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ZXMP S200SDH Based Multi-Service Node Equipment

Product Descriptions

Version 3.00

ZTE CORPORATIONZTE Plaza, Keji Road South,Hi-Tech Industrial Park,Nanshan District, Shenzhen,P. R. China

518057Tel: (86) 755 26771900Fax: (86) 755 26770801URL: http://ensupport.zte.com.cn

E-mail: [email protected]

http://ensupport.zte.com.cn/


mailto:[email protected]






LEGAL INFORMATION

Copyright © 2006 ZTE CORPORATION.

The contents of this document are protected by copyright laws and international treaties. Any reproduction or distribution of

this document or any portion of this document, in any form by any means, without the prior written consent of ZTECORPORATION is prohibited. Additionally, the contents of this document are protected by contractual confidentialityobligations.

All company, brand and product names are trade or service marks, or registered trade or service marks, of ZTECORPORATION or of their respective owners.

This document is provided “as is”, and all express, implied, or statutory warranties, representations or conditions aredisclaimed, including without limitation any implied warranty of merchantability, fitness for a particular purpose, title or non-infringement. ZTE CORPORATION and its licensors shall not be liable for damages resulting from the use of or reliance on

the information contained herein.

ZTE CORPORATION or its licensors may have current or pending intellectual property rights or applications covering thesubject matter of this document. Except as expressly provided in any written license between ZTE CORPORATION and itslicensee, the user of this document shall not acquire any license to the subject matter herein.

ZTE CORPORATION reserves the right to upgrade or make technical change to this product without further notice.

Users may visit ZTE technical support website http://ensupport.zte.com.cn to inquire related information.

The ultimate right to interpret this product resides in ZTE CORPORATION.

Revision History

Date RevisionNo.

Serial No. Description

2009/01/08 R1.1 sjzl20081400Second edition. Adds SMB board and EIE3

board.

2009/05/20 R1.2 sjzl20081400Add the descriptions about the networkingapplication of Ethernet.



ZTE CORPORATIONValues Your Comments & Suggestions!Your opinion is of great value and will help us improve the quality of our productdocumentation and offer better services to our customers.

Please fax to: (86) 755-26770801; or mail to ZTE University, ZTE CORPORATION,ZTE Plaza, A Wing, Keji Road South, Hi-Tech Industrial Park, Shenzhen, P. R. China518057.

Thank you for your cooperation!

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Contents

About This Product Descriptions .................................................... i

Purpose........................................................................................................i

Intended Audience......................................................................................i

Prerequisite Skill and Knowledge...............................................................i

What is in This Manual................................................................................i

Related Documentation .............................................................................ii

Conventions................................................................................................ii

Typographical Conventions...................................................................................... ii

Mouse Operation Conventions..................................................................................iii

How to Get in Touch..................................................................................iii

Customer Support ................................................................................................. iv

Documentation Support ......................................................................................... iv

Chapter 1........................................................................................1

Overview ........................................................................................1

ZTE’s Unitrans ZXMP Family ......................................................................1

Introduction to ZXMP S200 .......................................................................2

System Structure........................................................................................3

Structure of Hardware System.................................................................................3

Network Management System.................................................................................5

System Features.........................................................................................7

Chapter 2......................................................................................15

System Hardware.........................................................................15

Outline and Structure.............................................................................. 15

Board Overview....................................................................................... 17

Main Board............................................................................................... 19

SMC Main Board...................................................................................................22

SMB Main Board...................................................................................................37

Front Panel ..........................................................................................................50

DC Power Module (PWA/PWB).............................................................. 54



Functions.............................................................................................................54

Operating Principle................................................................................................54

Front Panel ..........................................................................................................55

AC Power Module (PWC) ........................................................................ 58


Front Panel ..........................................................................................................59

V.35 Data Interface Board (V35B) ......................................................... 60


Front Panel ..........................................................................................................61

E1/T1 Electrical Tributary Board............................................................ 62

Types ..................................................................................................................62

Functions.............................................................................................................63


Front Panel ..........................................................................................................64

E3/T3 Electrical Interface Board (EIE3) ................................................ 65

Functions.............................................................................................................65


Front Panel ..........................................................................................................66

4-Channel Transparent-Transmission Fast Ethernet Electrical InterfaceBoard (TFEx4) ......................................................................................... 67

Functions.............................................................................................................67


Front Panel ..........................................................................................................67

4-Channel Transparent-transmission Fast Ethernet Optical Interface

Board (TFEx4B)....................................................................................... 69

Functions.............................................................................................................69


Front Panel ..........................................................................................................69

Audio Interface Board (AI)..................................................................... 70

Functions.............................................................................................................70


Front Panel ..........................................................................................................72

Orderwire Board (OW)............................................................................ 74

Functions.............................................................................................................74


Front Panel ..........................................................................................................75

Enhanced Smart Ethernet Board (SEC).................................................. 77

Functions.............................................................................................................77




Front Panel ..........................................................................................................78

SHDSL Interface Board (SDB) ................................................................ 80

Functions.............................................................................................................80


Front Panel ..........................................................................................................81

Chapter 3......................................................................................83

Technical Specifications...............................................................83

Dimensions & Weight.............................................................................. 84

Power Supply Requirements .................................................................. 85

Voltage Range......................................................................................................85

Power Consumption and Weight ............................................................................85

Environment Requirements.................................................................... 90

Grounding and Lightning Protection Requirements...................................................90

Temperature/Humidity Requirements.....................................................................94

Cleanness Requirements.......................................................................................94

Application Environment Requirements...................................................................95

Earthquake-Proof Performance.............................................................. 95

Reliability Indexes................................................................................... 96

Electromagnetic Compatibility................................................................ 96

Criterion ..............................................................................................................96

Immunity Performance .........................................................................................97

Disturbance Characteristics....................................................................................99

Eye Pattern of Optical Launched Signals.............................................. 100

Optical Interfaces Specifications.......................................................... 101

Electrical Interfaces Specifications ...................................................... 104

Specification of STM-1 Electrical Interfaces............................................................ 104

Specification of E1 Electrical Interfaces .................................................................104

Specification of T1 Electrical Interfaces .................................................................105

Specification of E3 Electrical Interfaces .................................................................106

Specification of T3 Electrical Interfaces .................................................................107

Clock Timing & Synchronization........................................................... 108

Bit Error Performance........................................................................... 109

Protection Switching Time.................................................................... 109

Compliant Standards of Interfaces....................................................... 109

Chapter 4....................................................................................111

Networking and Configurations.................................................111



Functions as an SDH NE........................................................................ 111

Terminal Multiplexer (TM)....................................................................................111

Add/Drop Multiplexer (ADM)................................................................................112

Regenerator (REG) .............................................................................................112

Networking Modes ................................................................................ 112

Point-to-Point Networking....................................................................................113

Chain Networking...............................................................................................113

Ring Networking.................................................................................................113

Hybrid Networking..............................................................................................115

Networking Application of Ethernet..................................................... 115

Overview...........................................................................................................115

Ethernet Private Line (EPL).................................................................................. 115

Ethernet Virtual Private Line (EVPL) ..................................................................... 116

Ethernet Private LAN (EPLAN).............................................................................. 117

Ethernet Virtual Private LAN (EVPLAN).................................................................. 118

Application Example.............................................................................. 119

Network Description............................................................................................119

Networking Analysis............................................................................................120

Board Configurations...........................................................................................121

Installation Configurations................................................................................... 122

Configurations in the EMS....................................................................................122

Networking Features...........................................................................................122

Appendix A .................................................................................125

Compliant Recommendations and Standards...........................125

Appendix B .................................................................................131

Abbreviations .............................................................................131



About This ProductDescriptions

PurposeThis manual provides the basic information you need for understandingUnitrans ZXMP S200 (V3.00) SDH Based Multi-Service Node Equipment

(ZXMP S200 for short).

Intended AudienceThis document is intended for engineers and technicians who want toknow the system information, hardware information, operating principleand technical specifications of ZXMP S200.

Prerequisite Skill and KnowledgeTo use this document effectively, users should have a generalunderstanding of SDH transmission system technology. Familiarity with

the following is helpful:

ZXMP S200 equipment and its various components

ZXONM E300 Network Element Management System (EMS)

What is in This ManualThis Manual contains the following chapters and appendixes:

T A B L E 1 CH A P T E R A N D A PPENDI X SUM M ARY

Chapter/Appendix Summary

Chapter 1 Overview Introduces the overall structures, features andcompliant standards of ZXMP S200.

Chapter 2 System Describes the hardware structure and mechanical

Confidential and Proprietary Information of ZTE CORPORATION i



ZXMP S200 (V3.00) Product Descriptions

ii Confidential and Proprietary Information of ZTE CORPORATION

Chapter/Appendix Summary

Hardware characteristics of ZXMP S200, including workingprinciples, functions, structures, panels andindicators.

Chapter 3 TechnicalSpecifications

Lists and describes the specifications andparameters of ZXMP S200.

Chapter 4 Networking andConfigurations

Introduces the networking modes, networkapplication of Ethernet, as well as a networkingexample of ZXMP S200.

Appendix A CompliantRecommendations andStandards

Lists all compliant recommendations andstandards used in the design of ZXMP S200.

Appendix B Abbreviations Lists the abbreviations of technical terms you mayencounter in this manual.

Related DocumentationThe following documentation is related to this manual:

Documentation Descriptions

Unitrans ZXMP S200(V3.00) Installation& MaintenanceManual

Introduces the installation steps on site, includinginstallation preparation, hardware installation,cable layout, installation checkup, the process ofpower-on/power-off.

Introduces the main and common operationsduring the routine maintenance, focusing on thecommon alarms and performance information, inaddition, the reasons and handling way of sometypical faults.

Unitrans ZXMP S200(V3.00)Configuration Manual

Based on ZXONM E300, introduce the provisioningmethods, basic configuration of the NE, SDHprotection configuration and the data service

configuration, which are related to ZXMP S200.

ConventionsTypographical ConventionsZTE documents employ with the following typographical conventions.



About This Product Descriptions

T A B L E 2 TY P O G R A P H I C A L C O NVENT I O NS

Typeface Meaning

Italics References to other guides and documents.

“Quotes” Links on screens.

Bold Menus, menu options, function names, input fields,radio button names, check boxes, drop-down lists,dialog box names, window names.

CAPS Keys on the keyboard and buttons on screens andcompany name.

Constant width Text that you type, program code, files and directorynames, and function names.

[ ] Optional parameters

Mandatory parameters

| Select one of the parameters that are delimited by it

Note: Provides additional information about a certaintopic.

Checkpoint: Indicates that a particular step needs tobe checked before proceeding further.

Tip: Indicates a suggestion or hint to make thingseasier or more productive for the reader.

Mouse Operation Conventions

T A B L E 3 MO USE OP E R A T I O N CO NVENT I O NS

Typeface Meaning

Click Refers to clicking the primary mouse button (usuallythe left mouse button) once.

Double-click Refers to quickly clicking the primary mouse button(usually the left mouse button) twice.

Right-click Refers to clicking the secondary mouse button(usually the right mouse button) once.

Drag Refers to pressing and holding a mouse button andmoving the mouse.

How to Get in TouchThe following sections provide information on how to obtain support forthe documentation and the software.

Confidential and Proprietary Information of ZTE CORPORATION iii




iv Confidential and Proprietary Information of ZTE CORPORATION

Customer SupportIf you have problems, questions, comments, or suggestions regardingyour product, contact us by e-mail at [email protected]. You can also

call our customer support center at (86) 755 26771900.

Documentation SupportZTE welcomes your comments and suggestions on the quality andusefulness of this document. For further questions, comments, orsuggestions on the documentation, you can contact us by e-mail [email protected]; or you can fax your comments and suggestions to (86)755 26770801. You can also explore our website athttp://ensupport.zte.com.cn, which contains various interesting subjectslike documentation, knowledge base, forums and service request.









C h a p t e r 1

Overview

In this chapter, you will learn about:

ZTE’s SDH transmission product family–Unitrans ZXMP family,

Structure and system features of ZXMP S200.

ZTE’s Unitrans ZXMP FamilyZTE’s SDH based multi-service node equipment family (Unitrans ZXMPfamily) can support all applications at the core layer, convergence layerand access layer. It provides users with future-oriented and integrated

solutions for metro area network (MAN).

The Unitrans ZXMP family includes various SDH based multi-service nodeequipment, such as ZXMP S390, ZXMP S385, ZXMP S380, ZXMP S330,ZXMP S325, ZXMP S320, ZXMP S310, ZXMP S200, ZXMP S150 and ZXMPS100, as illustrated in Figure 1.

F I G URE 1 ZTE’ S UN I T R A N S ZXM P F A M I L Y

Confidential and Proprietary Information of ZTE CORPORATION 1




Introduction to ZXMP S200ZXMP S200 is a kind of SDH transmission equipment for multi-serviceaccess, supporting the rate up to STM-4. Besides serving as theintegrative transmission equipment in GSM, CDMA or 3G base stations, itcan also access multi-services for customers in buildings or communities

as well as private line services for business customers. Moreover ZXMPS200 can replace existing PDH equipment for transmission.

ZXMP S200, designed as a platform, strictly complies with related ITU-Trecommendations and China national standards. It provides a main boardfor accessing various services. The main board integrates all SDHfunctions (including the transmission of data services) and provides thebus, control and communication interfaces for extension plug-in cards.Multiple plug-in cards, which provide more powerful service accessfunction, are optional. The main board and plug-in cards support the

remote online upgrade of card software, including software programs andFPGA programs.

Currently, ZXMP S200 can be configured with SMB main board or SMCmain board. It can provide STM-1/STM-4 optical interfaces, STM-1electrical interface, E3/T3 electrical interfaces, E1/T1 electrical interfaces,and FE (Fast Ethernet) optical/electrical interfaces, SHDSL interfaces, V.35data interface, RS232/RS485/RS422 interfaces, orderwire telephoneinterfaces and audio interfaces.

Figure 2 shows the front view of ZXMP S200.

F I G URE 2 FRO NT V I EW O F ZXM P S200

ZXMP S200 can be used as a network element, such as terminalmultiplexer (TM), regenerator (REG) or add/drop multiplexer (ADM), insimple networking applications.

Note: The SMB and SMC have the same design principle. The differencesbetween them are the types and quantities of interfaces. Refer to Main Board .

ZXMP S200 has good network adaptive capability. It can be managed byUnitrans ZXONM E300 Unified EMS/SNMS of Optical Network (ZXONME300 for short) developed by ZTE CORPORATION. The networkmanagement information can be transmitted via E1 tributaries. ZXMPS200 can also work without the network management system.

ZXMP S200 is a compact equipment with high integration. It has high

reliability and high cost to performance ratio. It can be applied to various

2 Confidential and Proprietary Information of ZTE CORPORATION



Chapter 1 Overview

situations and be configured flexibly. ZXMP S200 can be configured asvarious network element, such as terminal multiplexer (TM), regenerator(REG) or add/drop multiplexer (ADM).

ZXMP S200 can be powered by any of below power supply ways: AC110/220 V, DC -48 V and DC +24 V.

ZXMP S200 supports various installation modes, that is, it can be installedon the desktop, hung on the wall, inside an indoor cabinet, antransmission outdoor cabinet (including outdoor functional cabinet andfield power supply cabinet).

System StructureFigure 3 shows the structure of ZXMP S200.

F I G URE 3 ST RUCT URE O F ZXM P S200

ZXMP S2

ZXONME300

C onf i g ur a t i onm an a g em en t

F a ul t m an a g em en t

P er f or m an c em an a g em en t

S e c ur i t y m an a g em en t

S y s t emm an a g em en t

Network Element Management System

M ai n t en an c em an a g em en t

NE c on t r ol pr o c e s s i n g uni t

S er v i c e uni t

C r o s s - c onn e c t uni t

Hardware System

Ov er h e a d uni t

C l o c k uni t

Or d er wi r e Uni t

P ow er uni t

SDHEquipment

(TM,ADM,REG)

Mi c r o C on t r ol Uni t

ZXMP S200 consists of the hardware system and the networkmanagement software system, which are independent of each other whileworking in a coordinated way.

The hardware system is the principal part of ZXMP S200, and it can workindependently without the network element management system.

Structure of Hardware SystemThe ZXMP S200 hardware system is composed of eight functional units.

Figure 4 illustrates the relationship among these units in the block diagram.





F I G URE 4 RE L A T I O N S H I P S B ET WEEN F U N C T I O N A L UNI T S I N ZXMP S200

The functions of each unit are described as follows.

1. NE control processing unit (NCP)

As the control management core of ZXMP S200, the NCP unit can:

Process ECC data,

Manage alarms, performances and configurations,

Provide interfaces for connections between equipment and EMS.

