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ZXMP M820 Product Description


ZTE Confidential Proprietary 1

ZXMP M820

Product Description Version Date Author Reviewer Notes

V2.4 2009-07-02 Zhao Shuai Wei Xiaoqiang Not open to the Third Party

V2.5 2010-04-14 Chi Yongjie Wei Xiaoqiang Not open to the Third Party

V2.51 2010-02-28 Zhao Shuai Wei Xiaoqiang Not open to the Third Party

V2,52 2012-06-30 Zhao Shuai Tu Yong Not open to the Third Party

V2,60 2013-1-30 Zhao Shuai Xu Kun Not open to the Third Party

© 2011 ZTE Corporation. All rights reserved.

ZTE CONFIDENTIAL: This document contains proprietary information of ZTE and is not to be disclosed or used

without the prior written permission of ZTE.

Due to update and improvement of ZTE products and technologies, information in this document is subjected to

change without notice.


2 ZTE Confidential Proprietary

TABLE OF CONTENTS

1 Overview .......................................................................................................... 13

2 Highlight Features ........................................................................................... 15

2.1 Large Capacity and Easy Upgrade .................................................................... 15

2.2 Single 100Gbit/s system .................................................................................... 15

2.3 Single 40Gbit/s system ...................................................................................... 15

2.4 Super-long-haul Transmission ........................................................................... 16

2.5 Multi-service Access Mode ................................................................................ 17

2.6 Flexible networking modes ................................................................................. 17

2.7 Wavelength Add/Drop Functions ........................................................................ 17

2.8 Reliable Protection Functions ............................................................................ 18

2.9 Performance Monitoring Technology.................................................................. 18

2.10 Power Management Technology ........................................................................ 18

2.11 Powerful NM ...................................................................................................... 18

2.12 WASON ............................................................................................................. 19

3 Functionality .................................................................................................... 20

3.1 Functions ........................................................................................................... 20

3.1.1 Large Transmission Capacity ............................................................................. 20

3.1.2 Ultra-long-haul Distance Optical Source ............................................................ 20

3.1.3 Optical Amplifier ................................................................................................. 21

3.1.4 Power Management ........................................................................................... 22

3.1.5 Performance Detection Function ........................................................................ 25

3.1.6 OTN Description ................................................................................................ 26

3.1.7 Dispersion Management .................................................................................... 26

3.1.8 Service Functions .............................................................................................. 27

3.1.9 Wavelength Add/Drop Function ......................................................................... 28

3.1.10 Communication and Monitoring Functions ......................................................... 29

3.1.11 Time/Clock Synchronization Service .................................................................. 32

3.1.12 Alarm Input /Output Function ............................................................................. 33

3.1.13 System Level Protection .................................................................................... 33

3.1.14 Network level Protection .................................................................................... 34

3.1.15 Network management channel backup .............................................................. 37

3.1.16 L0/L1/L2 integrated transport technologies ........................................................ 39

3.1.17 ROADM Function ............................................................................................... 39

3.1.18 Electrical Cross-Connect Function ..................................................................... 41

3.1.19 Wavelength Tuning Function ............................................................................. 43

3.1.20 IWF Function ..................................................................................................... 45

3.2 Networking ......................................................................................................... 47



3.2.1 System Applications ........................................................................................... 47

3.2.2 Networking Modes ............................................................................................. 53

3.3 Transmission Codes Supported ......................................................................... 56

4 System Architecture ........................................................................................ 61

4.1 Description of System Functional Platform ......................................................... 61

4.1.1 Optical transfer platform ..................................................................................... 61

4.1.2 Service convergence platform ............................................................................ 62

4.1.3 OM/OD platform ................................................................................................. 62

4.1.4 Add/drop platform .............................................................................................. 63

4.1.5 Optical amplifying platform ................................................................................. 63

4.1.6 Monitoring platform ............................................................................................ 63

4.2 Hardware Architecture ....................................................................................... 63

4.2.1 Sub-rack ............................................................................................................ 63

4.2.2 Board Description .............................................................................................. 66

4.3 The NM Software System Structure ................................................................... 78

4.3.1 Hierarchical structure ......................................................................................... 79

4.3.2 Interface description ........................................................................................... 81

4.4 System Configuration ......................................................................................... 82

4.4.1 Optical Terminal Multiplexer (OTM) ................................................................... 82

4.4.2 Optical Add/Drop Multiplexer (OADM) ................................................................ 82

4.4.3 Optical Line Amplifier (OLA) ............................................................................... 85

5 Technical Specifications ................................................................................. 87

5.1 Working Wavelength Requirements ................................................................... 87

5.1.1 Wavelength Allocation in 8/16/32/40-Channel Systems ..................................... 87

5.1.2 Wavelength Allocation in 48/96 Wavelength System .......................................... 88

5.1.3 Wavelength Allocation in 80/160 Wavelength System ........................................ 90

5.1.4 Wavelength Allocation in 176-Channel Systems ................................................ 94

5.1.5 Wavelength Allocation in 192-Channel Systems ................................................ 94

5.2 System Component Indices ............................................................................... 98

5.3 OMU/ODU Unit Specifications ........................................................................... 99

5.3.1 Specifications of OMU Board ............................................................................. 99

5.3.2 Specifications of ODU Board............................................................................ 101

5.3.3 Specifications of ODUB Board ......................................................................... 102

5.3.4 Specifications of VMUX Board ......................................................................... 103

5.3.5 Specifications of VMUXB Board ....................................................................... 104

5.3.6 Specifications of OCI Board ............................................................................. 104

5.3.7 Specifications of OBM Board ........................................................................... 105

5.4 WSUA/WSUD & WBU Unit Specifications........................................................ 106

5.5 OADM Unit Specifications ................................................................................ 110

5.6 OA Unit Specifications ..................................................................................... 110



5.6.1 Specifications of EOBA (Enhanced Optical Booster Amplifier) Board............... 111

5.6.2 Specifications of EOLA (Enhanced Optical Line Amplifier) Board .................... 117

5.6.3 Specifications of EOPA (Optical preamplifier) Board ........................................ 118

5.6.4 Specifications of EONA (Enhanced Optical Node Amplifier) Board .................. 124

5.6.5 Specifications of SEOBA Board ....................................................................... 127

5.6.6 Specifications of SEOPA Board ....................................................................... 129

5.6.7 Specifications of SEOLA Board ........................................................................ 131

5.6.8 Specifications of EDFA+RAMAN Board ........................................................... 133

5.6.9 Specifications of RPOA Board ......................................................................... 135

5.6.10 Specifications of LAC Board ............................................................................ 135

5.7 OTU Unit Specifications ................................................................................... 136

5.7.1 Specifications of 2.5Gbit/s Board ..................................................................... 136

5.7.2 Specifications of 10Gbit/s Board ...................................................................... 138

5.7.3 Specifications of 40Gbit/s Board ...................................................................... 141

5.7.4 Specifications of 100Gbit/s Board .................................................................... 143

5.8 Service Convergence Technical Specifications ................................................ 145

5.8.1 Specifications of SRM41 Board ........................................................................ 145

5.8.2 Specifications of SRM42 Board ........................................................................ 147

5.8.3 Specifications of MQT3 Board.......................................................................... 149

5.8.4 Specifications of MX2 Board ............................................................................ 151

5.8.5 Specifications of FCA Board ............................................................................ 153

5.8.6 Specifications of MOM2 Board ......................................................................... 154

5.8.7 Specifications of GEM8 Board ......................................................................... 155

5.8.8 Specifications of SDSA Board .......................................................................... 157

5.8.9 Specifications of DSA Board ............................................................................ 158

5.8.10 Specifications of DSAF Board .......................................................................... 160

5.8.11 Specifications of GEM2/GEMF Board .............................................................. 161

5.8.12 Specifications of ASMA Board ......................................................................... 162

5.8.13 Specifications of TD2C Board .......................................................................... 164

5.8.14 Specifications of MQA1 Board ......................................................................... 165

5.8.15 Specifications of MQA2 Board ......................................................................... 167

5.8.16 Specifications of MJA Board ............................................................................ 168

5.9 Electrical Cross-connection Subsystem Specifications .................................... 169

5.9.1 Specifications of CH1 Board ............................................................................ 169

5.9.2 Specifications of CO2 Board ............................................................................ 170

5.9.3 Specifications of CQ2 Board ............................................................................ 171

5.9.4 Specifications of CS3 Board ............................................................................ 172

5.9.5 Specifications of CD3 Board ............................................................................ 172

5.9.6 Specifications of LO2 Board ............................................................................. 175

5.9.7 Specifications of LQ2 Board ............................................................................. 176

5.9.8 Specifications of LD2B Board........................................................................... 178

5.9.9 Specifications of LS3 Board ............................................................................. 178



5.10 Tributary overhead processing of convergence board ...................................... 180

5.11 OS Channel (SOSC) Unit Specifications .......................................................... 181

5.12 Supervision Unit Specifications ........................................................................ 181

5.13 Dispersion Compensation Unit Specifications .................................................. 182

5.14 Dispersion compensation unit (DCU) Performance Indices .............................. 182

5.15 Physical Performance ...................................................................................... 183

5.15.1 Structure Indices .............................................................................................. 183

5.15.2 Bearing Requirements of the Equipment Room ............................................... 188

5.15.3 Power Supply Indices ...................................................................................... 188

5.16 Environment Conditions ................................................................................... 193

5.16.1 Grounding Requirements ................................................................................. 193

5.16.2 Temperature and Humidity Requirements ........................................................ 194

5.16.3 Requirements for Cleanness ............................................................................ 194

5.16.4 Dustproof and Corrosion-Proof Requirements ................................................. 195

5.16.5 Environment for Storage .................................................................................. 195

5.16.6 Environment for Transportation ........................................................................ 196

5.16.7 Electronic Static Discharge (ESD) .................................................................... 197

5.16.8 Safety requirements ......................................................................................... 199

5.17 Introduction to Interfaces .................................................................................. 202

5.17.1 Interface on SEIA board ................................................................................... 202

5.17.2 Interface on SPWA board ................................................................................ 206

6 Abbreviation .................................................................................................. 209

7 Followed Standards and Recommendations ............................................... 214



FIGURES

Figure 1-1 Rack Diagram of Unitrans® ZXMP M820 ...........................................................13

Figure 1-2 ZTE’s New-Generation Digital Transmission Product Family ............................14

Figure 3-1 Principles of RA ................................................................................................22

Figure 3-2 Power management sub-system .......................................................................24

Figure 3-3 Dispersion management ...................................................................................27

Figure 3-4 Position of supervision subsystem ....................................................................32

Figure 3-5 The Block Diagram of Optical Path 1: N Protection Function ............................34

Figure 3-6 Optical Path Layer 1+1 Protection (Chain Networking) .....................................35

Figure 3-7 Ring Networking ...............................................................................................36

Figure 3-8 Functional Block Diagram for MS 1+1 Protection ..............................................36

Figure 3-9 Schematic diagram of 2-fiber bidirectional path shared protection ....................37

Figure 3-10 Network management through supervisory channel .......................................38

Figure 3-11 Network management through backup supervisory channel ...........................39

Figure 3-12 Electrical Cross-Connect System Structural Diagram .....................................42

Figure 3-13 Functional Blocks of IWF Function (External Wavelength Feedback) .............46

Figure 3-14 Whole Network Application with the ZXMP M820 (the System less than 48-Wavelength) ....................................................................................................................47

Figure 3-15 Whole Network Application with the ZXMP M820 (the System with 80/96-Wavelength) ...............................................................................................................49

Figure 3-16 Whole Network Application with the ZXMP M820 (160/176- Wavelength) .......50

Figure 3-17 Whole Network Application with the ZXMP M820 (the System with 192-Wavelength) ..................................................................................................................52

Figure 3-18 Point-to-Point Networking (Short-Haul) ...........................................................54

Figure 3-19 Point-to-Point Networking (Long-Haul) ............................................................54

Figure 3-20 Application of Chain Networking .....................................................................54

Figure 3-21 Application of Ring Networking .......................................................................55

Figure 3-22 Ring-with-Chain Networking ............................................................................55

Figure 3-23 Cross Connection Networking .........................................................................56

Figure 4-1 Functional Blocks of the ZXMP M820 ...............................................................61



Figure 4-2 Layout of ZXMP M820 NX Sub-rack (21 inch) ..................................................64

Figure 4-3 Layout of ZXMP M820 NX Sub-rack (19 inch) ..................................................64

Figure 4-4 Slot Arrangement of CX Sub-rack .....................................................................65

Figure 4-5 Slot Arrangement of DX Sub-rack .....................................................................65

Figure 4-6 Hierarchical Structure of the Element Management Software ...........................79

Figure 4-7 Functional Blocks of the OTM ...........................................................................82

Figure 4-8 Functional Blocks of the FOADM ......................................................................83

Figure 4-9 Optical Connection of ROADM Equipment with WBU Boards ...........................84

Figure 4-10 Optical Connection of ROADM Equipment with WBM Boards .........................84

Figure 4-11 Optical Connection of ROADM Equipment with WSU Boards .........................85

Figure 4-12 Functional Blocks of the OLA ..........................................................................86

Figure 5-1 Schematic Diagram of the DWDM System ........................................................98

Figure 5-2 Common Interface Area of the OTU Sub-rack ................................................ 202

Figure 5-3 Interfaces on the SPWA board ........................................................................ 206



TABLES

Table 3-1 Characteristics of dual/single pump source ........................................................22

Table 3-2 ZTE Networking Scheme and Application Environment .....................................40

Table 3-3 ZTE/ ROADM Solutions .....................................................................................41

Table 3-4 Boards Supporting Wavelength Tuning Function ...............................................44

Table 3-5 Transmission Codes Supported by 40 2.5Gbit/s System (G.652&G.655) .........56

Table 3-6 Transmission Codes Supported by 40 /48 10Gbit/s System (G.652&G.655) ....57

Table 3-7 Transmission Codes Supported by 80/96 10Gbit/s System (G.652&G.655) ....57

Table 3-8 Transmission Codes Supported by 192 10Gbit/s System (G.652&G.655) .......58

Table 3-9 Transmission Codes Supported by 40/48 40Gbit/s System (G.652&G.655) ....58

Table 3-10 Transmission Codes Supported by 80/96 40Gbit/s System (G.652&G.655) ..58

Table 3-11 Transmission Codes Supported by 80 100Gbit/s System (G.652 with DCM) .59

Table 3-12 Transmission Codes Supported by 80 100Gbit/s System (G.652 without DCM) .............................................................................................................................................59

Table 3-13 Transmission Codes Supported by 80 100Gbit/s System (G.655 with DCM) .59

Table 3-14 Transmission Codes Supported by 80 100Gbit/s System (G.655 without DCM) .............................................................................................................................................60

Table 4-1 Board Description ..............................................................................................66

Table 5-1 Wavelength Allocation (8/16/32/40-channel, C band) .........................................87

Table 5-2 Wavelength Allocation (48/96-channel, C band).................................................88

Table 5-3 Wavelength Allocation (80-channel, C band) .....................................................90

Table 5-4 Wavelength Allocation (80-channel, L band) ......................................................92

Table 5-5 Wavelength Allocation (192-channel, C band) ...................................................94

Table 5-6 Meaning of Components and Interfaces of the DWDM System ..........................98

Table 5-7 Technical specifications of OMU Board ..............................................................99

Table 5-8 Technical specifications of ODU Board ............................................................ 101

Table 5-9 Technical Specifications of the ODUB Board ................................................... 102

Table 5-10 Technical specifications of VMUX Board ........................................................ 103

Table 5-11 Technical specifications of VMUXB Board ..................................................... 104



Table 5-12 Technical Specifications of the OCI Board (100GHz-50GHz) ......................... 104

Table 5-13 Technical Specifications of the OCI Board (50GHz-25GHz) ........................... 105

Table 5-14 Technical Specifications of the OBM Board ................................................... 105

Table 5-15 Technical specifications of WBU Board .......................................................... 106

Table 5-16 Technical specifications of WSUA/WSUD Board ............................................ 107

Table 5-17 Technical specifications of WBM Board ......................................................... 107

Table 5-18 Technical specifications of PDU-4-X Board .................................................... 108


Table 5-20 Technical specifications of PDU-8-X board .................................................... 109


Table 5-22 Technical specifications of PDU-16-X Board .................................................. 109

Table 5-23 Technical specifications of OADM Board ....................................................... 110

Table 5-24 Technical specifications of 40-channel EOBA Board (C/L-band) .................... 111

Table 5-25 Technical specifications of 80-channel EOBA Board (C/L-band) .................... 112

Table 5-26 Technical specifications of 48-channel EOBA Board (C-band) ....................... 114

Table 5-27 Technical specifications of 96-channel EOBA Board (C-band) ....................... 115

Table 5-28 echnical specifications of 40/80-channel EOLA Board (C/L-band) ................. 117

Table 5-29 Technical specifications of 40-channel EOPA Board (C/L-band) .................... 119

Table 5-30 Technical specifications of 40-channel EOPA Board (C/L-band) .................... 120

Table 5-31 Technical specifications of 48-channel EOPA Board (C-band) ....................... 122

Table 5-32 Technical specifications of 96-channel EOPA Board (C-band) ....................... 123

Table 5-33 Technical specifications of 40/80-channel EONA Board (C/L-band) ............... 124

Table 5-34 Technical specifications of 48/96-channel EONA Board (C/L-band) ............... 126

Table 5-35 Technical specifications of 40/80-channel SEOBA Board (C- Band) .............. 128

Table 5-36 Technical specifications of 40-channel SEOPA Board (C-band) .................... 129

Table 5-37 Technical specifications of 80-channel SEOPA Board (C-band) ..................... 130

Table 5-38 Technical specifications of 40/80-channel SEOLA Board (C-band) ................ 131

Table 5-39 Technical specifications of RAMAN_P amplifier ............................................. 133

Table 5-40 Technical specifications of EDFA+RAMAN Amplifier ..................................... 133

Table 5-41 Performance Parameters of RAMAN_B amplifier ........................................... 134



Table 5-42 Technical specifications of RPOA amplifier .................................................... 135

Table 5-43 Technical Specifications of LAC Board .......................................................... 136

Table 5-44 Technical specifications of 2.5Gbit/s Board at Client-side .............................. 136

Table 5-45 Technical specifications: of 2.5Gbit/s Board at Line-side ................................ 137

Table 5-46 Technical specifications of 10Gbit/s Board at Client-side ............................... 138

Table 5-47 Technical specifications of 10Gbit/s Board at Line-side .................................. 139

Table 5-48 Technical specifications of 40Gbit/s Board at Client-side ............................... 141

Table 5-49 Technical specifications of 40Gbit/s Board at Line-side .................................. 142

Table 5-50 Technical specifications of 100Gbit/s Board at Client-side ............................. 143

Table 5-51 Technical specifications of 100Gbit/s Board at Line-side ................................ 144

Table 5-52 Technical specifications of SRM41 board ....................................................... 145

Table 5-53 Technical specifications of SRM42 Board ...................................................... 147

Table 5-54 Client-Side Technical specifications of MQT3 board ...................................... 149

Table 5-55 Line-side Technical specifications of MQT3 Board ......................................... 150

Table 5-56 Client-Side Technical specifications of MX2 board ......................................... 151

Table 5-57 Line-side Technical specifications of MX2 Board ........................................... 152

Table 5-58 Technical specifications of FCA Board ........................................................... 153

Table 5-59 Specification of MOM2 Board ......................................................................... 154

Table 5-60 Technical specifications of GEM8 Board ........................................................ 155

Table 5-61 Specification of SDSA Board .......................................................................... 157

Table 5-62 Technical specifications of DSA Board ........................................................... 158

Table 5-63 Technical specifications of DSAF Board......................................................... 160

Table 5-64 Technical specifications of GEM2/GEMF Board ............................................. 161

Table 5-65 Technical specifications of ASMA Board ........................................................ 162

Table 5-66 Technical specifications of TD2C board ......................................................... 164

Table 5-67 Technical specifications of MQA1 board ........................................................ 165

Table 5-68 Technical specifications of MQA2 Board ........................................................ 167

Table 5-69 Technical specifications of MJA board ........................................................... 168

Table 5-70 Technical specifications of CH1 Board ........................................................... 169

Table 5-71 Technical specifications of CO2 board ........................................................... 170



Table 5-72 Technical specifications of CQ2 board ........................................................... 171

Table 5-73 Technical specifications of CS3 board ........................................................... 172

Table 5-74 Technical specifications of CD3 Board for 40GBASE-LR4 ............................. 172

Table 5-75 Technical specifications of CD3 board for 40G POS ...................................... 174

Table 5-76 Technical specifications of LO2 card .............................................................. 175

Table 5-77 Technical specifications of LQ2 board ............................................................ 177

Table 5-78 Technical specifications of LD2B board ......................................................... 178

Table 5-79 Technical specifications of LS3 board ............................................................ 178

Table 5-80 Tributary overhead processing of convergence board .................................... 180

Table 5-81 Technical specifications of SOSC Board ........................................................ 181

Table 5-82 Technical specifications of supervision unit at boards .................................... 181

Table 5-83 Technical specifications of dispersion compensation Board ........................... 182

Table 5-84 Main technical specifications of DCU Board ................................................... 183

Table 5-85 Dimensions and Weight of ZXMP M820 ......................................................... 183

Table 5-86 ZXMP M820 Board Weight............................................................................. 184

Table 5-87 Power Consumption of Commonly Used Boards/Units of ZXMP M820 .......... 188

Table 5-88 Temperature and Humidity Requirements ...................................................... 194

Table 5-89 Requirements for Harmful Gases in the Equipment Room ............................. 195

Table 5-90 Climate requirement ....................................................................................... 196

Table 5-91 Requirements for mechanical stress .............................................................. 196

Table 5-92 Climate requirement ....................................................................................... 196

Table 5-93 Static discharge anti-interference ................................................................... 197

Table 5-94 RF electromagnetic radiated susceptibility ..................................................... 197

Table 5-95 Electrical fast transient burst susceptibility at the DC power port .................... 197

Table 5-96 Electrical fast transient burst susceptibilities at the signal cable and control cable ports ................................................................................................................................... 198

Table 5-97 Surge susceptibility of DC power ................................................................... 198

Table 5-98 Surge susceptibility of the outdoor signal cable .............................................. 198

Table 5-99 Surge susceptibility of the indoor signal cable ................................................ 198

Table 5-100 Conductivity susceptibility of RF field ........................................................... 199



Table 5-101 Conductive emission electromagnetic interference at the direct current port 199

Table 5-102 Radio active emission electromagnetic interference ..................................... 199

Table 5-103 Definitions and Description for the Common Interface on SEIA1 .................. 204

Table 5-104 Definitions and Description for the Common Interface on SEIA2 .................. 205

Table 5-105 Definitions and Description for the Common Interface on SPWA ................. 207



1 Overview Unitrans ZXMP M820 Dense Wavelength Division Multiplexing Optical Transmission

Equipment is a metro oriented transmission system. It can multiplex up to 192

wavelengths (uni-direction) in a single-core fiber, with total transmission capacity of

1.92Tbit/s in 10G system, 3.84Tbit/s in 40G system and 8Tbit/s in 100G system. It offers

full-rate optical access capability from STM-1/OC-3 to 100GE, as well as complete

access capability for other services, such as POS, ATM, Ethernet and PDH. ZXMP M820

rack is illustrated in Figure 1-1.

Figure 1-1 Rack Diagram of Unitrans® ZXMP M820



Based on the development idea of “creating free, powerful and scalable optical

transmission networks”, ZTE develops its new-generation of digital transmission

products including Unitrans ZXWM M920 DWDM equipment which provides large

bandwidth and long-haul transmission at the backbone layer, ZXMP M820 DWDM

equipment, ZXONE 8000 DWDM equipment, ZXMP M721 DWDM/CWDM equipment,

and ZXMP M600 CWDM equipment.

The new-generation digital transmission products of ZTE can satisfy all applications from

the backbone network to end user access, and provide users with future-oriented overall

transmission solutions. The applications of ZTE’s optical transmission products is shown

in Figure 1-2

Figure 1-2 ZTE’s New-Generation Digital Transmission Product Family

ZXMP M820 is mainly applied to the metro core and m.



2 Highlight Features This chapter introduces the salient features of ZXMP M820.

2.1 Large Capacity and Easy Upgrade

ZXMP M820 can provide 1.92/3.84/8Tbit/s transmission capacity, fully satisfying the

ever-growing requirements on bandwidth. The system is designed with modular structure

and multi-rack management technology. It can be smoothly upgraded to 192-wavelength.

Its good scalability and expansibility can protect user’s investment maximally.

2.2 Single 100Gbit/s system

ZXMP M820 can support single 100Gbit/s system, and has following features:

Support 80 wavelengths

Support 80*100GE transmission and the capacity of at most 8T

PM-QPSK Coherent Rx modulation for ULH transmission

PM-QPSK Coherent Rx coding with SD-FEC has good OSNR tolerance and can

restrain the non-linear effect well. It can reach over 1500KM without the REG with

50GHZ spacing.

Embedded high-speed DSP technology realizes the compensation of dispersion

and PMD, so that the additional boards of PMD and CD compensation are reduced.

PM-QPSK coding can restrain the non-linear effect well. With DSP technology, the

PMD tolerance can support 30ps and CD tolerance can support +/-50000ps/nm.

2.3 Single 40Gbit/s system

ZXMP M820 can support single 40Gbit/s system, and has following features:



Support 96 wavelengths

Support 80/96*40G transmission and the capacity of at most 3.84T;

P-DPSK and RZ-DQPSK modulation for ULH transmission

Improved DPSK coding has good OSNR tolerance and can restrain the non-linear

effect well. It can reach 1500KM without the REG with 50GHz spacing.

RZ-DQPSK coding has good PMD tolerance and can restrain the non-linear effect

well. It can reach 2000KM without the REG with 50GHZ spacing.

Embedded TODC and EDFA and the same dispersion tolerance & power budget as

10G system.

OTU board is embedded with TODC and EDFA, the system allows the biggest

dispersion tolerance of -700ps/nm ~+700ps/nm, and the dispersion tolerance &

power budget are the same as 10G system.

Ultra high integration

40G board only needs 2 slots, with high integration and low power consumption.

Single rack supports 21×40G wavelengths.

For the OTN electrical cross-connection subsystem, this supports 2*40G in a single

slot for client side and 1*40G in a single slot for line side.

Smooth network upgrade

The 40G board can plug and play in the legacy equipment because the system is

developed on the existing WDM platform. It supports smooth upgrade from 10G to

40G without any service interruption.

2.4 Super-long-haul Transmission

With different optical transponder units (OTU), EDFA, FEC, AFEC and SD FEC

technologies, RZ/SRZ coding technology, P-DPSK/DQPSK/PM-QPSK coding

technology, distributed Raman amplifier(RAMAN), Remote pumped optical amplifier



(RPOA) and dispersion management technology, ZXMP M820 can perform super long

non-electric relay transmission from several kilometers up to thousands of kilometers.

2.5 Multi-service Access Mode

ZXMP M820 adopts an open design. The accessed optical signals can be converted to

ITU-T G.692 recommendation compliant wavelength signals for output by employing

optical/electric/optical conversion technology.

It supports transparent transmission of optical signals in multiple formats, such as

STM-N (N=1, 4, 16, 64,256), POS, GE/10GE/100GE, OTU1/2, ATM, ESCON,

FICON,DVB and FC, which protect users’ benefit and provide an ideal means for network

expansion.

ZXMP M820 also can multiplex low-rate services into 100GE, 40G, 10G or 2.5G rates

transparently to improve the availability of system wavelength.

2.6 Flexible networking modes

Functionality of ZXMP M820 can be changed from OLA to OADM to OTM by choosing

different combination of functional modules, making it more flexible for complicated

network topologies, such as chain, star, cross, tangent-ring and mesh networks.

2.7 Wavelength Add/Drop Functions

Filters in the ZXMP M820 can be configured flexibly to implement the adding/dropping of

1 to 80 wavelengths. With this kind of design, the ZXMP M820 supports both the FOADM

and the ROADM functions.

FOADM: This function is to implement the adding/dropping of fixed wavelengths.

ROADM: With this function, wavelengths to be added/dropped can be reconfigured.

Besides, add/drop ports can be assigned to these wavelengths flexibly, that is the

port-assignment function. ZXMP M820 support ROADM function based on WSS



technologies.

2.8 Reliable Protection Functions

ZXMP M820 can provide multiple and effective protection modes: Optical subnet

connection protective switchover(OSNCP); Unidirectional optical line protective

switchover (ULSR); Unidirectional optical channel protective switchover(UPSR);

Bidirectional optical line share protective switchover (BLSR); Bidirectional optical

channel share protective switchover(BPSR) etc. which with the switching time shorter

than 50ms. When ZXMP M820 is configured as OADM node on a ring network, route

protection of channels can be accomplished.

2.9 Performance Monitoring Technology

ZXMP M820 uses a board performance monitoring unit to capture board performance

data, which can be viewed to accurately locate a fault via NMS.

2.10 Power Management Technology

ZXMP M820 adopts excellent power management technology to adjust and control the

power and power spectrum at each point in the system.

ZXMP M820 system supports LAC(line attenuation control), APC(automatic power

control), AGC(automatic gain control) etc. technologies. The gain adjustment range of

LAC card is: 2-26dB; the gain adjustment range of general optical amplifier is ±5dB

which can both be adjusted via NM.

APC and AGC technologies can control the launched power/gain on MS level to ensure

hitless in-service insertion or removal of channels.

2.11 Powerful NM

NetNumenTM U31 (BN), adopted by ZXMP M820, can manage CWDM, DWDM, SDH,



PTN and Data equipments. The new generation network management system on NE

management layer/ subnet management layer is used to manage and supervise NE

equipment in the bearer network (BN).

Based on OSPF algorithm, the NMS has ECC automatic route function, that is to say the

ECC route between NEs can be set up automatically without manual configuration,

which could make the networking application easily and fast.

In addition, the NMS supports remote and online upgrade of NE software and board

software, provides management at multiple layers, i.e. NE layer, NE management layer

and network management layer, and offers the fault management, performance

management, security management, configuration management, maintenance

management and system management.

