cern.ch/CMS_TMB/personal/anttila/crack/Photos/Testbeam2/IMG_2118.JPG


S/N > 32

S/N Module 4 @ 300V (PEAK)


Ivan Reid

ORCA reconstruction of tracks


Cost Performance

Delays have cost us• Recently extended production to Jan. 2006

• Net increase of 600k$ in project

Other US costs• Paid for Masks (NRE) at Hamamatsu to be able to transfer sensor

order from ST• 290k$

• Misc. equipment for higher/more robust production• ~100K$

Anticipated costs • US Tech. to work at CERN on hybrids for 6 months

• 50k$ (?)

Currently schedule has no contingency…


SST Schedule

Completion: Jan. 2006

An aggressive schedule

Will be revised:

Assumes 500 hybrids/wk

Actual 400 hybrids/wk


Summary

No longer have a manpower shortage• In process of adding some personnel at UCSB

Have studied all possible threats to production stability• Purchased or manufactured spares

Further increased capacity to ~50 modules/d• Requires manpower (~ 4-5 FTE total)

Systems• All stages of production have been exercised and are near to final

except rod testing

• Multi-rod stands rapidly converging


Strips have been at war with poor components• ST sensors have too many uncertainties

• Switched to HPK!

• Hybrids problem is solved – large deliveries starting early ‘05

US Role has been extremely importantWe are doing everything we can do

Conclusion

us cms si tracker project presentation to the program management group at fermilab; 22 october 2004,...

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