2. Micro control unit (MCU)

As the service management core of ZXMP S200, the MCU implementsthe initialization, configuration, alarm and performance monitoring ofthe service chips on the main board.

3. Service unit

This unit implements the accessing of SDH, PDH and Ethernet services,which are translated into special format, and then sent to the cross-connect unit for service convergence and distribution.

4. Cross-connect unit

Based on configuration information from the EMS and alarms in each

optical direction, cross-connect unit can:

Cross connect traffic from different optical directions,

Cross overheads,

Perform path protection switching,

Perform APS bridging/switching.

5. Overhead processing unit

This unit provides user with transparent data channel by means of theoverhead bytes in Section Over Head (SOH).

6. Orderwire unit




Chapter 1 Overview

This unit implements the orderwire and low-rate data transmission.Audio interfaces are also provided by this unit.

7. Clock unit

This unit provides each functional unit in the equipment with thestandard system clock, to achieve the entire network synchronization

based on the configuration in the EMS. In addition, the clock unitprovides external clock input/output interfaces.

8. Power unit

Working as an independent unit, the power unit provides steady power

supply to all the other functional units in the system.

Network Management SystemZXONM E300 with the version V3.18R2 or above can manage and monitorthe ZXMP S200 (V3.00) hardware system and the transmission network,

thus coordinate the operation of the transmission network.

ZXONM E300 is designed with a four-layer structure, consisting of theequipment layer, NE layer, NE management layer and the subnetmanagement layer. It also provides Corba interface for the networkmanagement layer. Figure 5 illustrates the hierarchical structure ofZXONM E300.

F I G URE 5 H I E R A R C H I C A L ST RUCT URE O F ZXONM E300

GUI(Cient)

EMS/SNMS

Manager 2

EMS/SNMS

Manager n

GNE/Agent

NE/AgentNE/Agent

NE/Agent

ECC

ECCECC

ECC

ECC

SS

NE/Agent GNE/Agent

S S

FF

LCT

f

Qx

Network

ManagementLayer

Element

ManagementLayer

NE Layer

EquipmentLayer

Qx

Corba

SubnetManagementLayer

SNMS

Manager 3

GUI(Cient)

F

NMS

F

Corba

EMS/SNMS

Manager 1

GNE/Agent

NE/AgentNE/Agent

NE/Agent

MCU MCU

ECC

ECCECC

ECC

SS

F

Qx

GUI(Cient)

F

F

MCU MCU MCUMCU

NMS

……

…… …………

GUI(Cient) GUI(Cient)





Four-Layer Structure of NMSThe four-layer structure of the network management system is describedas follows.

Equipment layer (MCU)

It monitors alarms and performances of boards, receives instructionsfrom the network management system and controls the specificoperation of the boards.

Network element layer (Agent)

As the Agent in the network management system, it performs themanagement function for the individual NE.

The agent initializes each board when the NE is powered on firstly.Normally, it monitors alarm and performance status of the NE. Inaddition, it receives and processes monitoring commands from the

element management layer (Manager) through the gateway networkelement (GNE).

Element management layer (Manager)

It controls and coordinates the operation of multiple NEs. This layerincludes Manager, Graphical User Interface (GUI) and Local Craft

Terminal (LCT).

Manager: core of the element management layer, also called asServer. It can manage multiple subnets simultaneously, controllingand coordinating the NE equipment.

GUI: graphical user interfaces. It converts user’s management

requests into commands in the internal format, and then forwardsthem to the Manager.

LCT: it is a simple combination of GUI and Manager by controllingthe user authority and software functional parts. The LCT provides

the reduced NE management function. It is usually used forcommissioning or maintenance of local NEs.

Subnet management layer

The structure of the subnet management layer is similar to that of the

NE management layer. The configuration and maintenance for NEs areperformed through the element management system (EMS) indirectly.

SubNet Management System (SNMS) sends a command to the EMS,and then the EMS forwards it to the NE. Finally the NE responds to the

SNMS through the EMS. The SNMS can provide the networkmanagement layer with the Corba interface to transmit subnetmonitoring command and operation information.

Interfaces in NMSTable 4 lists the interfaces in a network management system and thecorresponding descriptions.




Chapter 1 Overview

T A B L E 4 IN T E R F A C E S I N A N E T W O R K M A NA GE M EN T SYST EM

Interface Description

Qx interface

It is the interface between Agent and Manager, as shown inFigure 5, that is, the interface between the NCP and the

computer with the Manager program.

The Qx interface complies with the TCP/IP protocol.

F interface

It is the interface between GUI and Manager, or between theManager on the subnet management layer and the Manager onthe NE management layer, as shown in Figure 5.

The F interface complies with the TCP/IP protocol.

f interface

It is the interface between Agent and LCT, as shown in Figure 5,that is, the interface between the NCP and the local craftterminal. There is network management software on the LCT.

The f interface complies with the TCP/IP protocol.

S interface

It is the interface between Agent and MCU, as shown in Figure

5, that is, the communication interface between the NCP andother boards.

The S interface adopts the point-to-multipoint communicationmode based on the High level Data Link Control (HDLC)communication mechanism.

ECCinterface

It is the interface between Agents, as shown in Figure 5, that is,the communication interface between NEs.

The ECC interface adopts Data Communication Channel (DCC)

for communication, be capable of supporting both thecustomized communication protocol and the standard protocol.It implements the network bridge function Agents.

You can get more information about the network management system inthe related manuals of ZXONM E300.

System Features Small Size and Compact Structure

ZXMP S200 has small size and high integration. Equipped with variousmounting flanges, ZXMP S200 can be installed on the desktop, hung on

the wall, or in an IEC, ETS standard 19-inch cabinet and transmissionoutdoor cabinet (including outdoor functional cabinet and field power

supply cabinet). It needs less space for accommodation.

All interfaces are located at the front, by which, operation andmaintenance of the equipment is very convenient.

Abundant Service Functions

ZXMP S200 can access multi-services, including traditional SDH

services and data services. Table 5 lists the cross-connect capacity ofZXMP S200.





T A B L E 5 CRO SS - CO NNECT C A P A C I T Y OF ZXM P S200

Main BoardHigher-order Cross-connect Capacity

Lower-order Cross-connect Capacity

SMB 32 × 32 VC4 1008 × 1008 VC12

SMC 64 × 64 VC4 2037 × 2037 VC12

Table 6 and Table 7 respectively list the service interfaces andcorresponding maximum access capacities provided by ZXMP S200

with SMB or SMC main board.

T A B L E 6 SERVI CE I NT ERF ACES PR O V I D ED B Y ZXMP S200 (SM B)

InterfaceMax. Capacity

(Channel)Remark

SDH opticalinterface

4

ZXMP S200 supports 4 channels of

STM-1 and 2 channels of STM-4 opticalinterfaces at most.

Thus, the allowable SDH interfacecombinations are as follows:

4 × STM-1 or

2 × STM-1 + 2 × STM-4 or

3 × STM-1 + 1 × STM-4

E1/T1

electrical interface42 -

E3/T3

electrical interface3 E3 or T3 rate is supported via theEMS.

FE interface8

FE interface include FE electricalinterface and FE optical interface. Theallowable combinations of 8 channelsof FE interfaces are as follows:

4 × FE (electrical) + 4 × FE (optical)or

8 × FE (electrical)

The main board provides 4 channels ofFE interfaces, and the SEC boardprovides another 4 channels of FE

electrical interfaces, which supports L2switch.

V.35 datainterface

(N × 64 kbit/s)

2 N is an integer from 1 to 31

Audio interface 6Set the interface type is two-line orfour-line via EMS, or set the output

electrical level gain.




Chapter 1 Overview


InterfaceMax. Capacity(Channel)

Remark

Data interface 6 or 3

The ZXMP S200 supports

6 RS232 interfaces or

6 RS485 interfaces or

3 RS422 interfaces.

The interface type can be set via theEMS.

Orderwiretelephoneinterface

1 -

TRK interface 1 -

SHDSL interface 4 -

Note:

Optical interfaces adopt Small form Factor Pluggable (SFP) modules,supporting interface diagnosis function.

ZXMP S200 provides an extension slot. If the maximum capacity of one type ofinterface is reached by using the extension slot, the other types of interfaces thatneed to use the extension slot cannot reach the maximum capacity listed in Table6.

T A B L E 7 SERVI CE I NT ERF ACES PR O V I D ED B Y ZXMP S200 (SM C)


Remark

SDH opticalinterface

4Each of the optical interfaces canbe set to access the STM-4 orSTM-1 signal.

STM-1 electricalinterface

4 -

E1/T1electrical interface

42

The main board provides 21 x

E1/T1, besides, the plug-in boardET1 can provide another 21 xE1/T1.

FE interface 8

FE interface include FE electricalinterface and FE optical interface.The allowable combinations of 8channels of FE interfaces are asfollows:

4 × FE (electrical) + 4 × FE(optical) or

8 × FE (electrical)

The main board provides 4 channels of

FE interfaces, and the SEC board






Remark

provides another 4 channels of FEelectrical interfaces, which supports L2switch.

V.35 data interface

(N × 64 kbit/s)2 N is an integer from 1 to 31.

Audio interface 6Set the interface type is two-line orfour-line via EMS, or set the outputelectrical level gain.

Data interface 6 or 3

ZXMP S200 can provide:

6 RS232 interfaces or,

6 RS485 interfaces or,

3 RS422 interfaces.

The interface type can be set onthe EMS.

Orderwiretelephone interface

1 -

TRK interface 1 -

SHDSL interface 4 -

Note:

Optical interfaces and STM-1 electrical interfaces adopt Small form FactorPluggable (SFP) modules, supporting interface diagnosis function.

ZXMP S200 provides an extension slot. If the maximum capacity of one type of

interface is reached by using the extension slot, the other types of interfaces thatneed to use the extension slot cannot reach the maximum capacity listed in Table7.

ZXMP S200 supports E1/T1 and E3/T3 mapping and multiplexingstructure specified by ITU-T recommendations, as illustrated in Figure6.



Chapter 1 Overview

F I G URE 6 M A P PI NG /MU L T I P L E X I N G ST RUCT URE O F ZXMP S200

In addition, with the SMC board, SDH optical interfaces of ZXMP S200also support the application of single fiber bi-directional transmission ofSTM-1/4 optical signal, which is a fiber-saving solution to transport the

receiving signal and transmitting signal in a same fiber.

ZXMP S200 can act as a terminal multiplexer (TM), add/dropmultiplexer (ADM) or a regenerator (REG) depending on the actualnetworking requirements. It supports point-to-point, chain and ringnetworking modes.

Perfect Network-Level Protection

At the Multiplex Section (MS) layer, ZXMP S200 supports the

following MS protection modes:

T A B L E 8 MS PRO T ECT I O N MO DES SU P P O R TE D B Y ZXM P S200

Networkingmode

Rate Protection mode Remark

MS ring STM-4 Two-fiberbidirectional MSshared protectionring

Revertive protectionwithout extra trafficand the fault blockedfunction

Four-fiberbidirectional link MS1+1 protection

Revertive or non-revertive protection

Four-fiberbidirectional link MS

1:1 protection

Revertive protectionwith the extra traffic

Four-fiberunidirectional linkMS 1+1 protection

-

MS link STM-1/STM-4

Four-fiberunidirectional linkMS 1:1 protection

It is divided into twomodes further: withextra traffic andwithout extra traffic

At the path layer, ZXMP S200 supports the Sub-Network

Connection (SNC) protection modes, such as SNC (I) protection at





the level of VC12/VC3 and SNC (N) and SNC (I) protection at thelevel of VC4.

The SNC protection complies with ITU-T G.841 and G.842recommendations. Table 9 lists the alarms that will trigger the SNC

protection switching.

T A B L E 9 A L A R M S T RI G G ERI NG S NC PRO T ECT I O N SWI T CHI NG

Protection Mode Alarms Triggering Protection Switching

SNC (I) at VC12/VC3 level TU AIS, TU LOP

SNC (I) at VC4 level AU AIS, AU LOP

SNC (N) at VC4 level AU AIS, AU LOP, HP TIM, HP UNEQ, HP SD

Note: Currently, ZXMP S200 doesn’t support SNC (N) at the level ofVC12/VC3.

Powerful Overhead Configuration Capability

The service unit of ZXMP S200 separates the SOH and payloads in SDHframes, combines the overhead bytes into standard overhead bus andthen forwards them to the overhead unit.

The overhead bus not only includes the management, orderwire andswitching bytes complying with ITU-T recommendations, but also loadsorderwire and data services into idle overhead bytes.

The overhead unit of ZXMP S200 performs the overhead processing

function. It implements the cross-connection and dispatch ofoverheads. The minimum cross-connect granularity is byte. Theoverhead unit can cross-connect overheads to any port according tothe configuration in the EMS.

Multiple Power Supply Input Modes

The ZXMP S200 equipment adopts concentrated power supply mode. Itcan be powered by multiple kinds of power supplies, including AC 110V/220 V, DC -48 V and DC +24 V.

When DC power supply is used, ZXMP S200 supports the dual-inputmode, that is, dual paths of DC power supply are input to theequipment for protection. Accordingly, the EMS indicates the input

status (normal or alarm) of each path of the two power supply inputs. Various Alarm Modes

ZXMP S200 supports the alarms in visible and audible modes:

Indicators on the main board use different colors to indicate critical,

major and minor alarms. Indicators on plug-in cards are used toindicate whether the cards report an alarm.

The buzzer provided by the equipment presents alarm sound when

an alarm occurs. User can enable or disable the audible alarmfunction via the ring trip button (identified with “B.OFF”) on themain board.




Chapter 1 Overview

In addition, ZXMP S200 provides one alarm input interface and onealarm output interface, to support four alarm inputs (on-off signalinputs) and two alarm outputs (on-off signal outputs).

SSM-based Timing Synchronization Processing

ZXMP S200 has multiple synchronous timing sources, including internal

timing source, timing signal extracted from line/tributary and externaltiming source. It supports one external timing source (2 MHz or 2

Mbit/s), all of the extracted clocks from optical interfaces and STM-1electrical interface (i.e. four line extracted clocks) and two tributaryclocks extracted from tributary 1 and 2.

ZXMP S200 supports the processing of the synchronization status byteS1. It also identifies timing quality with synchronization status

message (SSM). By this way, NEs can select the synchronous path withthe highest quality level, to ensure the network synchronizationperformance and avoid possible timing loop caused by timing reference

switching. Powerful and Easy-to-Use Network Management System

ZXMP S200 (V3.00) can be managed by ZXONM E300 with the versionof V3.18R2 or above, which can manage all optical transmissionequipment of ZTE CORPORATION and support their hybrid networking.

ZXONM E300 has the element management layer functions and somenetwork management layer functions. It performs fault (maintenance)management, performance management, configuration management,security management and system management functions.

ZXONM 300 provides a graphical user interface (GUI) for easyoperation.

Good Network Adaptability

Provides network management channels suitable for hybridnetworking

Different SDH equipment manufacturers define the DCC (datacommunication channel) bytes and process them in different ways.Due to this, network management information interconnection may

be impossible in a hybrid network consisting of equipment providedby different manufacturers.

ZXMP S200 adopts DCC bytes as embedded control channel (ECC)for transmitting network management information. In addition,

timeslots of E1 tributaries can also be used as ECC.

In this way, the network management information is added in theSDH payload, and then transmitted transparently through otherSDH equipment. Thus the integrated network management inhybrid network is implemented.

Supports normal operation without EMS

ZXMP S200 can operate normally without the management of theZXONM E300.

Online Download and Upgrade of Board Software






The main board and plug-in cards of ZXMP S200 support remote onlinedownload and upgrade of board software, including application andlogic programs.

Not interrupted traffic during the download of application programs

makes the maintenance and upgrade of the equipment moreconvenient and guarantees the reliability during system upgrade. Onlydownloading logic programs may cause transient interruption of traffic.



C h a p t e r 2

System Hardware


Hardware structure and mechanical characteristics of ZXMP S200,

Operating principles, functions, structures, interfaces and indicators of

the boards in ZXMP S200.

Outline and StructureZXMP S200 can be flexibly configured according to the power board andservice interface type to meet different requirements of users. The outlineand structure of ZXMP S200 with different configurations are similar

except the power input mode, the type and quantity of service interfaces.

ZXMP S200 consists of the chassis, main board, plug-in cards (configured

as needed), power module, fan module and the dustproof module.

For example, Figure 7 shows the ZXMP S200 equipment configured with 4

optical interfaces, 21 E1 electrical interfaces and a power module foraccessing DC -48 V power supply.