2.12 WASON

ZXMP M820 supports GMPLS/WASON control plane load, and has following features:

Rapid automatic route discovery

Strong ability for automatic resource discovery

Versatile resource management functions

Fast end-to-end service provisioning

Multi-level SLA

Standard technology and open platform

Flexible equipment upgradeability

Highly operable and maintainable



3 Functionality This chapter introduces the functions of ZXMP M820 in detail, including transmission,

ultra-long-haul distance transmission, power management, performance test, dispersion

management, service capability, communication monitoring, alarm input/output and

protection.

3.1 Functions

3.1.1 Large Transmission Capacity

Transmission system less than 48-wavelength employs on the C band with 100

GHz channel spacing.

80/96-wavelength transmission system employs on the C band via inter-leaver

technology with 50 GHz channel spacing.

3.1.2 Ultra-long-haul Distance Optical Source

ZXMP M820 employs the ultra-long-haul distance optical source technologies including

forward error correction (FEC) coding, advanced out band FEC coding, soft-decision (SD)

FEC coding, RZ code pattern and self-adaptive receiving.

FEC technique

i Description

FEC is a signal data processing technique. At the transmitting end, it sends the data with

the redundant code generated by the specific algorithm, while, at the receiving end,

according to the relevant algorithm, it checks and corrects the bit errors occurring during

transmission with the redundant codes, and restores the original signals.

ii Features

Improve the error tolerance capability of the transmission signals to reduce signal/noise

ratio required by the system, and extend the transmission distance.



The conventional FEC based on G.709 can increase the OSNR tolerance about 5~6 dB,

and the advanced FEC technique adopting more effective coding algorithm can increase

the OSNR tolerance about 7~9dB.

PM-QPSK Coherent Rx modulation for ULH transmission

PM-QPSK Coherent Rx coding with SD-FEC has good OSNR tolerance and can

restrain the non-linear effect well. It can reach over 1500KM without the REG

with 50GHZ spacing. Return to zero (RZ) technique

RZ code allows higher peak value of power than NRZ code, and the mean transmitting

optical power of RZ and NRZ code are on the same level, so it improves the signal/noise

ratio for receiving signals of the system.

And RZ code reduces signal power spectral density to effectively suppress non-linear

impact during transmission, so RZ code is more suitable for ultra-long-haul transmission.

Super RZ (SRZ) technique

With lower spectrum power density and higher suppression of the non linear effect than

RZ technique, the OSNR tolerance of back to back is less than 9dB, so it is suitable for

the long-haul or super long-haul transmission distance.

Self-adaptive receiving technology

The receiver adjusts the judgment point level and phase automatically according to the

signal receiving conditions, in order to obtain a higher Q value and lower bit error rate.

3.1.3 Optical Amplifier

Optical fiber amplifier of ZXMP M820 system is based on single-stage mode or

double-stage mode. Enhanced Optical Booster Amplifier (EOBA),,Enhanced Optical

Line Amplifier (EOLA) and Enhanced Optical Preamplifier (EOPA) is based on

single-stage mode , and Enhanced Optical Node Amplifier(EONA) is based on

double-stage mode. EOBA,,EOLA and EONA use dual pumps, and EOPA use single

pump or dual pumps. The wavelength of single pump source is 980nm, and the

wavelengths of dual pump sources are 980nm and 1480nm. Gain flatness is ±1dB. Extra

metal ion and Gain Flattening Filter (GFF) can be added to ensure OA gain flatness.



Characteristics of dual/single pump source of EDFA are shown as below:

Table 3-1 Characteristics of dual/single pump source

Quantity of pump source

Wavelength Output power

Power stability

Power stableness technique

Dual pumps

980nm 100-150mW ±0.02dB Automatic gain control

1480nm 200-350mw ±0.02dB Automatic gain control

Single pump

980nm 100-150mW ±0.02dB Automatic gain control

ZXMP M820 employs ultra-long-haul distance technologies, such as RAMAN amplifier

and large power EDFA. Working principles of Raman amplifier (RA) are shown as

following:

Figure 3-1 Principles of RA

Compared with EDFA, the RAMAN fiber amplifier enjoys low noise merit. The equivalent

noise factor of the distributed RAMAN amplifier board (DRA) of ZXMP M820 is 0 dB, and

switching gain is 10 dB.

ZXMP M820 also provides large power EDFA, which directly improves OSNR to extend

the transmission distance.

3.1.4 Power Management

To guarantee the network performance, ZXMP M820 adopts power management

technology to adjust and control the power and power spectrum at each point in the



system.

Intelligent Power Management

The intelligent power management is implemented by the line attenuation card (LAC),

optical amplifier board and EMS. It can detect the changing state of the optical line power

and make relevant adjustments accordingly, so as to maintain the receiving power and

OSNR ratio at the normal value during ZXMP M820’s operation.

Attenuation of LAC can be adjusted from 2dB to 26dB. And attenuation of LAC with

attenuation slope compensation can be adjusted from 5dB to 26dB. The gain of optical

amplifier in ZXMP M820 system can be adjusted via NM, and the typical range is ±5dB.

ZXMP M820 can provide APR or APSD protection process, that is, the EDFA

automatically reduces the power or switches off the power in case of no input light, so as

to make operator safety.

Protection process is fulfilled as follows:

i. Optical power supervision device detects signal loss at active optical channel.

ii. Reversing pump of RA shuts down.

iii. Co-directional EDFA output at downstream node of breakpoint remains (APR)

or shuts down (APSD).

iv. Inverse EDFA at downstream node of breakpoint shuts down and

automatically checks system recovery in intervals specified.

v. Inverse EDFA output at upstream node of breakpoint remains (APR) or shuts

down (APSD).

vi. Co-directional EDFA at upstream node of breakpoint shuts down and

automatically checks system recovery in intervals specified.

vii. After bidirectional fibers of the system recover, the output of EDFA and RA at

the transmission section of breakpoint returns to normal.

In ZXMP M820 system, RA can automatically shut down and manually restart.



Auto Performance Optimization

When APO (Auto Performance Optimization) is adopted, the power management

subsystem plane can intelligently adjust LAC and EDFA gain to automatically optimize

and manage DWDM system parameters such as optical power and OSNR.

The power management subsystem is composed of controller, executor, monitor,

communication (within a NE or between NEs) interface and protocols, as shown in the

following figure:

Figure 3-2 Power management sub-system

SNCP SOSC

EMS SNMS

Optical board Optical board

Monitor Executor

Monitor Executor

Backplane Interface

Backplane Interface

Backplane Interface

Backplane Interface

Board control/ management backplane interface (across subracks and racks)

Communication control interface within a NE

Communication control interface between NEs

Power management functions are at SNMS level. The controller is embedded in

Manager.

i. It takes the data from EMS database and analyzes it according to system

service and network topology.

ii. It makes the management scheme (comprising the setting states of the power

adjustment executors of the NEs) in accordance with the power management

algorithm.



iii. It supplies the scheme to the operator to view, and then sends it to the NEs to

optimize the power.

The network power optimization starts under the command of auto performance

optimization. After the automatic optimization completion, it can be executed with the

operator’s approval.

The automatic power management starts after operation, and monitors the system

performances. It can handle a fault automatically, store and display the result.

3.1.5 Performance Detection Function

ZXMP M820 systems can provide OPM to supervise optical parameters at each optical

channel, e.g., optical channel power, central wavelength and OSNR. It can supervise

active optical channel in real time without disconnecting services, send related data to

NMS and check the associated physical quantity at NM in two view modes: illustration

and data. Measurement precision of central wavelength is ±0.1nm, power ±1.0dB and

OSNR ±1.5dB.

OPM functions are shown as following:

Supervise path wavelength, optical power and OSNR of WDM signals in real-time.

Automatic self-calibration.

Supervise four channels of input optical signals (with optical switch);

Process data on boards, and find out power, wavelength and OSNR at peak points.

If OPM is not configured, NMS can supervise OA and OTU input and output power.

Precision of optical power is ±1dB.

The OTU part has performance monitoring and overhead processing functions,

which can accurately locate faulty point and type by layer.

OTN layer: Monitor loss of frame alarm (OTUk-LOF) and bit interleaver parity check

(OTUk-BIP8), and process overhead SM-TTI.

SDH signal: Monitor and check B1, B2 and J0 bytes.



GE signal: Monitor and collect error packets and error packet rate statistics.

ZXMP M820 equipment provides monitoring port in each board for the carrier to test and

monitor the signal quality by accessing the apparatus.

3.1.6 OTN Description

In OTN architecture, the OTH (Optical Transport Hierarchy), which is based on the ITU-T

G.709 Recommendation, can be adopted to build a flexible transmission sub-layer. At

present, the OTH provides electronic cross-connect and convergence for ODU1

(2.5Gbit/s) and ODU2 (10Gb/s), which helps to improve wavelength utilization.

The G.709-based OTN provides rich overhead resources and enables strong

management ability on the optical layer. OTN maintenance signals are used for fault

isolation and alarm suppression, which greatly reduces system maintenance burden.

In a configurable optical network, powerful monitoring management is very important.

Carriers always find that data signals cannot be properly received, though the optical

power of the receiving end is normal. The TCM overhead on the ODU (Optical

Demultiplexer Unit) layer supports trans-domain or trans-network end-to-end optical

channel monitoring and management; together with optical channel detection technology,

it enables optical power monitoring, alarm correlation check, fault location, QoS

confirmation, and protection switchover triggering.

The OTU boards of ZXMP M820 comply with G.709 recommendations. M820 supports

OTN overhead detection and processing such as OTUk/ODUk/OPUk-based LOF

detection, multi-frame detection, FEC performance detection and SM/PM/TCM/PT

overhead detection which enable precise fault location and easy network maintenance

management.

ZXMP M820 supports electrical cross-connect based on

ODU0/ODU1/ODU2/2e/ODU3/3e2 which can achieve sub-wavelength grooming.

3.1.7 Dispersion Management

Dispersion restrictions must be taken into consideration in long-haul transmission for

10G and 40G system. Certain amounts of the dispersion compensation modules are



configured in the dispersion compensation plug-in box (DCM) of ZXMP M820 on actual

demands.

By configuring the values of line compensation, pre-compensation and

post-compensation reasonably, the system could actualize the balance compensation,

as shown in Figure 3-3

Figure 3-3 Dispersion management

3.1.8 Service Functions

Service Access Function

ZXMP M820 can access the following services:

SDH services including STM-1/4/16/64/256

SONET services including OC-3/12/48/192/768

ATM or POS services including VC4, VC4-4c and VC4-16c

Ethernet services including FE, GE, 10GE, 100GE

Enterprise intranet services such as ESCON, FICON, DVB and FC.

Any rate services between 34Mbit/s ~ 2.67Gbit/s

Service Convergence Function

ZXMP M820 can converge and de-multiplex the low rate signals.

Each SRM42 board converge 4 STM-1/4 SDH signals or ATM signals to STM-16



signal.

Each SRM41 board converge 4 STM-16 SDH signals or ATM signals to STM-64

signal.

Each MQT3 board converge 4 STM-64/OC-192/10GE/OTU2 signals to OTU3

signal.

Each MX2 board converge 10 STM-64/OC-192/10GE/OTU2 signals to OTU4

signal.

Each SDSA/GEM2/GEMF board converge 2 GE signals to 2.5Gbit/s rate.

Each MOM2 board converge 8 GE/FC or 4* 2GFC or 4*2.5G to OTU2 signal.

DSA board implements the multiplexing/demultiplexing between eight data service

signals at tributary side and two STM-16 signals at aggregate side.

MQA1 board can access four channels of any rate service ranging from 100Mbps to

2.67Gbps, the typical types of services include STM-1/4/16(OC-3/12/48),OTU1,

FE/GE, 1G/2GFC, DVB_ASI/ESCON/FICON/HDTV, PDH.

MQA2 board can access four channels of any rate service ranging from

1.0625Gbps to 4.25Gbps.

MJA board can upgrade smoothly from 4 to 10 any rate service access on client

side by collaborating with MQA1, and can upgrade smoothly from 4 to 22 any rate

service access on client side by collaborating with MQA2. MJA supports any rate

service from 100Mbps to 2.67Gbps.

It is applicable to different networking conditions by selecting tributary modules and

aggregation module type.

3.1.9 Wavelength Add/Drop Function

The ZXMP M820 supports the adding/dropping of wavelengths in the granularity of 1

wavelength, 4 wavelengths or 8 wavelengths. The quantity of wavelengths to be

added/dropped can be expanded from 1 to 80.



An optical add/drop multiplexer subsystem can be configured as a fixed one (FOADM) or

a reconfigurable one (ROADM).

FOADM: In such subsystem, OAD board is needed to add/drop fixed wavelengths in the

system.

ROADM: In such subsystem, additional WBU or WSU board is needed. Configure the

system in the EMS to implement the adding/dropping and direct transmission of any

specified wavelengths in the same direction. Moreover, the ROADM subsystem provides

the port assignment function, with which wavelengths can be added/dropped through

assigned ports.

In ROADM subsystems, it is unnecessary to adjust fibers manually when the quantity of

wavelength to be added/dropped changes or some other wavelengths need to be

added/dropped.

3.1.10 Communication and Monitoring Functions

The supervision and communication subsystem of ZXMP M820 is composed of SNP,

SOSC and SEI boards.

The functions are:

Main control board (SNP)

SNP board is used as an NE control processor in the supervision subsystem

implementing NE-level network management function. SNP board provides the following

functions:

Provides S interfaces that are used to communicate with the other boards in an

NE, collect and process alarm and performance messages of the other boards, and

report to the EMS.

Stores configuration data of an NE. After configuration, SNP boards can work

independently without the EMS.

Provides Qx interfaces for upper-layer management system. In the supervision

subsystem, Qx interface is provided by SEI board.



Implements Automatic Protection Switch (APS) function to ensure that the

communication speed of APS data meets the requirement of the APS conversion

time.

When optical supervision channel fails, SNP board ensures the transfer and

exchange of supervision information through standby route (accessed via SOSC

board).

Provides alarm input/output signals for SEI board, through which output the

alarms to head cabinet or other user alarm equipments.

Provides management function for multiple racks. An SNP board can manage

16 racks, that is, 1 master rack and 15 slave racks.

Provides SD card to store EMS historical data.

PCB board provides RJ45 interface to facilitate the board debugging. The

panel provides RS232 interface to output the board debugging information.

Supports the online update of board software.

Optical supervision channel card (SOSC)

SOSC board is used in 100M supervision systems to implement the transmission and

exchange of ECC data, channel data of order and transparent user, and APS information.

The main functions are described as follows:

In 100 M supervision system, pack the data between NEs in the form of IP

packet, such ECC data, APS data, transparent user channel data and order voice

data. And transmit and exchange all these data in the Ethernet data frame.

The SOSC board provides three 10/100BASE-T Ethernet electric interfaces

with the automatic cross function (the physical interface is provided by SEI board).

The SNP board, EMS, slave SOSC board and backup route are accessed by these

interfaces to implement the supervision information exchange within the NEs.

The front panel of SOSC board provides four 100BASE-FX Ethernet optical

interfaces to access 1510 nm supervision channel and realize the supervision



information transmission between the NEs. 100BASE-FX is an optical interface with

the rate at 100Mbit/s.

Based on the board hardware, the SOSC board provides the capability to

transmit supervision information within the three-level.

The SOSC board adopts OSPF protocol to dynamically search the route.

Extension Interface Board (SEIA)

SEIA board is used to lead various external interfaces and cascaded interface of

sub-rack to the panel for connection. The functions are described as follows:

Provides four FE Ethernet interfaces to be used as Qx interface to connect to

the EMS computer, or as the transparent user channel interface and IP phone

interface based on Ethernet.

Provides a 26–pin interface for external alarm input.

Provides a 15–pin interface for external alarm output, alarm LED or ringing

output.

Provides a 15–pin alarm cascaded interface.

Provides alarm ring switch.

Through the 100Mb/s Ethernet technologies, the 100Mbit/s supervision system

encapsulates ECC data, APS data, transparent user channel data, and order wire voice

data in IP packets, and transmits/exchanges them in the Ethernet data frame. The 100

Mb/s supervision systems can increase communication bandwidth between control

boards in the NE, and reduce quantity and type of backplane buses.

The position of supervision subsystem is shown in Figure 3-4



Figure 3-4 Position of supervision subsystem

3.1.11 Time/Clock Synchronization Service

ZXMP M820 supports clock and time synchronization. It meets the requirements of the

3G base station for precise time synchronization.

By abstracting clock information from serial stream of transmission link physical path, the

clock synchronization mechanism in the physical layer can realize synchronous

frequency.

Time synchronization follows IEEE 1588 V2 protocol. ZXMP M820 provides out-of-band

1pps+TOD and FE time synchronous interface to realize out-of-band time transmission.

Time synchronization service supported by ZXMP M820 includes:

Use BMC algorithm to choose clock. BMC (Best Master Clock) algorithm

decide clock source by comparing descriptive data of two or more clocks.

Support OC, BC and TC.

Support clock and time SSM processing.

Support latency compensation service

Support switchover of active and standby clock sources.



SEIA2 card installed in CX sub-rack provides the input/output of 2M Hz or 2M bits clock.

The selection of analog or digital clock is realized by the switch. M2SEIA2 supports two

groups of clock input or output.

3.1.12 Alarm Input /Output Function

Alarm input function

ZXMP M820 uses the optical coupler isolation signal to access the alarm inputted

by the external monitoring equipment, and displays it on the NMS through the

ALARM_IN interface on the SEIA board.

The system can access 10 external alarms at most. The alarm type can be set

through the NMS for detection of external environment alarms, such as fan, doors

and temperature.

Alarm output function

The equipment alarm is outputted to the WARN interface in the SEIA board and

then outputted to the monitoring display cabinet or other monitoring units in the

equipment room via the ALARM_OUT interface of the SEIA board. Signals are

isolated by relays.

3.1.13 System Level Protection

OTU board 1:N protection

The WDM networks generally require spare OTU boards and elements. When

configured in protective mode, spare part can realize real-time protection, which is

much quicker, safer and saves maintenance cost.

1:N protection only need to configure OTU and OMCP units at both ends of OTM,

and may utilize the spare OTU board also, which has a low cost.

The processes are shown in Figure 3-5



Figure 3-5 The Block Diagram of Optical Path 1: N Protection Function

When several paths of services are faulty simultaneously, it is required to protect

the services with higher priority set in the NMS. One OMCP board can perform 1: 8

protections.

Common Units Protection

Firstly, ZXMP M820 supports 1+1 power protection on the sub-rack with two power

inputs. The sub-rack power module SPWA fulfills reverse connection prevention,

soft start, balance and supervision of two power inputs. The information is sent to

Power Distribution Unit on the top of rack for processing and reporting to NM via

alarm cable.

Secondly, ZXMP M820 supports 1+1 SNP board protection, so that guarantee the

communication among all the boards in the NE, and Implements various functions,

such as control, communication and GMPLS protocol processing more security.

Thirdly, ZXMP M820 supports ring protection for the inner-connection of sub-racks,

so that avoids the communication interruption between sub-racks. .

3.1.14 Network level Protection

Optical Path 1+1 Protection

i Protection principles

The optical path 1+1 protection is implemented with the OP board, by sending

concurrently and receiving selectively in both working path and protection path.

ii Applications



One OP board is used to protect a pair of bidirectional services with the same

wavelength. Under the 1+1 protection case, the number of OP boards configured is

the same as that of protected channels.

iii Chain networking

The protection path and the protected path are transmitted in the same fiber. On the

chain networking, 1+1 protection can only perform equipment protection instead of

route protection, as shown in Figure 3-6

Figure 3-6 Optical Path Layer 1+1 Protection (Chain Networking)

iv Ring networking

On the ring networking, the protection path and the protected path reach the

receiving end through different paths. 1+1 path protection can protect both route

and the equipment. The ring networking is shown in Figure 3-7.



Figure 3-7 Ring Networking

A

B

C

D

Protection path

Work path

MS 1+1 Protection

The MS 1+1 protection of ZXMP M820 adopts 1+1 protection mode section by section,

as shown in Figure 3-8.

Figure 3-8 Functional Block Diagram for MS 1+1 Protection

2-fiber bidirectional path shared protection

In the 2-fiber bidirectional path shared protection ring, λ1 of the external ring forms the

working path, and λ1 of the internal ring forms the protection path. The working path

allows wavelength multiplexing of multiple unidirectional services, and the protection



path shares protection of all services on the working path. Meanwhile, the optical switch

can be connected via OPCS (path shared protection board) to control the adding status

of adding protection wavelengths, so as to avoid conflict, on the protection ring, of

multiple services that use the same working wavelength.

In Figure 3-9 for example, as optical fibers on a certain span failed (indicated by the

symbol of ×), services passing this span are broken, thus the access switch starts

operation at the transmitting end, and services are transmitted along the protection route.

When the two switching switches at the receiving end start operation, services are

received from the protection route and the service protection is actualized.

Figure 3-9 Schematic diagram of 2-fiber bidirectional path shared protection

3.1.15 Network management channel backup

In DWDM transmission networks, network management information is transmitted

through an optical supervisory channel, which is generally transmitted through the same

optical fiber with main channel. In case of any failure in main channel, it will also affect

the supervisory channel, i.e. loss of control on NE. In the condition of high traffic and

backbone network, it is not affordable to lose control. To solve such problems, ZXMP

M820 provides abundant measurements and protection to the supervisory channel.



In ring network, when certain section fails (e.g. optical fiber damage) in a certain direction,

network management information automatically switch to the optical supervisory channel

in the other direction of the ring without affecting the management of the whole network.

In chain network, the situation is more critical, because breakage in optical fiber means

breakage of supervisory channel. Consequently, network management administrators

are unable to get the supervisory information of failed station. To avoid this accident,

network management information should use the backup channel. By using data

communication network (DCN) and routers, ZXMP M820 can provide backup network

management channel.

When the network is normal, network management information is transmitted over the

main supervisory channel, as shown in Figure 3-10

Figure 3-10 Network management through supervisory channel

On the failure of main supervisory channel, network elements automatically switch the

management information to the backup channel to guarantee that the network

management system can supervise and operate the entire network, as illustrated in the

Figure 3-11



Figure 3-11 Network management through backup supervisory channel

3.1.16 L0/L1/L2 integrated transport technologies

ZXMP M820 WDM platform integrates L0/L1/L2 transport technologies and enables the

flexible accessing and dispatching of service, especially the prevailing Ethernet service.

ZXMP M820 offers three kinds of ROADM technology aiming at different scenarios to

provide the most cost-effective solution for the customer. ZXMP M820’s multi-degree

ROADM based on WSS technology enables the wavelength routing and accelerates the

deployment of new services.

To better transport the Ethernet service, ZXMP M820 offers both transparent

transmission and statistic multiplexing of Ethernet service, the former is based on TDM

technology without affecting the Ethernet service, the latter is based on L2 switch

technology to enhance the transport efficiency of Ethernet service and reduce the

CAPEX and OPEX of the network. ZXMP M820’s L2 switch supports E-Line (EPL &

EVPL) and E-LAN.

3.1.17 ROADM Function

ROADM supports dynamic wavelengths add/drop through remote control from NMS. In

directionless configuration, the wavelength can be retrieved or assigned from/to any

direction. In colorless configuration, any port can add/drop any wavelength. ZTE ROADM

solutions are based on the WB (wavelength blocker), PLC (Planar Lightwave Circuit) and

WSS (Wavelength Selective Switch) technology, which can support 2~9 directions

ROADM solution.



ROADM provides node reconfiguration, implements connection between any two nodes,

wavelength-level add/drop and pass-through configuration without manual intervention,

thus addressing service demands and cutting operation & maintenance cost. In addition,

the adoption of ULH WDM techniques greatly reduces full-band service terminations and

undesirable O-E regeneration, enabling a highly scalable network, and saving equipment

investment. With ROADM, multi-ring, mesh and star can be formed flexibly, adapting to

dynamic characteristics and networking requirements for future service networks.

ZXMP M820 supports colorless and directionless ROADM solutions which are the most

flexible. Colorless means any wavelength can be assigned to any port. Directionless

means any direction can be assigned to any port.

ZXMP M820 ROADM supports multiple networking modes, meets networking

requirements at different levels. The Comparison of ROADM networking schemes is

shown as below table.

Table 3-2 ZTE Networking Scheme and Application Environment

Scheme Linear ROADM Ring ROADM Mesh ROADM

Main application environment

Long-haul trunk line Metro network Metro network

Technology WB ROADM

PLC ROADM

WB ROADM

PLC ROADM

WSS ROADM

WSS ROADM

Available functions

Spectrum balancing, wavelength add/drop

Wavelength add/drop, wavelength scheduling,

wavelength grooming

Wavelength add/drop, wavelength scheduling,

wavelength grooming

ZTE ROADM system provides multiple solutions, complete networking modes, meeting

requirements of the customers with different network status and at various levels. The

below table lists the recommended ROADM configuration targeting customers’ different

requirements:



Table 3-3 ZTE/ ROADM Solutions

Solution Characteristics Target customer

WSS ROADM with tunable port in add channel

Add/drop wavelengths can be provisioned randomly, wavelength grooming flexibly.

Uncertainty in service growth, large traffic of future services, or requiring extremely high network flexibility and wavelength route.

WSS ROADM with fixed port in add channel

Add/drop wavelengths are fixed, supports complex network architecture in the future.

Services are relatively fixed, future networks may evolve towards Mesh.

PLC ROADM with fixed port in add/drop channels

Add/drop wavelengths are fixed, the cost is low.

Services are relatively fixed, future services are predictable.

WB ROADM with fixed port in add/drop channels

Add/drop wavelengths are fixed, the cost is low.

Services are relatively fixed, future services are predictable.

3.1.18 Electrical Cross-Connect Function

Electrical Cross-Connect system can access data services including GE, FC, FICON,

ESCON, SDH and DVB. The services can be aggregated into multiple ODUk services on

the tributary convergence board and be cross connected at a granularity of

ODU0/1/2/2e/3/3e2. Then the cross connected signals are aggregated into OTU2/OTU3

on the group convergence board and are eventually output from the line-side interface.

Electrical Cross-Connect system is categorized as centralized or distributed switching

platform in Figure 3-12



Figure 3-12 Electrical Cross-Connect System Structural Diagram

16x Any(GE/STM-1/4/16/FC100/200)

CS3

8x10G Any（10GE LAN/WAN/STM-64）

CH1

1x40G（STM-256/40G POS）

CO2

CD3

ODUk Switch CoreLS3 1xOTU3/3e2

LO2B(PIC)

8xOTU2/2e

LO2 8xOTU2/2e4x10G Any（10GE LAN/WAN/STM-64） CQ2

2x40G（STM-256/40G POS）

LQ2 4xOTU2/2e

LS3 1xOTU3/3e2

ZXMP M820 equipment can provides CX20 electrical switching sub-rack, which can

implements ODU0/1/2/2e/3/3e2-based centralized non-blocking switching and realize

flexible service scheduling in electrical layer. At the same time, client-side and line-side

are separated. They share the line bandwidth and effectively improve network bandwidth

utilization.

Client-side card or line-side card can be flexibly added or deleted based on practical

needs to protect operators’ investment.

Client-side and line-side cards can be combined flexibly. Network spare parts types

can be reduced from M×N to M+N (M is client-side card and N is line-side card, M,

N>2) to reduce CapEx.

Client-side and line-side cards are separated, which can improve flexible

scheduling and reduce OAM pressure.

The DSS (Distributed Service Switch Platform) consists of four cards, and each card is

composed of line side unit, client unit and switching matrix. Client unit can access any

rate service from 100Mbit/s to 4.25Gbit/s. The non-blocking service switching among

these four cards can realize sub-wavelength service dispatching or multicasting during

multiple directions. The switching granularity can be ODU0 or ODU1. Total switching

capacity of each DSS group is 80G and single sub-rack can support multiple DSS. The

cross connected signals are aggregated into OTU1/OTU2 on these group convergence

cards and are eventually output from the line-side unit. DSS can also realize 1+1

protection on ODUk and BPSR on ODUk based on ODU0/ODU1 granularity.



In DSS subsystem, switching matrix is distributed on service card and doesn’t occupy

other service slots. Such highly integrated cards can reduce power consumption

effectively.

3.1.19 Photonic Integrated Circuit (PIC) Technique

LO2B board uses PIC technique to improve integration and facilitate maintenance.

Figure 3-13 Principle of PIC module (TX and RX)

TEC

AW

G

Mu

x

Optical

output8×10Gb/s

electrical

signal input

Ther

mister

PD

heater

Bias Moniter

92 2

8

power GND

2

heater

heater

EML

EML

EML

PD

8

Ther

mister

2

PD

PD

PD

PD

PD

PD

. . .

. . .. . .

heater

AW

G

DM

ux

PIN

PIN

TIA

TIA

8×10Gb/s

electrical

signal

output

Optical

inout

themi

ster

2 2 8

bias

2x8

. . .

. . .

. . .

3.1.20 Wavelength Tuning Function

Traditional DWDM systems use fixed wavelength lasers as light sources, which only

output fixed wavelengths complying with the specifications of ITU-T G.692. Fixed



wavelength lasers cannot be fully utilized when they are used as standby light sources,

which results in the increase of cost. With the continuous development of light source

technology, a kind of tunable wavelength laser that can meet the requirement for

multi-wavelength tuning appears.

The “tunable wavelength laser” refers to a laser module that can be controlled to output

different wavelengths in a certain bandwidth. The channel quantity and channel spacing

of the output wavelengths meet the specifications of ITU-T G.692. With the application of

tunable wavelength lasers, wavelengths can be selected dynamically for signals in a

DWDM system according to the actual application of wavelengths. Especially when the

system uses standby light sources, using tunable wavelength lasers can improve the

utilization ratio of wavelengths.

Some service boards of the ZXMP M820 support both fixed wavelength output and

tunable wavelength output. The below table lists the boards supporting tunable

wavelengths and their tuning ranges (relationship among operating band, channel

quantity and channel spacing).