F I G URE 7 OU T L I N E A N D ST RUCT URE O F ZXM P S200

1. Fan module 2. Power module

3. Dummy panel 4. Main board

5. Dustproof module 6. Chassis





Fan module

In order to meet the different installation conditions, ZXMP S200supports middle-speed and high-speed fan module. The middle-speedfan module is applied to the indoor environment under the

temperature between -5 and 45 degrees, meanwhile it has low noise.On the other side, the high-speed fan module is applied to theenvironment under the temperature between -5 and 50 degrees.

The middle-speed and high-speed fan modules have the same outline,structure and size. They both contain three plastic fans to guaranteeheat dissipation of the chassis.

Figure 8 shows the structure of the fan module.

F I G URE 8 S T RUCT URE O F T HE F A N MO D U L E

Fan

Power module

The power module consists of the power board and enclosure. Itprovides power to all units in the ZXMP S200 equipment.

Figure 9 illustrates the structure of power module with a power board(PWA).

The descriptions of PWA and PWB refer to DC Power Module(PWA/PWB), and the descriptions of PWC in details refer to AC PowerModule (PWC).




Chapter 2 System Hardware

F I G URE 9 ST RUCT URE O F T HE PO WER MO D U L E ( P W A )

1. Knob 2. Handle

3. Power indicator (A path) 4. Power indicator (B path)

5. DC power socket (A path) 6. DC power socket (B path)7. Power switch 8. Running and alarm indicator

9. Enclosure

Dustproof module

As shown in Figure 7, the dustproof module keeps the inner of theequipment clean, and prevents dust accumulation, which may affectthe equipment performance. It is composed of a dustproof cover and

an air filter. The air filter is pluggable for periodical cleaning.

Board OverviewZXMP S200 provides various main boards and plug-in cards for choice, aslisted in Table 10.

T A B L E 10 B O A R D L I ST O F ZXMP S200

No. Board Code Description

1 SMCxD75ESystem Main Center of Dual optical interfaces and Eight75 Ω E1 interfaces

2 SMCxD75TSystem Main Center with Dual optical interface and

Twenty-one 75 Ω E1 interfaces

3 SMCxF75ESystem Main Center with Four optical interfaces andEight 75 Ω E1 interface

4 SMCxF75TSystem Main Center with Four optical interfaces andTwenty-one 75 Ω E1 interfaces

5 SMCxD120ESystem Main Center with Dual optical interfaces andEight 120 Ω E1 interfaces

6 SMCxD120TSystem Main Center with Dual optical interfaces andTwenty-one 120 Ω E1 interfaces

7 SMCxF120ESystem Main Center with Four optical interfaces andEight 120 Ω E1 interfaces







8 SMCxF120TSystem Main Center with Four optical interfaces andTwenty-one 120 Ω E1 interfaces

9 SMCxD100ESystem Main Center with Dual optical interfaces andeight 100 Ω T1 interfaces

10 SMCxD100TSystem Main Center with Dual optical interfaces andTwenty-One 100 Ω T1 interfaces

11 SMCxF100ESystem Main Center with Four optical interfaces andeight 100 Ω T1 interfaces

12 SMCxF100TSystem Main Center with Four optical interfaces andTwenty-One 100 Ω T1 interfaces

13 SMBxD75E0System Main Board with Dual optical interfaces andEight 75 Ω E1 interfaces

14 SMBxD75T0System Main Board with Dual optical interface and

Twenty-one 75 Ω E1 interfaces

15 SMBxF75E0System Main Board with Four optical interfaces andEight 75 Ω E1 interface

16 SMBxF75T0System Main Board with Four optical interfaces andTwenty-one 75 Ω E1 interfaces

17 SMBxD120E0System Main Board with Dual optical interfaces andEight 120 Ω E1 interfaces

18 SMBxD120T0System Main Board with Dual optical interfaces andTwenty-one 120 Ω E1 interfaces

19 SMBxF120E0System Main Board with Four optical interfaces andEight 120 Ω E1 interfaces

20 SMBxF120T0System Main Board with Four optical interfaces andTwenty-one 120 Ω E1 interfaces

21 SMBxD100E0System Main Board with Dual optical interfaces andeight 100 Ω T1 interfaces

22 SMBxD100F0System Main Board with Dual optical interfaces andTwenty-One 100 Ω T1 interfaces

23 SMBxF100E0System Main Board with Four optical interfaces andeight 100 Ω T1 interfaces

24 SMBxF100F0System Main Board with Four optical interfaces andTwenty-One 100 Ω T1 interfaces

25 PWA Power Board A, -48 V DC power module

26 PWB Power Board B, +24 V DC power module

27 PWC Power Board C, 110 V/220 V AC power module

28 IBB 2 Mbit/s BITS interface board

29 IBBZ 2 MHz BITS interface board

30 ET1-75 21-channel E1 Electrical Tributary board (75 ohm)






31 ET1-120 21-channel E1 Electrical Tributary board (120 ohm)

32 TT1-100 21-channel T1 Electrical Tributary board (100 ohm)

33 EIE3 Electrical interface board of E3/T3

34 V35B 2-channel V.35 data interface Board

35 TFEx44-channel Transparent-transmission Fast Ethernetelectrical interface board

36 TFEx4B4-channel Transparent-transmission Fast Ethernetoptical interface board

37 AI Audio Interface board

38 OW Order Wire interface board

39 SDB 4xSDB interface board

40 SEC 4xFE Enhanced Smart Ethernet board

41 MB Mother board

42 FAN Fan board

Main BoardThe main board of ZXMP S200 integrates the functions of NCP, aggregate,tributary, cross-connect, clock, and Ethernet service processing. In

addition, it supports the temperature detection function. Set the upper andlower temperature thresholds on the EMS, once the temperature is overthreshold, the board will report an alarm.

ZXMP S200 supports two different main board types: SMB and SMC. Theyhave the same design and differ in interface types and interface quantities.

Table 11 and Table 12 list various SMC boards and SMB boards.

T A B L E 11 L I ST O F SMC M A I N B O A R D S

Available Interfaces

No.BoardCode Optical

InterfaceElectricalInterface

Other Interface

1SMCxD75E

2 opticalinterfaces

Eight 75 Ω non-balanced E1electrical interfaces

Each type of SMC mainboard can provide:








Other Interface

2 SMCxD75T

2 opticalinterfaces

Twenty-one 75 Ω non-balanced E1electrical interfaces

3SMCxF75E

4 opticalinterfaces

Eight 75 Ω non-balanced E1electrical interfaces

4SMCxF75T

4 opticalinterfaces


5SMCxD120E

2 opticalinterfaces

Eight 120 Ω balanced E1electrical interfaces

6SMCxD120T

2 opticalinterfaces

Twenty-one 120 Ω balanced E1electrical interfaces

7SMCxF120E

4 opticalinterfaces

Eight 120 Ω balanced E1electrical interfaces

8SMCxF120T

4 opticalinterfaces

Twenty-one 120 Ω balanced E1electrical interfaces

9SMCxD100T

2 opticalinterfaces

Twenty-one 100 Ω balanced T1electrical interfaces

10SMCxD1

00E

2 optical

interfaces

Eight 100 Ω balanced T1electrical interfaces

11SMCxF100T

4 opticalinterfaces

Twenty-one 100 Ω balanced T1electrical interfaces

12SMCxF100E

4 opticalinterfaces

Eight 100 Ω balanced T1electrical interfaces

One 75 Ω BITS

interface, One alarm output

interface,

One RS232interface/120 Ω BITS interface,

One LCT interface,

One networkmanagementinterface,

One alarm input

interface, Four fast Ethernet

electricalinterfaces.

Note:

ZXMP S200 can support the STM-1 electrical service by being configured withthe SFP electrical interface module on the SMC board.

For the main board providing two optical interfaces, each of the opticalinterfaces supports traffic at the rate of either STM-1 or STM-4. On the board panel,they are identified as “5” and “6”.




T A B L E 12 L I ST O F SMB B O A R D S




Other Interface

1SMBxD75E0

Two opticalinterfaces

Eight 75 Ω non-balanced E1electricalinterfaces

2SMBxD75T0



3SMBxF75E0

Four opticalinterfaces

Eight 75 Ω non-balanced E1electricalinterfaces

4SMBxF75T0


Twenty-one 75 Ω non-balanced E1

electricalinterfaces

5SMBxD120E0


Eight 120 Ω balanced E1electricalinterfaces

6SMBxD120T0


Twenty-one 120Ω balanced E1electricalinterfaces

7SMBxF120E0


Eight 120 Ω balanced E1electricalinterfaces

8SMBxF12

0T0

Four optical

interfaces

Twenty-one 120Ω balanced E1electricalinterfaces

9SMBxD100F0


Twenty-one 100Ω balanced T1electricalinterfaces

10SMBxD100E0


Eight 100 Ω balanced T1electricalinterfaces

11SMBxF100F0


Twenty-one 100Ω balanced T1electricalinterfaces

12SMBxF10

0E0

Four optical

interfaces

Eight 100 Ω balanced T1electricalinterfaces

Each type of SMBmain board canprovide:

One 75 Ω BITSinterface

One alarm outputinterface

One RS232interface/120 Ω

BITS interface One LCT interface

One networkmanagementinterface

One alarm inputinterface

Four fast Ethernetelectricalinterfaces





Note: For the main board providing two optical interfaces, each of theoptical interfaces supports traffic at the rate of either STM-1 or STM-4. On theboard panel, they are identified as “5” and “6”.

Table 13 lists the differences between SMB board and SMC board.

T A B L E 13 D I F F ERENCES BET WEEN SMB B O A R D A N D SMC B O A R D

Main Board TypeFunction.

SMC SMB

Cross-connectcapacity

Higher-order cross-connect:

64×64 VC4

Lower-order cross-connect:2037×2037 VC12

Higher-order cross-connect:

32×32 VC4

Lower-order cross-connect:1008×1008 VC12

Opticalinterface unit

Accesses four channels ofSTM-1/STM-4 optical signals

Accesses two channels of STM-1 optical signals and two STM-1/STM-4 optical signals

STM-1electricalinterface unit

Accesses four channels of

STM-1 electrical signalsDoes not support STM-1electrical interface

Switchingmode

Supports SNC-I+SD and SNC-N switching at both higher-order (VC4) path and lower-order (VC12) path

Supports SNC-N and SNC-Iswitching at higher-order(VC4) path, and SNC-Iswitching at lower-order

(VC12) pathE3/T3 serviceconfiguration

Does not support EIE3 boardwhich accesses E3/T3 service

Supports EIE3 board whichaccesses E3/T3 service

EOS serviceconfiguration

Supports configuration of 12TUG3

Supports configuration of 12TUG3

PRBS self-testfunction

Supports PRBS self-test function Does not support PRBS self-testfunction

LCTmanagementinterface

Ethernet interface RS232 interface

SMC Main Board

Operating PrincipleFigure 10 illustrates the operating principle of SMC board.





F I G URE 10 OP E R A T I N G PRI NCI PL E O F SMC B O A R D

In Figure 10, SMC board of ZXMP S200 consists of the following functional

units.

NE control processor (NCP)

Optical interface unit

STM-1 electrical unit

Tributary unit

Ethernet interface unit

Cross-connect unit

Overhead unit

ECC-2M unit

HDLC unit

Clock unit

Micro control unit (MCU)

NCP UnitFunctions The NCP unit is the control core of the main board, and it can:

Provide Qx interface, through which the EMS implements theconfiguration and management of the NE,

Provide ECC to implement the communication between the NEs,

Issue the configuration commands to the optical interface unit,

tributary unit and Ethernet interface unit, meanwhile collect theirperformances and alarms information,





Monitor the power module and fan module intelligently and detectalarms reported by the fan board and power module, such as boardon-position information, DC power indication, power module type and

power module failure information,

Support online download and upgrade of board software,

Provide four external alarm input interfaces (on-off signal inputs),

Provide alarm output interfaces to column-head cabinet (on-off signaloutputs),

Provide real-time clock, which can be ensured even the power is down

due to its built-in battery,

Provide a buzzer and ring trip for audible alarm function.

Operating

Principle

Figure 11 illustrates the operating principle of the NCP in the block

diagram. And Table 14 lists the modules in the diagram.

F I G URE 11 OP E R A T I N G PRI NCI PL E O F T HE NCP UNI T

T A B L E 14 F UNCT I O NS O F MO DUL ES I N T HE NCP

Module Function

Real-Time Clock

Used to ensure the accurate time when alarms occur ordisappear during the monitoring of NE.

This module will be powered by the spare rechargeablebattery once the power is down, so as to guarantee thecorrect timing of the clock.






Module Function

Qx/f Interface

Qx is the interface between NE and Subnet ManagementControl Center (SMCC), through which the main boardcan report performances and alarms of the NE or the

subnet to the SMCC. In addition, the main boardexecutes the commands and configurations from theSMCC.

f interface is the communication interface between theNE and a portable computer.

ECC/S InterfaceAs the monitoring center, this module provides embeddedcontrol channel and communication interface between theNCP and other functional units.

Control &

Processing

Implements the initialization and startup of board software,

and cooperates with other functional modules.

Board-in-PositionDetection

Detects whether the board is in position, that is, whetherthe board is inserted into the slot.

External AlarmInput

Monitors external alarms.

NE Alarm Output Outputs the alarms of the NE.

Board ResetControl

Resets all boards in the NE (hard reset).

Fan/PowerDistribution Unit

Monitoring

Monitors the fan module and power module of the NE

intelligently.

Optical Interface UnitThe optical interface unit has the following functions.

Provide up to four STM-1/STM-4 compatible optical interfaces.

The optical interfaces marked as 5 and 6 on the panel can accessthe signal at either STM-1 or STM-4 rate.

The optical interfaces marked as 4-1 and 4-2 on the panel only canaccess the signal at the same rate level.

STM-4 optical interface can access up to 4 channels of STM-4 signal.

Adopt LC/PC fiber optic connectors and SFP lasers, supporting thedetection of optical received power, optical transmitted power, lasertemperature and transmit laser bias current. In addition, SFP lasers

support the detection of on-position status, LOS (loss of signal) alarmand ALS (automatic laser shutdown) function.

Support SOH extraction and insertion functions, and process 28 sectionoverheads according to the system specifications. Table 15 lists theoverhead bytes processed by the optical interface unit.

Functions




T A B L E 15 OV E R H E A D S PR O C E S S E D B Y OP T I C A L IN T E R F A C E U NI T

Overhead Type Number Overhead Byte

Standard byte 20 J0, D1-D12, E1, E2, F1, K1, K2, S1, M1

User-defined

byte8

R2C6, R3C6, R3C8, R3C9, R5C5, R5C6,

R2C8 and R2C9 [Note]

Note: “R” represents the row and “C” represents the column of the STM-1frame. For example, R2C6 means the byte lies at the 2nd row and the 6th column in the STM frame.

Support the transparent transportation of overheads except the byte

M1.

Support the function of DCC extraction and insertion.

The extraction mode of each DCC can be configured as DCCr (D1-D3),

DCCm (D4-D12), DCCr+m (D1-D12) or disabled according to the EMScommand. The DCC extraction mode of optical receiving interfaces andoptical transmitting interfaces can be configured independently.

Implement the transfer from DCC to ECC in a hardware way, thus

breaking through CPU resource limitation, avoiding ECC block andfinally improving the stability of ECC in optical transmission network.

Read signal degrade (SD) and signal failure (SF) alarms via boardsoftware after the alarm led-out by the hardware connection lines,which ensures protection switching implemented in the specified time.

Provide clock to the clock unit as the reference clock for phase locking.

Support channel-level loopback.

Optical interfaces support line side AU loopback and terminal side AUloopback.

Support VC-4-4C concatenation of STM-4 optical interfaces.

Support the insertion and detection of pseudo-random binary sequenceof each AU-4 channel.

Figure 12 illustrates the operating principle of the optical interface unit inthe block diagram. And Table 16 lists the functional modules in thediagram.

OperatingPrinciple





F I G URE 12 OP E R A T I N G PRI NCI PL E O F T HE OP T I C A L I NT ERF ACE UNI T

T A B L E 16 F UNCT I O NS O F MO DUL ES I N T HE OP T I C A L I N T E R F A C E UNI T

Module Function

Optical

Interface

It converts STM-1/STM-4 optical signals to thecorresponding electrical signals, and checks the inputoptical signals.

The key component of it is an integrated opticalreceiving/transmitting module with general auto gain

control function. Three types of STM-1 optical modules are available: S-

1.1, L-1.1 and L-1.2.

Three types of STM-4 optical modules are available: S-4.1, L-4.1 and L-4.2.

Clock Recovery&

DataRegeneration

It extracts the line clock from the received data stream, andregenerates the received data according to this clock.

SOH Processing

At the receiving end, it locks the frame alignment bytein the received data to achieve frame synchronization,

and then extracts the section overheads afterunscrambling the data.

At the transmitting end, it inserts section overheads intothe launched data which will be framed after scrambled.