Table 3-4 Boards Supporting Wavelength Tuning Function

Board Operating Band Channel Quantity @ Channel

Spacing

100G boards (with SD-FEC)

TS4 C band 80 CH@50 GHz

MX2 C band 80 CH@50 GHz

40G boards (with FEC or AFEC)

TST3

C band

40 CH@100 GHz

80 CH@50 GHz

96 CH@50 GHz (CE band) MQT3

10 G boards (with FEC or AFEC)

EOTU10G

C band

40 CH@100 GHz

80 CH@50 GHz

96 CH@50 GHz (CE band)

SRM41

FCA

LD2B

SOTU10G 40 CH@100 GHz



Board Operating Band Channel Quantity @ Channel

Spacing

80 CH@50 GHz

96 CH@50 GHz (CE band)

2.5 G boards (with FEC)

OTUF C band 4 CH@100 GHz (continuous wavelengths)

16 CH@50 GHz (continuous wavelengths)

GEMF C band

DSAF C band 16 CH@100 GHz (continuous wavelengths)

2.5 G boards (without FEC)

OTU

C band



SRM42

3.1.21 IWF Function

The IWF function can control wavelength and make wavelength stable in a DWDM

system with channel spacing of 50GHz. Stable wavelength means that frequency has no

wander.

In a DWDM system with channel spacing of 100 GHz, the system has relatively greater

tolerance for frequency wander. However, with the channel rate increasing and channel

spacing decreasing, e.g., the channel spacing of 80/96–channel system is 50GHz;

frequency wander will directly affect the system reliability.

ZXMP M820 provides different methods for systems with different channel spacing to

make wavelength stable.

The system with 100 GHz channel spacing: Uses automatic power control,

temperature feedback, and internal wavelength feedback. They are implemented by

optical transponder boards.

The system with 50 GHz channel spacing: Uses internal wavelength feedback and

external wavelength feedback to improve stability and accuracy of wavelength



control.

i. Internal wavelength feedback: It is implemented by optical transponder boards.

ii. External wavelength feedback: It is implemented by IWF function. IWF function

employs integrated supervision and ordered adjustment to realize wavelength

feedback control. OWM board, multiplex boards, optical transponder boards, SNP

board, and EMS work together to realize IWF function. Figure 3-14 shows the

functional blocks of IWF function.

Figure 3-14 Functional Blocks of IWF Function (External Wavelength Feedback)

OWM board receives the aggregate optical signal sent by the MON interface of optical

amplification board. Then it tests the wavelength offset of each channel in the

multiplexed signal. If the offset is out of limit, OWM board informs SNP about this. Then

SNP sends the wavelength adjustment command to the corresponding OTU board, so as

to adjust wavelength offset to satisfy wavelength offset requirement.

EMS configures parameters, enables/disables the function of wavelength adjustment,

and sends command to OWM board.



3.2 Networking

3.2.1 System Applications

3.2.1.1 Application of 8/16/32/40/48-Wavelength System

For less than 48-wavelength system, ZXMP M820 whole network application is illustrated

in Figure 3-15.

Figure 3-15 Whole Network Application with the ZXMP M820 (the System less than 48-Wavelength)

The module shown in the diagram is board in ZXMP M820.

1. Working wavelength range and channel spacing

C band (191.3 THz ~ 196.0 THz) at 100 GHz channel spacing



2. System composition

OTM: Optical terminal equipment. As shown in Figure 3-15. OTU belongs to

the optical transfer platform, OMU and ODU belong to the OM and OD platform,

EOBA and EOPA belong to the optical amplifying platform, SOSC belongs to the

monitoring platform. At the receiving end of the OTM, modules should be added for

dispersion compensation after long distance transmission. The wavelength spacing

transferred by OTU is 100 GHz.

OLA: Optical line amplifier, including EOLA and SOSC. As shown in Figure

3-15, EOLA belongs to the optical amplifying platform; SOSC belongs to the

monitoring platform.

OADM: Optical add/drop multiplexer. As shown in Figure 3-15, OAD belongs to

the add/drop platform, OTU belongs to the optical transfer platform, and SOSC

belongs to the monitoring platform.

3.2.1.2 Application of 80/96-Wavelength System

Take a unidirectional 2-segment transmission for example, and the whole network

application of the 80/96-wavelength ZXMP M820 is illustrated in Figure 3-16.



Figure 3-16 Whole Network Application with the ZXMP M820 (the System with 80/96-Wavelength)



C band at 50 GHz spacing


OTM: Optical terminal equipment

OTU: belongs to the optical transfer platform in Figure 3-16.

OMU, ODU and OCI: The OM and OD platforms in Figure 3-16

OMU/ODU: Multiplex/de-multiplex C band (191.3 THz ~ 196.0 THz), C+ band

(191.35 THz ~ 196.05 THz), with the channel spacing of 100 GHz.

OCI: By adopting the inter-leaver technology, it multiplexes/de-multiplexes C band

and C+ band, and integrates them into the C band multiplexing signals with 50 GHz

channel spacing.

EOBA, EOPA: Belong to the optical amplifying platform in Figure 3-16. In an

80/96-wavelength system, they amplify the C band signals. At the receiving end of



the OTM, modules should be added for dispersion compensation and power

balance after long distance transmission.

SOSC: Monitoring platform in Figure 3-16.

OLA: Optical line amplifier

EOBA and EOPA: Belong to the optical amplifying platform in Figure 3-16. In

96/176-wavelength systems, they amplify the C band and L band signals.

SOSC and OPM: Belong to the monitoring platform in Figure 3-16. SOSC transmits

and receives monitoring information, while OPM tests the optical performance of

the optical interfaces.

3.2.1.3 Application of 160/176-Wavelength System


application of the 160/176-wavelength ZXMP M820 is illustrated in Figure 3-17.

Figure 3-17 Whole Network Application with the ZXMP M820 (160/176- Wavelength)



C+L band at 50 GHz spacing






OMU, ODU, OCI and OBM: The OM and OD platform in Figure 3-17

OMU/ODU: Multiplex/de-multiplex C band (191.3 THz ~ 196.0 THz), C+ band

(191.35 THz ~ 196.05 THz), L band (187.0 THz ~ 190.9 THz) and L+ band (186.95

THz ~ 190.85 THz) with the channel spacing of100 GHz.

OCI: By adopting the inter-leaver technology, it multiplexes/de-multiplexes C band

and C+ band, L band and L+ band, and integrates them into the C band and L band

multiplexing signals with 50 GHz channel spacing.

OBM: At the transmitting end, the OBM feeds the amplified C/L band signals via the

C/L pass band OM into the fiber. At the receiving end, it de-multiplexes the received

signals into the C/L band multiplexing signals and sends them to the relevant

amplifiers.

EOBA and EOPA: Optical amplifying platform in 0. In 160/176-wavelength system,

they amplify the C band and L band signals. At the receiving end of the OTM,

modules should be added for dispersion compensation and power balance after

long distance transmission.

SOSC: Monitoring platform in Figure 3-17.

OLA: Optical line amplifier. Compared with the 40/48-wavelength system, an OM

part is added for C/L band signals.

OBM: Multiplexes/de-multiplexes signals of C/L band to the C band and L band.

EOBA, DCM and EOPA: Optical amplifying platform in Figure 3-17. In

160/176-wavelength system, they amplify the C band and L band signals. Among them,

DCM compensates dispersion for long distance transmission.

SOSC and OPM: Monitoring platform in Figure 3-17. SOSC transmits and receives

monitoring information, while OPM tests the optical performance of the optical interfaces.



3.2.1.4 Application of 192-Wavelength System


application of the 192-wavelength ZXMP M820 is illustrated in Figure 3-18.

Figure 3-18 Whole Network Application with the ZXMP M820 (the System with 192-Wavelength)



C band at 25 GHz spacing






OMU, ODU, OCI: The OM and OD platform in Figure 3-18.

OMU/ODU: Multiplex/de-multiplex C1001 sub-band (191.300 THz ~ 196.000 THz),

C1002 sub-band (191.350 THz ~ 196.050 THz), C1003 sub-band (191.325 THz ~

196.025 THz) and C1003 sub-band (191.375 THz ~ 196.075 THz) with the channel

spacing of100 GHz.

OCI:

OCI1 and OCI2, by adopting the inter-leaver technology, it

multiplexes/de-multiplexes C1001 sub-band and C1002 sub-band, C1003sub-band

and C1004 sub-band integrates them into the C band multiplexing signals with 50

GHz channel spacing.

OCI3, by adopting the inter-leaver technology, it multiplexes/de-multiplexes C501

and C502 sub-band integrates them into the C band multiplexing signals with 25

GHz channel spacing

EOBA and EOPA: Optical amplifying platform in 0. In 192-wavelength system, they

amplify the C band signals. At the receiving end of the OTM, modules should be

added for dispersion compensation and power balance after long distance

transmission.

SOSC: Monitoring platform in 0.

SOSC and OPM: Monitoring platform in 0. SOSC transmits and receives monitoring

information, while OPM tests the optical performance of the optical interfaces.

3.2.2 Networking Modes

To satisfy the need of various networking modes and functions, ZXMP M820 can be

configured as an OTM, OADM and OLA.



3.2.2.1 Point-to-Point Networking

For short-haul transmission, ZXMP M820 can provide point-to-point network without

OLA, as shown in Figure 3-19.

Figure 3-19 Point-to-Point Networking (Short-Haul)

For long-haul distance, trunk amplification mode is employed. An EOLA is added

between OTMs, as shown in Figure 3-20, which consists of three optical amplifying

segments.

Figure 3-20 Point-to-Point Networking (Long-Haul)

3.2.2.2 Chain Networking

The chain networking application with the OADM function is shown in Figure 3-21.

Figure 3-21 Application of Chain Networking

3.2.2.3 Ring Networking

The ring networking application is shown in Figure 3-22



Figure 3-22 Application of Ring Networking

3.2.2.4 Ring-with-Chain Networking

The ring-with-chain networking application is shown in Figure 3-23.

Figure 3-23 Ring-with-Chain Networking

3.2.2.5 Cross Connection Networking

Cross connection networking is shown in Figure 3-24



Figure 3-24 Cross Connection Networking

3.3 Transmission Codes Supported

By adopting the ultra-long-haul distance optical source and optical amplifying

technologies, the transmission codes supported by ZXMP M820 are listed in the

following tables.

Table 3-5 Transmission Codes Supported by 40 2.5Gbit/s System (G.652&G.655)

Category Specifications Target Distance (km)

Without FEC

(OSNR > 20 dB)

1 36 dB 1 144 km

2 33 dB 2 132 km

3 31dB 3 124 km

10 23 dB 10 92 km

FEC without RAMAN

(OSNR>15dB)

1 41 dB 1×164km

2 38 dB 2×152km



Category Specifications Target Distance (km)

3 36dB 3×144km

20 25dB 20×100km

FEC+ RAMAN

(OSNR >15 dB)

1 45dB 1×180km

2 42dB 2×168km

3 40dB 3×160km

20 28 dB 20×112km

Table 3-6 Transmission Codes Supported by 40 /48 10Gbit/s System (G.652&G.655)

Category Specifications Target Distance (km) remark

AFEC NRZ

1 61 dB 1 244km RPOA,40 10Gbit/s

1 49 dB 1 196km DRA, 40 10Gbit/s

1 57 dB 1228km RPOA,48 10Gbit/s

1 48 dB 1 192 km DRA, 4810Gbit/s

30 22 dB 30 88 km -

12 30 dB 12 120 km -

AFEC RZ

1 64 dB 1 256km RPOA,40 10Gbit/s

1 52 dB 1 208km DRA, 40 10Gbit/s

1 60 dB 1240km RPOA,48 10Gbit/s

1 51 dB 1 204 km DRA, 48 10Gbit/s

50 22 dB 50 88 km -

18 30 dB 18 120 km -

Table 3-7 Transmission Codes Supported by 80/96 10Gbit/s System (G.652&G.655)


AFEC NRZ

1 45 dB 1 180km DRA, 80 10Gbit/s

1 44 dB 1 176km DRA, 9610Gbit/s

20 22 dB 20 88 km -

8 30 dB 8 120 km -

AFEC RZ 1 48 dB 1 192km DRA, 80 10Gbit/s

1 47 dB 1 188km DRA, 96 10Gbit/s




30 22 dB 30 88 km -

12 30 dB 12 120 km -

Table 3-8 Transmission Codes Supported by 192 10Gbit/s System (G.652&G.655)


AFEC NRZ

1 41 dB 1 164km DRA

10 22 dB 10 88km -

3 30 dB 3 120 km -



AFEC+DPSK

1 47 dB 1 188km DRA, 40 40Gbit/s

1 46 dB 1 184km DRA, 4840Gbit/s

22 22 dB 22 88 km -

5 30 dB 5 120 km -

12 30 dB 12 120 km DRA

AFEC+DQPSK

1 48 dB 1 192km DRA, 40 40Gbit/s

1 47 dB 1 188km DRA, 48 40Gbit/s

25 22dB 25 88 km

6 30dB 6 120 km

13 30 dB 13 120 km DRA



AFEC+DPSK

1 44 dB 1 176km DRA, 80 40Gbit/s

1 43 dB 1 172km DRA, 9640Gbit/s

16 22 dB 16 88 km -

3 30 dB 3 120 km -

6 30 dB 6 120 km DRA

AFEC+DQPSK 1 45dB 1 180km DRA, 80 40Gbit/s




1 44 dB 1 176km DRA, 96 40Gbit/s

18 22 dB 18 88 km

4 30 dB 4 120km

7 30 dB 7 120 km DRA

Table 3-11 Transmission Codes Supported by 80 100Gbit/s System (G.652 with DCM)


SD+FEC+PM-QPSK

1x45dB 1x180km DRA, 80x100Gbit/s

16x22 dB 16x88 km

4x30 dB 4x120km

7x30 dB 7x120 km DRA

Table 3-12 Transmission Codes Supported by 80 100Gbit/s System (G.652 without DCM)


SD+FEC+PM-QPSK


20x22 dB 20x88 km

4x30 dB 4x120km


Table 3-13 Transmission Codes Supported by 80 100Gbit/s System (G.655 with DCM)


SD+FEC+PM-QPSK


10x22 dB 10x88 km

3x30 dB 3x120km




Table 3-14 Transmission Codes Supported by 80 100Gbit/s System (G.655 without DCM)


SD+FEC+PM-QPSK


12x22 dB 12x88 km

3x30 dB 3x120km


Note: SD-FEC is soft decision FEC coding and decoding, and means that the channel difference should be

included. Target Distance is calculated at 0.25dB/km.



4 System Architecture This chapter briefly introduces the overall structure of ZXMP M820, including hardware

and software, and its applications.

4.1 Description of System Functional Platform

The functional block diagram of ZXMP M820 is shown in Table 4-1

Figure 4-1 Functional Blocks of the ZXMP M820

ZXMP M820 consists of hardware system and NM software system, which are

independent of each other and work coordinately.

ZXMP M820 hardware system consists of optical transfer platform, service convergent

platform, optical wavelength multiplexing (OM) and optical wavelength de-multiplexing

(OD) platforms, add/drop platform, optical amplifying platform and monitoring platform.

4.1.1 Optical transfer platform

It employs Optical/electric/optical conversion mode to convert wavelengths between the

service signals and line signals.

The service signals support the SDH signals at STM-1/4/16/64/256 rates, OC-3/12/48/

192/768 and other service signals (i.e. POS, FC, FICON, ESCON, DVB, FDDI, FE, GE,



10GE, 100GE, ATM and PDH) at the client side, satisfying the G.957, G691 and

IEEE802.3 recommendation.

The line signals are compliant with the G.692 recommendation.

4.1.2 Service convergence platform

It converge multiple low-speed signals into one wavelength for transmission, and

completes its reversion process.

The low-speed signals include STM-1, STM-4, STM-16, STM-64, GE, 10GE, 40GE and

100GE.

The maximum rate at the line side is 120Gbit/s.

4.1.3 OM/OD platform

It consists of two parts: the OM and OD.

The OM: It couples and multiplexes multiple optical signals with different wavelengths

from the optical transfer platform and service convergent platform into one fiber for

transmission.

The OD: It separates the line optical signals from the optical amplifying platform by

wavelengths, and sends them to different optical transfer platforms and service

convergent platforms.

The OM and OD of ZXMP M820 employ C band with 100 GHz/50GHz channel spacing

in less than 40-wavelength /80/96-wavelength transmission.

The OM and OD of ZXMP M820 employ C/L band by using interleaver technology with

50 GHz channel spacing in 40-176-wavelength super-large capacity transmission.

The OM and OD of ZXMP M820 employ C band by using interleaver technology with 25

GHz channel spacing in 192-wavelength super-large capacity transmission.



4.1.4 Add/drop platform

It implements add/drop and multiplexing function for the wavelength of the optical line

signals. The ZXMP M820 can be configured as a fixed optical add/drop multiplexer

(FOADM) or a reconfigurable optical add/drop multiplexer (ROADM) depending on

whether the wavelengths to be added/dropped are fixed.

4.1.5 Optical amplifying platform

It compensates optical signal power in long distance transmission with optical amplifying

technology. Normally, it is located at the back and in front of the OM/OD platform, as well

as in the middle of the line transmission.

The optical amplifying part of ZXMP M820 employs C band EDFA in less than

40-wavelength/80/96 wavelength transmission.

The optical amplifying platform of ZXMP M820 amplifies the C band and L band

respectively in 40-176-wavelength transmission. The amplifier types involve C band

EDFA, L band EDFA, C+L band RAMAN/EDFA hybrid amplifiers.

4.1.6 Monitoring platform

It collects handles and reports various information such as platform configurations,

alarms and performance to the NMS.

It receives the commands sent by the NMS and transfers them to the target board.

It transmits the NMS information with the specified monitoring optical channel. The

wavelength of the monitoring channel is 1510 nm at 100Mbit/s.

The NM Software System is introduced in chapter 4.3

4.2 Hardware Architecture

4.2.1 Sub-rack

ZXMP M820 has three kinds of sub-racks, NX sub-rack and CX sub-rack and DX



sub-rack

NX sub-rack can be installed in 21 inch or 19 inch cabinet. One 21 inch and 2.2 m high

cabinet can install 4 NX-sub-racks or CX sub-racks or DX sub-racks. One 19 inch and

2.2 m high cabinet can install 3 NX-sub-racks.

Figure 4-2 Layout of ZXMP M820 NX Sub-rack (21 inch)

Dust Proof Net

SEIA

Fiber Cable Area

SFANASFANASFANASFANA

SPWA

SPWA

Wiring

Area

SNP

SNP

SOSC

Figure 4-3 Layout of ZXMP M820 NX Sub-rack (19 inch)

Fiber Cable Area

2 4 6 8 14 16 18 20 22 1410 12

SE

IAS

PW

A

SP

WA

Wiring

Area

SFANASFANASFANASFANA

Dust Proof Net

1 3 5 7 13 15 17 19 219 11



Figure 4-4 Slot Arrangement of DX41 Sub-rack

Fiber Cable Area

FCC

PWE

PWE

30 32

CC

PC

CP

1210 161442 86 28262018 2422

29 31119 151331 75 27251917 2321

Figure 4-5 Slot Arrangement of CX20 Subrack

Fiber Cable Area

FCC

XCA

XCA

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

PWD

PWD

18 19

CC

PC

CP

22 23

16 17

20 21



Figure 4-6 Slot Arrangement of CX22Subrack

SOG

MD

BEIC

100G slot

Fiber Cable Area

M3FCC

100G slot

100G slot

100G slot

XCA

XCA

100G slot

15 16 17 18 19 20

100G slot

100G slot

21 22

PWF

PWF

26 28

CC

PC

CP

100G slot

23 24

SNP

SNP

SOSC

BTIS

1 3 5 7 25 27

2 4 6 8 12 14

9

10

11 13

4.2.2 Board Description

Table 4-1 Board Description

Board Name Description Remarks

Service Access and Convergence Boards

SOTU2.5G Compact 2.5Gb/s Optical transponder unit

Transforms the 2.5Gb/s optical signals into electrical signals, and then transform the electrical signals into the required optical signals complying with G.692.

OTUF 2.5Gb/s Optical transponder unit with the FEC function

Performs the same the functions as the OTU, and conducts forward error correction (FEC) coding/decoding.

EOTU10G Enhanced 10Gb/s optical transponder unit with FEC/AFEC

Realizes G.709 recommendation compliant wavelength conversion of 10Gb/s optical signals in one channel, and conducts FEC/AFEC coding/decoding on the signal.

EOTU10GB Type B Enhanced Optical Transponder

Realizes G.709 recommendation compliant wavelength conversion of 10Gb/s optical signals in one




Unit for 10Gbit/s channel, and conducts FEC/AFEC coding/decoding on the signal.

SOTU10G Compact 10Gb/s optical transponder unit with FEC/AFEC

Realizes G.709 recommendation compliant wavelength conversion of 10Gb/s optical signals in one channel, and conducts FEC/AFEC coding/decoding on the signal.

TST3 40Gb/s optical transponder unit with FEC/AFEC

Realizes STM256, OTU3 access, complaint with G.709 recommendation, supports wavelength conversion of 40Gb/s optical signals into one DWDM channel, and conducts FEC/AFEC coding/decoding on the signal.

TS4 Single-channel 100Gb/s Optical Channel Transport Unit

Realizes 100GE, OTU4 access, complaint with G.709 recommendation, supports wavelength conversion of 100Gb/s optical signals into one DWDM channel, and conducts SD FEC coding/decoding on the signal.

MQT3 Multi 10G aggregation board

Realizes 4* STM64, 10GE LAN, OTU2, complaint with G.709 recommendation, and conducts FEC/AFEC coding/decoding on the signal

MX2 Ten 10G SubRate Mux Unit

Realizes 10* STM64, 10GE LAN, OTU2, complaint with G.709 recommendation, and conducts SD FEC coding/decoding on the signal

SRM41 Sub-rate Multiplex Board Realizes the multiplex/de-multiplex function of four STM-16 signals to one STM-64 signal.

SRM42 Sub-rate multiplex Board Realizes the multiplex/de-multiplex function of four STM-4/STM-1 signals to one STM-16 signal

ASMA Aggregation Switch Muxponder (Type A)

ASMA aggregates up to 24 GEs into 10GE LAN with rich L2 feature sets,




such as IEEE 802.1ad(Q-in-Q), IEEE 802.1P, IEEE 802.3ad

MOM2 Eight GE/FC Muxponder converges 8GE or 42GFC or 81GFC or 42.5G or their combination into OTU2

FCA Fiber Channel or Gigabit Ethernet Access Board

FCA is used to implement the multiplexing/de-multiplexing between eight GE signals, or two 4GFC, or four 2GFC or no more than eight 1GFC signals and OTU2 through O/E/O conversion.

GEM8 Gigabit Ethernet Access Board

GEM8 is used to implement the multiplexing/de-multiplexing between eight GE signals and OTU2 .

SDSA Compact Data Service Aggregation Board

SDSA used to implement the multiplexing/demultiplexing between two optical GE signals or 1G FC signals and an STM-16/OTU1 signal through O/E/O conversion.

DSAF Data Service Aggregation with FEC

DSAF used to implement the multiplexing/demultiplexing between two optical GE signals and an STM-16/OTU1 signal through O/E/O conversion. However, the line-side rate is up to 2.667 Gbit/s due to the application of FEC.

DSA Data Service Aggregation Board

DSA board implements the multiplexing/demultiplexing between eight data service signals, such as GE, FC, ESCON, FICON and DVB signals, and two STM-16 signals through O/E/O conversion.

GEM2 Gigabit Ethernet Multiplex Board

Multiplexes two IEEE802.3Z recommendation compliant standard GE optical signals into one G.692-compliant optical signal.

GEMF Gigabit Ethernet Multiplex Multiplexes two IEEE802.3Z




Board with FEC function recommendation compliant standard GE into one G.692-compliant optical signal with FEC.

TD2C Transponder of 2 ports 10Gb/s

Access the service of STM-64 (9.953Gbit/s), OTU2 (10.709Gbit/s), 10 GE (10.3125Gbit/s), OTU2e (11.1Gbit/s) and 10G FC (10.518Gbit/s)

MQA2 Muxponder of 4 ports any rate to OTU2

Access four channels of any rate service ranging from 1.0625Gbps to 4.25Gbps.


Access four channels of any rate service ranging from 100Mbps to 2.67Gbps.

Typical types of services:

STM-1/4/16(OC-3/12/48),

OTU1, FE/GE, 1G/2GFC, DVB_ASI/ESCON/FICON/HDTV, PDH.

Interconnection with backplane at granularity of ODU0/1.

MJA Muxponder of 6 ports any rate to main board

Upgrade smoothly from 4 to 10 any rate service access on client side by collaborating with MQA1;

Upgrade smoothly from 4 to 22 any rate service access on client side by collaborating with MQA2.

MJA supports any rate service from 100Mbps to 2.67Gbps.

Interconnection with backplane at granularity of ODU0/1.

800G Centralized Cross-Connect Subsystem Boards

FCC Fan Board

PWD Power Supply Board Two PWD card should be configured for single CX20 switching subrack

CCP Subrack Management Board Two CCP card should be configured for single CX20 switching subrack




XCA Switching Board Two XCA card should be configured for single CX20 switching subrack

CS3 Client board for Single OTU3 To implement conversion between 1-port 40Gbit/s optical signal and 1-port ODU3 electrical signal.

CD3 Client board for Double OTU3

To implement conversion between 2-port 40Gbit/s optical signal and 2-port ODU3 electrical signal.

CO2 Client board for 8*OTU2 To implement conversion between 4-port 10Gbit/s optical signal and 4-port ODU2 electrical signal.

CQ2 Client board for 4*OTU2 To implement conversion between 8-port 10Gbit/s optical signal and 8-port ODU2 electrical signal.

CH1 Client board for 16*GE or 8*OTU1

To implement conversion between 16-port optical signal at any rate and 16-port ODU0 or 16-port ODU1 electrical signals.

LS3(2 slots) Line board for single OTU3 (2 slots)

It has mapping of 32-port ODU0 or 16-port ODU1, 4-port ODU2, or 1-port ODU3 signal sent by switching card to OTU3, and converts it to DWDM standard wavelength conforming to ITU-T G.694.1. At the same time the reverse process of the above can be implemented. it supports hybrid transmission of ODU0/1/2.

LS3(1 slot) Line board for single OTU3 (1slot)

It has mapping of 32-port ODU0 or 16-port ODU1, 4-port ODU2, or 1-port ODU3 signal sent by switching card to OTU3, and converts it to DWDM standard wavelength conforming to ITU-T G.694.1. At the same time the reverse process of the above can be implemented. it supports hybrid transmission of ODU0/1/2.




LO2 Line board for 8*OTU2

It has mapping of 64-port ODU0 or 32-port ODU1, 8-port ODU2 signal sent by switching card to OTU2, and converts it to DWDM standard wavelength conforming to ITU-T G.694.1. At the same time the reverse process of the above can be implemented. it supports hybrid transmission of ODU0/1.

LO2B Line board for 8*OTU2 with PIC technique


LQ2 Line board for 4*OTU2


LD2B Line board for 2*OTU2


Optical Amplification Subsystem Boards

EOBA Enhanced Optical booster It is equipped with the erbium-doped fiber amplifier (EDFA) to boost




amplifier optical power of signals. It is usually used at the transmitting end.

EOLA Enhanced Optical line amplifier

It is equipped with the erbium-doped fiber amplifier (EDFA) to amplify optical signals. It is usually used at the optical relay segment.

EOPA Enhanced Optical pre-amplifier

It is equipped with the erbium-doped fiber amplifier (EDFA) to pre-amplify optical signals. It is usually used at the receiving end.

SEOBA Compact Enhanced Optical booster amplifier

It is equipped with the erbium-doped fiber amplifier (EDFA) to boost optical power of signals. It is usually used at the transmitting end.

SEOLA Compact Enhanced Optical line amplifier

It is equipped with the erbium-doped fiber amplifier (EDFA) to amplify optical signals. It is usually used at the optical relay segment.

SEOPA Compact Enhanced Optical pre-amplifier

It is equipped with the erbium-doped fiber amplifier (EDFA) to pre-amplify optical signals. It is usually used at the receiving end.

EONA Enhanced node amplifier

It is equipped with erbium-doped fiber amplifier (EDFA) to amplify optical signals. The gain range can be adjusted greatly to meet the requirements of different regeneration distances. DCM module can be inserted in the middle for the dispersion compensation. It is usually Configured in the middle of an Optical Multiplex Section.

EONAH High power enhanced node amplifier

It is equipped with erbium-doped fiber amplifier (EDFA) to amplify optical signals and offer high output power. The gain range can be adjusted greatly to meet the requirements of different




regeneration distances. DCM module can be inserted in the middle for the dispersion compensation. It is usually Configured in the middle of an Optical Multiplex Section.

EOBAH High power optical booster amplifier

It is equipped with the erbium-doped fiber amplifier (EDFA)\ to offer high output power. It is used at the transmitting end.

DRA Distributed Raman amplifier

Feeds the Raman pump light to the transmission fiber backward so as to achieve distributed amplification of the optical signal. The range of the amplified wavelength covers C Band and L Band.

RPOA Remote Pump Optical Amplifier

RPOA is new type optical amplification technology: the pump laser is put on OTM station, while gain unit is put on the indicated location of line optical fiber. When the pump light is transmitted through gain unit, it will be interacted with gain unit, thus realizes the amplification function to the signals.

SSDM Supervision add/drop multiplexer

Provides the function of combining the main path optical signal and monitoring signal.

LAC Line Attenuation Compensator

Includes NM-controlled attenuator, it is configured at the end of line to make remote adjustment according to line fiber attenuation change.

Mux/DeMux Subsystem Boards

SOAD1 Optical add/drop multiplex Board of 1 Wavelength Implements add/drop for

1–channel/2

–channel/4–channel, and pass-through wavelength.

SOAD2 Optical add/drop multiplex Board of 2 Wavelength

SOAD4 Optical add/drop multiplex




board of 4 Wavelength

SOGMD Compact Optical Group Mux/DeMux Board

Multiplexes/de-multiplexes four group of wavelengths through red-blue ribbon filters.

OMU Optical multiplex unit

Multiplex optical signals with different wavelengths to one fiber, and provides 8-wave, 16-wave, 32-wave, 40-wave, 48-wave and 80-wave multiplexers.

ODU Optical de-multiplex unit

Separates optical signals of different channels in one fiber from each other, and provides 8-wave, 16-wave, 32-wave, 40-wave, 48-wave and 80-wave de-multiplexers.

VMUX Variable attenuation MUX

Multiplex unit with channel power pre-balance. With AWG+VOA technique, it adjusts attenuations of channels, and then multiplexes them into one channel for output via voltage or current control. Configured at OTM site, it can independently adjust optical power of each channel for channel power pre-balance.

VMUXB

Variable Insertion Loss Multiplexer (B

Type)

Multiplexes signals of 40 optical channels in C band, and implements the channel power pre-equalization.

ODUB Optical De-Multiplexing Unit (B Type)

De-multiplexes signals of 40 optical channels, and provides online monitoring interface of multiplexed optical signal.

OCI Optical channel multiplex /de-multiplex inter-leaver board

Completes the multiplex/de-multiplex of the C band or L band channel interleave at the same time, applying in 80-wave system.

OBM Broadband multiplex board Multiplexes/de-multiplexes the C/L




band signals and the 1510nm (1625nm) monitoring channel, applying in 160/176-wave system.

WSU Wavelength Selective Unit

WSU (Wavelength Selective Unit) board is configured in an ROADM (Reconfigurable Optical Add/Drop Multiplexer) subsystem to implement the reconfiguration of add/drop wavelengths. It makes the maintenance convenient when the add/drop wavelengths change.

WBU Wavelength Blocking Unit

WBU (Wavelength Blocking Unit) board is configured in an ROADM (Reconfigurable Optical Add/Drop Multiplexer) subsystem to implement the reconfiguration of add/drop wavelengths. It makes the maintenance convenient when the add/drop wavelengths change.

WBM Wavelength Blocking Multiplexing

WBU (Wavelength Blocking Unit) board is configured in an ROADM (Reconfigurable Optical Add/Drop Multiplexer) subsystem to implement the reconfiguration of add/drop wavelengths. It makes the maintenance convenient when the add/drop wavelengths change.

PDU Power Distribution Unit Assigns power of optical input signal to optical output ports.

Protection Subsystem Boards

SOP Optical protection board

Provides 1+1 protection for the optical multiplex section or optical channel mainly in the “concurrent sending/optimum receiving” mode.

SOPCS Optical protect for channel section

Realizes the channel fault detection and the optical channel changeover function when there is any fault in the lines.




SOPMS Optical protect for Mux section

Mainly serves to implement the changeover function of the optical multiplex section shared protection.

OMCP Optical Protect for Mux Section

Performs service add/drop and protection switching by means of optical signal cross-connect. The optical switching module in OMCP board implements the function of OMCP board.

Optical Layer Management Subsystem Boards

OPM Optical performance monitoring board

Provides optical performance monitoring function for each optical channel with measuring parameters including optical power, central wavelength and optical S/N ratio and reports the corresponding data to the NMS.

EOPM Enhanced Optical Channel Performance Monitor

Monitors optical channel wavelength, optical power and OSNR of 4-channel or 8-channel WDM optical signals. Measures parameters of each optical channel, including optical power, central wavelength and OSNR. Reports measured data to NMS.

OWM Optical Wavelength Monitor

OWM could automatic detect the abnormal wavelength shift of the OTU, and send adjustment command to the aim OTU until the wavelength shift is in the normal range.

EOWM Enhanced Optical Wavelength Monitor Board

Monitors the central frequency wander of optical channels after the multiplexing and reports the frequency adjustment information to the SNP board.

DCU Dispersion Compensation

Board Used for dispersion compensation of 40G NRZ-DPSK, RZ-DQPSK or




other advanced modulation and coding patterns. Working with the OP board to implement 1+1 protection switching to 40G line-side optical channel. Presetting dispersion compensation and automatically searching the optimum dispersion compensation for protected channel by analyzing error code information on receiver. Dispersion compensation-related optical performance indicators meet system demands.

Supervision Subsystem

SNP Node Processor Collects and processes alarm and performance information of the local NE.

SCC Communication Control Board

Implements routing and transfer of management and control message among boards of sub-racks within an NE.

CCP The subrack control card The subrack control card is located in switching subrack to forward the information between SNP cards.

SOSC Optical supervision channel board

Receives 1510nm optical supervision signals from the adjacent NE and sends them to the SNP after the optical-to-electrical conversion, then receives electrical signals from the SNP and sends them to the adjacent NE after the generation of the 1510nm optical signals with supervision information.

SOSCB Optical supervision channel board for Fast Ethernet

Transfers and exchanges ECC data, orderwire and transparent user channel data, and APS information between NEs of the 100M monitoring system.




Support time synchronization following 1588V2 protocol.

TIS Time interface supply card Provide time synchronization following 1588V2 protocol and input/output of 2M Hz/bit clock

SEIA Compact Extension Interface

Board(type A)

Leads external interfaces and cascade interface of the sub-rack to the front panel, so as to facilitate the connection.

SEIB Compact Extension Interface

Board(type B) Leads external interfaces and makes communication with SNP

Power Supply Subsystem

SPWA Compact Power Box Board (A-type)

SPWA board supports 1+1 hot backup, provides stable power supply for all the boards in the sub-rack, and satisfies the requirements for EMC. It also supports 1+1 backup for sub-racks.

SPWE Compact Power Box Board (E-type)

SPWE board supports 1+1 hot backup, provides stable power supply for all the boards in the sub-rack, and satisfies the requirements for EMC. It also supports 1+1 backup for sub-racks.

SFANA Compact Fan Board Provides heat dissipation for the system.

4.3 The NM Software System Structure

ZXMP M820 implements software management via NetNumenTM U31 (BN) Element

/Network Management Platform for Unix/Windows. It can perform various management

functions for faults, performance, security, configuration, and maintenance of the system.

Designs for NetNumenTM U31 (BN) are based on a four-layered structure including the

equipment layer, the NE layer, the NE management layer and the subnet management

layer. It can also provide the Corba interface for the network management layer.



The hierarchical structure of NetNumenTM U31 (BN) is shown in Figure 4-7

Figure 4-7 Hierarchical Structure of the Element Management Software

4.3.1 Hierarchical structure

The equipment layer (MCU-Manager Control Unit)

The functions of the equipment layer are:

Monitoring alarm and performance status of boards

GUI(Cient) GUI(Cient)

NE/SubnetManager 2

NE/SubnetManager n

GNE/Agent

NE/AgentNE/Agent

NE/AgentECC

ECCECC

ECC ECC

SS

NE/Agent GNE/Agent

S S

FF

LMT

fQx

NML

NEL

NEL

Equipment layer

Qx

Corba

Subnet management layer

SubnetManager 3

GUI(Cient)

F

NMS

F

Corba

NE/SubnetManager 1

GNE/Agent

NE/AgentNE/Agent

NE/Agent

MCU MCU

ECC

ECCECC

ECC

SS

F

Qx

GUI(Cient)

F

F

MCU MCU MCUMCU

NMS

…..… ...

...

…



Receiving EMS commands

Controlling boards to implement certain operations

The NE layer, which is the Agent in the EMS

The functions of the NE layer are:

Managing each NE

Configuring each board when NE is powered on for initialization

Monitoring alarm and performance status of whole NEs under normal running

conditions

Receiving and processing the monitoring commands of NE manager layer through

gateway NE (GNE)

The NE management layer (Manager): controls and coordinates a series of NEs,

including Manager, graphical user interface (GUI) and Local Maintenance Terminal

(LMT).

The functions of the NE management layer are:

The core of the NE manager layer is the Manager (or Server), which can manage

multiple subnets, control and coordinate NE equipment.

GUI provides graphic user interfaces and converts the requirements of user

management into the commands of the internal formats and sends them down to

the Manager.

LMT simply combines GUI and Manager via controlling user rights and software

functional parts, provides some of NE management functions for local NEs

commissioning and maintenance.

The subnet management layer: its structure is similar to that of NE management layer,

and the NEs configuration and maintenance commands are indirectly performed through

NE management layer.

The subnet management system sends a command to the NE management system, via



which forwards it to the NE. After then, the NE responds to the subnet management

system through the NE management system. In addition, it can provide the network

management layer with the Corba interface.

4.3.2 Interface description

Qx interface:

As shown in Figure 4-7, t is the interface between the Agent and the Manager, i.e.,

the interface between the SNP board and the computer where the Manager

program resides. It complies with the TCP/IP.

F interface:

As shown in Figure 4-7, t is the interface between the GUI and the Manager, i.e., the

interface between the GUI and the computer where the Manager program resides. It

complies with the TCP/IP.

f interface:

As shown in Figure 4-7, t is the interface between the Agent and LMT, i.e. the

interface between the SNP board and the local maintenance terminal. On the local

maintenance terminal, related NM software is installed. This interface complies with

the TCP/IP.

S interface:

As shown in Figure 4-7, t is the interface between Agent and MCU, i.e., the

communication interface between the SNP board and other boards. S interface

adopts the point-to-multi-point communication mode based on the HDLC

communication mechanism.

ECC interface:

As shown in Figure 4-7, t is the interface between Agents, i.e. the communication

interface between NEs. It uses DCC for communication, supports customized

communication protocol and standard protocol at the same time, and implements

bridge function on Agent.

Please refer to the element management manuals for more details.



4.4 System Configuration

ZXMP M820 can be configured as the optical terminal multiplexer (OTM), the optical

add/drop multiplexer (OADM) and optical line amplifier (OLA).

4.4.1 Optical Terminal Multiplexer (OTM)

The OTM can add/drop all the services to implement the line terminal node function. As

an OTM, the relationship between platforms is illustrated in Figure 4-8

Figure 4-8 Functional Blocks of the OTM

4.4.2 Optical Add/Drop Multiplexer (OADM)

The ZXMP M820 supports both the Fixed Optical Add/Drop Multiplexer (FOADM)

function and the Reconfigurable Optical Add/Drop Multiplexer (ROADM) function.

FOADM: This function is used to add/drop fixed wavelengths.



ROADM: Wavelengths to be added/ dropped can be reconfigured. In addition, the port

assignment function is available when ROADM is enabled.

The following port assignment function is controlled via the EMS.

In a ROADM node, optical signals with special wavelengths can be assigned to any drop

ports and then dropped through these ports. The wavelengths of these signals meet the

specification of the drop ports assigned for them.

On the other hand, the wavelengths of optical signals input from different add ports can

be converted into the wavelengths of those optical signals having been dropped in the

same node. After that, these optical signals are added at the node.

FOADM equipment

The FOADM can add/drop the specified fixed wavelengths services and pass straight

through other services. As an FOADM, the relationship between platforms is illustrated in

Figure 4-9

Figure 4-9 Functional Blocks of the FOADM

ROADM equipment



Take bidirectional ROADM equipment that adds/drops eight wavelengths as example.

Figure 4-10, Figure 4-11, and Figure 4-12 illustrates the optical connection in the

equipment configured with WBU board ,WBM board and WSU board respectively.

Figure 4-10 Optical Connection of ROADM Equipment with WBU Boards

Figure 4-11 Optical Connection of ROADM Equipment with WBM Boards

OPA

ODU

OTU

1

OTU

2

OTU

3

OTU

8: :

O M U

OTU

1

OTU

2

OTU

3

OTU

8 ::WB

OBA

OPA

WB

OTU

1

OTU

2

OTU

3

OTU

8 ::

OMU

O D U

OTU

1

OTU

2

OTU

3

OTU

8 ::

OBA

IN EX OUTD1

EX IN

A1

OUT

EX IN

A1OUT

IN

D1

EX OUT

WBU WBU

OPA

ODU

OTU

1

OTU

2

OTU

3

OTU

40: :O

TU1

OTU

2

OTU

3

OTU

40 ::

PLC

OBA

OPA

PLC

OTU

1

OTU

2

OTU

3

OTU

40 ::

O D U

OTU

1

OTU

2

OTU

3

OTU

40 ::

OBA

IN EX OUTD1

EX IN

A1

OUT

EX IN

A1OUT

IN

D1

EX OUT

WBM WBM



Figure 4-12 Optical Connection of ROADM Equipment with WSU Boards

4.4.3 Optical Line Amplifier (OLA)

The OLA is used to compensate the optical signal power for long distance transmission.

As an OLA, the relationship between platforms is illustrated in Figure 4-13.

OPA(A)

OBA(A)

OSCL

TL8(

B)

TL3(

B)

TL2(

B)

TL1(

B)

:8:1

DR

OP1

AD

D

OTU

8(A)

OTU

3(A)

OTU

2(A)

OTU

1(A)

OTU

4(A)

OTU

5(A)

OTU

6(A)

OTU

7(A)

BA

OBA(A)

OPA(B)

OSCL

WSS

IN EX OUT

MONA1

EX INOUT

DR

OP2

DR

OP3

DR

OP4

DR

OP5

DR

OP6

DR

OP7

DR

OP8

WSS

DR

OP

7

DR

OP

6

DR

OP

5

DR

OP

4

DR

OP

3

DR

OP

2

DR

OP

1

TL8(

A)

TL3(

A)

TL2(

A)

TL1(

A) :

8 : 1A

DD

INEX OUT

OTU

3(B)

OTU

2(B)

OTU

1(B)

OTU

4(B)

OTU

5(B)

OTU

6(B)

OTU

7(B)

EX INOUT

MONA1

WSU/MA1 WSU/MA1

DR

OP

8O

TU8(B

)



Figure 4-13 Functional Blocks of the OLA



5 Technical Specifications This chapter introduces technical indices of ZXMP M820, including structure, power

supply, performances of boards and the system component indices of OMU/ODU,

OADM, OA and OTU etc.

5.1 Working Wavelength Requirements

The working wavelength of the system strictly complies with the specific central

wavelength and central frequency values used in the multi-channel system, as specified

in the ITU-T Recommendation G.692 and G.694.1.

5.1.1 Wavelength Allocation in 8/16/32/40-Channel Systems

Table 5-1 lists the wavelength allocation in a system consisting of ZXMP M820 with no

more than 40 wavelengths in C band. The spacing between wavelengths is 100GHz (The

spacing for 8-channel system is 200GHz).

Table 5-1 Wavelength Allocation (8/16/32/40-channel, C band)

S/N.

Sub-band Nam

e

Central Frequenc

y

(THz)

Central Wavelength

(nm)

S/N.

Sub-band Nam

e

Central Frequenc

y

(THz)

Central Wavelength

(nm)

1 C 192.1 1560.61 21 C 194.1 1544.53

2 C 192.2 1559.79 22 C 194.2 1543.73

3 C 192.3 1558.98 23 C 194.3 1542.94

4 C 192.4 1558.17 24 C 194.4 1542.14

5 C 192.5 1557.36 25 C 194.5 1541.35

6 C 192.6 1556.55 26 C 194.6 1540.56

7 C 192.7 1555.75 27 C 194.7 1539.77

8 C 192.8 1554.94 28 C 194.8 1538.98

9 C 192.9 1554.13 29 C 194.9 1538.19

10 C 193.0 1553.33 30 C 195.0 1537.40



S/N.

Sub-band Nam

e

Central Frequenc

y

(THz)

Central Wavelength

(nm)

S/N.

Sub-band Nam

e

Central Frequenc

y

(THz)

Central Wavelength

(nm)

11 C 193.1 1552.52 31 C 195.1 1536.61

12 C 193.2 1551.72 32 C 195.2 1535.82

13 C 193.3 1550.92 33 C 195.3 1535.04

14 C 193.4 1550.12 34 C 195.4 1534.25

15 C 193.5 1549.32 35 C 195.5 1533.47

16 C 193.6 1548.51 36 C 195.6 1532.68

17 C 193.7 1547.72 37 C 195.7 1531.90

18 C 193.8 1546.92 38 C 195.8 1531.12

19 C 193.9 1546.12 39 C 195.9 1530.33

20 C 194.0 1545.32 40 C 196.0 1529.55

Note: Sub-band C refers to the first sub-band in C band with the wavelength spacing at 100 GHz.

5.1.2 Wavelength Allocation in 48/96 Wavelength System

Table 5-2 lists the wavelength allocation in a system consisting of ZXMP M820 with

48/96 wavelengths in C band. The spacing between wavelengths is 100GHz/50GHz.

Table 5-2 Wavelength Allocation (48/96-channel, C band)

S/N.

Sub-band

Name

Central Frequenc

y

(THz)

Central Wavelength

(nm)

S/N.

Sub-band

Name

Central Frequenc

y

(THz)

Central Wavelength

(nm)

1 C1002 196.05 1529.16 49 C1002 193.65 1548.11

2 C1001 196.00 1529.55 50 C1001 193.60 1548.51

3 C1002 195.95 1529.94 51 C1002 193.55 1548.91

4 C1001 195.90 1530.33 52 C1001 193.50 1549.32

5 C1002 195.85 1530.72 53 C1002 193.45 1549.72

6 C1001 195.80 1531.12 54 C1001 193.40 1550.12

7 C1002 195.75 1531.51 55 C1002 193.35 1550.52

8 C1001 195.70 1531.90 56 C1001 193.30 1550.92



S/N.

Sub-band

Name

Central Frequenc

y

(THz)

Central Wavelength

(nm)

S/N.

Sub-band

Name

Central Frequenc

y

(THz)

Central Wavelength

(nm)

9 C1002 195.65 1532.29 57 C1002 193.25 1551.32

10 C1001 195.60 1532.68 58 C1001 193.20 1551.72

11 C1002 195.55 1533.07 59 C1002 193.15 1552.12

12 C1001 195.50 1533.47 60 C1001 193.10 1552.52

13 C1002 195.45 1533.86 61 C1002 193.05 1552.93

14 C1001 195.40 1534.25 62 C1001 193.00 1553.33

15 C1002 195.35 1534.64 63 C1002 192.95 1553.73

16 C1001 195.30 1535.04 64 C1001 192.90 1554.13

17 C1002 195.25 1535.43 65 C1002 192.85 1554.54

18 C1001 195.20 1535.82 66 C1001 192.80 1554.94

19 C1002 195.15 1536.22 67 C1002 192.75 1555.34

20 C1001 195.10 1536.61 68 C1001 192.70 1555.75

21 C1002 195.05 1537.00 69 C1002 192.65 1556.15

22 C1001 195.00 1537.40 70 C1001 192.60 1556.55

23 C1002 194.95 1537.79 71 C1002 192.55 1556.96

24 C1001 194.90 1538.19 72 C1001 192.50 1557.36

25 C1002 194.85 1538.58 73 C1002 192.45 1557.77

26 C1001 194.80 1538.98 74 C1001 192.40 1558.17

27 C1002 194.75 1539.37 75 C1002 192.35 1558.58

28 C1001 194.70 1539.77 76 C1001 192.30 1558.98

29 C1002 194.65 1540.16 77 C1002 192.25 1559.39

30 C1001 194.60 1540.56 78 C1001 192.20 1559.79

31 C1002 194.55 1540.95 79 C1002 192.15 1560.20

32 C1001 194.50 1541.35 80 C1001 192.10 1560.61

33 C1002 194.45 1541.75 81 C1002 192.05 1561.02

34 C1001 194.40 1542.14 82 C1001 192.00 1561.42

35 C1002 194.35 1542.54 83 C1002 191.95 1561.83

36 C1001 194.30 1542.94 84 C1001 191.90 1562.24

37 C1002 194.25 1543.33 85 C1002 191.85 1562.64



S/N.

Sub-band

Name

Central Frequenc

y

(THz)

Central Wavelength

(nm)

S/N.

Sub-band

Name

Central Frequenc

y

(THz)

Central Wavelength

(nm)

38 C1001 194.20 1543.73 86 C1001 191.80 1563.05

39 C1002 194.15 1544.13 87 C1002 191.75 1563.46

40 C1001 194.10 1544.53 88 C1001 191.70 1563.87

41 C1002 194.05 1544.92 89 C1002 191.65 1564.27

42 C1001 194.00 1545.32 90 C1001 191.60 1564.68

43 C1002 193.95 1545.72 91 C1002 191.55 1565.09

44 C1001 193.90 1546.12 92 C1001 191.50 1565.5

45 C1002 193.85 1546.52 93 C1002 191.45 1565.91

46 C1001 193.80 1546.92 94 C1001 191.40 1566.32

47 C1002 193.75 1547.32 95 C1002 191.35 1566.73

48 C1001 193.70 1547.72 96 C1001 191.30 1567.14

Note: Sub-band C1001 and C1002 respectively refer to the first and the second sub-bands in C band with the

wavelength spacing at 100 GHz. Each sub-band includes 48 wavelengths.

5.1.3 Wavelength Allocation in 80/160 Wavelength System

Table 5-3 lists the wavelength allocation in a system consisting of ZXMP M820 with 80

wavelengths in C band. The spacing between wavelengths is 50 GHz.

Table 5-3 Wavelength Allocation (80-channel, C band)

S/N.

Sub-ban

d Nam

e

Central Frequency

(THz)

Central Wavelength

(nm)

S/N.

Sub-band

Name

Central Frequency

(THz)

Central Wavelength

(nm)

1 C+ 196.05 1529.16 41 C+ 194.05 1544.92

2 C 196.00 1529.55 42 C 194.00 1545.32

3 C+ 195.95 1529.94 43 C+ 193.95 1545.72

4 C 195.90 1530.33 44 C 193.90 1546.12

5 C+ 195.85 1530.72 45 C+ 193.85 1546.52



S/N.

Sub-ban

d Nam

e

Central Frequency

(THz)

Central Wavelength

(nm)

S/N.

Sub-band

Name

Central Frequency

(THz)

Central Wavelength

(nm)

6 C 195.80 1531.12 46 C 193.80 1546.92

7 C+ 195.75 1531.51 47 C+ 193.75 1547.32

8 C 195.70 1531.90 48 C 193.70 1547.72

9 C+ 195.65 1532.29 49 C+ 193.65 1548.11

10 C 195.60 1532.68 50 C 193.60 1548.51

11 C+ 195.55 1533.07 51 C+ 193.55 1548.91

12 C 195.50 1533.47 52 C 193.50 1549.32

13 C+ 195.45 1533.86 53 C+ 193.45 1549.72

14 C 195.40 1534.25 54 C 193.40 1550.12

15 C+ 195.35 1534.64 55 C+ 193.35 1550.52

16 C 195.30 1535.04 56 C 193.30 1550.92

17 C+ 195.25 1535.43 57 C+ 193.25 1551.32

18 C 195.20 1535.82 58 C 193.20 1551.72

19 C+ 195.15 1536.22 59 C+ 193.15 1552.12

20 C 195.10 1536.61 60 C 193.10 1552.52

21 C+ 195.05 1537.00 61 C+ 193.05 1552.93

22 C 195.00 1537.40 62 C 193.00 1553.33

23 C+ 194.95 1537.79 63 C+ 192.95 1553.73

24 C 194.90 1538.19 64 C 192.90 1554.13

25 C+ 194.85 1538.58 65 C+ 192.85 1554.54

26 C 194.80 1538.98 66 C 192.80 1554.94

27 C+ 194.75 1539.37 67 C+ 192.75 1555.34

28 C 194.70 1539.77 68 C 192.70 1555.75

29 C+ 194.65 1540.16 69 C+ 192.65 1556.15

30 C 194.60 1540.56 70 C 192.60 1556.55

31 C+ 194.55 1540.95 71 C+ 192.55 1556.96

32 C 194.50 1541.35 72 C 192.50 1557.36

33 C+ 194.45 1541.75 73 C+ 192.45 1557.77



S/N.

Sub-ban

d Nam

e

Central Frequency

(THz)

Central Wavelength

(nm)

S/N.

Sub-band

Name

Central Frequency

(THz)

Central Wavelength

(nm)

34 C 194.40 1542.14 74 C 192.40 1558.17

35 C+ 194.35 1542.54 75 C+ 192.35 1558.58

36 C 194.30 1542.94 76 C 192.30 1558.98

37 C+ 194.25 1543.33 77 C+ 192.25 1559.39

38 C 194.20 1543.73 78 C 192.20 1559.79

39 C+ 194.15 1544.13 79 C+ 192.15 1560.20

40 C 194.10 1544.53 80 C 192.10 1560.61

Note: Sub-band C and C+ respectively refer to the first and the second sub-bands in C band with the wavelength

spacing at 100 GHz. Each sub-band includes 40 wavelengths.


wavelengths in L band. The spacing between wavelengths is 50GHz.

Table 5-4 Wavelength Allocation (80-channel, L band)

S/N.

Sub-ban

d Nam

e

Central Frequency

(THz)

Central Wavelength

(nm)

S/N.

Sub-band

Name

Central Frequency

(THz)

Central Wavelength

(nm)

1 L 190.90 1570.42 41 L 188.90 1587.04

2 L+ 190.85 1570.83 42 L+ 188.85 1587.46

3 L 190.80 1571.24 43 L 188.80 1587.88

4 L+ 190.75 1571.65 44 L+ 188.75 1588.30

5 L 190.70 1572.06 45 L 188.70 1588.73

6 L+ 190.65 1572.48 46 L+ 188.65 1589.15

7 L 190.60 1572.89 47 L 188.60 1589.57

8 L+ 190.55 1573.30 48 L+ 188.55 1589.99

9 L 190.50 1573.71 49 L 188.50 1590.41

10 L+ 190.45 1574.13 50 L+ 188.45 1590.83



S/N.

Sub-ban

d Nam

e

Central Frequency

(THz)

Central Wavelength

(nm)

S/N.

Sub-band

Name

Central Frequency

(THz)

Central Wavelength

(nm)

11 L 190.40 1574.54 51 L 188.40 1591.26

12 L+ 190.35 1574.95 52 L+ 188.35 1591.68

13 L 190.30 1575.37 53 L 188.30 1592.10

14 L+ 190.25 1575.78 54 L+ 188.25 1592.52

15 L 190.20 1576.20 55 L 188.20 1592.95

16 L+ 190.15 1576.61 56 L+ 188.15 1593.37

17 L 190.10 1577.03 57 L 188.10 1593.79

18 L+ 190.05 1577.44 58 L+ 188.05 1594.22

19 L 190.00 1577.86 59 L 188.00 1594.64

20 L+ 189.95 1578.27 60 L+ 187.95 1595.06

21 L 189.90 1578.69 61 L 187.90 1595.49

22 L+ 189.85 1579.10 62 L+ 187.85 1595.91

23 L 189.80 1579.52 63 L 187.80 1596.34

24 L+ 189.75 1579.93 64 L+ 187.75 1596.76

25 L 189.70 1580.35 65 L 187.70 1597.19

26 L+ 189.65 1580.77 66 L+ 187.65 1597.62

27 L 189.60 1581.18 67 L 187.60 1598.04

28 L+ 189.55 1581.60 68 L+ 187.55 1598.47

29 L 189.50 1582.02 69 L 187.50 1598.89

30 L+ 189.45 1582.44 70 L+ 187.45 1599.32

31 L 189.40 1582.85 71 L 187.40 1599.75

32 L+ 189.35 1583.27 72 L+ 187.35 1600.17

33 L 189.30 1583.69 73 L 187.30 1600.60

34 L+ 189.25 1584.11 74 L+ 187.25 1601.03

35 L 189.20 1584.53 75 L 187.20 1601.46

36 L+ 189.15 1584.95 76 L+ 187.15 1601.88

37 L 189.10 1585.36 77 L 187.10 1602.31

38 L+ 189.05 1585.78 78 L+ 187.05 1602.74



S/N.

Sub-ban

d Nam

e

Central Frequency

(THz)

Central Wavelength

(nm)

S/N.

Sub-band

Name

Central Frequency

(THz)

Central Wavelength

(nm)

39 L 189.00 1586.20 79 L 187.00 1602.17

40 L+ 188.95 1586.62 80 L+ 186.95 1603.57

Note: Sub-band L and L+ respectively refer to the first and the second sub-bands in L band with the wavelength

spacing at 100 GHz. Each sub-band includes 40 wavelengths.

Table 5-3 and Table 5-4 list the wavelength allocation in a system consisting of ZXMP

M820 with 160 wavelengths in C+L band. The spacing between wavelengths is 50GHz.

5.1.4 Wavelength Allocation in 176-Channel Systems

When the system is extended to 176-channel system (C+L band) with the spacing at

50GHz, wavelength allocations in 96-channel band (C band) and 80-channel system (L

band) are adopted.

5.1.5 Wavelength Allocation in 192-Channel Systems


wavelengths in C band. The spacing between wavelengths is 25GHz.

Table 5-5 Wavelength Allocation (192-channel, C band)

S/N. Sub-band

Name

Central Frequenc

y

(THz)

Central Wavelength

(nm) S/N.

Sub-band Nam

e

Central Frequenc

y

(THz)

Central Wavelength

(nm)

1 C1004 196.075 1528.97 97 C1004 193.675 1547.92

2 C1002 196.05 1529.16 98 C1002 193.65 1548.11

3 C1003 196.025 1529.36 99 C1003 193.625 1548.31

4 C1001 196 1529.55 100 C1001 193.6 1548.51

5 C1004 195.975 1529.75 101 C1004 193.575 1548.71

6 C1002 195.95 1529.94 102 C1002 193.55 1548.91



S/N. Sub-band

Name

Central Frequenc

y

(THz)

Central Wavelength

(nm) S/N.