POH Processing

At the receiving end, it processes the AU-4 pointer,separates the path overheads and payloads.

At the transmitting end, it justifies the AU-4 pointer and

inserts path overheads into the payloads.

Controlling &Processing

It monitors the working status and mode of the opticalinterface unit, and performs part functions of overheadprocessing. In addition, it implements switching and statisticof performance.






Module Function

CommunicationInterface

It implements the communication between the opticalinterface unit and the NCP.

Alarm DetectingIt outputs the alarm/status signals of the optical interfaceunit, detects and responds to alarms/status of other units,and provides reasons for switching control.

STM-1 Electrical UnitThe STM-1 electrical unit has the following functions:

Provide 4 channels STM-1 electrical interfaces, adopting SFPtransmitting/receiving module and supporting alarm detection.

Support SOH extraction and insertion functions, and process 28 sectionoverheads according to the system specifications. Table 17 lists theoverhead bytes processed by the STM-1 electrical interface unit.

T A B L E 17 OV E R H E A D S PR O C E S S E D B Y STM -1 EL E C T R I C A L I NT ERF ACE UNI T



User-definedbyte

8R2C6, R3C6, R3C8, R3C9, R5C5, R5C6,R2C8 and R2C9 [Note]

Note: “R” represents the row and “C” represents the column of the STM-1frame. For example, R2C6 means the byte lies at the 2nd row and the 6th column in the STM frame.

Support the transparent transportation of overheads except the byteM1.

Support the function of DCC extraction and insertion.

The extraction mode of each DCC can be configured as DCCr (D1-D3),DCCm (D4-D12), DCCr+m (D1-D12) or disabled according to the EMScommand. The DCC extraction mode of electrical transmitting andreceiving interfaces can be configured independently.

Implement the transfer from DCC to ECC in a hardware way, thusbreaking through CPU resource limitation, avoiding ECC block andfinally improving the stability of ECC in optical transmission network.

Read signal degrade (SD) and signal failure (SF) alarms via boardsoftware after the alarm led-out by the hardware connection lines,which ensures protection switching implemented in the specified time.

Provide clock to the clock unit as the reference clock for phase locking.

Support channel-level loopback.

Electrical interfaces support line side AU loopback and terminal side AU

loopback.

Functions





Support the insertion and detection of pseudo-random binary sequenceof each AU-4 channel.

Figure 13 illustrates the operating principle of the STM-1 electricalinterface unit in the block diagram. And Table 18 lists the functional

modules in the diagram.

F I G URE 13 OP E R A T I N G PRI NCI PL E O F T HE STM -1 EL E C T R I C A L I N T E R F A C E UNI T

T A B L E 18 F UNCT I O NS O F MO DUL ES I N T HE EL E C T R I C A L I NT ERF ACE U NI T

Module Function

STM-1 Electricalthe receiving and transmitting of STM-1 electrical signal.

Interface

It achieves

Its main component is common electrical transmitting and receivingmodule.

Clock Recovery

ta

eration

It extracts the line clock from the received data stream, and&

Da

Regen

regenerates the received data according to this clock.

SOH Processing

At the receiving end, it locks the frame alignment byte

it inserts section overheads into

in the received data to achieve frame synchronization,and then extracts the section overheads after

unscrambling the data. At the transmitting end,

the launched data which will be framed after scrambled.

POH Processiointer and

ngseparates the path overheads and payloads.

At the transmitting end, it justifies the AU-4 p

At the receiving end, it processes the AU-4 pointer,

inserts path overheads into the payloads.

Controlling &f the STM-1

Processing

It monitors the working status and mode oelectrical interface unit, and performs part functions of

overhead processing. In addition, it implements switchingand statistic of performance.

OperatingPrinciple





Module Function


It implements the communication between the opticalinterface unit and the NCP.

Alarm DetectingIt outputs the alarm/status signals of the optical interfaceunit, detects and responds to alarms/status of other units,and provides reasons for switching control.

Tributary Unit

The E1/T1 tributary unit has the following functions.

Implement the mapping or demapping of E1/T1 signals.

Add/drop the dependent timeslots according to the different timeslot

No.. Analyze the performance and alarm of E1/T1 signals and report them

to the EMS.

Support up to 21 channels of E1 or T1 interfaces.

Support both non-balanced and balanced E1 interfaces and onlybalanced T1 interfaces.

Support framing of E1/T1 signals.

Support the retiming function at the E1 tributaries.

Transmit the DCC bytes transparently through the first three timeslotsof the 5th to 8th E1 tributaries.

Extract the timing clock from the clock recovered from the 1st and 2nd E1 tributaries and send it to the clock unit.

Detect the pseudo-random binary sequence at all E1/T1 tributaries.

Figure 14 illustrates the operating principle of the tributary unit. And Table19 lists the functional modules.

F I G URE 14 OP E R A T I N G PRI NCI PL E O F TR I B U T A R Y U NI T

Functions

OperatingPrinciple




T A B L E 19 F UNCT I O NS O F MO D U L E S I N TR I B U T A R Y UNI T

Module Function

TributaryInterfaceModule

It codes/decodes line signals.

In the receiving direction, this module converts the linesignals into monopole signals and recovers the tributaryclock. After retiming the signals according to the recoveredclock, it forwards the line signals.

In the transmitting direction, this module converts monopole

signals into the line signals.

DCCDetection &

TimingClockExtraction

In the receiving direction, it detects whether there is DCCinformation in the 5th-8th decoded tributary signals. If yes,send them to the DCC Information Insertion/Extractionmodule, if no, send them to the Mapping/Demapping module.

In the transmitting direction, it sends the DCC informationfrom the DCC Information Insertion/Extraction module andtributary signals from the Mapping/Demapping module to theTributary Interface Unit.

In addition, this module extracts the timing reference clock.

DCCInformationInsertion/Extraction

It extracts DCC information from the 5th-8th tributary signals orinserts DCC information into them.

Mapping/Demapping

Maps tributary services to the corresponding timeslots of AU,

or gets tributary services by demapping the correspondingAU.

Reads and inserts the higher-order and lower-order pathoverheads.

Ethernet Interface UnitFunctions The Ethernet interface unit has the following functions.

Process up to 8 channels of Fast Ethernet (FE) services. The mainboard provides four FE interfaces while the TFEx4/TFEx4B board offersthe other four FE interfaces.

These interfaces are adaptive 10/100 Mbit/s Ethernet electricalinterfaces, complying with IEEE802.3. They support 10 M/100 M fullduplex mode as well as auto-negotiation and forced working status.

Access and process other FE data services via other plug-in cards.

Support Ethernet flow control and 802.3x flow control frame processing.

Support GFP or PPP/HDLC encapsulation.

Support Jumbo frame with 9600 bytes.





Support VLAN processing. It is optional for user port to add a VLAN taginto a frame head under the Transparent LAN Service (TLS) accessmode.

Provide 8 system side directions and support service convergence

based on port.

The system side bandwidth is 12 × VC3. Bandwidth in each systemdirection can be concatenated virtually based on 2 M bandwidth at

least. The compensation time for virtual concatenation is up to 64 ms.

The system supports VC4, VC3 and VC12 virtual concatenation. Table20 lists the supported virtual concatenation groups of different

concatenation modes.

T A B L E 20 D ESCRI PT I O NS O F V I R T U A L CO N C A T E N A T I O N GRO UP

Virtual

Concatenation Group Mode

Group

Number

Number/Type of

Members inEach Group

Maximum Number ofGroup Supported

VC4 group 4 1/VC4 4/VC4

VC3 group 8 1-3/VC3 12/VC3

VC12 group 8 1-63/VC12 252/VC12

Support the function of scatheless Link Capacity Adjustment Scheme

(LCAS).

Support the Ethernet Private Line (EPL) function for FE services.

Support alarm and performance query for user ports and virtualconcatenation groups.

Provide loopback test for engineering applications

OperatingPrinciple

Figure 15 illustrates the operating principle of the Ethernet interface unit.Table 21 lists the functional modules.

F I G URE 15 OP E R A T I N G PRI NCI PL E O F T HE ET HERNET INT ERF ACE U NI T

Interface

Module

EthernetControl

ModuleMappingModule

ControlModuleLCASProcessing

Module

Backplane

Interface

Module

Overhead/

clockbus

Ethernet

datapacket Cross-Connect

Unit

Cross-Connect

Unit

NCP





T A B L E 21 F UNCT I O NS O F MO DUL ES I N T HE ET HERNET INT ERF ACE U NI T

Module Function

Interface Module Inputs/outputs Ethernet data packets.

Ethernet ControlModule

Processes the MAC layer of Ethernet.

At the receiving side, it implements the extraction,verification, flow control detection and serial-parallelconversion for data frames, and then sends theprocessed data to the Mapping Module.

At the transmitting side, it generates the preamble

code, implements the verification, flow control andparallel-serial conversion, and then sends theprocessed data to the Ethernet optical module.

Mapping Module

Implements the translation between Ethernet frames

and SDH frames and processes path overheads,including PPP/GFP-F encapsulation/de-encapsulation,virtual concatenation mapping /demapping and LCASprocessing.

Transfers the payloads in SDH frames to service bus

and then sends them to the Cross-Connect Unit.

LCAS ProcessingModule

When the LCAS is effective, the channel will be discardedautomatically in case that the channel in the virtualconcatenation group is detected damaged. Then thebandwidth decreases automatically, thus guaranteeing theother traffic in the virtual concatenation.

When the channel recovers, it will return to the virtual

concatenation group.

BackplaneInterface Unit

Receives the clock selected from the overhead bus andclock bus of the Cross-Connect Unit in the main board, andthen sends it to the Mapping Module.

Control Unit

Provides channels for the communication between theunit and the NCP of main board.

Implements performance statistic, alarm detection, andthe communication among modules.

Cross-Connect UnitFunctions The cross-connect unit has the following functions.

Implement cross-connection and protection switching for line signals

and tributary signals.

Support space division cross-connect capacity up to 64×64 VC-4 andtime division cross-connect capacity up to 2037×2037 VC-12.

Support overhead cross-connection.

In the EMS, up to 20 overhead bytes of each optical interface can beconfigured as full byte-based cross-connection.





Support the broadcast, uni-direction and bi-direction working modesthrough configuration in the EMS.

The line signals from the optical interface unit and tributary signals fromthe tributary unit are input to the cross-connect unit, where they are

cross-connected. The cross-connect unit implements corresponding cross-connect and allocation of timeslots according to service configurationrequirements.

OperatingPrinciple

Overhead UnitFunctions The overhead unit has the following functions.

Extract and combine serial overheads from different directions, andcontrol the cross-connection, read/write of them.

Provide user with a transparent channel by using one of the sevenbytes (including F1 byte) in the section overheads.

Provide an RS232 interface (RJ45 socket) on the front panel of main

board.

The overheads extracted from STM-1/STM-4 optical interfaces areconverted to a standard highway (HW) and then sent to the overhead unit.At the same time, send the HWs from interfaces on boards in extendedslots to the overhead unit too. Finally cross-connect all the overheads inthe overhead unit.

Operating

Principle

The overhead unit also processes F1 byte in section overheads or

configures the other six idle overhead bytes, converts them into RS232data and then sends the data to the corresponding interface circuit.

ECC-2M UnitFunctions The ECC-2M unit implements the transmission of SDH management

information through the 5th-8th 2 M channels. Thus the networkmanagement information can pass through equipment developed by othermanufacturers.

In the direction from 2 M to ECC, the unit extracts DCC bytes in the 1st-3rd timeslots of the 2 M signal, implements framing and then forwards them tothe HDLC bus.

Operating

Principle

In the direction from ECC to 2 M, the unit extracts ECC information fromthe HDLC bus, unframes it and converts it to DCC bytes. Then it insertsthe DCC bytes into the 1st-3rd timeslots of the 2 M signal.

HDLC UnitFunctions The HDLC unit transmits ECC information received from multiple directions.

This unit combines ECC information from multiple directions to the HDLCbus or extracts ECC information from the HDLC bus. Then the HDLC unitforwards the ECC information directly through hardware.

OperatingPrinciple





Clock UnitFunctions The clock unit provides the clock signal and system frame header

(complying with ITU-T G.813) for SDH NEs. It can implement the networksynchronization by limiting the frequency and phase of every NE in the

network within the predefined tolerance. In this way, the correct andeffective transmission and exchange of data flow in the network is

achieved by avoiding slip errors caused by unsynchronized clock.

ZXMP S200 adopts the master-slave synchronization mode. The available

clocks include line clock, tributary clock and external reference clock,which can be selected and switched according to alarms of clock sourceand the synchronization status message (SSM). The clock unit supportsextracted line clock in all optical directions and the tributary clockextracted from the first or the second E1 tributary.

In addition, the clock unit provides BITS interfaces to implement an

external clock output (2.048 Mbit/s or 2.048 MHz) and an external clockinput (2.048 Mbit/s or 2.048 MHz). Get the 2.048 Mbit/s clock by installing2 Mbit/s BITS interface board on the main board, and 2.048 MHz clock by

installing 2 MHz BITS interface board on the main board.

Two types of BITS interface are provided, 75 Ω (coaxial socket) and 120 Ω (RJ45 socket). The impedance 75 Ω or 120 Ω of a BITS interface can beset through jumpers on the main board.

System clock or line clock can be exported from the clock unit.

Figure 16 illustrates the operating principle of the clock unit.Operating

Principle

F I G URE 16 OP E R A T I N G PRI NCI PL E O F T HE CL O C K U NI T

VCXO

Timing

Reference

Selection Controlling

&Processing

Frequency

Division

Drive

Output

Digital

Discriminator

Line/tributary

clock

ExternalClock

InterfaceUnit

Externalreference

clock

T i mi n gr ef er en c e

The clock unit selects the timing reference for the NE from the line clock,tributary clock and external reference clock according to alarm informationof clock source and synchronization information. It implements thesynchronization of the local clock and clock source selected through thephase locked loop, which consists of the digital discriminator and VoltageControlled Oscillator (VCXO). In addition, it distributes the timingreference to other units.

The clock unit has four working mode during the synchronization and

phase locking described as follows.





Fast pull-in mode

The fast pull-in is the process from selecting the reference clock tolocking the reference clock source.

Tracking mode

After locking the reference clock source, the clock unit works in thetracking mode. In this mode, the clock unit tracks small variance of thereference clock source and keeps synchronization with it.

Hold-on mode

When all timing references are lost, the clock unit will work in the hold-on mode. The last frequency saved before losing the timing referencewill be held on as the timing reference. The hold-on mode will last 24hours at most.

Free-run mode

If the equipment loses all external timing references, it will work in thehold-on mode for a certain time period. When it is up to the hold-ontime limitation and the timing reference does not recover yet, the

oscillator inside the clock unit will work in free-run mode, providingtiming reference for the system.

Micro Control UnitFunctions The micro control unit implements the initialization and configuration of

main service chips on the main board and monitors their alarms andperformances.

Figure 17 illustrates the operating principle of the micro control unit. And

Table 22 lists the functional modules.

Operating

Principle

F I G URE 17 OP E R A T I N G PRI NCI PL E O F T HE M I CRO CO NT RO L U NI T

Controlling &

Processing

Channel Alarm & Performance Detection

Service Chip Control

Alarm & PerforamnceReport

T A B L E 22 F UNCT I O NS O F MO DUL ES I N T HE M I CRO CO NT RO L U NI T

Module Function

Channel Alarm &Performance Detection

Monitors alarm and performance of each channel andimplements protection switching if necessary

Service Chip ControlInitializes and configures chips for PDH, SDH andEthernet services






Module Function


Controls other modules and allows the interactiveprocessing among these modules

Alarm & PerformanceReport

Receives commands from the NCP and reports alarmsand performances

SMB Main Board

Operating Principle

Figure 18 illustrates the operating principle of the main board.

F I G URE 18 OP E R A T I N G PRI NCI PL E O F SMB B O A R D

Cross-Connect

Unit

ClockUnit

Optical

InterfaceUnit

TributaryUnit

Overhead

Unit

NCP

Ethernet

InterfaceUnit

ECC-2M

Unitand

HDLCUnit

E1/T1

E3/T3

Ethernet

STM-1/

STM-4

Clock,service,

communication

information

MicroControlUnit

As shown in Figure 18, SMB board of ZXMP S200 consists of the followingfunctional units.

NE control processor (NCP)

Optical interface unit

Tributary unit

Ethernet interface unit

Cross-connect unit

Overhead unit

ECC-2M unit

HDLC unit

Clock unit




Micro control unit (MCU)

NCP UnitFunctions NCP unit is the control core of the main board, which provides the

following functions.