Sub-band Nam

e

Central Frequenc

y

(THz)

Central Wavelength

(nm)

7 C1003 195.925 1530.14 103 C1003 193.525 1549.11

8 C1001 195.9 1530.33 104 C1001 193.5 1549.32

9 C1004 195.875 1530.53 105 C1004 193.475 1549.52

10 C1002 195.85 1530.72 106 C1002 193.45 1549.72

11 C1003 195.825 1530.92 107 C1003 193.425 1549.92

12 C1001 195.8 1531.12 108 C1001 193.4 1550.12

13 C1004 195.775 1531.31 109 C1004 193.375 1550.32

14 C1002 195.75 1531.51 110 C1002 193.35 1550.52

15 C1003 195.725 1531.7 111 C1003 193.325 1550.72

16 C1001 195.7 1531.9 112 C1001 193.3 1550.92

17 C1004 195.675 1532.09 113 C1004 193.275 1551.12

18 C1002 195.65 1532.29 114 C1002 193.25 1551.32

19 C1003 195.625 1532.49 115 C1003 193.225 1551.52

20 C1001 195.6 1532.68 116 C1001 193.2 1551.72

21 C1004 195.575 1532.88 117 C1004 193.175 1551.92

22 C1002 195.55 1533.07 118 C1002 193.15 1552.12

23 C1003 195.525 1533.27 119 C1003 193.125 1552.32

24 C1001 195.5 1533.47 120 C1001 193.1 1552.52

25 C1004 195.475 1533.66 121 C1004 193.075 1552.73

26 C1002 195.45 1533.86 122 C1002 193.05 1552.93

27 C1003 195.425 1534.05 123 C1003 193.025 1553.13

28 C1001 195.4 1534.25 124 C1001 193 1553.33

29 C1004 195.375 1534.45 125 C1004 192.975 1553.53

30 C1002 195.35 1534.64 126 C1002 192.95 1553.73

31 C1003 195.325 1534.84 127 C1003 192.925 1553.93

32 C1001 195.3 1535.04 128 C1001 192.9 1554.13

33 C1004 195.275 1535.23 129 C1004 192.875 1554.34

34 C1002 195.25 1535.43 130 C1002 192.85 1554.54

35 C1003 195.225 1535.63 131 C1003 192.825 1554.74



S/N. Sub-band

Name

Central Frequenc

y

(THz)

Central Wavelength

(nm) S/N.

Sub-band Nam

e

Central Frequenc

y

(THz)

Central Wavelength

(nm)

36 C1001 195.2 1535.82 132 C1001 192.8 1554.94

37 C1004 195.175 1536.02 133 C1004 192.775 1555.14

38 C1002 195.15 1536.22 134 C1002 192.75 1555.34

39 C1003 195.125 1536.41 135 C1003 192.725 1555.55

40 C1001 195.1 1536.61 136 C1001 192.7 1555.75

41 C1004 195.075 1536.81 137 C1004 192.675 1555.95

42 C1002 195.05 1537 138 C1002 192.65 1556.15

43 C1003 195.025 1537.2 139 C1003 192.625 1556.35

44 C1001 195 1537.4 140 C1001 192.6 1556.55

45 C1004 194.975 1537.59 141 C1004 192.575 1556.76

46 C1002 194.95 1537.79 142 C1002 192.55 1556.96

47 C1003 194.925 1537.99 143 C1003 192.525 1557.16

48 C1001 194.9 1538.19 144 C1001 192.5 1557.36

49 C1004 194.875 1538.38 145 C1004 192.475 1557.57

50 C1002 194.85 1538.58 146 C1002 192.45 1557.77

51 C1003 194.825 1538.78 147 C1003 192.425 1557.97

52 C1001 194.8 1538.98 148 C1001 192.4 1558.17

53 C1004 194.775 1539.17 149 C1004 192.375 1558.38

54 C1002 194.75 1539.37 150 C1002 192.35 1558.58

55 C1003 194.725 1539.57 151 C1003 192.325 1558.78

56 C1001 194.7 1539.77 152 C1001 192.3 1558.98

57 C1004 194.675 1539.96 153 C1004 192.275 1559.19

58 C1002 194.65 1540.16 154 C1002 192.25 1559.39

59 C1003 194.625 1540.36 155 C1003 192.225 1559.59

60 C1001 194.6 1540.56 156 C1001 192.2 1559.79

61 C1004 194.575 1540.76 157 C1004 192.175 1560

62 C1002 194.55 1540.95 158 C1002 192.15 1560.2

63 C1003 194.525 1541.15 159 C1003 192.125 1560.4

64 C1001 194.5 1541.35 160 C1001 192.1 1560.61



S/N. Sub-band

Name

Central Frequenc

y

(THz)

Central Wavelength

(nm) S/N.

Sub-band Nam

e

Central Frequenc

y

(THz)

Central Wavelength

(nm)

65 C1004 194.475 1541.55 161 C1004 192.075 1560.81

66 C1002 194.45 1541.75 162 C1002 192.05 1561.02

67 C1003 194.425 1541.94 163 C1003 192.025 1561.22

68 C1001 194.4 1542.14 164 C1001 192 1561.42

69 C1004 194.375 1542.34 165 C1004 191.975 1561.62

70 C1002 194.35 1542.54 166 C1002 191.95 1561.83

71 C1003 194.325 1542.74 167 C1003 191.925 1562.03

72 C1001 194.3 1542.94 168 C1001 191.9 1562.24

73 C1004 194.275 1543.13 169 C1004 191.875 1562.44

74 C1002 194.25 1543.33 170 C1002 191.85 1562.64

75 C1003 194.225 1543.53 171 C1003 191.825 1562.84

76 C1001 194.2 1543.73 172 C1001 191.8 1563.05

77 C1004 194.175 1543.93 173 C1004 191.775 1563.25

78 C1002 194.15 1544.13 174 C1002 191.75 1563.46

79 C1003 194.125 1544.33 175 C1003 191.725 1563.66

80 C1001 194.1 1544.53 176 C1001 191.7 1563.87

81 C1004 194.075 1544.72 177 C1004 191.675 1564.07

82 C1002 194.05 1544.92 178 C1002 191.65 1564.27

83 C1003 194.025 1545.12 179 C1003 191.625 1564.47

84 C1001 194 1545.32 180 C1001 191.6 1564.68

85 C1004 193.975 1545.52 181 C1004 191.575 1564.88

86 C1002 193.95 1545.72 182 C1002 191.55 1565.09

87 C1003 193.925 1545.92 183 C1003 191.525 1565.29

88 C1001 193.9 1546.12 184 C1001 191.5 1565.5

89 C1004 193.875 1546.32 185 C1004 191.475 1565.7

90 C1002 193.85 1546.52 186 C1002 191.45 1565.91

91 C1003 193.825 1546.72 187 C1003 191.425 1566.11

92 C1001 193.8 1546.92 188 C1001 191.4 1566.32

93 C1004 193.775 1547.12 189 C1004 191.375 1566.52



S/N. Sub-band

Name

Central Frequenc

y

(THz)

Central Wavelength

(nm) S/N.

Sub-band Nam

e

Central Frequenc

y

(THz)

Central Wavelength

(nm)

94 C1002 193.75 1547.32 190 C1002 191.35 1566.73

95 C1003 193.725 1547.52 191 C1003 191.325 1566.93

96 C1001 193.7 1547.72 192 C1001 191.3 1567.14

Note: Sub-band C1001, C1002, C1003 and C1004 respectively refer to the first, second, third and fourth sub-bands in

C band with the wavelength spacing at 100 GHz. Each sub-band includes 48 wavelengths. Sub-band C501 with

wavelength spacing at 50 GHz is composed of sub-band C1001 and C1002, while sub-band C502 with wavelength

spacing at 50 GHz is composed of sub-band C1003 and C1004.

5.2 System Component Indices

The schematic diagram of the system is illustrated in Figure 5-1, and meaning of each

component and interface is listed in Table 5-6.

Figure 5-1 Schematic Diagram of the DWDM System

Table 5-6 Meaning of Components and Interfaces of the DWDM System

Code Description

TX1 … TXn The OTU for multiplexing paths 1 … n

F1 … fn The wavelength occupied by multiplexing paths 1 … n (in unit of frequency)

OM/OA

OAOD/OA

TX1

TX2

TXn

RX1

RX2

RXn

OM/OA

OD/OA

RX1

RX2

RXn

TX1

TX2

TXn

OSC

Rm1

Rm2

Rmn

MPI-R

MPI-S

MPI-S

MPI-R

R1

R2

Rn

R1

R2

Rn

S1

S2

Sn

f1

f2

fn

S1

S2

Sn

f1

f2

fnSDn

SD2

SD1

SDn

SD2

SD1

R'

S' R'

S'

OA



Code Description

S1 … Sn Reference points on the optical fibre at the output optical connectors of the transmitters for channels 1...n respectively

RM1 … RMn Reference points on the optical fibre just before the OM/OA input optical connectors for channels 1...n respectively

OM Optical Multiplexer

OA Optical amplifier

OD Optical demultiplexer

MPI Main optical channel

MPI-S Reference point on the optical fibre just after the OM/OA output optical connector

MPI-R Reference point on the optical fibre just before the OA/OD input optical connector

R’ Reference point on the optical fibre just before the line OA input optical connector

S’ Reference point just after the line OA output optical connector

SD1 … SDn Reference points at the OA/OD output optical connectors

R1 … Rn Reference points at the inputs to the receiver optical connectors.

RX1 … RXn The OTU for multiplexing paths 1 … n

OSC Optical supervisory channel

5.3 OMU/ODU Unit Specifications

Technical specifications of OM U and ODU for ZXMP M820 are listed below:

5.3.1 Specifications of OMU Board

The OMU technical specifications of ZXMP M820 are listed in Table 5-7.

Table 5-7 Technical specifications of OMU Board

Item Unit Specifications (32

Channels) Specifications (40

Channels)

Specifications

(48 Chann

Specifications (80 Channels)



els)

Coupler AWG TFF Coupl

er AWG TFF AWG Coupler AWG

Insertion loss

dB <17 <10 <10 <19 <10 <10 <10 <23 <10

Max. difference of insertion losses of channels

dB <3 <3 <3 <3 <3 <3 <3 <3.5 <3

Channel spacing

GHz - 100 100 - 100 100 100 - 50

Optical

return

loss

dB >40 >40 >40 >40 >40 >40 >40 >40 >40

Working wavelength range

nm 1529-1561

1529- 1561

/1570-1605

1529- 1561

/1570-1605

1529-1561

1529- 1561

/1570-1605

1529- 1561

/1570-1605

1529- 1561

/1570-1605

1529-1568

1529- 1561

/1570-1605

Polarization-related loss

dB <0.5 <0.5 <0.5 <0.6 <0.5 <0.5 <0.5 <0.7 <0.5

Polarization-mode dispersion

ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5

Temperature characteristics

nm/C --- <0.005 --- --- <0.005 --- --- --- ---



Note: 1529 nm ~ 1561 nm corresponds to the C band OMU, while 1570nm ~ 1605 nm corresponds to the L band

OMU.

5.3.2 Specifications of ODU Board

Technical specifications of ZXMP M820 ODU are listed in Table 5-8.

Table 5-8 Technical specifications of ODU Board

Item Unit



Specifications

(48 Channel

s)

Specifications (80

Channels)

AWG TFF AWG TFF AWG AWG

Insertion loss

dB < 10 < 10 < 10 < 10 < 10 < 10

Max. difference of insertion losses of channels

dB < 3 < 3 < 3 < 3 < 3 < 3

Channel spacing

GHz 100 100 100 100 100 50

Optical return

loss

dB > 40 > 40 > 40 > 40 > 40 > 40


nm

1529-1561

/ 1570-1605

1529-1561

/ 1570-1605

1529-1561

/ 1570-1605

1529-1561

/1570-1605

1529-1568

/ 1570-1605

1529-1561

/ 1570-1605

Separation of adjacent channel

dB > 25 > 25 > 25 > 25 > 25 > 25



Item Unit



Specifications

(48 Channel

s)

Specifications (80

Channels)

AWG TFF AWG TFF AWG AWG

s

Separation of non-adjacent channels

dB > 30 > 30 > 30 > 30 > 30 > 30


dB < 0.5 < 0.5 < 0.5 < 0.5 < 0.5 < 0.5


ps < 0.5 < 0.5 < 0.5 < 0.5 < 0.5 < 0.5

Temperature characteristics

nm/C

< 0.005 --- < 0.005 --- < 0.005 < 0.005

-1dB bandwidth

nm > 0.3 > 0.3 > 0.3 > 0.3 > 0.3 > 0.3

Note: 1529 nm ~ 1561 nm corresponds to the C band ODU, while 1570 nm ~ 1605 nm corresponds to the L band

ODU.

5.3.3 Specifications of ODUB Board

Technical specifications of the ODUB board are listed in Table 5-9.

Table 5-9 Technical Specifications of the ODUB Board

Item Unit Specification(40-Channel)



Item Unit Specification(40-Channel)

Insertion loss dB <10

Maximum insertion loss difference between channels

dB <2

Channel spacing GHz 100

Optical return loss dB > 40

Operating wavelength range nm 1529 - 1561 / 1570 - 1605

Isolation of adjacent channel dB >25

Isolation of non-adjacent channel dB >30

Polarization dependent loss (PDL) dB <0.5

Polarization mode dispersion (PMD) Ps <0.5

Temperature characteristics nm/℃ -

-1 dB bandwidth nm >0.2

5.3.4 Specifications of VMUX Board

Configured at OTM site, VMUX can independently adjust optical power of each channel

to pre-weight channel power. Technical specifications of ZXMP M820 VMUX are listed in

Table 5-10.

Table 5-10 Technical specifications of VMUX Board

Item Unit Specification

Number of channels --- 40/48


Working wavelength range nm 40-channel: 1529-1561/1570-1605

48-channel: 1529-1568

-1dB bandwidth nm > 0.2

Insertion loss (@0dB VOA) dB < 8

Polarization-mode dispersion ps 0.5

Polarization-related loss dB 0.8


Channel adjustment range dB 0~10

VOA adjustment accuracy dB < 0.5



5.3.5 Specifications of VMUXB Board

Configured at OTM site, VMUX can independently adjust optical power of each channel

to pre-weight channel power. Technical specifications of ZXMP M820 VMUXB are listed

in Table 5-11.

Table 5-11 Technical specifications of VMUXB Board


Number of channels --- 40


Working wavelength range nm 40-channel: 1529-1561/1570-1605


Insertion loss (@0dB VOA) dB < 8

Polarization-mode dispersion ps 0.5

Polarization-related loss dB 0.8


Channel adjustment range dB 0~10

VOA adjustment accuracy dB < 0.5

5.3.6 Specifications of OCI Board

Technical specifications of the OCI board are illustrated in Table 5-12 and Table 5-13.

Table 5-12 Technical Specifications of the OCI Board (100GHz-50GHz)


C band wavelength range nm 1529 - 1568

CE band wavelength range nm 1529-1568

L band wavelength range nm 1570 - 1605

Input optical power range dBm < +23

Input wavelength spacing GHz 100

Output wavelength spacing GHz 50

Insertion loss dB < 3

Max. difference of insertion losses of channels dB < 1





Separation of adjacent channels dB > 25

Separation of non-adjacent channels dB > 25

Polarization-related loss dB < 0.5

Polarization-mode dispersion ps < 0.5


Table 5-13 Technical Specifications of the OCI Board (50GHz-25GHz)


CE band wavelength range THz 1529-1568

Input optical power range dBm < +23

Input wavelength spacing GHz 50

Output wavelength spacing GHz 25

Insertion loss dB < 3

Max. difference of insertion losses of channels dB < 2


Isolation of de-multiplexing procedure dB > 21

Isolation of multiplexing procedure dB > 16

Polarization dependent loss (PDL) dB < 0.5

Polarization mode dispersion (PMD) ps < 0.2

-1dB bandwidth nm > 20

5.3.7 Specifications of OBM Board

Technical Specifications of the OBM Board for ZXMP M820 are listed in Table 5-14.

Table 5-14 Technical Specifications of the OBM Board


C band wavelength range nm 1529 -1561

CE band wavelength range nm 1529-1568

L band wavelength range nm 1570 -1605




C band insertion loss dB < 1.5

CE band insertion loss dB < 1.5

L band insertion loss dB < 1.5

Isolation dB 15


Polarization-related loss dB < 0.5

Polarization-mode dispersion ps < 0.5

5.4 WSUA/WSUD & WBU Unit Specifications

Technical specifications of WBU are listed in Table 5-15.

Table 5-15 Technical specifications of WBU Board


Optical Spectrum range nm 1529-1568


50

Channel quantity - 40/48

80/96

Straight insertion loss

A1/A2-OUT dB <1.5

IN-D1/D2 dB <4

EXIN-OUT dB <14

IN-EXOUT dB <4

Attenuation tunable range dB 0~15

Attenuation tunable precision(ER) dB <0.5

Blocked extinction ratio dB >35

Return loss dB >40

Maximum total input optical power dBm ≤25

Maximum Single-channel input optical power dBm ≤16



Technical specifications of WSUA/WSUD for ZXMP M820 are listed in Table 5-16.

Table 5-16 Technical specifications of WSUA/WSUD Board


WSUD WSUA

Optical Spectrum range nm 1529-1561 1529-1561

Channel spacing GHz 100 100

50 50

Channel quantity - 40 40

80 80

Straight insertion loss

A1-OUT dB <2 <2

A2-OUT dB <10 <10

IN-D1~D8 dB <6 <6

EXIN-OUT dB <9 <6

IN-EXOUT dB

<6（WSUD/MA1）

<16（WSUD/MA2）

<9（WSUA/MD1）

<16（WSUA/MD2）

Attenuation tunable range dB 0~15 0~15

Attenuation tunable precision(ER) dB <0.5 <0.5

Blocked extinction ratio dB >35 >35

Return loss dB >40 >40

Maximum total input optical power dBm ≤25 ≤25

Maximum Single-channel input optical power

dBm ≤16 ≤16

Technical specifications of WBM are listed in Table 5-17.

Table 5-17 Technical specifications of WBM Board


Optical spectrum range nm 1529-1561


Channel quantity - 40

insertion loss An-OUT (n=1-40) dB <8




IN-DROP dB <7

EXIN-OUT dB <13

IN-EXOUT dB <3

Attenuation adjustment range dB 0-15

Attenuation adjustment precision dB < (0.5 or ±10% of the adjustment precision, select the larger one)

Return loss dB >40

Technical specifications of PDU Boards are listed in following tables.

Table 5-18 Technical specifications of PDU-4-X Board

Item Unit Indices (PDU-4-X)

wavelength range Nm

1529~1561(C-band)

1529~1568(CE-band)

1570~1605(L-band)

Insertion Loss

INx→Ox-1/2/3/4 dB <8.0

Polarization-related loss dB <0.4

Optical Return Loss dB >40



wavelength range Nm

1529~1561(C-band)

1529~1568(CE-band)

1570~1605(L-band)

Insertion Loss

INx →

Ox-1/2/3/4 dB <12.0

INx→Dx dB <4.0





Table 5-20 Technical specifications of PDU-8-X board


wavelength range Nm

1529~1561(C-band)

1529~1568(CE-band)

1570~1605(L-band)

Insertion Loss INx →

Ox-1/2/3/4/5/6/7/8 dB <11.0





wavelength range Nm

1529~1561(C-band)

1529~1568(CE-band)

1570~1605(L-band)

Insertion Loss

INx →

Ox-1/2/3/4/5/6/7/8 dB <15.0

INx→Dx dB <4.0




Item Unit Indices

(PDU-16-X)

wavelength range Nm

1529~1561(C-band)

1529~1568(CE-band)

1570~1605(L-band)

Insertion Loss

Inx

Ox-1/2/3/4/5/6/7/8/9/10/11/12/13/14/15/16 dB <14.0





5.5 OADM Unit Specifications

The OADM of ZXMP M820 is used to add/drop 4 or 8-wavelength signals. Take the C

band 8-wavelength OADM for example, its main Technical specifications are listed in

Table 5-23.

Table 5-23 Technical specifications of OADM Board

Name Specification Unit

Central frequency range 191.3~196.0 THz

Central channel range 1529.16 ~1567.14 nm

- 0.5dB bandwidth > 0.2 nm

- 20dB bandwidth <1.2 nm

Channel spacing 100 GHz

Number of add/drop channels 8/4 ---

Isolation

Between In-Drop and adjacent channel

> 25 dB

Between In-Drop and non- adjacent channel

>35 dB

Between In-Midl and Drop

>14 dB

Between In-Out and Drop

> 28 dB

Optical return loss >40 dB

Directivity > 60 dB

Insertion loss

In-drop <4.0 dB

Add-out <4.0 dB

In-out <6.0 dB

Working relative humidity 5 ~95 %RH

Max. allowed optical power <500 mW

5.6 OA Unit Specifications

To achieve smooth expansion of DWDM systems from 2.5Gbit/s and 10Gbit/s to 40Gbit/s,



optical amplifiers used in the ZXWMM820 are compatible with both 2.5Gbit/s, 10Gbit/s

and 40Gbit/s systems.

5.6.1 Specifications of EOBA (Enhanced Optical Booster Amplifier) Board

40-channel C/L band optical booster amplifiers

As shown in Table 5-24, the single channel power is applicable to 40-channel

system.

Table 5-24 Technical specifications of 40-channel EOBA Board (C/L-band)

Item Unit Indices (40-channel system)

EOBA17/17 EOBA27/26 EOBA22/20 EOBA20/20 EOBA24/24


nm

1529~1561 (C band)

1570~1605 (L band)

1529~1561 (C band)

1570~1605

(L band)

1529~1561 (C band)

1570~1605 (L band)

1529~1561 (C band)

1570~1605 (L band)

1529~1561 (C band)

1570~1605(L band)

Total input power range

dBm -32 ~3 -32 ~2 -32 ~1 -32 ~3 -32 ~3

Input power range of the channel

dBm -32 ~-13 -32 ~-14 -32~ -15 -32 ~-13 -32 ~-13

Output power range of the channel

dBm -2~4 7~13 1~7 1~7 5~11

Total output power range

dBm -2~17 7~26 1~20 1~20 5~24

Max. total output power

dBm 17 26 20 20 24

Noise coefficient

dB <6 <6 <6 <6 <6


dB <0.5 <0.5 <0.5 <0.5 <0.5

Pump leak at input

dBm <-30 <-30 <-30 <-30 <-30

Pump leak at dBm <-30 <-30 <-30 <-30 <-30





output

Input return loss

dB >40 >40 >40 >40 >40

Output return loss

dB >40 >40 >40 >40 >40

Channel gain dB 17 27 22 20 24

Max. bearable reflectance at input

dB <-30 <-30 <-30 <-30 <-30

Max. bearable reflectance at output

dB <-30 <-30 <-30 <-30 <-30

Gain flatness dB ±1 ±1 ±1 ±1 ±1

Gain response time when channels are added or reduced (stable state)

ms <10 <10 <10 <10 <10


ps <0.5 <0.5 <0.5 <0.5 <0.5

80-channel C/L band optical booster amplifiers


system.

Table 5-25 Technical specifications of 80-channel EOBA Board (C/L-band)



Working nm 1529~1561 1529~1561 1529~1561 1529~1561 1529~1561 (C





wavelength range

(C band)

1570~1605 (L band)

(C band)

1570~1605

(L band)

(C band)

1570~1605 (L band)

(C band)

1570~1605 (L band)

band)

1570~1605(L band)


dBm -32 ~ 3 -32 ~2 -32 ~ 1 -32 ~ 3 -32 ~3


dBm -32 ~ -16 -32 ~ -17 -32 ~ -18 -32 ~ -16 -32 ~ -16


dBm -5~1 4~10 –2~4 –2~4 2~8


dBm -5~17 4~26 –2~20 –2~20 2~24


dBm 17 26 20 20 24

Noise coefficient

dB <6 <6 <6 <6 <6


dB <0.5 <0.5 <0.5 <0.5 <0.5

Pump leak at input

dBm <-30 <-30 <-30 <-30 <-30

Pump leak at output

dBm <-30 <-30 <-30 <-30 <-30

Input return loss

dB >40 >40 >40 >40 >40

Output return loss

dB >40 >40 >40 >40 >40

Channel gain dB 17 27 22 20 24


dB <-30 <-30 <-30 <-30 <-30

Max. bearable reflectance at

dB <-30 <-30 <-30 <-30 <-30





output

Gain flatness dB ±1 ±1 ±1 ±1 ±1


ms <10 <10 <10 <10 <10


ps <0.5 <0.5 <0.5 <0.5 <0.5

48-channel C band optical booster amplifiers


system.

Table 5-26 Technical specifications of 48-channel EOBA Board (C-band)


EOBA17/17 EOBA23/21 EOBA26/24 EOBA28/26

Operating wavelength range

nm 1529-1568

(C-band)

1529-1568

(C-band)

1529-1568

(C-band)

1529-1568

(C-band)


dBm -32 ~3 -32 ~1 -32 ~1 -32 ~1

Channel input power range

dBm -32 ~-14 -32 to -19 -32 to -19 -32 to -19

Channel output power range

dBm –3~3 1~7 4~10 6~12


dBm –3~17 1~21 4~24 6~26

Maximum total output power

dBm 17 21 24 26





Noise figure dB <6 <6 <6 <6

Polarization dependent loss

dB <0.5 <0.5 <0.5 <0.5

Pump leakage at input

dBm <-30 <-30 <-30 <-30

Pump leakage at output

dBm <-30 <-30 <-30 <-30

Input return loss dB >40 >40 >40 >40

Output return loss

dB >40 >40 >40 >40

Channel gain dB 17 23 26 28

Allowed Maximum input reflectance

dB <-30 <-30 <-30 <-30

Allowed maximum output reflectance

dB <-30 <-30 <-30 <-30

Gain flatness dB ±1 ±1 ±1 ±1

Gain response time while adding/reducing channels (stable status)

ms <10 <10 <10 <10

Polarization mode dispersion

ps <0.5 <0.5 <0.5 <0.5

96-channel C band optical booster amplifiers

The single channel power is applicable to 96-channel system.

Table 5-27 Technical specifications of 96-channel EOBA Board (C-band)



Operating nm 1529-1568 1529-1568 1529-1568 1529-1568





wavelength range

(C-band) (C-band) (C-band) (C-band)


dBm -32 ~ 3 -32 ~ 1 -32 ~ 1 -32 ~ 1


dBm -32 ~ -17 -32 ~ -19 -32 ~ -19 -32 ~ -19


dBm -6 ~ 0 -2 ~ 4 1 ~ 7 3 ~ 9


dBm -6 ~ 17 -2 ~ 21 1 ~ 24 3 ~ 26


dBm 17 21 24 26

Noise figure dB <6 <6 <6 <6


dB <0.5 <0.5 <0.5 <0.5


dBm <-30 <-30 <-30 <-30


dBm <-30 <-30 <-30 <-30

Input return loss dB >40 >40 >40 >40

Output return loss

dB >40 >40 >40 >40


Allowed Maximum input reflectance

dB <-30 <-30 <-30 <-30


dB <-30 <-30 <-30 <-30


Gain response time while adding/reducing

ms <10 <10 <10 <10





channels (stable status)


ps <0.5 <0.5 <0.5 <0.5

5.6.2 Specifications of EOLA (Enhanced Optical Line Amplifier) Board

40/80-channel C/L band optical line amplifiers

Technical specifications of the 40/80-channel C/L band EOLA are listed in Table

5-28.

Table 5-28 Technical specifications of 40/80-channel EOLA Board (C/L-band)

Item Unit Indices (40-channel system) Indices (80-channel system)

EOLA22/20 EOLA27/20 EOLA32/20 EOLA22/20 EOLA27/20 EOLA32/20


nm

1529~1561 (C band)

1570~1605 (L band)

1529~1561 (C band)

1570~1605 (L band)

1529~1561 (C band)

1570~1605 (L band)

1529~1561 (C band)

1570~1605 (L band)

1529~1561 (C band)

1570~1605 (L band)

1529~1561 (C band)

1570~1605 (L band)


dBm -35 ~ 1 -35 ~ -4 -35 ~ -9 -35 ~ 1 -35 ~ -4 -35 ~ -9


dBm -35 ~ -15 -35 ~ -20 -35 ~ -25 -35 ~ -18 -35 ~ -23 -35 ~ -28


dBm 1~7 1~7 1~7 -2~4 -2~4 -2~4


dBm 1~20 1~20 1~20 -2~20 -2~20 -2~20


dBm 20 20 20 20 20 20

Noise coefficient

dB <6 <6 <6 <6 <6 <6




EOLA22/20 EOLA27/20 EOLA32/20 EOLA22/20 EOLA27/20 EOLA32/20


dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.5

Pump leak at input

dBm <-30 <-30 <-30 <-30 <-30 <-30

Pump leak at output

dBm <-30 <-30 <-30 <-30 <-30 <-30

Input return loss

dB >40 >40 >40 >40 >40 >40

Output return loss

dB >40 >40 >40 >40 >40 >40

Channel gain dB 22 27 32 22 27 32


dB <-30 <-30 <-30 <-30 <-30 <-30


dB <-30 <-30 <-30 <-30 <-30 <-30

Gain flatness dB ±1 ±1 ±1 ±1 ±1 ±1


Ms <10 <10 <10 <10 <10 <10


Ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5

5.6.3 Specifications of EOPA (Optical preamplifier) Board

40-channel C/L band optical preamplifiers



Technical specifications of the 40-channel C/L band optical preamplifiers are listed

in Table 5-29.

Table 5-29 Technical specifications of 40-channel EOPA Board (C/L-band)


EOPA17/17 EOPA22/17 EOPA27/17

Channels allocation

nm 1529~1561/

1570~1605

1529~1561/

1570~1605

1529~1561/

1570~1605


dBm -35 ~ 3 -35 ~ -2 -35 ~ -7


dBm -35 ~ -13 -35 ~ -18 -35 ~ -23


dBm -2 ~ 4 -2 ~ 4 -2 ~ 4


dBm -2 ~ 17 -2 ~ 17 -2 ~ 17


dBm 17 17 17

Noise coefficient

dB <5.5 <5.5 <5.5


dB <0.5 <0.5 <0.5

Pump leak at input

dBm <-30 <-30 <-30

Pump leak at output

dBm <-30 <-30 <-30

Input return loss

dB >40 >40 >40

Output return loss

dB >40 >40 >40

Channel gain dB 17 22 27

Max. bearable reflectance at

dB <-30 <-30 <-30





input


dB <-30 <-30 <-30

Gain flatness

dB ±1 ±1 ±1


ms <10 <10 <10


ps <0.5 <0.5 <0.5

80-channel C/L band optical preamplifiers

Technical specifications of the 80-channel C/L band optical preamplifiers are listed

in Table 5-30.

Table 5-30 Technical specifications of 40-channel EOPA Board (C/L-band)



Channels allocation

nm 1529~1561/

1570~1605

1529~1561/

1570~1605

1529~1561/

1570~1605


dBm -35 ~ 3 -35 ~ -2 -35 ~ -7


dBm -35 ~ -16 -35 ~ -21 -35 ~ -26

Output power range of the

dBm -5 ~ 1 -5 ~ 1 -5 ~ 1





channel


dBm -5 ~ 17 -5 ~ 17 -5 ~ 17


dBm 17 17 17

Noise coefficient

dB <5.5 <5.5 <5.5


dB <0.5 <0.5 <0.5

Pump leak at input

dBm <-30 <-30 <-30

Pump leak at output

dBm <-30 <-30 <-30

Input return loss

dB >40 >40 >40

Output return loss

dB >40 >40 >40



dB <-30 <-30 <-30


dB <-30 <-30 <-30

Gain flatness

dB ±1 ±1 ±1


ms <10 <10 <10






ps <0.5 <0.5 <0.5

48-channel C band optical preamplifiers

Technical specifications of the 48-channel C band optical preamplifiers are listed in

Table 5-31.

Table 5-31 Technical specifications of 48-channel EOPA Board (C-band)




nm 1529-1568 (C-band)

1529-1568 (C-band)

1529-1568 (C-band)


dBm -35 ~ 3 -35 ~ -2 -35 ~ -7


dBm -35 ~ -14 -35 ~ -19 -35 ~ -24


dBm -3 ~ 3 -3 ~ 3 -3 ~ 3


dBm -3 ~ 17 -3 ~ 17 -3 ~ 17


dBm 17 17 17

Noise figure dB <5.5 <5.5 <5.5


dB <0.5 <0.5 <0.5


dBm <-30 <-30 <-30


dBm <-30 <-30 <-30

Input return loss dB >40 >40 >40

Output return loss dB >40 >40 >40






Allowed maximum input reflectance

dB <-30 <-30 <-30


dB <-30 <-30 <-30

Gain flatness dB ±1 ±1 ±1

Gain response time while adding/ reducing channels (stable status)

ms <10 <10 <10


ps <0.5 <0.5 <0.5

96-channel C band optical preamplifiers

Technical specifications of the 96-channel C band optical preamplifiers are listed in

Table 5-32.

Table 5-32 Technical specifications of 96-channel EOPA Board (C-band)




nm 1529-1568 (C-band)

1529-1568 (C-band)

1529-1568 (C-band)


dBm -35 ~ 3 -35 ~ -2 -35 ~ -7


dBm -35 ~ -17 -35 ~ -22 -35 ~ -27


dBm -6 ~ 0 -6 ~ 0 -6 ~ 0


dBm -6 ~ 17 -6 ~ 17 -6 ~ 17


dBm 17 17 17





Noise figure dB <5.5 <5.5 <5.5


dB <0.5 <0.5 <0.5


dBm <-30 <-30 <-30


dBm <-30 <-30 <-30





dB <-30 <-30 <-30


dB <-30 <-30 <-30


Gain response time while adding/ reducing channels (stable status)

ms <10 <10 <10


ps <0.5 <0.5 <0.5

5.6.4 Specifications of EONA (Enhanced Optical Node Amplifier) Board

40/80 channel C Enhanced Optical Node Amplifier

Technical specifications of the 40/80-channel C/L band optical Node amplifiers are

listed in Table 5-33.

Table 5-33 Technical specifications of 40/80-channel EONA Board (C/L-band)


EONA25/20 EONA33/20 EONA27/24 EONA25/20 EONA33/20 EONA27/24

Working nm 1529~1567 1529~1567 1529~1567 1529~1567 1529~1567 1529~1567





wavelength range

(C-band)

1570~1605

(L-band)

(C-band)

1570~1605

(L-band)

(C-band)

1570~1605

(L-band)

(C-band)

1570~1605

(L-band)

(C-band)

1570~1605

(L-band)

(C-band)

1570~1605

(L-band)


dBm -35 ~ -2 -35 ~ -10 -35 ~ 0 -35 ~ -2 -35 ~ -10 -35 ~ 0


dBm -35 ~ -18 -35 ~ -26 -35 ~ -16 -35 ~ -21 -35 ~ -29 -35 ~ -19


dBm 1 ~ 7 1 ~ 7 5 ~ 11 -2 ~ 4 -2 ~ 4 2 ~ 8


dBm 1 ~ 20 1 ~ 20 5 ~ 24 -2 ~ 20 -2 ~ 20 2 ~ 24


dBm 20 20 24 20 20 24

Noise coefficient

dB

20~22: 8.0

22~25: 7.0

25~30: 6.5

28~30: 6.5

30~38: 6.0

22~24: 8.5

24~27: 7.5

27~32: 6.5

20~22: 8.0

22~25: 7.0

25~30: 6.5

28~30: 6.5

30~38: 6.0

22~24: 8.5

24~27: 7.5

27~32: 6.5


dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.5

Pump leak at input

dBm <-30 <-30 <-30 <-30 <-30 <-30

Pump leak at output

dBm <-30 <-30 <-30 <-30 <-30 <-30

Input return loss

dB >40 >40 >40 >40 >40 >40

Output return loss

dB >40 >40 >40 >40 >40 >40

Channel gain dB 25 33 27 25 33 27


dB <-30 <-30 <-30 <-30 <-30 <-30

Max. dB <-30 <-30 <-30 <-30 <-30 <-30





bearable reflectance at output



ms <10 <10 <10 <10 <10 <10


ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5

48/96-channel C Enhanced Optical Node Amplifier

Technical specifications of the 48/96-channel C band optical Node amplifiers are

listed in Table 5-34.

Table 5-34 Technical specifications of 48/96-channel EONA Board (C/L-band)

Item Unit Indices (48-channel system)) Indices (96-channel system))



nm 1529-1568 (C-band)

1529-1568 (C-band)

1529-1568 (C-band)

1529-1568 (C-band)

1529-1568 (C-band)

1529-1568 (C-band)


dBm -35 ~ -1 -35 ~ -9 -35 ~ 0 -35 ~ -1 -35 ~ -9 -35 ~ 0


dBm -35 ~ -18 -35 ~ -26 -35 ~ -17 -35 ~ -21 -35 ~ -29 -35 ~ -20


dBm 1 ~ 7 1 ~ 7 4 ~ 10 -2 ~ 4 -2 ~ 4 1 ~ 7


dBm 1 ~ 21 1 ~ 21 4 ~ 24 -2 ~ 21 -2 ~ 21 1 ~ 24



Item Unit Indices (48-channel system)) Indices (96-channel system))



dBm 21 21 24 21 21 24

Noise figure dB

20~22: 8.0

22~25: 7.0

25~30: 6.5

28~30: 6.5

30~38: 6.0

22~24: 8.5

24~27: 7.5

27~32: 6.5

20~22: 8.0

22~25: 7.0

25~30: 6.5

28~30: 6.5

30~38: 6.0

22~24: 8.5

24~27: 7.5

27~32: 6.5


dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.5


dBm <-30 <-30 <-30 <-30 <-30 <-30


dBm <-30 <-30 <-30 <-30 <-30 <-30

Input return loss dB >40 >40 >40 >40 >40 >40

Output return loss

dB >40 >40 >40 >40 >40 >40

Channel gain dB 25 33 27 25 33 27


dB <-30 <-30 <-30 <-30 <-30 <-30


dB <-30 <-30 <-30 <-30 <-30 <-30


Gain response time while adding/reducing channels (stable status)

ms <10 <10 <10 <10 <10 <10


ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5

5.6.5 Specifications of SEOBA Board

40/80-channel C band optical booster amplifiers.



Table 5-35 Technical specifications of 40/80-channel SEOBA Board (C- Band)

Item Unit

Indices (40-channel system)


SEOBA17/17 SEOBA22/20 SEOBA17/17 SEOBA22/20


nm

1529~1561

(C band)

1529~1561

(C band)

1529~1561 (C band)

1529~1561 (C band)


dBm -32 ~ 3 -32 ~1 -32 ~ 3 -32 ~ 1


dBm -32 ~-13 -32~ -15 -32 ~ -16 -32 ~ -18


dBm -2~4 1~7 -5~1 -2~4


dBm -2~17 1~20 -5~17 -2~20


dBm 17 20 17 20

Noise coefficient

dB <6 <6 <6 <6


dB <0.5 <0.5 <0.5 <0.5

Pump leak at input

dBm <-30 <-30 <-30 <-30

Pump leak at output

dBm <-30 <-30 <-30 <-30

Input return loss

dB >40 >40 >40 >40

Output return loss

dB >40 >40 >40 >40


Max. bearable reflectance

dB <-30 <-30 <-30 <-30



Item Unit



SEOBA17/17 SEOBA22/20 SEOBA17/17 SEOBA22/20

at input


dB <-30 <-30 <-30 <-30



ms <10 <10 <10 <10


ps <0.5 <0.5 <0.5 <0.5

5.6.6 Specifications of SEOPA Board

40/80-channel C band optical preamplifiers.

Table 5-36 Technical specifications of 40-channel SEOPA Board (C-band)


SEOPA17/17 SEOPA22/17 SEOPA27/17

Channels allocation nm 1529~1561 1529~1561 1529~1561


dBm -35~3 -35~-2 -35~-7


dBm -35 ~ -13 -35 ~ -18 -35 ~ -23


dBm -2 ~ 4 -2 ~ 4 -2 ~ 4


dBm -2 ~ 17 -2 ~ 17 -2 ~ 17






dBm 17 17 17

Noise coefficient dB <5.5 <5.5 <5.5


dB <0.5 <0.5 <0.5

Pump leak at input dBm <-30 <-30 <-30

Pump leak at output dBm <-30 <-30 <-30





dB <-30 <-30 <-30


dB <-30 <-30 <-30



ms <10 <10 <10


ps <0.5 <0.5 <0.5

Table 5-37 Technical specifications of 80-channel SEOPA Board (C-band)



Channels allocation nm 1529~1561 1529~1561 1529~1561


dBm -35 ~ 3 -35 ~ -2 -35 ~ -7


dBm -35 ~ -16 -35 ~ -21 -35 ~ -26


dBm -5 ~ 1 -5 ~ 1 -5 ~ 1






dBm -5 ~ 17 -5 ~ 17 -5 ~ 17


dBm 17 17 17

Noise coefficient dB <5.5 <5.5 <5.5


dB <0.5 <0.5 <0.5

Pump leak at input dBm <-30 <-30 <-30

Pump leak at output dBm <-30 <-30 <-30





dB <-30 <-30 <-30


dB <-30 <-30 <-30



ms <10 <10 <10


ps <0.5 <0.5 <0.5

5.6.7 Specifications of SEOLA Board

40/80-channel C band optical line amplifiers.

Table 5-38 Technical specifications of 40/80-channel SEOLA Board (C-band)

Item Unit



SEOLA22/20 SEOLA22/20



Item Unit



SEOLA22/20 SEOLA22/20


nm 1529~1561 (C band) 1529~1561 (C band)


dBm -35 ~ 1 -35 ~ 1


dBm -35 ~ -15 -35 ~ -18


dBm 1-7 -2~4


dBm 1~20 -2~20


dBm 20 20

Noise coefficient dB <6 <6


dB <0.5 <0.5

Pump leak at input dBm <-30 <-30

Pump leak at output dBm <-30 <-30

Input return loss dB >40 >40

Output return loss dB >40 >40

Channel gain dB 22 22


dB >30 >30


dB >30 >30

Gain flatness dB ±1 ±1


Ms <10 <10


Ps <0.5 <0.5



5.6.8 Specifications of EDFA+RAMAN Board

The DRA_P board applies RAMAN amplifier to amplify the optical signals, and its

specifications are listed in Table 5-39.

Table 5-39 Technical specifications of RAMAN_P amplifier

Item Unit Parameters

Type Inverse distributed pump

Pump wavelength and quantity nm/piece C:2~3, CE: 2~3,L:2~3

Pump power mW 750

Total output power dBm 12

Type of output connector SC/UPC (APC)

C,CE, L and C+L gain (G652) dB 10/10/10

C, CE,L and C+L gain (LEAF) dB 12/12/12

C, CE,L and C+L gain (TW RS) dB 13/13/13

C,CE, L and C+L equivalent noise figure (G652)

dB 0/0/0

C, CE,L and C+L equivalent noise figure (LEAF)

dB -1/-1/-1

C, CE,L and C+L equivalent noise figure (TW RS)

dB -1.5/-1.5/-1.5

Associated polarization loss dB <0.5

Temperature feature pm/C <500

Note: C band amplifier module pump wavelength: 1421.5/1455.0nm and 1425/1440/1456nm; L band amplifier module

pump wavelength: 1439.0/1495.0nm.

Practically, we adopt EDFA+RAMAN technologies, which is the combination of the EOA

board and the DRA_P board, to amply the optical signals. The specifications are listed in

Table 5-40.

Table 5-40 Technical specifications of EDFA+RAMAN Amplifier


Working wavelength range Nm 1529 ~ 1561 (C band)

1529~1568(CE band)




1570 ~ 1605 (L band)

Max. total output power dBm > 20

Noise coefficient dB < 3

Polarization-related gain dB < 0.5

Input reflectance dB >40

Output reflectance dB >40

Max. bearable reflectance at input dB <-30

Max. bearable reflectance at output dB <-30

Gain flatness dB 1


Ms < 10

Polarization-mode dispersion Ps < 0.5

The DRA_B board applies RAMAN amplifier to amplify the optical signals, and its

specifications are listed in Table 5-41.

Table 5-41 Performance Parameters of RAMAN_B amplifier


Type Inverse distributed pump

Pump wavelength nm

1529 ~ 1561 (C band)

1529~1568(CE band)

1570 ~ 1605 (L band)

Pump power mW 850

Total output power dBm 12

Band gain(G.652) dB 1-6

Noise figure dB <1

Polarization dependent loss dB <0.2

Input return loss dB >45

Output return loss dB >45

Gain flatness dB <4

Polarization mode dispersion ps <0.5




Insertion loss dB <1.5

5.6.9 Specifications of RPOA Board

RPOA amplifier technical specifications are listed in Table 5-42.

Table 5-42 Technical specifications of RPOA amplifier

Item RPOA with GFF sub-system RPOA without GFF sub-system


1529~1561nm 1546~1561nm

Noise coefficient

<7dB <7dB

Gain >17dB >17dB

Gain flatness

<2dB <2dB


-44～-18dBm -44～-18dBm


-30～2dBm -34～8dBm

Working temperature range

-40～65°C （RGU）,

-10～60°C（RPU）

-40～65°C (RGU)

-10～60°C(RPU)

Storage temperature range

-40～85°C -40～85°C

Notes: RPOA subsystems without Gain Flatness Filter (GFF) meet the requirements of systems with capacity below 16

wavelengths, while RPOA subsystems with GFF meet the requirements of systems with capacity of 40 wavelengths.

5.6.10 Specifications of LAC Board

Technical specifications of LAC board are listed in Table 5-43.



Table 5-43 Technical Specifications of LAC Board


Application wavelength range nm

1529~1561(C band)

1529~1568(CE band)

1570~1605(L band)

Input power detection range dBm -39 to +20

Output power detection range dBm -40 to +18

Optical power detection Precision dB ≤±0.5

Attenuation adjustment precision dB ≤±0.5

Attenuation adjustment step length dB ≤±0.2

Attenuation adjustment range dB ≥20

Attenuation adjustment rate dB ≤10

5.7 OTU Unit Specifications

This section describes the specifications of transponder boards, including the

transponders of 2.5Gbit/s, 10Gbit/s, 40Gbit/s and 100Gbit/s.

5.7.1 Specifications of 2.5Gbit/s Board

Client-side: Transmitting part of receiving end and receiving part of transmitting end.

Line-side: Receiving part of receiving end, transmitting part of transmitting end and

transmitting/receiving part of regenerator.

Technical specifications of 2.5Gbit/s board at Client-Side and Line-Side are listed in

Table 5-44 and Table 5-45.

Table 5-44 Technical specifications of 2.5Gbit/s Board at Client-side

Item Unit Parameter

Parameters of optical receive port at client side (S point)

Type of Receiver --- PIN

Receiving sensitivity (BER10-12) dBm -18



Item Unit Parameter

Max. reflection of Receiver dB <-27

Overload power dBm 0

Input signals wavelength range nm 1280~1625

Parameters of optical transmit port at client side (R point) Mean launched power (near-end optical port S-16.1)

Maximum

dBm

0

Minimum -5

Mean launched power (near-end optical port

L-16.2)

Maximum

dBm

3

Minimum -2

Minimum extinction ratio dB 8.2

Eye diagram - Compliance with ITU-T G.957

Table 5-45 Technical specifications: of 2.5Gbit/s Board at Line-side

Item Unit Parameter

Parameters of optical transmit port at line side (Sn point)

Type of nominal light source --- DFB-LD

Spectral characteristics

Max. -20dB spectral width

nm 0.2(EA)

0.5(direct modulation)

Min. side mode suppression ratio

dB 35

Central frequency

Nominal central frequency

THz 192.1-196.0

Central frequency deviation

GHz 12.5 (100 GHz spacing)

Mean transmission

Max. dBm 0

Min. dBm -10



Item Unit Parameter

power

Min. extinction ratio dB +10(EA)

8.2 (direct modulation)

Dispersion holding value ps/nm 12800(EA)

6400 (direct modulation)

Eye pattern mask --- In compliance with ITU-T Recommendation G.957

Parameters of optical receive port at line side (Rn point)

Receiving sensitivity

(BER10-12) dBm

-21(PIN)

-28(APD)


Overload power dBm 0(PIN)

-9(APD)

Input signals wavelength range nm 1280~1565

Note 1: Mean transmitting power includes two types: long-haul optical interface and intra office interface.

5.7.2 Specifications of 10Gbit/s Board




Technical specifications of 10Gbit/s Board at Client-side and Line-side are listed in Table

5-46 and Table 5-47.

Table 5-46 Technical specifications of 10Gbit/s Board at Client-side

Item Unit Parameter


Type of Receiver --- PIN/APD

Receiving sensitivity (BER10-12) dBm -14 PIN

-21 APD




Item Unit Parameter

Overload power dBm 0 PIN

-9 APD

Input signals wavelength range nm 1280 ~ 1625

Parameters of optical transmit port at client side (R point)

Type of nominal light source --- MQW-DFB

Mean launched power (far-end optical port

S-64.2a)

Maximum dBm -1

Minimum dBm -5

Mean launched power (far-end optical port

S-64.2b)

Maximum dBm 2

Minimum dBm -1

Mean launched

power (near-end optical

port I-64.2r)

Maximum dBm -1

Minimum dBm -5

Mean launched

power (near-end optical

port I-64.1)

Maximum dBm -1

Minimum dBm -6

Min. extinction ratio dB 10/8.2

Eye pattern mask --- In compliance with ITU-T Recommendation G.691

Table 5-47 Technical specifications of 10Gbit/s Board at Line-side

Item Unit Parameter


Type of nominal light source --- MQW-DFB


Max. -20dB spectral width

nm 0.3(NRZ)

Min. side mode dB 30



Item Unit Parameter

suppression ratio

Central frequency


THz ITU.T .694.1 compliant

Central frequency deviation (EOL)

GHz ≤12.5 (spacing: 100 GHz)

≤5 (spacing: 50 GHz)

Central frequency deviation (BOL)

GHz ≤10 (spacing: 100 GHz)

≤3(spacing: 50 GHz)

Mean transmission power

Max. dBm +1(NRZ)

-2(ERZ)

Min. dBm -3(NRZ)

-5(ERZ)

Chirp modulus --- 0.3 ~ 0.7

Min. extinction ratio dB +8.2

Dispersion holding value ps/nm -300~800(NRZ)

400(ERZ)

Eye pattern mask ---

In compliance with ITU-T Recommendation G.691(STM-64)

In compliance with ITU-T Recommendation G.959.1(OTU2)



(BER10-12) dBm

PIN -14 (STM-64)

APD -21 (STM-64)

Max. reflection of Receiver dB <–27

Overload power dBm 0 (PIN)

-9 (APD)



Item Unit Parameter

Input signals wavelength range nm 1280 ~ 1565





Technical specifications of 40Gbit/s Board at Client-side and Line-side are listed in Table

5-48 and Table 5-49.



Bit rate (optical modulation mode) Gbps 39.813 (NRZ),

43.018

39.813 (NRZ),

43.018

Optical interface category --- VSR2000-3R2 P1I13D1 and

1I13D1F

Goal distance km 2 10


Frequency range nm 1280-1625 1280-1625

Sensitivity (BER=10–12) dBm -6 -7

Overload power(BER=10–12) dBm +3 +4

Receiver reflectance dB <-27 <-27


Frequency range --- 1280-1625 1307–1317

Mean launched power

Maximum dBm

+3 +4

Minimum 0 0

Minimum side mode compression ratio(SMCR)

dB 35 35

Minimum extinction ratio dB 8.2 8.2

Jitter transfer characteristics --- Complies with GR-253, Issue

Complies with GR-253, Issue



4 4

Eye diagram --- Complies with G.959.1 NRZ 40G

Complies with G.959.1 NRZ 40G



Optical signal modulation mode

- P-DPSK RZ-DQPSK

Bit rate Gbps 44.6 44.6


Frequency range nm 1528 - 1568 1528 – 1568

Sensitivity (BER=1×10–12) dBm -18 -18

Minimum overload power (BER=1×10–12)

dBm 1 1

Maximum input power (damage)

dBm 20 20


Dispersion tolerance (including TDC)

ps/nm

-700~+700 -700~+700

Jitter transfer characteristics - Complies with G.8251

Complies with G.8251

FEC gain dB >8(AFEC) >8(AFEC)



THz

G694.1 compliant G694.1 compliant

Maximum central frequency offset (EOL)

GHz ≤±5 (100GHz) ≤±2.5 (50GHz)

≤±5 (100GHz)

≤±2.5 (50GHz)

Maximum central frequency offset(BOL)

GHz ≤±3 (100GHz)

≤±1.5 (50GHz)

≤±3 (100GHz)

≤±1.5 (50GHz)

Mean launched power

Maximum dBm

+5 +5

Minimum -5 -5

Launched power offset dB ±1 ±1





Maximum –20 dB bandwidth

nm 0.7 0.7

Minimum side mode compression ratio (SMCR)

dB 35 35





Technical specifications of 100Gbit/s Board at Client-side and Line-side are listed in




Bit rate (optical modulation mode) Gbps 100GE 4x25.78

OTU4 4x27.95

100GE 4x25.78

OTU4 4x27.95

Optical interface category --- LR4 ER4

Target distance km 10 40


Frequency range nm

1294.53–1296.59

1299.02–1301.09

1303.54–1305.63

1308.09–1310.19

1294.53–1296.59

1299.02–1301.09

1303.54–1305.63

1308.09–1310.19

Sensitivity (BER=10–12) dBm

-8.6(PIN)

(single channel)

-21.4(APD)

(single channel)

Overload power(BER=10–12) dBm

+4.5

(single channel)

+4.5

(single channel)






Mean output power

Maximum

dBm

+4.5

(single channel)

+2.9

(single channel)

Minimum

-4.3

(single channel)

-2.9

(single channel)

Minimum extinction ratio dB 4 8



Optical signal modulation format - PM-QPSK

Bit rate Gbps 120

Frequency range THz 192.10~196.05(C band)

191.30~196.05 ( CE band)



Power sensitivity (BER=1×10–12) dBm -15


dBm 0

OSNR sensitivity(B2B) dB 13

Dispersion tolerance ps/nm +/-50000

PMD tolerance ps 30

Receiver reflectance dB <-27

Jitter transfer characteristics - TBD


Maximum central frequency offset GHz ±2.5

Transmitter output power

Maximum dBm

0

Minimum -5

Launched power offset dB ±1



Maximum optical spectral Bandwidth

–3 dB GHz

20

-15dB 60

Minimum side mode suppression ratio (SMSR)

dB 35

Transmitter reflectance dB <-27

OTU jitter transfer characteristics

In ZXMP M820, the wavelength converter of the OTU has the same jitter transfer

characteristics with that of SDH regenerative repeater, which is compliant with ITU-T

G.825, G.958, and G.783 recommendation.

OTU input jitter tolerance

In ZXMP M820, the input jitter template that can be tolerated by the OTU input port is

complaint with ITU-T G.825, G.958, and G.783 Recommendation.

5.8 Service Convergence Technical Specifications

This section describes the specifications of convergence boards, including SRM41,

SRM42, MQT3, MX2, FCA, MOM2, GEM8, SDSA, DSAF, GEM2/GEMF, ASMA, TD2C,

MQA1, MQA2 and MJA.

5.8.1 Specifications of SRM41 Board

Table 5-52 Technical specifications of SRM41 board


Parameters of optical receiving port at line side (Rn point)

Receiving sensitivity dBm -14 (PIN)

-21 (APD)

Receiver reflection dB <-27


-9 (APD)




Wavelength area of input signals nm 1280-1625

Parameters of optical transmitting port at line side (Sn point)



nm 0.3


dB 35

Central frequency


THz

192.10~196.05(C-band)

191.30~196.075(CE-band)

186.95~190.90(L-band)

Central frequency offset

GHz

≤ 12.5 (spacing: 100 GHz)

≤ 5 (spacing: 50 GHz)

≤ 2.5G (spacing: 25 GHz)

Mean launched power dBm -4~+1(ERZ)/-3~+1(NRZ/SRZ)

Minimum extinction ratio dB 10

Dispersion tolerance ps/nm 800(NRZ)/400(ERZ/SRZ)

Eye diagram - Compliance with ITU-T G.959.1

Parameters of optical receiving port at client side (S point)

Receiving sensitivity dBm

-18 (I-16)

-18 (S-16)

-27 (L-16.1)

-28 (L-16.2)

-27 (L-16.3)


Overload power dBm

-3 (I-16)

0 (S-16)

-9 (L-16)


Parameters of optical transmitting port at client side (R point)

Mean launched power dBm

-10 to -3 (I-16)

-5 to 0 (S-16)

-2 to +3 (L-16)





Eye diagram - Compliant with ITU-T G.957

5.8.2 Specifications of SRM42 Board

Table 5-53 Technical specifications of SRM42 Board




-28 (APD)



-9 (APD)





nm 0.2 (EA)

0.4 (DM)


dB 35

Central frequency


THz

192.10~196.05(C-band)

191.30~196.075(CE-band)

186.95~190.90(L-band)

Central frequency offset GHz




Mean launched power dBm -10 to 0

Minimum extinction ratio dB 10 (EA)

8.2 (DM)

Dispersion tolerance ps/nm 12800 (EA)

3200 (DM)







-23 (I-4)

-18 (S-4)

-28 (L-4)

-23 (I-1)

-28 (S-1)

-34 (L-1)

Receiver reflection dB

<-27 (S-4.2)

<-14 (L-4.1)

<-27 (L-4.2)

<-14 (L-4.3)

<-25 (L-1.2)

NA (others)

Overload power dBm

-8 (I-4)

-8 (S-4)

-8 (L-4)

-8 (I-1)

-8 (S-1)

-10 (L-1)




-15 to -8 (I-4)

-15 to -8 (S-4)

-3 to +2 (L-4)

-15 to -8 (I-1)

-15 to -8 (S-1)

-5 to 0 (L-1)

Minimum extinction ratio dB

8.2 (I-4)

8.2 (S-4)

10 (L-4)

8.2 (I-1)




8.2 (S-1)

10 (L-1)


5.8.3 Specifications of MQT3 Board

Table 5-54 Client-Side Technical specifications of MQT3 board


Parameters of client-side optical receive port (S point)

Receiver sensitivity (BER10-12) dBm

-14 (I64.1)

-16 (S64.2b)

-14 (10GBASE-LR/LW)

-16 (10GBASE-ER/EW

Receiver reflectance dB

<–14 (I64.1)

<–27 (S64.2b)

<–14 (10GBASE-LR/LW)

<–27 (10GBASE-ER/EW)

Overload power dBm

0 (I64.1)

-1 (S64.2b)

0 (10GBASE-LR/LW)

-1 (10GBASE-ER/EW)

Wavelength range of receiving signal nm 1280-1625

Parameters of client-side optical transmitting port (R point)


-6 to -1 (I64.1)

-1 to 2 (S64.2b)

-6 to -1 (10GBASE-LR/LW)

-1 to 2 (10GBASE-ER/EW)

Minimum extinction ratio dB 6 (I64.1)

8.2 (S64.2b)




6 (10GBASE-LR/LW)

8.2 (10GBASE-ER/EW)

Eye diagram - Complies with ITU-T G.691

Table 5-55 Line-side Technical specifications of MQT3 Board


Optical signal modulation mode - P-DPSK RZ-DQPSK


Parameters of line-side optical transmit port (Sn point)

Frequency range THz

192.10–196.05 (C

band)

191.30–196.075

(CE band)

192.10–196.05 (C band)


Minimum overload (BER=1×10–12)

dBm 0 0

Max. reflectance dB <-27 <-27


ps/nm -700~+700 -700~+700

Jitter Transfer Characteristics - Complies with ITU-T G.8251

Complies with ITU-T G.8251

FEC code gain dB >8 (AFEC) >8 (AFEC)

Parameters of line-side optical receive port (Rn point)


THz

192.10–196.05

(C band)

191.30–196.075

(CE band)

186.95–190.90

(L band)

192.10–196.05

(C band)

191.30–196.075

(CE band)

186.95–190.90

(L band)

Wavelength spacing GHz 50 50

Maximum central frequency offset

GHz ±2.5 ±2.5

Mean launched Maximum dBm +5 +5




power Minimum -5 -10




GHz 0.7 0.7


dB 35 35

5.8.4 Specifications of MX2 Board

Table 5-56 Client-Side Technical specifications of MX2 board



Receiver sensitivity (BER10-12) dBm

-14 (I64.1)

-16 (S64.2b)