Provides Qx interface, through which the EMS implements the

configuration and management of the NE

Provides ECC to implement the communication between the NE and theEMS

Issues configuration commands to the optical interface unit, tributary

unit and Ethernet interface unit, and collects their performances andalarms

Monitors the power module and fan module intelligently and detects

alarms reported by the fan board and power board, such as board on-position information, DC power indication, power board type and powerboard failure information

Supports online download and upgrade of board software

Provides four external alarm input interfaces (on-off signal inputs)

Provides alarm output interfaces to column-head cabinet (on-off signaloutputs)

Provides real-time clock, which can be ensured even the power is downdue to its built-in battery

Provides a buzzer and ring trip for audible alarm function

Figure 19 illustrates the operating principle of the NCP in the blockdiagram. And the modules in the diagram are described in Table 23.

OperatingPrinciple

F I G URE 19 OP E R A T I N G PRI NCI PL E O F NCP UN I T

Controlling&

Processing

Real-TimeClock

Qx/fInterface

ECC/SInterface

Board-in-Position

Detection

BoardResetControl

NEAlarmOutput

ExternalAlarmInput

Fan/PowerDistribution

UnitMonitoring





T A B L E 23 F UNCT I O NS O F MO D U L E S I N NCP U NI T

Module Function

Real-TimeClock

Used to ensure the accurate time when alarms occur ordisappear during the monitoring of NE.

This module will be powered by the spare rechargeablebattery once power down is detected, so as to guarantee thecorrect timing of the clock.

Qx/f Interface

Qx is the interface between NE and SMCC (SubnetManagement Control Center), through which the main boardcan report performances and alarms of the NE or the subnetto the SMCC. In addition, the main board executes thecommands and configurations received from the SMCC.

f interface is the communication interface between the NE anda portable computer.

ECC/SInterface

As the monitoring center, this module provides embeddedcontrol channel and communication interface between the NCPand other functional units.


Implements the initialization and startup of board software,and cooperates with other functional modules

Board-in-PositionDetection

Detects whether the board is in position, that is, whether theboard is inserted into the slot.

External AlarmInput

Monitors external alarms

NE AlarmOutput

Outputs the alarms of the NE

Board ResetControl

Resets all boards in the NE (hard reset)

Fan/Power

DistributionUnitMonitoring

Monitors the fan module and power module of the NEintelligently

Optical Interface UnitFunctions The optical interface unit has the following functions:





The optical interface unit provides up to four STM-1/STM-4 opticalinterfaces. However, two STM-4 optical interfaces are available at thesame time at most. The following lists the available combination of

optical interfaces:

Four STM-1 optical interfaces

Two STM-1 optical interfaces and two STM-4 optical interfaces

Three STM-1 optical interfaces and one STM-4 optical interface

It adopts LC/PC fiber optic connectors and SFP lasers, supporting thedetection of optical received power, optical launched power, laser

temperature and transmit laser bias current. In addition, SFP laserssupport the detection of in-position status, LOS (loss of signal) alarmand ALS (automatic laser shutdown) function.

Supports SOH extraction and insertion functions, and processes 28section overheads according to the system specifications. Table 24 lists

the overhead bytes processed by the optical interface unit.

T A B L E 24 OV E R H E A D S PR O C E S S E D B Y OP T I C A L IN T E R F A C E U NI T



User-definedbyte

8R2C6, R3C6, R3C8, R3C9, R5C6, R5C7,R2C8 and R2C9 [Note]

Note: “R” refers to the row and “C” refers to the column of the STM-1 frame

Supports the transparent transfer of overheads except the byte M1.

Supports the function of DCC extraction and insertion

The extraction mode of each DCC can be configured as DCCr (D1-D3),DCCm (D4-D12), DCCr+m (D1-D12) or Disabled according to the EMScommand. The DCC extraction mode of optical receive interfaces and

optical transmit interfaces can be configured independently.

Implements the transfer from DCC to ECC in a hardware way, thusbreaking through CPU resource limitation, avoiding ECC block and

finally improving the stability of ECC in optical transmission network.

Board software reads signal degrade (SD) and signal failure (SF)alarms through hardware connection, which ensures protectionswitching implemented in specified time.

Provides clock to the clock unit as the reference clock for phase locking

Supports port-level and channel-level loopback

Optical interfaces identified with “4-1” and “4-2” on the panel supportline side AU loopback, terminal side port loopback and AU loopback.

Optical interfaces identified with “5” and “6” supports line side port

loopback, line side AU loopback and terminal side port terminal.

STM-4 optical interfaces support VC-4-4C concatenation.





Each AU-4 channel supports the insertion and detection of pseudo-random binary sequence.

OperatingPrinciple

Figure 20 illustrates the operating principle of the optical interface unit inthe block diagram. And the functional modules in the diagram are

described in Table 25.

F I G URE 20 OP E R A T I N G PRI NCI PL E O F T HE OP T I C A L I NT ERF ACE UNI T

Optical

Interface

Clock

Recovery

&

Data

Regeneration

SOH

Processing

POH

Processing

Controlling&Processing

SOH( E1,E2,DCC)

STM-1/STM-4 Databus

Clocksignal Alarmmonitoring

Communicationinterface

T A B L E 25 F UNCT I O NS O F MO DUL ES I N T HE OP T I C A L I N T E R F A C E UNI T

Module Function

OpticalInterface

It converts STM-1/STM-4 optical signals to correspondingelectrical signals, and checks the input optical signals.

Integrated optical receive/transmit modules with general autogain control function are adopted as the key component.

Three types of STM-1 optical modules are available: S-1.1,L-1.1 and L-1.2.

Three types of STM-4 optical modules are available: S-4.1,L-4.1 and L-4.2.

Clock Recovery

&DataRegeneration

It recovers the line clock from the received data stream, andregenerates the received data according to this clock.

SOHProcessing

At the receiving end, it locks the frame alignment byte inthe received data to achieve frame synchronization, andthen extract the section overheads after unscrambling thedata.

At the transmitting end, it inserts section overheads into thelaunched data which will be framed after scrambled.






Module Function

POH Processing

At the receiving end, it processes the AU-4 pointer,separating the path overheads and payloads.

At the transmitting end, it justifies the AU-4 pointerand inserts path overheads into the payloads.


It monitors the working status and mode of the opticalinterface unit, and performs part functions of overheadprocessing. In addition, it implements switching and statisticof performance.


It is used to implement the communication between theoptical interface unit and the NCP.

AlarmDetecting

It outputs alarm/status signals of the optical interface unit,detects and responds to alarms/status of other units, andprovides reasons for switching control.

Tributary Unit

ZXMP S200 provides two kinds of tributary unit for accessing different

tributary services: E1/T1 tributary unit and E3/T3 tributary unit.

The following describes the functions and operating principle of E1/T1

tributary unit and E3/T3 tributary unit.

The E1/T1 tributary unit has the following functions:

Implements the mapping or demapping of E1/T1 signals.

Supports the adding/dropping of timeslots with different serialnumbers, and independent adding/dropping of timeslots

Analyzes the performance and alarms of E1/T1 signals and reportsthem to the EMS

Supports for up to 21 channels of E1 or T1 interfaces. Supports bothnon-balanced and balanced E1 interfaces and only balanced T1interfaces

Supports framing of E1/T1 signals

E1 tributaries support the retiming function

Supports transmitting DCC bytes transparently through the first threetimeslots of the 5th to 8th E1 tributaries

Supports extracting timing clock from the received clock recoveredfrom the first and second E1 tributaries and sending it to the clock unit

All E1/T1 tributaries support the detection of pseudo-random binarysequence

Figure 21 illustrates the operating principle of the E1/T1 tributary unit.

And the functional modules are described in Table 26.

E1/T1Tributary Unit




F I G URE 21 OP E R A T I N G PRI NCI PL E O F E1 /T1 T R I B U T A R Y U NI T

Tributary

InterfaceModule

DCCDetection

&

TimingClockExtraction

Mapping/

Demapping

DCC

Infromation

Insertion/

Extraction

ClockUnit

E1/T1

DCC

information

Cross-Connect

Unit

T A B L E 26 F UNCT I O NS O F MO D U L E S I N E1 /T1 T R I B U T A R Y U NI T

Module Function

TributaryInterfaceModule

It codes/decodes line signals.

In the receiving direction, this module converts linesignals into monopole signals and recovers tributaryclock. After retiming the signals according to therecovered clock, it forwards the line signals.

In the transmitting direction, this module convertsmonopole signals into line signals.

DCCDetection &

Timing ClockExtraction

In the receiving direction, it detects whether there is

DCC information in the 5-8 decoded tributarysignals. If DCC information is included, send them tothe DCC Information Insertion/Extraction module; ifno DCC information, send them to theMapping/Demapping module.

In the transmitting direction, it sends the DCCinformation from the DCC InformationInsertion/Extraction module and tributary signalsfrom the Mapping/Demapping module to theTributary Interface Unit.

In addition, this module extracts the timing reference clock.

DCCInformationInsertion/Extraction

Extracts DCC information from the 5-8 tributary signals orinserts DCC information into them.

Mapping/Demapping

Maps tributary services to corresponding timeslots ofAU, or gets tributary services by demapping thecorresponding AU.

Reads and inserts higher-order and lower-order pathoverheads.





E3/T3Tributary Unit

The E3/T3 tributary unit has the following functions:

Implements the mapping/demapping of E3/T3 signals. Each board

provides three E3/T3 interfaces, which support HDB3 and B3ZScoding/decoding.

The mapping path can be set as AU4 or AU3 in the EMS. The unitsupports the mapping and demapping between three E3/T3 signals and

any timeslots of AU-4/AU-3.

The added and dropped timeslots can be independent and different.

The E3/T3 tributary unit can process lower-order overheads andpointers, and report corresponding alarms and performance to the EMS.

Figure 22 illustrates the operating principle of the E3/T3 tributary unit.And the functional modules are described in Table 27.

F I G URE 22 OP E R A T I N G PRI NCI PL E O F E3 /T3 T R I B U T A R Y U NI T

Control

Module

Clock

Module

Service

Processing

ModuleInterfaceModule

E3/T3tributary

interfaceboard

(EIE3)

SystemClock

ReferenceClock

NCP

Cross-Connect

Unit

T A B L E 27 F UNCT I O NS O F MO D U L E S I N E3 /T3 T R I B U T A R Y U NI T

Module Function

Clock ModuleDistributes the system clock to the main board andprovides clocks needed by the board.

Interface ModuleImplements the code pattern conversion, jitter attenuationand coding between tributary analog signals and digitalsignals.

Service ProcessingModule

Implements the mapping/demapping of timeslots,tributary path protection, and the processing of pointers

and path overheads.

Control Module

Provides channels for the communication between the unitand the NCP of the main board, and implements theperformance statistic, alarm detection, and the

communication among modules.





Ethernet Interface UnitFunctions The Ethernet interface unit has the following functions:

Processes up to eight channels of Fast Ethernet (FE) services. The

main board provides four FE interfaces while the TFEx4/TFEx4B boardoffers the other four FE interfaces.

These interfaces are adaptive 10/100 Mbit/s Ethernet electricalinterfaces, complying with IEEE802.3. They support 10 M/100 M fullduplex mode as well as auto-negotiation and forced working status.

Accesses and processes other FE data services via other plug-in cards

Supports Ethernet flow control and 802.3x flow control frameprocessing

Supports GFP or PPP/HDLC encapsulation

Supports Jumbo frame with 9600 bytes

Supports VLAN processing. It is optional for user port to add a VLANlabel into a frame head under the transparent LAN service (TLS) accessmode.

Provides eight system side directions and supports service convergence

based on port.

The system side bandwidth is 10 × VC-3. Bandwidth in each systemdirection can be cascaded virtually based on 2 M bandwidth at least.

The compensation time for virtual concatenation is up to 64 ms.

The system supports VC-4, VC-3 and VC-12 virtual concatenation.Table 28 describes the supported virtual concatenation groups of

different cascade modes.

T A B L E 28 DESCRI PT I O N O F V I R T U A L CO N C A T E N A T I O N G RO UP

VirtualConcatenationGroup Mode

GroupNumber

Number/Type ofMembers in EachGroup

MaximumNumber of GroupSupported

VC-4 group 2 1/VC-4 2

VC-3 group 8 1-3/VC-3 10

VC-12 group 8 1-63/VC-12 210

Supports the function of scratchless Link Capacity Adjustment Scheme(LCAS)

Supports Ethernet private line (EPL) function for FE services

Supports alarm and performance query for user ports and virtualconcatenation groups

Provides loopback test for engineering applications

Figure 23 illustrates the operating principle of the Ethernet interface unit.The functional modules are described in Table 29.

Operating

Principle





F I G URE 23 OP E R A T I N G PRI NCI PL E O F T HE ET HERNET INT ERF ACE U NI T

Interface

Module

EthernetControl

ModuleMappingModule

ControlModuleLCASProcessing

Module

Motherboard

Interface

Module

Overhead/

clockbus

Ethernetdatapacket Cross-Connect

Unit

Cross-Connect

Unit

NCP

T A B L E 29 F UNCT I O NS O F MO DUL ES I N T HE ET HERNET INT ERF ACE U NI T

Module Function

Interface Module Inputs/outputs Ethernet data packets

Ethernet ControlModule

Processes the MAC layer of Ethernet

At the receiving side, it implements the extraction,verification, flow control detection and serial-parallelconversion for data frames, and then sends theprocessed data to the Mapping Module.

At the transmitting side, it generates the preamblecode, implements the verification, flow control andparallel-serial conversion, and then sends the processed

data to the Ethernet optical module.

Mapping Module

Implements the translation between Ethernet framesand SDH frames and processes path overheads,including PPP/GFP-F encapsulation/de-encapsulation,virtual concatenation mapping /demapping and LCASprocessing.

Transfers the payloads in SDH frames to service bus andthen sends them to the Cross-Connect Unit.

LCAS ProcessingModule

When the LCAS is effective, the channel will be discardedautomatically in case that the channel in the virtualconcatenation group is detected damaged. Then thebandwidth decreases automatically, thus guaranteeing theother traffic in the virtual concatenation.

When the channel recovers, it will return to the virtualconcatenation group.






Module Function

BackplaneInterface Unit

Receives the clock selected from the overhead bus and clockbus of the Cross-Connect Unit in the main board, and then

sends it to the Mapping Module.

Control Unit


Implements performance statistic, alarm detection, andthe communication among modules.

Cross-Connect UnitThe cross-connect unit has the following functions:

Implements cross-connection and protection switching for line signalsand tributary signals

Supports space division cross-connect capacity up to 16×16 VC-4 and

time division cross-connect capacity up to 1008×1008 VC-12

Supports overhead cross-connection

In the EMS, up to 20 overhead bytes of each optical interface can beconfigured as full byte-based cross-connection

Supports the broadcast, uni-direction and bi-direction working modesthrough configuration in the EMS

The operating principle of the cross-connect unit is described below:

Line signals from the optical interface unit and tributary signals from thetributary unit are input to the cross-connect unit, where they are cross-connected. The cross-connect unit implements corresponding cross-connection and allocation of timeslots according to service configurationrequirements.

Overhead UnitThe overhead unit has the following functions:

Extracts and combines serial overheads from different directions, and

controls the cross-connection, read/write of them

Provides user with a transparent channel by using one of the sevenbytes (including F1 byte) in the section overheads

Provides an RS232 interface (RJ45 socket) on the front panel of mainboard

The operating principle of the overhead unit is described below:

Overheads extracted from STM-1/STM-4 interfaces are converted to a

standard highway (HW) and then sent to the overhead unit. At the same

Functions

OperatingPrinciple

Functions

OperatingPrinciple




time, the HWs from interfaces on boards in extended slots are sent to theoverhead unit too. The overhead unit cross-connects all the overheads.

The overhead unit also processes F1 byte in section overheads orconfigures the other six idle overhead bytes, converts them into RS232data and then sends the data to corresponding interface circuit.

ECC-2M UnitFunctions The ECC-2M unit implements the transmission of SDH management

information through the 5th-8th 2 M channels. Thus the networkmanagement information can pass through equipment developed by othermanufacturers.

In the direction from 2 M to ECC, the unit extracts DCC bytes in the 1st-3rd timeslots of the 2 M signal, implements framing and then forwardsthem to the HDLC bus.

OperatingPrinciple

In the direction from ECC to 2 M, the unit extracts ECC information fromthe HDLC bus, unframes it and converts it to DCC bytes. Then it insertsthe DCC bytes into the 1st-3rd timeslots of the 2 M signal.

HDLC UnitFunctions The HDLC unit transmits ECC information received from multiple directions.

This unit combines ECC information from multiple directions to the HDLCbus or extracts ECC information from the HDLC bus. Then the HDLC unit

forwards the ECC information directly through hardware.