-14 (10GBASE-LR/LW)

-16 (10GBASE-ER/EW

Receiver reflectance dB

<–14 (I64.1)

<–27 (S64.2b)

<–14 (10GBASE-LR/LW)

<–27 (10GBASE-ER/EW)

Overload power dBm

0 (I64.1)

-1 (S64.2b)

0 (10GBASE-LR/LW)

-1 (10GBASE-ER/EW)

Wavelength range of receiving signal nm 1280-1625

Parameters of client-side optical transmitting port (R point)


-6 to -1 (I64.1)

-1 to 2 (S64.2b)

-6 to -1 (10GBASE-LR/LW)

-1 to 2 (10GBASE-ER/EW)





6 (I64.1)

8.2 (S64.2b)

6 (10GBASE-LR/LW)

8.2 (10GBASE-ER/EW)

Eye diagram - Complies with ITU-T G.691

Table 5-57 Line-side Technical specifications of MX2 Board


Optical signal modulation format - PM-QPSK

Bit rate Gbps 120

Frequency range THz 192.10~196.05(C band)

191.30~196.05 ( CE band)



Power sensitivity (BER=1×10–12) dBm -15


dBm 0

OSNR sensitivity(B2B) dB 13

Dispersion tolerance ps/nm +/-50000

PMD tolerance ps 30

Receiver reflectance dB <-27

Jitter transfer characteristics - TBD


Maximum central frequency offset GHz ±2.5

Transmitter output power

Maximum dBm

0

Minimum -5

Launched power offset dB ±1

Maximum optical spectral Bandwidth

–3 dB GHz

20

-15dB 60

Minimum side mode suppression ratio (SMSR)

dB 35




Transmitter reflectance dB <-27

5.8.5 Specifications of FCA Board

Table 5-58 Technical specifications of FCA Board


Parameters of optical receive port at line side (Rn)


-21 (APD)



-9 (APD)



Spectral characteristic


nm 0.3


dB 35

Central frequency


THz 192.1-196.05

Central frequency offset GHz ≤ 12.5 (spacing: 100 GHz)








FC dBm -18

2GFC dBm -18

4GFC dBm -18

Overload power FC dBm 0




2GFC dBm 0

4GFC dBm 0


Output power

FC dBm -4.5

2GFC dBm -4.5

4GFC dBm -4.5

5.8.6 Specifications of MOM2 Board

Table 5-59 Specification of MOM2 Board




-21 (APD)



-9 (APD)





nm 0.3


dB 35

Central frequency


THz 192.1-196.05












FC

dBm

-18

2GFC -18

4GFC -18

1000BASE-SX -17

1000BASE-LX -19

1000BASE-LH1 -20

1000BASE-ZX -22

Overload power

FC

dBm

0

2GFC 0

4GFC 0

1000BASE-SX 0

1000BASE-LX -3

1000BASE-LH1 -3

1000BASE-ZX -3


Output power

FC

dBm

-4.5

2GFC -4.5

4GFC -4.5

1000BASE-SX -9.5 to -3 (1000BASE-SX)

1000BASE-LX -11 to -3 (1000BASE-LX)

1000BASE-LH1 -4 to 0 (1000BASE-LH1)

1000BASE-ZX -2 to +3 (1000BASE-ZX)

5.8.7 Specifications of GEM8 Board

Table 5-60 Technical specifications of GEM8 Board







-21 (APD)



-9 (APD)





nm 0.3


dB 35

Central frequency

Nominal central frequency THz 192.10~196.05(C-band)

191.30~196.075(CE-band)






Dispersion tolerance ps/nm 800

Eye diagram - Compliance with ITU-T G.959.1


Receiving sensitivity dBm -17 (1000BASE-SX)

-19 (1000BASE-LX)

Overload power dBm 0 (1000BASE-SX)

-3 (1000BASE-LX)


Mean launched power dBm -9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)



5.8.8 Specifications of SDSA Board

Table 5-61 Specification of SDSA Board




-25 (APD)



-9 (APD)





nm 0.2 (EA)

0.4 (DM)


dB 35

Central frequency


THz 192.1-196.05 (C band)

191.30~196.05 (CE band)


GHz ≤ 12.5 (100 GHz spacing)

≤ 5 (50 GHz spacing)



8.2 (DM)

Dispersion tolerance ps/nm 12800 (EA)/3200/6400 (DM)




-17 (1000BASE-SX)

-19 (1000BASE-LX)

-20 (1000BASE-LH1)

-22 (1000BASE-ZX)




Overload power dBm

0 (1000BASE-SX)

-3 (1000BASE-LX)

-3 (1000BASE-LH1)

-3 (1000BASE-ZX)



-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

5.8.9 Specifications of DSA Board

Table 5-62 Technical specifications of DSA Board




-25 (APD)



-2 (APD)





nm 0.2 (EA)

0.4 (DM)


dB 35

Central frequency


THz 192.10~196.05(C-band)

191.30~196.075(CE-band)








8.2 (DM)

Dispersion tolerance ps/nm 12800 (EA)/3200 (DM)




-17 (1000BASE-SX)

-19 (1000BASE-LX)

-20 (1000BASE-LH1)

-22 (1000BASE-ZX)

-25 (100-SM-LL-L)

-20 (100-SM-LL-I)

-13 (100-M5-SL-I)

Overload power dBm

0 (1000BASE-SX)

-3 (1000BASE-LX)

-3 (1000BASE-LH1)

-3 (1000BASE-ZX)

-3 (100-SM-LL-L)

-3 (100-SM-LL-I)

-1.3 (100-M5-SL-I)



-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

-9 to -3 (100-SM-LL-L)

-12 to -3 (100-SM-LL-I)

-7.3 to +1.3 (100-M5-SL-I)



5.8.10 Specifications of DSAF Board

Table 5-63 Technical specifications of DSAF Board




-25 (APD)



-9 (APD)





nm 0.2 (EA)

0.5 (DM)


dB 30

Central frequency


THz 192.10~196.05(C-band)

191.30~196.075(CE-band)





8.2 (DM)


6500 (DM)




-17 (1000BASE-SX)

-19 (1000BASE-LX)

-20 (1000BASE-LH1)

-22 (1000BASE-ZX)





-3 (1000BASE-LX)

-3 (1000BASE-LH1)

-3 (1000BASE-ZX)



-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

5.8.11 Specifications of GEM2/GEMF Board

Table 5-64 Technical specifications of GEM2/GEMF Board




-28 (APD)



-9 (APD)





nm 0.2 (EA)

0.4 (DM)


dB 35

Central frequency


THz 192.10~196.05(C-band)

191.30~196.075(CE-band)








8.2 (DM)


3200 (DM)




-17 (1000BASE-SX)

-19 (1000BASE-LX)

-20 (1000BASE-LH1)

-22 (1000BASE-ZX)

Overload power dBm

0 (1000BASE-SX)

-3 (1000BASE-LX)

-3 (1000BASE-LH1)

-3 (1000BASE-ZX)



-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

5.8.12 Specifications of ASMA Board

Table 5-65 Technical specifications of ASMA Board


Parameters of WDM-side optical receive port (Rn point)

Receiver sensitivity dBm <-14 (PIN)

<-21 (APD)

Receiver reflection dB <–27

Overload power dBm >0 (PIN)

>-9 (APD)

Wavelength range of input signal nm 1280~1625




Parameters of WDM-side optical transmit port (Sn point)

Maximum -20 dB bandwidth nm 0.3

Minimum side mode suppression ratio

dB 35

Nominal central frequency THz 192.10~196.05 (C band)

191.30~196.075 (CE band)


≤±12.5 (wavelength spacing:

100GHz)

≤±5 (wavelength spacing:

50GHz)

Mean launched power dBm -3~+1(NRZ)



Eye diagram - Comply with ITU-T G.691 Recommendation


Receiver sensitivity dBm

<-17 (1000BASE-SX)

<-19 (1000BASE-LX)

<-14 (10GBASE-LR)

<-15 (10GBASE-ER

Overload power dBm

>0 (1000BASE-SX)

>-3 (1000BASE-LX)

>0.5 (10GBASE-LR)

>-1 (10GBASE-ER)

Parameters of client-side optical transmit port (R point)


-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-8.2 to 0.5 (10GBASE-LR)

-4.7 to 4.0 (10GBASE-ER)



5.8.13 Specifications of TD2C Board

Table 5-66 Technical specifications of TD2C board


Parameters of input port (S point)

Receiving sensitivity (BER10-12) dBm

-14 (I64.1)

-16 (S64.2b)

-12.6 (10GBASE-LR/LW)

-14.1 (10GBASE-ER/EW)

-14 (1200-SM-LL-L)

Overload power dBm

0 (I64.1)

-1 (S64.2b)

0 (10GBASE-LR/LW)

-1 (10GBASE-ER/EW)

0 (1200-SM-LL-L)

Wavelength of input signals nm 1280 to 1565

Parameters of output port (Sn point)

Maximum bandwidth @ -20 dB nm 0.3


dB 35

Nominal central frequency THz 192.1 to 196.0

Central frequency offset GHz ≤±12.5 (spacing: 100 GHz)

Mean launched power dBm -3 to +1


Dispersion tolerance ps/nm 800 (G.652)

Eye diagram - ITU-T G.691

Parameters of input port (Rn point)

Receiving sensitivity (BER10-12) dBm -14 (PIN)

-21 (APD)






-9 (APD)

Wavelength area of input signals nm 1280 to 1565

Parameters of output port (R point)


-6 ~ -1 (I64.1)

-1 ~ 2 (S64.2b)

-8.2 ~ 0.5 (10GBASE-LR/LW)

-4.7 ~ 4 (10GBASE-ER/EW)

-6 ~ -1 (1200-SM-LL-L)


6 (I64.1)

8.2 (S64.2b)

6 (10GBASE-LR/LW)

8.2 (10GBASE-ER/EW)

6 (1200-SM-LL-L)


5.8.14 Specifications of MQA1 Board

Table 5-67 Technical specifications of MQA1 board




-17 (1000BASE-SX)

-19 (1000BASE-LX)

-20 (1000BASE-LH1)

-22 (1000BASE-ZX)

-19 (100-SM-LL-I)

-20 (200-SM-LL-I)


-3 (1000BASE-LX)




-3 (1000BASE-LH1)

-3 (1000BASE-ZX)

-3 (100-SM-LL-I)

0 (200-SM-LL-I)


Light source type



dB 30


(spacing: 100 GHz)


Mean launched power dBm 0~5






-25 (APD)



-9 (APD)

Wavelength area of input signals nm 1280 to 1565



-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

-11 to -3 (100-SM-LL-I)

-12 to -3 (200-SM-LL-I)



5.8.15 Specifications of MQA2 Board

Table 5-68 Technical specifications of MQA2 Board




FC

dBm

-18

2G FC -18

4G FC -18

GE -19

Overload power

1G FC

dBm

0

2G FC 0

4G FC 0

GE -3




dB 35



Mean launched power dBm -3 to +1


Dispersion tolerance ps/nm

800 (G.652)




-21 (APD)



-9 (APD)

Wavelength of input signals nm 1280 to 1565





Mean launched power

1G FC

dBm

-4.5

2G FC -4.5

4G FC -4.5

GE -11~0

5.8.16 Specifications of MJA Board

Table 5-69 Technical specifications of MJA board




-17 (1000BASE-SX)

-19 (1000BASE-LX)

-20 (1000BASE-LH1)

-22 (1000BASE-ZX)

-19 (100-SM-LL-I)

-20 (200-SM-LL-I)

Overload power dBm

0 (1000BASE-SX)

-3 (1000BASE-LX)

-3 (1000BASE-LH1)

-3 (1000BASE-ZX)

-3 (100-SM-LL-I)

0 (200-SM-LL-I)



-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

-11 to -3 (100-SM-LL-I)

-12 to -3 (200-SM-LL-I)



5.9 Electrical Cross-connection Subsystem

Specifications

5.9.1 Specifications of CH1 Board

Table 5-70 Technical specifications of CH1 Board


Parameters of optical receiving port (S point) at client side


-17 (1000BASE-SX)

-19 (1000BASE-LX)

-20 (1000BASE-LH1)

-22 (1000BASE-ZX)

-25 (100-SM-LL-L)

-20 (100-SM-LL-I)

-13 (100-M5-SL-I)

-18 (I-16)

-18 (S-16.1)

-18 (S-16.2)

-27 (L-16.1/L-16.2/L-16.3)

-27 (L-16.1/L-16.2/L-16.3)

Overload power dBm

0 (1000BASE-SX)

-3 (1000BASE-LX)

-3 (1000BASE-LH1)

-3 (1000BASE-ZX)

-3 (100-SM-LL-L)

-3 (100-SM-LL-I)

-1.3 (100-M5-SL-I)

-3 (I-16)

0 (S-16.1)

0 (S-16.2)

-9 (L-16.1/L-16.2/L-16.3)




-9 (L-16.1/L-16.2/L-16.3)

Parameters of optical transmit port (R point) at client side

Average optical transmit power dBm

-9.5 ~ -3 (1000BASE-SX)

-11 ~ -3 (1000BASE-LX)

-4 ~ 0 (1000BASE-LH1)

-2 ~ 3 (1000BASE-ZX)

-9 ~ -3 (100-SM-LL-L)

-12 ~ -3 (100-SM-LL-I)

-7.3 ~ 1.3 (100-M5-SL-I)

-10 ~ -3 (I-16)

-5 ~ 0 (S-16.1)

-5 ~ 0 (S-16.2)

-2 ~ 3 (L-16.1/L-16.2/L-16.3)

-2 ~ 3 (L-16.1/L-16.2/L-16.3)

5.9.2 Specifications of CO2 Board

Table 5-71 Technical specifications of CO2 board




-14 (I-64.1)

-16.5 (S-64.2b)

-24 (L-64.2c)

-14 (10GBASE-LR/LW)

-16 (10GBASE-ER/EW)

Overload power dBm

-1 (I-64.1)

-1 (S-64.2b)

-9 (L-64.2c)

0 (10GBASE-LR/LW)




-1 (10GBASE-ER/EW)



-5 ~ -1 (I-64.1)

0 ~ 2 (S-64.2b)

-1 ~ 4 (L-64.2c)

-6~ -1 (10GBASE-LR/LW)

-1 ~ 2 (10GBASE-ER/EW)

5.9.3 Specifications of CQ2 Board

Table 5-72 Technical specifications of CQ2 board




-14 (I-64.1)

-16.5 (S-64.2b)

-24 (L-64.2c)

-14 (10GBASE-LR/LW)

-16 (10GBASE-ER/EW)

Overload power dBm

-1 (I-64.1)

-1 (S-64.2b)

-9 (L-64.2c)

0 (10GBASE-LR/LW)

-1 (10GBASE-ER/EW)



-5 ~ -1 (I-64.1)

0 ~ 2 (S-64.2b)

-1 ~ 4 (L-64.2c)

-6~ -1 (10GBASE-LR/LW)

-1 ~ 2 (10GBASE-ER/EW)



5.9.4 Specifications of CS3 Board

Table 5-73 Technical specifications of CS3 board



Frequency range nm 1280 ~1625

Sensitivity (BER 1×10–12) dBm -6


Maximum reflectance dB 27

Chromatic Dispersion tolerance Ps/nm

-10 ~ 60

Mean DGD tolerance ps 2.5


Mean output power dBm 0 ~ 3

Frequency range

ITU-T G.693 VSR2000-3R2/3/5 compliant (STM-256)

G.959.1 P1S1 3C2/3/5 compliant (OTU3)

Minimum SMSR dB 35

jitter performance Conform to G.8251

Eye Mask Conform to G.959.1 NRZ 40G

5.9.5 Specifications of CD3 Board

Table 5-74 Technical specifications of CD3 Board for 40GBASE-LR4



Signaling rate, each lane (range) GBd 10.3125 ± 100 ppm

Lane wavelengths (range) nm

1264.5 to 1277.5

1284.5 to 1297.5

1304.5 to 1317.5




1324.5 to 1337.5

Damage threshold a (min) dBm 3.3

Average receive power, each lane (max)

dBm 2.3

Average receive power, each lane b (min) dBm -13.7

Receive power, each lane (OMA) (max) dBm 3.5

Difference in receive power between any two lanes (OMA) (max)

dB 7.5

Receiver reflectance (max) dB -26

Receiver sensitivity (OMA), each lane c (max)

dBm -11.5

Receiver 3 dB electrical upper cutoff frequency, each lane (max)

GHz 12.3

Stressed receiver sensitivity (OMA), each lane d (max)

dBm -9.6

Conditions of stressed receiver sensitivity test:

Vertical eye closure penalty, e each lane dB 1.9

Stressed eye J2 Jitter, e each lane UI 0.3

Stressed eye J9 Jitter, e each lane UI 0.47


Signaling rate, each lane (range) dB 10.3125 ± 100 ppm

Lane wavelengths (range) dBm

1264.5 to 1277.5

1284.5 to 1297.5

1304.5 to 1317.5

1324.5 to 1337.5

Side-mode suppression ratio (SMSR), (min)

dBm 30

Total average launch power (max) dBm 8.3

Average launch power, each lane (max) dBm 2.3

Average launch power, each lane a (min) dBm -7

Optical Modulation Amplitude (OMA), each lane (max)

dBm 3.5

Optical Modulation Amplitude (OMA), dBm -4




each lane (min)b

Difference in launch power between any two lanes (OMA) (max)

dB 6.5

Launch power in OMA minus TDP, each lane (min)

dBm -4.8

Transmitter and dispersion penalty (TDP), each lane (max)

dB 2.6

Average launch power of OFF transmitter, each lane (max)

dBm -30

Extinction ratio (min) dB 3.5

RIN20OMA (max) dB/Hz -128

Optical return loss tolerance (max) dB 20

Transmitter reflectance c (max) dB -12

Transmitter eye mask definition {X1, X2, X3, Y1, Y2, Y3}

{0.25, 0.4, 0.45, 0.25, 0.28, 0.4}

Receiver side note:

a The receiver shall be able to tolerate, without damage, continuous exposure to an optical input

signal having this average power level b Average receive power, each lane (min) is informative and not the principal indicator of signal

strength. A received power below this value cannot be compliant; however, a value above this does

not ensure compliance. c Receiver sensitivity (OMA), each lane (max) is informative. d Measured with conformance test signal at TP3 (see 87.8.11) for BER = 10–12. e Vertical eye closure penalty, stressed eye J2 Jitter, and stressed eye J9 Jitter are test conditions

for measuring stressed receiver sensitivity. They are not characteristics of the receiver.

Transmit side note:

a Average launch power, each lane (min) is informative and not the principal indicator of signal

strength. A transmitter with launch power below this value cannot be compliant; however, a value

above this does not ensure compliance. b Even if the TDP < 0.8dB, the OMA (min) must exceed this value. c Transmitter reflectance is defined looking into the transmitter.

Table 5-75 Technical specifications of CD3 board for 40G POS






Frequency range nm 1280 ~1625

Sensitivity (BER 1×10–12) dBm -6


Maximum reflectance dB 27

Chromatic Dispersion tolerance Ps/nm

-10 ~ 60

Mean DGD tolerance ps 2.5


Mean output power dBm 0 ~ 3

Frequency range

ITU-T G.693 VSR2000-3R2/3/5 compliant (STM-256)

G.959.1 P1S1 3C2/3/5 compliant (OTU3)

Minimum SMSR dB 35

jitter performance Conform to G.8251

Eye Mask Conform to G.959.1 NRZ 40G

5.9.6 Specifications of LO2 Board

Table 5-76 Technical specifications of LO2 card


Parameters of optical receiving port (Rn point) at line side


-21 (APD)

Maximum reflectance dB -27


-9 (APD)

Wavelength range of input signals nm 1280 ~ 1565

Parameter of transmitter at line side Sn point

Spectrum Maximum -20 dB nm 0.3




characteristics spectrum width


dB 35

Central frequency

Central frequency THz 192.10~196.05


GHz ≤ 12.5 (spacing: 100 GHz)


Average optical transmit power dBm -5 ~ -1



Eye diagram template - Comply with ITU-T G.691

5.9.7 Specifications of LO2B Board

Table 5-77 Technical specifications of LO2B card



Receiving sensitivity (BER10-12) dBm -15


Overload power dBm -0.5



Spectrum characteristics

Maximum -20 dB spectrum width

nm 0.3


dB 35

Central frequency


Central frequency GHz ≤ 12.5 (spacing: 100




offset GHz)


Average optical transmit power dBm -3 ~0


Dispersion tolerance ps/nm -600~800

Eye diagram template - Comply with ITU-T G.959.1

5.9.8 Specifications of LQ2 Board

Table 5-78 Technical specifications of LQ2 board




-21 (APD)



-9 (APD)





nm 0.3


dB 35




GHz ≤ 12.5 (spacing: 100 GHz)


Average optical transmit power dBm -5 ~ -1






5.9.9 Specifications of LD2B Board

Table 5-79 Technical specifications of LD2B board




-21 (APD)



-9 (APD)





nm 0.3(NRZ)

0.4(SRZ, RZ)


dB 35




GHz



Average optical transmit power dBm +1~-4(ERZ)

+1 ~-3(NRZ/SRZ)




5.9.10 Specifications of LS3 Board

Table 5-80 Technical specifications of LS3 board


Optical signal modulation mode

- P-DPSK RZ-DQPSK






Frequency range THz

192.10~196.05(C band)

191.30~196.075 ( CE band)

192.10~196.05(C band)



dBm 0 0



ps/nm

-700~+700 -700~+700

Jitter transfer characteristics - Complies with G.8251

Complies with G.8251

FEC gain dB >8(AFEC) >8(AFEC)



THz

192.10~196.05(C band)

191.30~196.075 ( CE band)

186.95~190.90(L band)

192.10~196.05(C band)

191.30~196.075 ( CE band)

186.95~190.90(L band)

Channel spacing GHz 50 50

Maximum central frequency offset

GHz ±2.5 ±2.5

Mean launched power

Maximum dBm

+5 +5

Minimum -5 -10




nm 0.7 0.7


dB 35 35



5.10 Tributary overhead processing of convergence

board

Convergence board processes segment overhead bytes at each tributary in accordance

with the following table. OTU2 signal at the line can supervise FEC error, uncorrectable

error and SM-BIP8.

Table 5-81 Tributary overhead processing of convergence board

Overhead byte at

tributary segment

Processing mode

A1, A2 Frame localization bytes A1 and A2 at each tributary are regenerated to ensure proper frame encapsulation.

B1 B1 at each tributary are terminated.

B2

If B2 at the line are not modified at multiplexing segment, bit error information of B2 will be transmitted transparently. Otherwise, the de-multiplexer will write the information into B2 at related tributary.

D1~D12 They ensure transparency of DCC channel at each tributary.

E1,E2 They ensure transparency of order wire channel at each tributary, that is, transparency of E1 and E2.

F1 It ensures transparency of F byte at each tributary.

J0 It can supervise J0 at each tributary and ensure transparent transmission.

K1,K2

After multiplexed and de-multiplexed by transparent sub-rate multiplexer, APS byte K1 and K2 at each tributary retain accuracy of original state, transparent sub-rate multiplexer do not affect services protection at each tributary.

S1 When S1 at each tributary is terminated, new clock is calculated again and used. Line interface of transparent sub-rate multiplexer should support SSM function (processed as SDH equipment).



5.11 OS Channel (SOSC) Unit Specifications

The SOSC interface technical specifications of ZXMP M820 are listed in Table 5-82

Table 5-82 Technical specifications of SOSC Board


Optical signal type 100BASE-FX

Operating wavelength nm 1510±10

Signal code 4B/5B

Supervision rate 100

Signal transmission power dBm -5 to 0 -1 to 6 ≥+4

Minimum receiving sensitivity dBm -34 -35 -43

5.12 Supervision Unit Specifications

In ZXMP M820 system, each DWDM TM, de-multiplexer and optical amplifier provide

service supervision interface SC/PC to supervise active optical channel in real time

without disconnecting services. Optical power difference between supervision interface

and active optical channel can be found in the following Table 5-83

Table 5-83 Technical specifications of supervision unit at boards

Board Division ratio at input supervision interface

Division ratio at output supervision interface

OMU None 2.5%

ODU 2.5% None

OCI 0.5% 2.5%

OBM 2.5% 0.5%

OA None 0.1% for 24dBm output OA, and 0.5% for others



5.13 Dispersion Compensation Unit Specifications

Dispersion compensation fiber is located before EOBA, EOPA and EOLA. When

EOPA+EOBA mode and EONA are adopted, DCM is between them.

Broadband dispersion compensation fiber is used to compensate optical channel

dispersion, which is a negative value just like slope. Slope compensation rate is up to

90%~110%.

Table 5-84 Technical specifications of dispersion compensation Board

Item Maximum insertion loss

DGD(ps) Unit Parameter

Maximum insertion loss

& DGD

G.652 fiber

20km dB 2.5 <0.6

40km dB 4 <0.8

60km dB 6 <1.0

80km dB 7 <1.1

100km dB 8 <1.2

120km dB 10 <1.2

Maximum insertion loss

& DGD

G.655 fiber

20km dB 2 <0.45

40km dB 4 <0.60

60km dB 5 <0.75

80km dB 6 <0.80

100km dB 7 <0.90

120km dB 8 <1.0

5.14 Dispersion compensation unit (DCU) Performance

Indices

The DCU interface technical specifications of ZXMP M820 are listed in Table 5-85



Table 5-85 Main technical specifications of DCU Board


Optical input power dBm -14 ~ +2

Dispersion adjustment range GHz +/- 700

5.15 Physical Performance

5.15.1 Structure Indices

The dimensions and weight of ZXMP M820 are shown in Table 5-86 and Table 5-87

Table 5-86 Dimensions and Weight of ZXMP M820

Components Dimensions Weight

(kg)

Unified cabinets of ZTE transmission equipment

2,000 mm (H) × 600 mm (W) × 300 mm (D) 58.50

2,200 mm (H) × 600 mm (W) × 300 mm (D) 64.50

2,600 mm (H) × 600 mm (W) × 300 mm (D) 76.00

sub-rack ( 21 inch ) 422 mm (H) × 533mm (W) × 286 mm (D) 12.50

sub-rack ( 19 inch ) 422 mm (H) × 473mm (W) × 286 mm (D) 11.20

CX4 447 mm (H) x 535 mm (W) x 275 mm (D) 18

CX20 447 mm (H) x 535 mm (W) x 275 mm (D) 18

CX22 447 mm (H) x 535 mm (W) x 275 mm (D) 18

Power supply distribution box

88.1 (height) × 535 (width) × 258 (depth) 3.8

ODF sub-rack 88 mm (H) × 482.6 mm (W) × 269.5 mm (D) 6.50

DCM chassis 47 mm (H) × 533 mm (W) × 286.5 mm (D) 5.60

Conversion bracket 29.6mm (H) × 345.6mm (W) 0.30

Fan unit 30 mm (H) × 122.9 mm(W) × 276.8mm(D) 0.68

Full-height board PCB:320 mm (W) × 210 mm (D)

Front panel: 345.6 mm (H) × 29.8 mm (W) --

Compact board PCB:152 mm (W) × 210 mm (D) --



Components Dimensions Weight

(kg)

Front panel: 155.6 mm (H) × 25.1 mm (W)

Note: The cabinet weight refers to the empty cabinet.

Table 5-87 ZXMP M820 Board Weight

Board ID Board Description Weight (kg)

SNP Compact Node Process Board 0.60

SCC Compact Communication Control Board

0.47

CCP Subrack Management Board 0.7

FCC Fan Board 3.6

PWD Power Supply Board 1.05

SOSC Compact Optical Supervision

Channel Board 0.60


0.5

TIS Time interface supply card 0.5

XCA Switching Board 1.85

SOGMD Compact Optical Group

Mux/DeMux Board 0.60

SOAD1

Compact Optical

Adding/Dropping Board of 1

Wavelength

0.60

SOAD2

Compact Optical


Wavelength

0.60

SOAD4

Compact Optical


Wavelength

0.60

SOP Compact Optical Protection

Board 0.60

SOPCS Compact Optical Protection 0.60




Board for Channel Section

SOPMS Compact Optical Protection

Board for Mux Section 0.60

SSDM Compact Supervisory Division Multiplexing Board

0.60

SPWA Compact Power Supply Board (A-type)

1.80

SEIA Compact Extension Interface Board 0.45

SFANA Compact Fan Board 0.68

OTU Optical Transparent Unit 1.55

SOTU2.5G Compact Optical Transponder

Unit for 2.5 Gbit/s 0.60

SOTU10G Compact OTU 10Gb/s Transceiver 0.70

OTU10G Optical Transponder Unit for 10Gb/s 1.65

EOTU10G Enhanced Optical Transponder Unit for 10 Gbit/s

1.65

EOTU10GB Type B Enhanced Optical Trans- ponder Unit for 10 Gbit/s

1.65

TST3 (using DPSK module)

Optical Transponder Unit for 40Gb/s 3.5

TST3 (using DQPSK module)

Optical Transponder Unit for 40Gb/s 3.3

TS4 Single-channel 100Gb/s Optical Channel Transport Unit

5.5

TS4(Regeneration) Single-channel 100Gb/s Optical Channel Transport Unit

5

MQT3 (using DPSK module)

Four 10G Sub Rate Mux Board 3.25

MQT3 (using DQPSK module)

Four 10G Sub Rate Mux Board 3.05

MX2 Ten 10G SubRate Mux Unit 3.5

SDSA Compact Data Service Aggregation Board 0.6

DSAF Data Service Aggregation with FEC 1.4

DSA Data Service Aggregation Board 1.6




GEMF Gigabit Ethernet Mux Board with FEC

1.50

GEM2 Two Gigabit Ethernet Mux Board 1.50

GEM8 Eight Gigabit Ethernet Mux Board 2.05

FCA FC service Access unit 1.5

MOM2 Eight GE/FC Muxponder 1.5

SRM42 Four 622 M/155 M SubRate Mux Board

1.25

SRM41 Four 2.5 G SubRate Mux Board 1.25

ASMA Type A Convergence Switching Board

0.6

CS3 Client board for Single OTU3 1.4

CD3 Client board for Double OTU3 2.325

CO2 Client board for 8*OTU2 2.1

CQ2 Client board for 4*OTU2 1.8

CH1 Client board for 16*GE or 8*OTU1 1.075

LS3(2 slots) Line board for single OTU3( 2 slots) 3.25

LS3(DPSK)(1 slot) Line board for single OTU3 (1slot) 2.225

LS3(DQPSK)(1 slot) Line board for single OTU3 (1slot) 2.32

LO2 Line board for 8*OTU2 2.1

LQ2 Line board for 4*OTU2 1.8

LD2B Line board for 2*OTU2 1.95

TD2C Transponder of 2 ports 10Gb/s 0.7

MQA2 Muxponder of 4 ports any rate to OTU2 0.6

MQA1 Muxponder of 4 ports any rate to OTU1 0.6


0.5

EOBA Enhanced Optical Booster Amplifier 1.80

EOPA Enhanced Optical Pre-Amplifier 1.80

EOLA Enhanced Optical Line Amplifier 1.80

EONA Enhanced Optical Node Amplifier 2.00

SEOBA Enhanced Optical Booster Amplifier 0.60




SEOPA Enhanced Optical Pre-Amplifier 0.60

SEOLA Enhanced Optical Line Amplifier 0.60

DRA_P Distributed Raman Amplifier 2.00

DRA_B 2.00

LAC Line Attenuation Compensator 1.10

DSA Data Service Aggregation Board 1.60

DSAC Data Service Aggregation Board 0.6

SAUC SDH Service Access Unit 0.6

OMU Optical Multiplexing Unit 1.60

ODU Optical De-Multiplexing Unit 1.60

ODUB Optical De-Multiplexing Unit(B Type) 1.60

OCI Optical Channel Interleaver 1.95

VMUX Variable Insertion Loss Multiplexer 2.10

VMUXB Variable Insertion Loss Multiplexer(B Type) 2.10

PDU Power Distribution Unit 1.40

WBU Wavelength Blocking Unit 2.60

WSU Wavelength Selective Unit 2.60

WBM Wavelength Blocking Multiplexer 2.10

OMCP Optical Multi-Channel Protection 1.25

OPM Optical Performance Monitor 1.15


0.96

OWM Optical Wavelength Monitor 1.10


0.9

RPU Remote Pump Unit 2.00

RGU Remote Gain Unit 0.50

DCU Dispersion Compensation Board 0.55


0.90


0.96



5.15.2 Bearing Requirements of the Equipment Room

The bearing capability of the equipment room should be over 450 kg/m2 in case of only

considering ZXMP M820.

5.15.3 Power Supply Indices

Voltage requirements

Input voltage: -48 VDC

Allowable fluctuation range: -60 V ~ -36 V

Power consumption requirements

The power consumption of each board and unit in ZXMP M820 is illustrated in Table

5-88.

Table 5-88 Power Consumption of Commonly Used Boards/Units of ZXMP M820

Abbreviation Unit Name

Max. Power Consumption (W) @ 25 C Environment

Temperature

Board

OTU 2.5G optical transfer unit 14

SOTU2.5G Compact Optical Transponder Unit for 2.5Gbit/s

14

OTUF 2.5G optical transfer unit with FEC

14

OTU10G 10G optical transfer unit with FEC/AFEC

29.2

OTU10G (regenerator)

10G optical transfer unit with FEC/AFEC

22.2

EOTU10G Enhanced 10G optical transfer unit with FEC/FEC

28

EOTU10G (regenerator)

Enhanced 10G optical transfer unit with FEC/FEC

21





Temperature

EOTU10GB Type B Enhanced OTU 10Gbit/s Transceiver

28

SOTU10G Semi 10G optical transfer unit with FEC/FEC

25

TST3 40G optical transfer unit with FEC/AFEC

90

TST3 (regenerator)

40G optical transfer unit with FEC/AFEC

79

MQT3 Four 10G SubRate Mux Board

120

TS4 Single-channel 100Gb/s Optical Channel Transport Board

190

MX2

(no SFP++)

Ten 10G Sub Rate Mux Board

185

MX2

(with SFP++) Ten 10G Sub Rate Mux Board

200

SRM41 Four 2.5G SubRate Mux Board

33

SRM42 Four 622M/155M SubRate Mux Board

20

SDSA Compact Data Service Aggregation Board

25

DSAF Data Service Aggregation

with FEC 22

DSA Data Service Aggregation

Board 25

GEM2 Dual-channel gigabit Ethernet convergence board

13

GEMF Dual-channel gigabit Ethernet convergence board with FEC

18





Temperature

GEM8 Eight Gigabit Ethernet Mux Board

35

FCA FC service Access unit 40

MOM2 Eight GE/FC Muxponder 40

ASMA Aggregation Switch Muxponder

80

TD2C Transponder of 2 ports 10Gb/s

25


28


28


28

CD3 Client board for Double OTU3

101

CS3 Client board for Single OTU3 70

CO2 Client board for 8*OTU2 90

CQ2 Client board for 4*OTU2 50

CH1 Client board for 16*GE or 8*OTU1

56

LS3(2 slots) Line board for single OTU3( 2 slots)

84 (DPSK)

93 (DQPSK)

LS3(1 slot) Line board for single OTU3 (1slot)

80(DPSK)

86(DQPSK)

LO2 Line board for 8*OTU2 92

LQ2 Line board for 4*OTU2 50

LD2B Line board for 2*OTU2 53

XCA Switching Board 55

OMU OM board TFF/AWG 3(TFF)/13.2(AWG)

ODU OD board TFF/AWG 3(TFF)/13.2(AWG)

ODUB Optical De-Multiplexing Unit 38





Temperature

(B Type)

VMUX Variable insertion loss Multiplexer

30

VMUXB Variable Insertion Loss Multiplexer (B Type)

30

OCI Optical multiplex/demultiplex interleaver

3

OBM Optical broadband multiplexer

3

SOAD1 Compact Optical Add/

Drop Board of 1/2/4 Wave

length

4

SOAD2 4

SOAD4 5

WBU Wavelength Blocking Unit 15

WSU Wavelength Selective Unit 15

WBM Wavelength Blocking Multiplexing

32

PDU Power Distribution Unit 3

EOBA

Enhanced Optical power amplifier

20

EOBAS 14.5

EOBAH2424 30

EOBAH2726 40

EOPA Enhanced Optical preamplifier

11

EOLA Enhanced Optical line amplifier

14.5

EONA Enhanced Optical node amplifier

25

SEOBA Enhanced Optical Booster

Amplifier 14

SEOPA Enhanced Optical PreAmplifier

11





Temperature

SEOLA Enhanced Optical Line Amplifier

14

RPU Remote Pump Unit 80

RGU Remote Gain Unit 0

DRA Distributed Raman amplifier 35

SOP Optical protection board 5

SOPCS Compact Optical Protection

Board for Channel Section 3

SOPMS Compact Optical Protection

Board for Mux Section 3

OMCP Optical Protect for Mux Section

5

OPM Optical performance monitoring board

5

OWM Optical Wavelength

Monitor 3

EOPM Enhanced Optical Channel

Performance Monitor 10

EOWM

Enhanced Optical

Wavelength Monitor

Board

10

SOSC Optical supervision channel board

12


18

TIS Time interface supply card 15

CCP Subrack Management Board 18

FCC Fan Board 67

SNP Net control processor 10

SCC Communication Control

Board 10





Temperature

SEIA Compact Extension Interface

Board 5

SDMT Transmitter supervisory add/drop multiplexer board

4

SDMR Receiver supervisory add/drop multiplexer board

4

LACG Line attenuation control board (generator)

3

LACT Line attenuation control board (terminal)

3

SEI Extension Interface Board 5

SPWA Power Board (A-type) 28

PWD Power Supply Board 5.8

SFAN Compact Fan Board 10

Sub-rack

- Master Sub-rack(NX) 733

Slave Sub-rack(NX) 721

Note: The power values of the sub-rack is for full configuration of 10G OTU (SOTU 10G).

The power consumption in the table is the maximum value at normal temperature.

5.16 Environment Conditions

5.16.1 Grounding Requirements

Internal grounding requirements of the system

The board shielding plate is grounded via the panel to the case, and there is no

electronic connection inside a board.

The cabinet and sub-rack case are connected to the protective ground.



The equipment room grounding requirements

Grounding resistance of the AC working ground: 4

Grounding resistance of the safety protection ground: 4

Grounding resistance of the lightning protection ground: 4

Combined grounding, with resistance 1

If the equipment room provides the working ground and the protection ground, the

working and protection grounds of the equipment shall be connected to the relevant

grounding copper bar. If the equipment room only provides a copper ground bar, it

is allowed to jointly earth the working and protection grounds. The resistance values

shall meet the above requirements.

5.16.2 Temperature and Humidity Requirements

The requirements on ambient temperature and relative humidity of ZXMP M820 are

shown in Table 5-89.

Table 5-89 Temperature and Humidity Requirements

Item Indices

Ambient temperature Long term running: 0 C + 45 C

Short term running: -5 C ~ +50 C

Relative humidity (35 C) Long term running: 10% ~ 90%

Short term running: 5% ~ 95%

In normal working environment, the measuring spot of humidity and temperature is the

data measured at the spot 1.5 m above the floor and 0.4 m in front of the equipment.

5.16.3 Requirements for Cleanness

Cleanness involves dust and harmful gases in the air. The equipment should be

operated in the equipment room that meets the cleanness requirements described

below:



In the transmission equipment room, there is no explosive, electrically conductive,

magnetically conductive or corrosive dust.

The concentration of dust particles with the diameter greater than 5µm should be less

than or equal to 3 104 particles/m3.

There is no corrosive metal or gases that are detrimental to the insulation in the

equipment room. For details, please refer to Table 5-90

Table 5-90 Requirements for Harmful Gases in the Equipment Room

Harmful Gas Mean Value (mg/m3) Max. Value (mg/m3)

SO2 0.2 1.5

H2S 0.006 0.03

NO2 0.04 0.15

NH3 0.05 0.15

CL2 0.01 0.3

The equipment room should be always kept clean, with doors and windows being closed.

5.16.4 Dustproof and Corrosion-Proof Requirements

According to the application range recommended in GB798, the dustproof and antisepsis

requirements of ZXMP M820 are as follows:

Storage environment conditions: For 1K5/1Z1/1B2/1C2/1S3/1M3, the storage duration is

180 days.

Transportation environment conditions: For 2K4P/2B2/2C2/2S3/2M3, the transportation

duration is 30 days.

Application environment conditions: For 3K5/3Z2/3Z7/3B2/3C2/3S2/3M3, the continuous

operation time is 20 years.

5.16.5 Environment for Storage

Climate



Table 5-91 Climate requirement

Item Range

Altitude < 4000m

Air pressure 70 ~ 106kPa

Temperature -40℃~ +70℃

Temperature change rate < 1℃/min

Relative humidity 5% ~ 100%

Solar radiation 1120W/s²

Air speed < 20m/s²

Mechanical stress

Table 5-92 Requirements for mechanical stress

Item unit value

Acceleration m/S2 0.1

Frequency range Hz 5～100, 100～5

direction X,Y,Z

duration Min 90

The earthquake-proof performance detection reaches the eight-level intensity

5.16.6 Environment for Transportation

Climate

Table 5-93 Climate requirement

Item Range

Altitude < 4000m

Air pressure 70 ~ 106kPa

Temperature -40℃~ +70℃

Temperature change rate < 1 ℃/min

Relative humidity 5% ~ 100%

Solar radiation < 1120W/s²



Air speed < 20m/s²

5.16.7 Electronic Static Discharge (ESD)

Anti-interference for static discharging

The static discharge anti-interference index of ZXMP M820 equipment is shown in Table

5-94. During the operation in the interface area, be sure to wear an antistatic wrist strap.

Table 5-94 Static discharge anti-interference

Contact discharge Air discharge Criterion for test results

6kV 8kV Performance B

8kV 15kV Performance R

RF electromagnetic radiated susceptibility

The RF electromagnetic radiated susceptibility of ZXMP M820 equipment is shown in

Table 5-95.

Table 5-95 RF electromagnetic radiated susceptibility

Test frequency (80MHz~1000MHz)

Electric field intensity Amplitude modulation Criterion for test results

10V/m 80%AM (1kHz) Performance A

Electrical fast transient burst susceptibility

The electrical fast transient burst susceptibility of ZXMP M820 equipment is shown in


Table 5-96 Electrical fast transient burst susceptibility at the DC power port

Generator waveform 5/50ns

Test voltage Repeated frequency Criterion for test results

1kV 5kHz Performance B



Table 5-97 Electrical fast transient burst susceptibilities at the signal cable and control cable ports

Generator waveform 5/50ns

Test voltage Repeated frequency Criterion for test results

1kV 5kHz Performance B

Surge susceptibility

The surge susceptibility of ZXMP M820 equipment is shown in and Table 5-100

Table 5-98 , Error! Reference source not found. and Table 5-100

Table 5-98 Surge susceptibility of DC power

The waveform of generators 1.2/50us (8/20μs), internal resistance 12

Test mode Test voltage Criterion for test results

Line to ground 1kV Performance B

Line to ground 2kV Performance R

Table 5-99 Surge susceptibility of the outdoor signal cable

The waveform of generators 10/700µs, internal resistance 40


Line to line 2kV Performance B

Line to ground

Line to line 4kV Performance R

Line to ground

Table 5-100 Surge susceptibility of the indoor signal cable

Generator waveform 1.2/50μs (8/20μs), internal resistance 42


Line to ground 1kV Performance B

Line to ground 2kV Performance R

Conductivity susceptibility of RF field



The conductivity susceptibility of RF field of ZXMP M820 equipment is shown in Table

5-101

Table 5-101 Conductivity susceptibility of RF field

Test frequency 0.15MHz ~ 80MHz

Test intensity Amplitude modulation Criterion for test results

3V 80%AM (1kHz) Performance A

Conductive emission electromagnetic interference

The conductive emission electromagnetic interference of ZXMP M820 equipment is

shown in Table 5-102

Table 5-102 Conductive emission electromagnetic interference at the direct current port

Testing frequency (MHz) Limits (dBuV)

Quasi-peak Mean value

0.02~0.15 79 --

0.15~0.5 79 66

0.5~30 73 60

Radioactive emission electromagnetic interference

The radioactive emission electromagnetic interference of the ZXMP M820 equipment is

shown in Table 5-103

Table 5-103 Radio active emission electromagnetic interference

Testing frequency (MHz) Quasi-peak demodulating limit (dBµV/m)

10m 3m

30~230 40 50

230~1000 47 57

5.16.8 Safety requirements

This product adopts the technical requirements specified in the following standard:



IEC/EN 60950:2000 Safety of information technology equipment

Working voltage and current

Rated working voltage: -48V

Max. working voltage: -60V

Min. working voltage: -36V

Insulation classification of the equipment

The power supply of the equipment provides the SELV circuit with safe and excessively

low voltage, without self-generating dangerous voltage. It belongs to the equipment of

the class III insulation (Class III equipment).

Optical interface

The optical module of the maximum power belongs to (Class 3A). All the optical modules

shall be under strict control and certified by authorities (such as UL, TUV and NEMKO),

and comply with EN60825.

Fuse

All the fuses and power modules, including recoverable fuses, shall be certified by

authorities such as CE, UL and TUV.

Safety mark

On the package of the equipment, there are striking labels about antistatic, fragile,

waterproof, and damp-proof.

The maximum optical power satisfies the 3A safety standard. An obvious label warning

against the laser shall be pasted at the optical interface.

Cables of different colors shall be used for the power input, shielding GND and lightening

protection GND to avoid incorrect connection. Different power connectors shall use

coding keys. There shall be a power label at the power inlet.

Both the equipment and each board shall have an antistatic label.



Grounding symbol . ” ” indicates switch-on, and” ” indicates switch-off.

Mechanical structure

In installation, four bolts are designed at the rack bottom (may also be used to adjust

balance) to fix the rack to the ground. At the rack top, the corresponding screws are

designed to fix the rack to the cabling rack. When installed in the equipment room, the

rack shall be fixed both at the top and bottom to ensure the stability and safety of the

equipment.

The corners of both the rack and sub-rack are processed to avoid hurting people.

Fire protection

The materials of the circuit boards in the equipment use the fireproof materials of the V-2

level to prevent the circuits from burning in case of failure.

The structural parts use unburnable materials with a good fireproof performance,

including surface processing materials.

With the effective heat dissipation design, it ensures that the temperature does not

exceed 70ºC to prevent heat aggregation and reduce the possibility of burning.

Safe parts passing the safety authentication (CE, UL, etc.) are used.

High temperature protection

In abnormal conditions, the temperature does not exceed 70ºC. The plastic parts,

components, wires and cables, and safety labels shall all comply with the requirements

specified in the safety standard-GB4943/EN60950.

Lightening protection

In this system, good grounding and isolation and protection of electrical interfaces are

used to prevent the dangerous voltage of lightening.



5.17 Introduction to Interfaces

This chapter briefly introduces types and functions of the interfaces used in ZXMP M820.

5.17.1 Interface on SEIA board

SEIA has two subclasses: SEIA1 and SEIA2, the former used in main sub-rack, the latter

used in slave sub-rack

Figure 5-2 Common Interface Area of the OTU Sub-rack



FE Ethernet interface

Testing switch

Subrack cascaded data interface

Bell control

External alarm input interface

Subrack indicators

Interface of cascaded alarm

Interface of alarm output, ring output and rack indicators signal

The definitions and descriptions of the interface area on SEI board are listed in Table

5-104 and Table 5-105



Table 5-104 Definitions and Description for the Common Interface on SEIA1

Board

Item SEIA1

Board ID SEIA1

FE Ethernet

interface J4

RJ45 socket is used as Qx interface to access EMS computer, and also as the transparent user channel interface or IP phone interface based on Ethernet.

Subrack cascaded data

interface

J1, J3 D-type 36–pin straight PCB jointing socket (female) to connect to subrack cascaded data interface of other subarcks.

External alarm input interface

J2 Inputs external alarms.

Interface of cascaded alarm

J5 Inputs alarms from other subrack

Interface of alarm output, ring output and rack indicators signal

J6 Outputs alarm signal, ring driving signal and rack indicator signal

Testing switch

TST Reserved

Bell control Control the ON state or OFF state of the ring.

Subrack indicators Indicates the state of the subrack, green light for normal state, red light for critical alarm, orange for major alarm, yellow for minor alarm

Number of occupied slot 1



Table 5-105 Definitions and Description for the Common Interface on SEIA2

Board Item SEIA2

Board ID SEIA2

FE Ethernet

interface J3

RJ45 socket is used as Qx interface to access EMS computer, and also as the transparent user channel interface or IP phone interface based on Ethernet.

Sub rack cascaded data

interface

J1, J2 D-type 36–pin straight PCB jointing socket (female) to connect to subrack cascaded data interface of other subarcks.

Testing switch

TST Reserved




5.17.2 Interface on SPWA board

Figure 5-3 Interfaces on the SPWA board

Terminal block

Sub rack cascaded GE interface

Sub rack cascaded GE optical interface connection indicator

Power switch

RS232 console interface

RJ-45 console interface

Indicators



Laser warning sign

Laser level sign

The definitions and descriptions of the interface area on SPWA board are listed in Table

5-106

Table 5-106 Definitions and Description for the Common Interface on SPWA

Board

Item SPWA

Board ID SPWA

Power switch

If the switch is in the status of “ON", the external power supply is connected to the SPWA. On the other hand, if the switch is in the status of "OFF”, the connection between SPWA and the external power is cut off.

Indicator

NOM Running indicator, green

ALM Alarm indicator, red

M/S Master/slave indicator, green

0, 1, 2, 3-1, 3-2, 3-3, 3-4, 4, 5-1, 5-2, 5-3, 5-4, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20-1, 20-2, 21, 22-1, 22-2, 23, 24-1, 24-2, 25, 26-1, 26-2

Board internal communication indicator, green.

Sub rack cascaded GE interface

J1, J2 Connects to sub rack cascaded GE interface of other sub racks, LC/PC connector

Laser warning sign Do not look at optical interfaces directly while plugging/unplugging fiber pigtails to avoid burning eyes.

Laser class sign Indicates that the laser class of SPWA board is



CLASS 1




6 Abbreviation Abbreviation Full English Description

AFEC Advance Forward Error Correction

AFR Absolute Frequency Reference

AIS Alarm Indication Signal

APO Automatic Power Optimization

APR Automatic Power Reduction

APS Automatic Protection Switching

APSD Automatic Power Shutdown

APSF Automatic Protection Switching for Fast Ethernet

ASE Amplified Spontaneous Emission

AWG Array Waveguide Grating

ADM Add/Drop Multiplexer

ATM Asynchronous Transfer Mode

ASON Automatically Switched Optical Network

AWG Array Waveguide Grating

BA Booster (power) Amplifier

BER Bit Error Ratio

BLSR Bidirectional Line Switching Ring

BSHR Bidirectional Self-Healing Ring

CBR Constant Bit Rate

CDR Clock and Data Recovery

CMI Code Mark Inversion

CODEC Code and Decode

CPU Center Process Unit

CRC Cyclic Redundancy Check

DBMS Database Management System

DCC Data Communications Channel

DCF Dispersion Compensation Fiber

DCG Dispersion Compensation Grating

DCN Data Communications Network

DCM Dispersion Compensation Module



Abbreviation Full English Description

DRA Distributed RAMAN fiber Amplifier

DVB Digital Video Broadcasting

DDI Double DAFECt Indication

DFB-LD Distributed Feedback Laser Diode

DSF Dispersion Shifted Fiber

DGD Differential Group Delay

DTMF Dual Tone Multi Frequency

DWDM Dense Wavelength Division Multiplexing

DXC Digital Cross-connect

EAM Electrical Absorption Modulation

ESCON Enterprise System Connection

ECC Embedded Control Channel

EDFA Erbium Doped Fiber Amplifier

EX Extinction Ratio

EMS Network Element Management System

EMC Electromagnetic Compatibility

EMI Electromagnetic Interference

ERZ Electrical Return to Zero

EOBA Enhanced Optical Booster Amplifier

EOPA Enhanced Optical Preamplifier Amplifier

FDI Forward DAFECtion Indication

FEC Forward Error Correction

FPDC Fiber Passive Dispersion Compensator

FAS Frame Alignment Signal

FC Fiber Channel

FICON Fiber Connection

FEC Forward Error Correction

FWM Four Wave Mixing

FOADM Fixed Optical Add/Drop Multiplexer

GCC General Communication Channel

GE Gigabits Ethernet




GFP Generic Framing Procedure

GUI Graphical User Interfaces

IP Internet Protocol

ITU-T International Telecommunication Union – Telecommunication Standardization Sector

IWF Inter-Working Function

LD Laser Diode

LA Line Amplifier

LOF Loss of Frame

LOS Loss of Signal

LAN Local Area Network

LCK Locked

MAN Metropolitan Area Network

MFAS MultiFrame Alignment Signal

MS-AIS Multiplex Section - Alarm Indication Signal

MDI Multiple Document Interface

MCU Management and Control Unit

MOADM Metro Optical Add Drop Multiplexer Equipment

MBOTU Sub-rack backplane for OUT

MQW Multiple Quantum Well

MSP Multiplex Section Protection

MST Multiplex Section Termination

NE Network Element

NNI Network Node Interface

NMCC Network Manage Control Center

NRZ Non Return to Zero

NT Network Termination

NZDSF Non-Zero Dispersion Shifted Fiber

OA Optical Amplifier

OAC Optical Access

OADM Optical Add/Drop Multiplexer




Och Optical Channel

ODF Optical fiber Distribution Frame

ODU Optical Demultiplexer Unit

OGMD Optical Group Mux/DeMux Board

OCI Open Connection Indication

OHP Order wire

OLA Optical Line Amplifier

OLT Optical Line Termination

OMU Optical Multiplexer Unit

OMS Optical Multiplex Section

ONU Optical Network Unit

OPU Optical Protection Unit

OPM Optical Performance Monitor

OPMSN Optical Protect for Mux Section (without preventing resonance switch)

OPMSS Optical Protect for Mux Section (with preventing resonance switch)

OSPF Open Shortest Path First

OSC Optical Supervision Channel

OSNR Optical Signal-Noise Ratio

OTM Optical Terminal Multiplexer

OTN Optical Transport Network

OTU Optical Transponder Unit

OXC Optical Cross-connect

PA Pre-Amplifier

PDL Polarization Dependent Loss

PDC Passive Dispersion Compensator

PM Path Monitoring

POS Packet Over SDH

PSI Payload Structure Identifier

PT Payload Type

PMD Polarization Mode Dispersion




ROADM Reconfigurable Optical Add/Drop Multiplexer

REG Regenerator

RES Reserved for Future International Standardization

RSOH Regenerator Section OverHead

SNP Net Control Processor for Fast Ethernet

SM Section Monitoring

SOH Section Overhead

SONET Synchronous Optical NETwork

SDH Synchronous Digital Hierarchy

SDM Supervision add/drop multiplexing board

SOSC Optical Supervisory Channel

SEF Severely Errored Frame

SES Severely Errored Block Second

SFP Small Form Factor Pluggable

SLIC Subscriber Line Interface Circuit

SMCC Sub-network Management Control Center

SMT Surface Mount

SRS Stimulated RAMAN Scattering

SNMP Simple Network Management Protocol

STM Synchronous Transfer Mode

TCP Transmission Control Protocol

TCM Tandem Connection Monitor

TIM Trace Identifier Mismatch

TTI Trail Trace Identifier

TFF Thin Film Filter

TMN Telecommunications Management Network

VOA Variable Optical Attenuator

XFP 10-Gigabit Small Form-Factor Pluggable

WDM Wavelength Division Multiplexing



7 Followed Standards and Recommendations The ZXMP M820 is designed with reference to the following recommendations and

standards:

Standard/

Recommendation Title

ITU-T G.652 Characteristics of a single-mode optical fiber and optical cable

ITU-T G.653 Characteristics of Dispersion-Shifted Single-Mode Fiber

ITU-T G.655 Characteristics of Non-Zero Dispersion-Shifted Single-Mode Fibers

ITU-T G.661 Definition and test methods for the relevant generic parameters of optical amplifier devices and subsystems

ITU-T G.662 Generic characteristics of optical fiber amplifier devices and subsystems

ITU-T G.663 Application related aspects of optical amplifier devices and subsystems

ITU-T G.664 Optical safety procedures and requirements for optical transport systems

ITU-T G.665

Definitions and Test Methods for Generic Characteristics Amplifiers

and Raman Amplified Subsystems

ITU-T G.671 Transmission characteristics of passive optical components

ITU-T G.681 Functional characteristics of interoffice and long-haul line systems using optical amplifiers, including optical multiplexing

ITU-T G.691 Optical interfaces for single channel STM-64, STM-256 systems and other SDH systems with optical amplifiers

ITU-T G.692 Optical interface for multichannel systems with optical amplifiers

ITUT-T G.694.1 Spectral grids for WDM application: DWDM frequency grid

ITU-T G.693 Optical interfaces for intra-office systems

ITU-T G.696.1 Optical transport network physical layer interfaces

ITU-T G.697 Optical monitoring for DWDM systems

ITU-T G.709 Interfaces for the Optical Transport Network

ITU-T G.709-2003 Optical Transport Network (OTN) Interfaces

ITU-T G.783 Characteristics of synchronous digital hierarchy (SDH) equipment



Standard/


functional blocks

ITU-T G.798 Characteristics of optical transport network hierarchy equipment functional blocks

ITU-T G.8201 Error performance parameters and objectives for multi-operator international paths within the Optical Transport Network (OTN)

ITU-T G.825 The control of jitter and wander within digital networks which are based on the synchronous digital hierarchy (SDH)

ITU-T G.8251 The control of jitter and wander within the optical transport network (OTN)

ITU-T G.828 Optical input jitter and wander control based on the synchronous digital hierarchy (SDH)

ITU-T G.826 Error performance parameters and indexes for international, constant bit rate digital paths at or above the primary group

ITU-T G.841 Types and characteristics of SDH network protection architectures

ITU-T G.873.1 The APS protocol and protection switching operation for the linear protection schemes for the Optical Transport Network at the Optical Channel Data Unit (ODUk) level

ITU-T G.874 Management aspects of the Optical Transport Network Element containing transport functions of one or more of the layer networks of the optical transport network.

ITU-T G.957 Optical interfaces for SDH equipment and systems

ITU-T G.959.1 Optical transport networks physical layer interfaces

ITU-T G.707 Network Node Interface for the SDH equipment

ITU-T G.975 Forward Error Correction for Submarine Systems

IEEE Std 802.3 Carrier sense multiple access with collision detection (CSMA/CD) access method and physical layer specification

IEEE 802.3-2002 Carrier wave interception multi-address access method with collision test and physical layer characteristics

EMC, Safety and Environmental Standard

EMC Standard: EMI Standard---CISPR22 (EN55022)

EN50082-1: 1992 or EN55024: 1998 (Mandatory by 1 July 2001) (EN61000-4-2, 3, 4, 5, 6 series)

TNE (Telecommunicatio

ETSI EN 300 386 V1.2.1 (2000-03)

Electromagnetic compatibility and Radio spectrum Matters (ERM);



Standard/


n network equipment)

Telecommunication network equipment; Electromagnetic Compatibility (EMC) requirements

Safety Standard IEC950(EN60950)

IEC 60825-1 Safety of laser products-Part 1: Equipment classification, requirements and user’s guide

IEC 60825-2 Safety of laser products-Part2: Safety of optical fiber communication systems

Environmental standard

ETS 300 019 (T/TR02-12)

ETSI EN 300 119-3 Environmental Engineering (EE) European telecommunication standard for equipment practice; Part 3: Engineering requirements for miscellaneous racks and cabinets

ETSI EN 300 119-4 Environmental Engineering (EE); European telecommunication standard for equipment practice; Part 4: Engineering requirements for sub-racks in miscellaneous racks and cabinets.

zxmp m820 product description - liberty port · 3.1.12 alarm input /output function ... zxmp m820...

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