OperatingPrinciple

Clock UnitFunctions The clock unit provides the clock signal and system frame header

(complying with ITU-T G.813) for SDH NEs. It is used to implement thenetwork synchronization by limiting the frequency and phase of every NEin the network within the predefined tolerance. In this way, the correctand effective transmission and exchange of data flow in the network isachieved by avoiding slip errors caused by unsynchronized clock.

The ZXMP S200 adopts the master-slave synchronization mode. Theavailable clocks include line clock, tributary clock and external referenceclock, which can be selected and switched according to alarms of clock

source and the synchronization status message (SSM). The clock unitsupports extracted line clock in all optical directions and the tributary clockextracted from the first or the second E1 tributary.

In addition, the clock unit provides BITS interfaces to implement anexternal clock output (2.048 Mbit/s or 2.048 MHz) and an external clockinput (2.048 Mbit/s or 2.048 MHz). Two types of BITS interface areprovided, 75 Ω (coaxial socket) and 120 Ω (RJ45 socket). The impedance75 Ω or 120 Ω of a BITS interface can be set through jumpers on the mainboard.

System clock or line clock can be exported from the clock unit.





Figure 24 illustrates the operating principle of the clock unit.OperatingPrinciple

F I G URE 24 OP E R A T I N G PRI NCI PL E O F T HE CL O C K U NI T

VCXO

Timing

Reference

Selection Controlling

&

Processing

Frequency

Division

Drive

Output

Digital

Discriminator

Line/

tributary

clock

ExternalClock

InterfaceUnit

External

reference

clock

T i mi n gr ef er en c e

The clock unit selects the timing reference for the NE from the line clock,tributary clock and external reference clock according to alarm informationof clock source and synchronization information. It implements thesynchronization of the local clock and clock source selected through thephase locked loop, which consists of the digital discriminator and VoltageControlled Oscillator (VCXO). In addition, it distributes the timingreference to other units.

The clock unit has four working mode during the synchronization andphase locking described as follows.

Fast pull-in mode

The fast pull-in is the process from selecting the reference clock tolocking the reference clock source.

Tracking mode

After locking the reference clock source, the clock unit works in thetracking mode. In this mode, the clock unit tracks small variance of thereference clock source and keeps synchronization with it.

Hold-on mode

When all timing references are lost, the clock unit will work in the hold-

on mode. The last frequency saved before losing the timing referencewill be held on as the timing reference. The hold-on mode will last 24

hours at most.

Free-run mode

If the equipment loses all external timing references, it will work in thehold-on mode for a certain time period. When it is up to the hold-ontime limitation and the timing reference does not recover yet, theoscillator inside the clock unit will work in free-run mode, providingtiming reference for the system.





Micro Control UnitFunctions The micro control unit implements the initialization and configuration of

main service chips on the main board and monitors their alarms andperformances.

Figure 25 illustrates the operating principle of the micro control unit. Andthe functional modules are described in Table 30.

OperatingPrinciple

F I G URE 25 OP E R A T I N G PRI NCI PL E O F T HE M I CRO CO NT RO L U NI T

Controlling

& Processing

Channel Alarm & Performance Detection

Service Chip Control

Alarm & PerforamnceReport

T A B L E 30 F UNCT I O NS O F MO DUL ES I N T HE M I CRO CO NT RO L U NI T

Module Function

Channel Alarm &Performance Detection

Monitors alarm and performance of each channeland implements protection switching if necessary

Service Chip ControlInitializes and configures chips for PDH, SDH andEthernet services

Controlling & ProcessingControls other modules and allows the interactiveprocessing among these modules

Alarm & PerformanceReport

Receives commands from the NCP and reportsalarms and performances

Front PanelTypes and quantities of interfaces vary with different main boards.

Figure 26 illustrates the front panel of the main board with four opticalinterfaces and twenty-one 75 Ω E1 interfaces (SMCxF75T).

F I G URE 26 FRO NT P A NE L O F T HE M A I N B O A R D (SM CXF75T)





Table 31 describes the components on front panel.

T A B L E 31 CO M PO NENT S O N T HE F RO NT P A NE L O F M A I N B O A R D

No. Component ID Descriptions

1Captivefastener

- Used to secure the main board in the chassis.

2 Ejector lever -Used to help pull in/out the main board and fixit in the chassis.

3Ring tripbutton

B.OFF

When some alarm occurs, the buzzer beginsringing, and the alarm indicator glows incorresponding color.

Press this button less than 2 second to stopringing. If a new alarm occurs, the buzzerwill ring again.

Press this button more than 2 seconds, the

alarm buzzer will never ring even a newalarm occurs. However, the alarm indicatorwill become to flicker 10 seconds perminute when a new alarm occurs.

Press this button again, the permanent ringtrip status will be cancelled and then thebuzzer will ring if the alarm has not beencleared yet.

During the reset of the main board, pressthis button more than 40 seconds to enterthe Download status.

4 Reset button N.RST

SMB: Press this button to reset the NCP unit of

the main board.SMC: Press this button to reset the main board.

5NCP runningindicator

RUN

Green indicator

Flickering regularly (once per second) meansthat the NCP unit runs normally.

6NCP alarmindicator

MAJ/MIN

Bi-color indicator (red-yellow)

OFF if the board runs normally,

ON if the critical alarm occurs,

Only yellow indicator ON if the major orminor alarm occurs.

7

Opticalreceiving/transmittinginterface

-

Four optical interfaces with LC/PC connectors

on the front panel, marked as “4-2”, “4-1”, “5”and “6” from left to right.

For SMC board, the optical interfaces allcan access STM-1 or STM-4 signal.However, the optical interfaces marked as “4-1” and “4-2” must be set to access thesignal with the same rate.

For SMB board, the optical interfacesmarked as “5” and “6” can access STM-1 orSTM-4 signal, the optical interfaces markedas “4-1” and “4-2” can only access STM-1signal.

Types of the optical module supported by the







STM-1 interface are S-1.1, L-1.1 and L-1.2.

Types of the optical module supported by theSTM-4 interface are S-4.1, L-4.1 and L-4.2.

8

Indicator ofopticalreceivinginterface

R

Green indicator

ON if the optical interface receives theoptical signal,

OFF if the signal is lost.

9

Indicator ofopticaltransmittinginterface

T

Green indicator

ON if the laser is turned on,

OFF if the laser is turned off.

1075 Ω BITSoutputinterface

Tx

75 Ω clock output interface

Connector type: 1.0/2.3 angle PCB solderfemale socket (with installed screw)

1175 Ω BITSinputinterface

Rx

75 Ω clock input interface

Connector type: 1.0/2.3 angle PCB solderfemale socket (with installed screw)

12Alarm outputinterface

OUT

It can output two channels of alarm signals,one is critical alarm and the other ismajor/minor alarm

Connector type: RJ11 socket with relay

isolation mode

13

RS232interface/

120 Ω BITSinterface

232

Connector type: RJ45 socket

It provides the function of either RS232interface or 120 Ω BITS clock interface.

On the lower part of the interface, there aretwo green indicators, one on the left and the

other on the right.

The left indicator is for the alarm indication ofSMC board, marked as M-ALM.

ON if any unit of SMC board (except NCPunit), TFEx4 and TFEx4B boards have thealarms (including critical, major, minor andprompt alarm).

OFF if the alarm is cleared or shielded.

The right indicator is for the status indication ofclock, marked as M-RUN.

Flickering 0.25 times per second indicatesinternal clock or hold-on mode.

Flickering once per second indicates normallocking of line clock or external clock.

Flickering 0.5 times per second indicatesthat the clock is working in the free-runmode.

Flickering five times per second indicatesthat the clock is working in the pull-in ortracking mode.

14Interface forlocal craft

terminal

LCTConnector type: RJ45 socket

Used to connect a Local Craft Terminal (LCT).






15 Qx interface Qx


Used to connect the EMS computer.

Under the Qx interface, there are two green

indicators on the left and right of the Qxinterface.

Left Indicator (LA): connection indicator.

ON if the interface is correctly connected.

OFF if the interface is not connected.

Right indicator: speed indicator.

ON if the data transmission speed is 100Mbit/s.

OFF if the data transmission speed is 10Mbit/s.

Note: Since the interface speed is 10 Mbit/s

forcibly, the right indicator is always OFF.

16Alarm inputinterface

IN


4 channels of external alarms (on-off signals)are supported through this interface, such assmoke alarm, entrance control alarm, firealarm and temperature alarm.

17Fast Ethernetelectricalinterface

FE1

FE2

FE3

FE4


On the front panel, there are four 10M/100Mfast Ethernet electrical interfaces, which areidentified as FE1, FE2, FE3 and FE4 from left toright.

On the top of each FE electrical interface, thereare two green indicators on the left and rightrespectively.

Left Indicator (LINK/ACTIVE): connectionindicator

ON if the interface is correctly connected.

OFF if the interface is not connected.

Right Indicator: speed indicator

ON if the data transmission speed is 100Mbit/s.

OFF if the data transmission speed is 10Mbit/s.

18E1 electricalinterface (1-12)

-Connector type: 50-pin angle PCB solder socket(female)

Used to access 1-12 channels of E1 signals.

19E1 electricalinterface (13-21)

-

Connector type: 50-pin angle PCB solder socket(female)

Used to access 13-21 channels of E1 signals.

20Laserwarning sign

-This sign warns users to beware of strong laserbeam and avoid burning eyes.




DC Power Module (PWA/PWB)ZXMP S200 provides two kinds of DC power modules to meet differentpower supply environment.

PWA module

It uses -48 V primary DC power supply.

Allowed voltage fluctuation range: -36 V to -72 V

PWB module

It uses +24 V primary DC power supply.

Allowed voltage fluctuation range: +18 V to +36 V

FunctionsThe DC power module supplies DC power, i.e. the secondary power supply,to all the other boards in ZXMP S200.

The power module provides dual power inputs: path A as the active powersupply and path B as the standby power supply (such as storage battery).When the path A fails, the power supply is switched to the path Bsmoothly. Once the path A recovers, the power supply is switched back tothe A path. Above means that the path A and path B are 1:1 backup oneanother.

Operating Principle

Figure 27 illustrates the functional block of PWA/PWB module.

Table 32 lists the function of each unit in the power module.

F I G URE 27 OP E R A T I N G PRI NCI PL E O F T HE PWA/PWB MO D U L E

InputFilter&

ProtectionPower

Transform

ControlCircuit Alarmoutput

-48V/-60Vor

+24V

Output

Filter

Primarypower

supply

Otherboards





T A B L E 32 UNI T S I N T HE PWA/PWB B O A R D

Unit Function

Input Filter andProtection

This unit consists of the input switch, fuses, lightning andsurging protection circuit, EMI filter circuit and soft start

circuit.

It implements the EMI filtering for the input power andprovides lightning/surging protection and over-voltage/under-voltage protection, thus improving theadaptability to the input power supply.

PowerTransform

Converts the primary power supply to the DC power neededby other boards.

Output FilterImproves the stability of output power by decreasing outputvoltage ripple.

Control Circuit

Implements protection and control with the input over/under

voltage protection circuit and output over/under voltageprotection circuit.

In addition, it performs the function of failure alarming,outputting alarm and board-in-position signal.

Front PanelFigure 28 shows the front panel of PWA board and Table 33 lists thecomponents on the front panel.

Front Panel ofPWA Board

F I G URE 28 FRO NT P A NE L O F T HE PW A B O A R D

1 2 3 4 5 6 7

8

9

4 0 m m

84.5mm

T A B L E 33 CO M PO NENT S O N T HE F RO NT P A NE L O F PW A B O A R D

No. Component Description

1 Handle Helps to pull in/out the power board.

2Rotaryswitch

Used to fix the fan module and the power module.

LOCK: to fix the fan module and the power module

UNLOCK: to unlock the fan module and the powermodule







3

Power

indicator of Bpath

Green indicator, used to indicate the working status of Bpath power supply.

ON if there is the power supply at B path, OFF if the output end of B path of power board is

disconnected, or the power switch is turned off.

4Powerindicator of Apath

Green indicator, used to indicate the working status of A

path power supply.

ON if there is the power supply at A path.

OFF if the output end of A path of power board isdisconnected, or the power switch is turned off.

5

DC power

socket of Apath

Used to connect with active external power supply (Apath).

Connector type: D-type, 3-pin angle PCB solder socket

(pin-hole-pin)

The signal definition of the pin/hole from left to right is -48 VGND, PGND and -48 V.

6DC power

socket of Bpath

Used to connect with standby external power supply (B

path).

Connector type: D-type, 3-pin angle PCB solder socket(pin-hole-pin)

The signal definition of the pin/hole from left to right is -48 VGND, PGND and -48 V.

7 Power switch

Turn the power switch to “I” to connect the external

power supply.Turn it to “O” to disconnect the external power.

8

Runningstatusindicator(RUN)

Indicate the running status of the board.

ON in green means that the board is running normally.

9Alarmindicator(ALM)

Indicates the alarm status of the board.

OFF means that the board is running normally, ON in redmeans that the alarm occurs in the board.

Figure 29 shows the front panel of PWB board and Table 34 lists thecomponents on the front panel.

Front Panel ofPWB Board




F I G URE 29 FRO NT P A NE L O F T HE PWB B O A R D

1 2 3 4 5 6 7

8

9

4 0 m m

84.5mm

T A B L E 34 CO M PO NENT S O N T HE F RO NT P A NE L O F PWB B O A R D


1 Handle Helps to pull in/out the power module.

2Rotaryswitch

Used to lock the fan module and the power module.

LOCK: to fix the fan module and the power module

UNLOCK: to unlock the fan module and the powermodule

3Powerindicator of B

path

Green indicator, used to indicate the working status of Bpath power supply.

ON if there is the power supply at B path.

OFF if the output end of B path of power board isdisconnected, or the power switch is turned off.

4Powerindicator of Apath

Green indicator, used to indicate the working status of Apath power supply.

ON if there is the power supply at A path.

OFF if the output end of A path of power board isdisconnected, or the power switch is turned off.

5DC powersocket of Apath

Used to connect with active external power supply (Apath).

Connector type: D-type, 3-pin angle PCB solder socket

(pin-hole-pin)

The signal definition of the pin/hole from left to right is+24 VGND, PGND and +24 V.

6

DC powersocket of Bpath

Used to connect with standby external power supply (Bpath).

Connector type: D-type, 3-pin angle PCB solder socket(pin-hole-pin)

The signal definition of the pin/hole from left to right is+24 VGND, PGND and +24 V.







7 Power switch

Turn the power switch to “I” to connect the externalpower supply.

Turn it to “O” to disconnect the external power.

8

Workingstatus

indicator(RUN, ALM)

The indicator identified as RUN indicates the runningstatus of the board. ON in green means that theboard is running normally.

The indicator identified as ALM indicates the alarmstatus of the board. OFF means that the board isrunning normally, ON in red means that the alarmoccurs in the board.

AC Power Module (PWC)Besides the DC power module (PWA/PWB), ZXMP S200 also provides an

AC power module (PWC) to meet the environment where only 110 V or220 V AC primary power supply is available. The allowed voltagefluctuation range of the primary AC power supply is from 90VAC to290VAC.

Caution: If the input voltage is higher than 280VAC, the PWC module willstart the power supply protection. Once the power supply protection is started, theequipment can not be turned on.

Note: Additional voltage-regulated power supply (such as UPS) should beconfigured when the PWC module is used in ZXMP S200. Besides, Class-B lightningprotector with the nominal discharge current of 60 kA should be installed in theequipment room where ZXMP S200 is located.

The PWC module meets the requirements specified in the standards IEC60950:1999, EN 60950: 2000 and GB 4943:2001.

Operating PrincipleThe PWC module converts the AC power (primary power supply) into DCpower needed by the other boards in ZXMP S200.

Figure 30 illustrates the operating principle of the PWC module.




F I G URE 30 OP E R A T I N G PRI NCI PL E O F T HE PWC MO D U L E

Input

Filter andProtection

Control Circuit Alarm output

OutputFilter

AC power supplyOther

boards

PowerConverter

AC/DCConverter220V

Table 35 lists the function of each unit in the PWC module.

T A B L E 35 UNI T S I N T HE PWC M O D U L E

Unit Function

Input Filter andProtection

This unit consists of the input switch, fuses, lightning andsurging protection circuit, EMI filter circuit and soft startcircuit.

It implements the EMI filtering for the input power andprovides lightning/surging protection and over-

voltage/under-voltage protection, thus improving theadaptability to the input power.

AC/DCConverter

Converts 220 V AC power supply into DC power supply, andthen outputs the DC power to the next module.

PowerConverter

Converts the -48 V DC power into DC power with propervoltages needed by other boards.

Output Filter Improves the stability of output power by decreasing outputvoltage ripple.

Control Circuit

Implements protection and control with the input over/undervoltage protection circuit and output over/under voltageprotection circuit.

In addition, it performs the function of failure alarming,outputting alarm and board-in-position signal.

Front PanelFigure 31 shows the front panel of the PWC module. Table 36 describesthe components on front panel.





F I G URE 31 FRO NT P A NE L O F T HE PWC MO D U L E

5

6

4 0 m m

84.5mm

1 2 3 4

T A B L E 36 CO M PO NENT S O N T HE F RO NT P A NE L O F T HE PWC MO D U L E


1 Handle Helps to pull in/out the power board.

2 Rotary switch

Used to lock the fan module and the power module.

LOCK: to fix the fan module and the powermodule

UNLOCK: to unlock the fan module and thepower module

3AC powersocket

Used to connect with 220 V AC power supply.

Connector type: D-type 3-pin socket

4 Power switch

Turns the power switch to “I” to connect theexternal power supply.

Turns the power switch to “O” to disconnect theexternal power.

5

Workingstatusindicator

(RUN)

Indicates the running status of the board.

ON in green means that the PWC board runsnormally.


Indicates the alarm status of the board.

OFF means that the board is running normally, ONin red means that the alarm occurs in the board.

V.35 Data Interface Board (V35B)

Operating PrincipleV35B board provides two V.35 synchronous data interfaces of N × 64K(N=1-31), which can be connected to V.35 data interfaces of a routerdirectly. The board software and FPGA program can be upgraded remotelyonline.





The V35B board uses E1 timeslots in SDH networks to transfer low-ratetransparent data services.

Figure 32 illustrates the operating principle of V35B board.

F I G URE 32 OP E R A T I N G PRI NCI PL E O F T HE V35B B O A R D

RateAdaptation

Unit

Mapping/

DemappingUnit

InterfaceUnit2M&N×64KDataService

AdaptationUnit

V.35data

Backplane

signals

The V35B board converts the high-rate signal received from the backplaneinto low-rate service signals, and then demaps them to two channels of 2M signals in the Mapping/Demapping Unit. After that, adapts the 2 Msignals to N×64K data service signals, which are sent to the Interface Unit.Finally, the Interface Unit converts the N×64K signals into V.35 data andoutput it.

In the opposite direction, the V35B board adapts two N×64K data signalsinto 2 M signals and then maps them to 2 M timeslots. The Rate

Adaptation Unit converts the signals into high-rate signals and then sentthem to the backplane.

Table 37 lists the functions of units of V35B board.

T A B L E 37 UNI T S I N T HE V35B B O A R D

Unit Function

Interface Unit Inputs/outputs V.35 data services.

2 M & N×64K DataService Adaptation

Unit

Implements the adaptation between 2 M signals andN×64 K service signals. The timeslots of 2 M signalsoccupied by N × 64 K data service are configuredthrough software.

Mapping/DemappingUnit

Maps/demaps two 2 M signals.

Rate Adaptation UnitImplements the conversion between high-rate signalsfrom the backplane and low-rate service signals.

Front PanelFigure 33 shows the front panel of V35B board.





F I G URE 33 FRO NT P A NE L O F T HE V35B B O A R D

1 2 3 4 5 6

156.7mm

2 0 . 6 m m

Table 38 lists the components on the front panel of V35B board.

T A B L E 38 CO M PO NENT S O N T HE F RO NT P A NE L O F V35B B O A R D


1 Captive fastener Used to fix the board in the chassis.

2 Ejector leverHelps to pull in/out the board into/from the chassisand also used to fix the board in the chassis.

3V.35 interface 1(PORT1)

Connector type: D-type 26-pin angle PCB soldersocket (female)

4V.35 interface 2(PORT2)

Connector type: D-type 26-pin angle PCB soldersocket (female)

5 Working statusindicator (RUN,ALM)

Indicate the running status of the board.

Flickering regularly (once per second) in greenmeans that the board is running normally.

6Alarm indicator(ALM)

Indicate the alarm status of the board.

OFF means that the board is running normally, ON inred means that the alarm occurs in the board.

E1/T1 Electrical Tributary Board

TypesAs an extension board of the main board, the E1/T1 electrical tributaryboard can process 21 channels of E1 or T1 signals. In terms of function,class the electrical tributary board into three types:

E1 electrical tributary board with interface impedance 75 Ω

E1 electrical tributary board with interface impedance 120 Ω

T1 electrical tributary board with interface impedance 100 Ω

These three kinds of the E1/T1 electrical tributary boards have the same

operating principle but different board identifiers on their front panels.





Table 39 lists the relations between the type and identifier of differentE1/T1 boards.

T A B L E 39 RE L A T I O N S B ET WEEN E1 /T1 EL E C T R I C A L T R I B U T A R Y B O A R D A N D ID

Board Type ID on Front Panel

E1 electrical tributary board

(Interface matching impedance 75 Ω)ET1-75

E1 electrical tributary board

(Interface matching impedance 120 Ω)ET1-120

T1 electrical tributary board

(Interface matching impedance 100 Ω)TT1

FunctionsThe E1/T1 electrical tributary board has the following functions:

Provides 21 E1 or T1 physical interfaces, which support HDB3 or B8ZSencoding/decoding.

Supports the mapping/demapping and multiplexing/demultiplexingbetween 21 E1/T1 signals and any timeslots in AU-4.

Supports the adding/dropping of timeslots with different serialnumbers, and supports independent adding/dropping of timeslots.

Supports remote online upgrade of board software and logic programs.In addition, the mapping path can be configured as AU-4 on the EMS.

Operating PrincipleFigure 34 illustrates the operating principle of the E1/T1 electrical tributaryboard.

F I G URE 34 OP E R A T I N G PRI NCI PL E O F T HE E1 /T1 E L E C T R I C A L T R I B U T A R Y B O A R D

InterfaceUnit

ControlUnit

ClockUnit

Service

ProcessingUnitE1/T1

Systemclock

Referenceclock

NCP

Cross-connectunit

Table 40 lists the functions of all units in E1/T1 electrical tributary board.





T A B L E 40 F UNCT I O NS O F UNI T S I N T HE E1 /T1 EL E C T R I C A L T R I B U T A R Y B O A R D

Unit Function

Clock UnitImplements the distribution of system clock for the clockneeded by the board.

Interface UnitImplements the code pattern conversion, jitter attenuationand HDB3 coding between E1/T1 analog signals and digitalsignals.

ServiceProcessing Unit

Implements the mapping/demapping between E1/T1payloads and VC-4, and processes pointers.

Control Unit


Implements the performance statistic, alarm detection,and the communication among modules.

Front PanelThe front panels of the electrical tributary boards are same with each

other except the identifiers on the panels. Take the ET1-75 board as anexample, the front panel is shown in Figure 35.

F I G URE 35 FRO NT P A NE L O F T HE EL E C T R I C A L T R I B U T A R Y B O A R D (ET1 -75 B O A R D )

156.7mm

2 0 6 m m

1 2 3 4 5

Rx+

Rx-

Tx+

Tx-

6

Table 41 describes the components on front panel.

T A B L E 41 CO M PO NENT S O N T HE F RO NT P A NE L O F ET1 B O A R D










3E1/T1 electricalinterface

(channel 1-12)

Connector type: 50-pin angle PCB solder femalesocket

This interface corresponds to the 1st to 12th channel

E1/T1 electrical ports from left to right.

Each E1/T1 signal occupies four pins with the signaldefinition Rx+, Tx+, Rx- and Tx- in order.

Note: “R” represents for “Receive” while “T”represents for “Transmit”. x=1, 2, 3, … 12.

4Runningindicator (RUN)

Indicate the running status of the ET1 board.

Flickering in green regularly (once per second)means that the ET1 board runs normally.


Indicate the alarm in the ET1 board.

OFF means that the ET1 board runs normally

ON in red means that the alarm occurs in theET1 board.

6

E1/T1 electricalinterface

(channel 13-21)

Connector type: 50-pin angle PCB solder femalesocket

This interface corresponds to the 13th to 21st channelE1/T1 electrical ports from left to right.

Each E1/T1 signal occupies four pins with the signaldefinition Rx+, Tx+, Rx- and Tx- in order.

Note: “R” represents for “Receive” while “T”represents for “Transmit”. x=13, 14, 15, … 21.

E3/T3 Electrical Interface Board(EIE3)

FunctionsEIE3 board has the following functions:

Provides three E3 or T3 physical interfaces, which support HDB3 orB3ZS code/decode

The rate of each interface can be configured as 45 M (T3) or 34 M (E3)

through the EMS.

Supports the remote online download of board software and logicprograms

Supports channel protection

Operating PrincipleThe operating principle of EIE3 board is as follows:





At the receiving side, the EIE3 board receives three E3/T3 PDH signals.After impedance matching and analog/digital conversion, the EIE3board sends the digital E3/T3 signals to the main board for mapping

and cross-connection.

At the transmitting side, the EIE3 board receives three E3/T3 digitalsignals from the main board. After the digital/analog conversion andimpedance matching, it sends the analog signals out from the board.

Front PanelThe front panel of EIE3 board is shown in Figure 36.

F I G URE 36 FRO NT P A NE L O F T HE EIE3 B O A R D

156.7mm

2 0 . 6 m m

1 2 3 4 5 6

Table 42 describes the components on the front panel of EIE3 board.

T A B L E 42 DESCRI PT I O NS O F C O M PO NENT S O N T HE FRO NT P A NEL OF EIE3 B O A R D


1Captivefastener

Used to fix the board in the chassis

2 Ejector leverHelps to pull in/out the board into/from the chassis andalso used to fix the board in the chassis

3Electricalreceiveinterface

Three electrical receive interfaces are available on thefront panel with the identifier “INn”, where n=1, 2, 3.

Connector type: 1.0/2.3 angle PCB solder female socket(with screw installed)

4Electricaltransmit

interface

Three electrical transmit interfaces are available on thefront panel with the identifier “OUTn”, where n=1, 2, 3.

Connector type: 1.0/2.3 angle PCB solder female socket(with screw installed)

5

Runningindicator(RUN)

Green indicator

Indicates the running status of EIE3 board

Flickering regularly (once per second): EIE3 board runs

normally.




Component DescriptionNo.

Red indicator

Alarmindicator

(ALM)

Indicates alarm of EIE3 board6

OFF: EIE3 board runs normally.

ON: Some alarm occurs in EIE3 board.

4-Channel Transparent-Transmission Fast Ethernet

Electrical Interface Board (TFEx4)FunctionsThe TFEx4 board has the following functions:

Provides four 10 M/100 M adaptive Ethernet electrical interfaces,

Supports 10 M/100 M, full duplex modes,

Supports auto-negotiation and forced working status,

Supports AutoMDIX (Auto-Medium Dependent Interface Crossover)function of network cables, i.e. auto-identification of crossover and

straight-through network cables.

In addition, the Ethernet electrical interfaces comply with the standardIEEE802.3.

Operating PrincipleThe operating principle of the TFEx4 board is as follows:

At the receiving side, the TFEx4 board receives four Ethernet signals.After pulse transform, then sends the signals to the main board

through the backplane for Ethernet service processing.

At the transmitting end, the TFEx4 board receives Ethernet dataframes from the main board. After pulse transform, the signals areoutput from the TFEx4 board.

Note: For the details of Ethernet service processing procedure, pleaserefer to the description of Ethernet interface unit in the section “MainBoard”.

Front PanelThe front panel of TFEx4 board is shown in Figure 37.





F I G URE 37 FRO NT P A NE L O F T HE TFEX4 B O A R D

1 2 3 4 5

156.7mm

2 0 . 6 m m

Table 43 lists the components on the front panel of the TFEx4 board.

T A B L E 43 CO M PO NENT S O N T HE F RO NT P A NE L O F TFEX4 B O A R D


1 Captivefastener

Used to fix the board in the chassis.


3LINK/ACKindicator

Yellow indicator

Used to indicate the connecting and running status ofcorresponding Ethernet electrical interface.

ON: The Ethernet interface is connected, that is,in the LINK status.

OFF: The Ethernet interface is not connected.

Flickering: Data packets are being received ortransmitted through the Ethernet interface.

4Ethernetelectricalinterface

Four Ethernet electrical interfaces are available on thefront panel, numbered with 5, 6, 7 and 8 respectivelyfrom left to right.


5Interfacespeedindicator

Green indicator

Used to indicate the data transmission speed ofcorresponding Ethernet electrical interface.

ON: The data transmission speed of the Ethernet

interface is 100 Mbit/s.

OFF: The data transmission speed of the Ethernetinterface is 10 Mbit/s.

Note: If the TFEx4 board reports an alarm, the M_ALM indicator on the main boardwill be ON continuously. For the description of the M_ALM indicator, please refer toTable 31 in the section “Main Board”.





4-Channel Transparent-transmission Fast EthernetOptical Interface Board (TFEx4B)

FunctionsThe TFEx4B board has the following functions.

It provides four Ethernet optical interfaces.

Ethernet optical interfaces comply with the standard IEEE802.3.

The interfaces works under the 100 M full duplex mode forcibly.

It supports hot-swappable SFP (small form-factor pluggable) opticalmodules. The interfaces on the board support optical modules for thetransmission distance 2 km (multi-mode 1310 nm) and 15 km (single-mode 1310 nm).

It can flexibly configure the optical modules for different transmissiondistance according to user’s requirements.

Operating PrincipleThe operating principle of the TFEx4B board is as follows:

At the receiving side, the TFEx4B board receives four Ethernet opticalsignals. It converts these optical signals into electrical signals and thensends them to the main board (SMC) through the backplane forEthernet service processing.

At the transmitting side, the TFEx4B board receives four Ethernetelectrical signals returned by the main board through the backplane. It

converts these electrical signals into optical signals and then sendsthem out from the board.

For the details of Ethernet service processing procedure, please refer to

the description of Ethernet interface unit in the section “Main Board”.

Front PanelThe front panel of TFEx4B board is shown in Figure 38.





F I G URE 38 FRO NT P A NE L O F T HE TFEX4B B O A R D

1 2 3 4

156.7mm

2 0 . 6 m m

Table 44 lists the components on the front panel of the TFEx4B board.

T A B L E 44 CO M PO NENT S O N T HE F RO NT P A NE L O F TFEX4B B O A R D




3Ethernet opticalinterface

Four Ethernet optical interfaces are available onthe front panel, numbered with 5, 6, 7 and 8respectively from left to right.

Supports hot-swappable SFP optical modules.

Supportable optical module type: 2 km (multi-mode 1310 nm) and 15 km (single-mode 1310nm) module.

4Indicator ofEthernet opticalinterface (LA)

Green indicator

Used to indicate the LINK/ACTIVE status ofcorresponding Ethernet optical interface.

ON: The Ethernet interface is connected, thatis, the interface is in the LINK status.

Flickering: Data packets are being received ortransmitted through corresponding Ethernet

optical interface.

Note: If the TFEx4B board reports an alarm, the M_ALM indicator on the mainboard will be continuously lit. For the description of the M_ALM indicator, pleaserefer to Table 31 in the section “Main Board”.

Audio Interface Board (AI)

FunctionsThe AI board provides analog audio interfaces without feed.

Each board provides six audio interfaces of two-line or four-line type,which are optional.

The electrical level of interface:





Transmitting end: 0 dB

Receiving end: 0 dB, -3.5 dB or -7 dB, optional

The interface type and the electrical level at the transmit end can be setthrough the EMS (ZXONM E300).

Operating PrincipleThe AI board uses idle overhead bytes in SDH frames to carry transparentanalog services. Table 45 lists the positions of the used overhead bytes inthe SDH frame.

T A B L E 45 PO SI T I O NS O F T HE US E D O V E R H E A D B YT ES I N T HE SDH FR A M E

Codes of theoverhead

bytes

Positions in theSDH frame

Codes of theoverhead bytes


R2C6 The 2nd row andthe 6th column

R3C9 The 3rd row andthe 9th column


R5C5 The 5th row andthe 5th column



Figure 39 illustrates the operating principle of the AI board.

F I G URE 39 OP E R A T I N G PRI NCI PL E O F T HE A I B O A R D

NCP unit

InterfaceProcessing

Unit

Control Unit

2/4-LineAudio

InterfaceSelection

Unit

2-LineAudio

InterfaceUnit

4-LineAudio

Interface

Unit

otherboard

Audio signal

Audio signal

The AI board provides non-feed 2-line or 4-line audio services in thefollowing way:

The interface processing unit separates and processes the overhead bytesreceived from the motherboard bus, and then outputs the analog audio

signal to the 2/4-line audio interface selection unit, which selects the audiointerface unit for the audio signal. After converting the analog audio signal,

the 2/4-line audio interface selection unit outputs the audio signal to theselected audio interface unit.





On the other hand, user’s audio service is input to the 2-line or 4-lineaudio interface unit, which forwards it to the 2/4-line audio interfaceselection unit. After conversion, the audio signal is output to the interface

processing unit by the 2/4-line audio interface selection unit. The interfaceprocessing unit combines the audio signal into system signal and outputs it

to the motherboard for further processing.

Table 46 lists each functional unit in the AI board.

T A B L E 46 F UNCT I O NS O F UNI T S I N T HE A I B O A R D

Unit Function

2-Line/4-Line AudioInterface Unit

Inputs/outputs audio signals.

2/4-Line Audio InterfaceSelection Unit

Selects 2-line or 4-line audio signals.

Interface ProcessingUnit

Implements A/D and D/A conversions of audiosignals, and the separation and combinationbetween system signals and audio signals.

Control Unit

Provides a channel for the AI board tocommunicate with the NCP unit.

Supports the communication among functionalunits in the AI board.

Front Panel

Figure 40 shows the front panel of the AI board.

F I G URE 40 FRO NT P A NE L O F A I B O A R D

156.7mm

2 0 . 6 m m

1 2 3 4 5

Table 47 lists the components on the front panel of AI board.

T A B L E 47 CO M PO NENT S O N T HE F RO NT P A NE L O F A I B O A R D










3 Audio interface

Provides six channels of 2-line/4-line audio interface.

Connector type: 26-pin D-type angle PCB solder

female socket (blade hole)

4Runningindicator (RUN)

Green indicator

Used to indicate the running status of the AI board.

Flickering regularly (once per second) means that theAI board runs normally.


Red indicator

Used to indicate alarm in the AI board.

OFF: The AI board runs normally.

ON: Some alarm occurs in the AI board.

Table 48 lists the signal definition of each pin in the audio interface.

T A B L E 48 S I G N A L D EF I N I T I O NS O F P I NS I N T HE A UDI O I NT ERF ACE

Pin Signal Definition Pin Signal Definition

1 ALINE1 14 BLINE1

2 ALINEG1 15 BLINEG1

3 ALINE2 16 BLINE2


5 ALINE3 18 BLINE3


7 ALINE4 20 BLINE4


9 ALINE5 22 BLINE5


11 ALINE6 24 BLINE6


13 PGND 26 PGNDNote:

ALINEn/ALINEGn (n=1-6) corresponds to the transmitting andreceiving signal lines of two-line audio interface, or transmitting signalline pair of four-line audio interface. There is no polarity requirementwhen they are connected.

BLINEn/BLINEGn (n=1-6) corresponds to receiving signal line pair offour-line audio interface. When corresponding to two-line audiointerface, they will not be used. There is no polarity requirement whenthey are connected.

PGND represents for protection ground.




The definition of transmitting and receiving is related to the AI board.

Orderwire Board (OW)FunctionsThe OW board supports orderwire telephone and low-speed datatransmission. In addition, it supports the trunk (TRK) function,implementing the orderwire communication between two SDH NEs withoutoptical connection, between SDH NE orderwire and the Public SwitchedTelephone Network (PSTN).

One orderwire telephone interface and six channels of RS232/RS485interface (or three channels of RS422 interface) are available on the OWboard.

Operating PrincipleThe OW board uses E1, E2, protection bytes and other idle overhead bytesto carry orderwire data and low-speed data. Table 49 lists the positions ofthe idle overhead bytes which are used to carry the low-speed data service.

T A B L E 49 PO SI T I O NS O F T HE I D L E O V E R H E A D B YT ES U SED T O C A RR Y TH E L O W -SPEED

D A T A SERVI CE

Codes of theoverhead

bytes


Codes of theoverhead bytes


R2C6 The2nd row andthe 6th column






Figure 41 illustrates the operating principle of the OW board.





F I G URE 41 OP E R A T I N G PRI NCI PL E O F T HE OW B O A R D

Control Unit

Orderwire Unit

Low-Speed DataProcessing Unit

Orderwire signal

Low-speed data signal

NCP unit

Table 50 describes the functions of each unit in the OW board.

T A B L E 50 UNI T S I N T HE OW B O A R D

Unit Function

Orderwire Unit

Implements the function of one channel two-line

analogue telephone interface.

Implements trunk (TRK) function.

Low-Speed DataProcessing Unit

Processes the services to or from 6 channels of RS232interface, 6 channels of RS485 interface or 3 channels ofRS422 interface.

Control Unit

Provides a channel for the AI board to communicate withthe NCP unit.

Supports the communication between modules in the OWboard.

Front PanelFigure 42 shows the front panel of the OW board.

F I G URE 42 FRO NT P A NE L O F T HE OW B O A R D

156.7mm

2 0 . 6 m m

1 2 3 4 5 6 7

Table 51 describes the components on the front panel of OW board.





T A B L E 51 CO M PO NENT S O N T HE F RO NT P A NE L O F OW B O A R D



2 Ejector leverHelps to pull in/out the board into/from thechassis and also used to fix the board in thechassis.

3RS232/RS485/RS422interface

Provides the service to or from 6 channels ofRS232 interface, 6 channels of RS485 interfaceor 3 channels of RS422 interface.

Connector type: 26-pin D-type angle PCB solderfemale socket (blade hole)

4 TRK interface (TRK) Connector type: RJ11 socket

5Orderwire telephoneinterface (PHONE)


6Running indicator(RUN)

Green indicator

Used to indicate the running status of the OWboard.

Flickering regularly (one time per second)means that the OW board runs normally.

7 Alarm indicator (ALM)

Red indicator

Used to indicate alarms in the OW board.

OFF: The OW board runs normally.

ON: Some alarm occurs in the OW board.

Table 52 lists the signal definitions of pins in the RS232/RS485/RS422interface.

T A B L E 52 S I G N A L D EF I N I T I O NS O F P I NS I N RS232/RS485/RS422 I NT ERF ACE

Pin Signal Definition

1 RS232_R1/RS422_R1+/RS485+_1

2 RS232_T1/RS422_R1-/RS485-_1

3 GND

4 RS232_R2/RS422_T1+/RS485+_2

5 RS232_T2/RS422_T1-/RS485-_2

6 GND

7 RS232_R3/RS422_R2+/RS485+_3

8 RS232_T3/RS422_R2-/RS485-_3

9 GND

10 RS232_R4/RS422_T2+/RS485+_4

11 RS232_T4/RS422_T2-/RS485-_4






Pin Signal Definition

12 GND

13 GND

14 RS232_R5/RS422_R3+/RS485+_5

15 RS232_T5/RS422_R3-/RS485-_5

16 GND

17 RS232_R6/RS422_T3+/RS485+_6

18 RS232_T6/RS422_T3-/RS485-_6

19 PGND

20 PGND

21 PGND

22 PGND

23 PGND

24 PGND

25 PGND

26 PGND

Note:

RS232_Tx (x=1-6) represents for the xth transmitting channel ofRS232 signal, while RS232_Rx (x=1-6) represents for the xth receivingchannel of RS232 signal.

RS422_Tx+ (x=1-3) represents for the positive polarity of the xth

transmitting channel, while RS422_Tx- (x=1-3) represents for thenegative polarity of the xth transmitting channel.

RS422_Rx+ (x=1-3) represents for the positive polarity of the xth receiving channel, while RS422_Rx- (x=1-3) represents for thenegative polarity of the xth receiving channel.

RS485+_x (x=1-6) represents for the positive polarity of the x th channel, while RS485-_x (x=1-6) represents for the negative polarity

of the xth channel.

GND represents for ground. PGND indicates that the pin is connectedto the protection ground in the socket.

Enhanced Smart Ethernet Board(SEC)

FunctionsThe SEC board has the following functions.




Provides 4 FE electrical interfaces at the user side. All of theseinterfaces meet the requirements of IEEE 802.3, and support the rateof 10 M/100 M, full duplex/half duplex modes as well as self-

negotiation and forced working status.

Provides 4 system ports at the system side. All of these ports supportthe convergence in 4:1 mode.

Supports the Ethernet flow control and the processing of flow control

frames as specified in IEEE 802.3x.

Supports Jumbo frames with the length of 9600 bytes.

Supports VLAN processing and Q in Q.

Supports learning and searching in Independent VLAN Learning (IVL)and Shared VLAN Learning (SVL) modes. The capacity of MAC address

table is 8 K.

Supports the special processing of L2 frames specified by users.

Supports Internet Group Management Protocol Snooping (IGMP)protocol.

Provides the Trunk function for ports and supports the protectionbased on Link Aggregation Control Protocol (LACP).

Provides the mirroring function for ports.

Supports Multi-Service Transport Platform (MSTP) protocol.

User ports support the access mode, TLS (Transparent LAN Services)mode, trunk mode and the transparent transmission mode. Thefunction of querying user ports’ alarm and performance messages isalso provided.

Operating PrincipleThe operating principle of the SEC board is as follows:

At the receiving side, the SEC board accesses 4 channels of Ethernetsignal. After L2 switching, these signals are converted into differentialsignals and then forwarded to the main board through the backplanefor Ethernet service signal processing.

At the transmitting side, cross-connect, de-map and de-capsulate theEthernet service signals in the main board firstly. Then send these

signals to the SEC board through the backplane. The SEC boardperforms L2 switching for these signals and finally outputs them.

Note: For the details of Ethernet service processing procedure, pleaserefer to the description of Ethernet interface unit in the section “MainBoard”.

Front PanelThe front panel of the SEC board is shown in Figure 43.





F I G URE 43 FRO NT P A NE L O F T HE SEC B O A R D

156.7mm

2 0 . 6 m m

1 2 3 4 5 6 7

Table 53 lists the components on the front panel of the SEC board.

T A B L E 53 CO M PO NENT S O N T HE F RO NT P A NE L O F SEC B O A R D


1Captivefastener

Used to fix the board in the chassis.

2 Ejector leverHelps to pull in/out the board into/from the chassisand also is used to fix the board in the chassis.

3LINK/ACKindicator

Green indicator

Used to indicate the connecting and running status ofcorresponding Ethernet interface.

ON: The Ethernet interface is connected, that is, inthe LINK status.

Flickering: Data packets are being received or

transmitted through the Ethernet interface.

4Ethernetelectricalinterface

Four Ethernet electrical interfaces are available on thefront panel, numbered with 5, 6, 7 and 8 respectivelyfrom left to right.


5Interfacespeedindicator

Green indicator

Used to indicate the data transmission speed ofcorresponding Ethernet electrical interface.

ON: The data transmission speed of correspondingEthernet interface is up to 100 Mbit/s after self-negotiation.

OFF: The data transmission speed ofcorresponding Ethernet interface is 10 Mbit/s.

6Runningindicator(RUN)

Green indicator

Used to indicate the running status of the SEC board.

Flickering regularly (once per second): The SEC boardruns normally.


Red indicator

Used to indicate alarm in the SEC board.

OFF: The SEC board runs normally.

ON: Some alarm occurs in the SEC board.





SHDSL Interface Board (SDB)G.SHDSL (Single-pair high-bit-rate Digital Subscriber Line) is atelecommunication technology corresponding to ADSL and VDSL. It notonly supports the symmetrical data rates of 2.048 Mbit/s but also has thelonger transmission distance than ADSL. Replacing E1 lines by G.SHDSL

can access the high-speed data services for transmission over longdistance.

The SHDSL interface board (SDB) can act as a circuit-based SHDSLTransceiver Unit-Central office (STU-C) equipment working in TDM (TimeDivision Multiplexing) mode. The SDB board enables ZXMP S200 toimplement the long-distance transmission of E1 data by cooperating withcorresponding SHDSL terminal equipment, moreover, the transmissiondistance is up to 2 km.

FunctionsThe SDB board has the following functions.

Provides up to 4 SHDSL data interfaces that meet the requirements ofITU-T G.991.2; supports two lines mode and symmetric PSD (PowerSpectral Density).

Supports the rate symmetry for the upward and downward data ofeach SHDSL.

Supports the payload transport rate of up to 2.048 Mbit/s.

Supports the framing of E1 signals. Supports retiming four E1 signals, which is set on the EMS.

Supports the remote download of board software.

Provides two loopback configuration points at VC12 and SHDSL portsfor convenient test. Each loopback point supports two loopback modes:terminal-side loopback and line-side loopback.

It is hot pluggable.

Operating PrincipleFigure 44 illustrates the operating principle of the SDB board.





F I G URE 44 OP E R A T I N G PRI NCI PL E O F T HE SDB B O A R D

Mapping/Demapping

Unit

Multiplexing/Demultiplexing

UnitInterface Unit

MicroprocessorUnit

Backplane SHDSL

signal

Table 54 lists the functions of each unit in the SDB board.

T A B L E 54 UNI T S I N T HE S DB B O A R D

Unit Function

Interface Unit Inputs/outputs SHDSL signals and completes the conversionbetween E1 signals and SHDSL signals.

Mapping/ De-mapping Unit

Performs the mapping/de-mapping of four E1 signals.

Multiplexing/De-multiplexingUnit

Implements the conversion between traffic buses, the relayoverlay of up/down traffic buses.

It also performs the de-framing of E1 signals in the updirection when the framing function is enabled, and theretiming of E1 signals.

MicroprocessorUnit

Performs the functions of system configuration, monitoringand management.

Front PanelThe front panel of the SDB board is shown in Figure 45.

F I G URE 45 FRO NT P A NE L O F T HE SDB B O A R D

156.7mm

2 0 . 6 m m

1 2 3 4 5 6 7

Table 55 describes the components on the front panel of SDB board.

T A B L E 55 CO M PO NENT S O N T HE F RO NT P A NE L O F SDB B O A R D


1Captive

fastenerUsed to fix the board in the chassis.








3Interfacealarmindicator

Yellow indicator

Used to indicate whether the interface has any alarm.

ON: Some alarm occurs in the interface.

OFF: No alarm occurs in the interface.

4SHDSLinterface

Four SHDSL interfaces are available on the front

panel, identified with PORT1, PORT2, PORT3 andPORT4 respectively from left to right.

Connector type: 8P8C angle PCB welding shieldedRJ45 socket with LED

Each RJ45 socket has eight metal contact sheets

numbered from left to right. The 4th and 5th metalsheets correspond to A and B lines of SHDSL interface.The other metal sheets are impending.

The cable used to connect SHDSL interface is a specialcable equipped with RJ45 plug.

5Lineconnectionindicator

Green indicator

Used to indicate whether the interface is connected.

ON: The interface is connected.

OFF: The interface is not connected.

6 Runningindicator(RUN)

Green indicator

Used to indicate the running status of the SDB board.

Flickering regularly (once per second): The SBD boardruns normally.


Red indicator

Used to indicate alarms in the SDB board.

OFF: The SBD board runs normally.

ON: Some alarm occurs in the SBD board.



C h a p t e r 3

Technical Specifications


Dimensions and weight of ZXMP S200 and its components

Power supply requirements

Environment requirements, including

Grounding and lightning protection requirements

Temperature and humidity requirements

Cleanness requirements

Application environment requirements

Earthquake proof performance

Reliability Indexes Electromagnetic compatibility (EMC) indexes

Eye pattern of optical launched signals

Technical specifications of optical interfaces and electrical interfaces

Clock timing and synchronization

Bit error indexes

Protection switching time

Compliant recommendations and standards of interfaces





Dimensions & WeightTable 56 lists the dimensions and weight of ZXMP S200 and itscomponents.

T A B L E 56 D I M ENSI O NS & W EI G HT O F CO M PO NENT S I N ZXM P S200

Equipment/ModuleDimension

(H × W × D, mm)

Weight

(kg)

ZXMP S200 subrack

(installed in cabinet)

49.5 (height) × 442.5 (width) × 240.0(depth)

2.900[Note1]

ZXMP S200 subrack

(installed on thedesktop or hung on

the wall)

49.5 (height) × 482.6 (width) × 240.0(depth)

3.000[Note 2]

PCB: 39 (width) × 27.2 (depth)× 229.9(height)

Total: 44.5 (height) x 33.1 (width) x 229.9(depth)

Fan module

Panel: 44.5 (height) x 33.1 (width) x 16.8(depth)

0.154

Dustproof module 44.5 (height) × 4.5 (width) × 226.0(depth)

-

Backplane PCB: 418.5 (width) x 38.3 (depth)ｘ３.0

(height)-

PWA/PWB/PWC PCB: 76 (width) x 210 (depth) x 2 (height)

Total:

40.1 (height) x 84.5 (width) x 206 (depth)(ejector lever not counted)

40.1 (height) x 84.5 (width) x 227 (depth)(ejector lever counted)

Panel: 40.1 (height) x 84.5 (width) x 12.3(depth)

Main board PCB: 306 (width) x 200 (depth) x 2(height)

Panel: 40.1 (height)ｘ319.1 (width) x 25(depth) (the length of captive screw not

counted)

40.1 (height) ｘ 319.1 (width) x 12.3

(depth) (the length of captive screwcounted)

Plug-in boards PCB: 149 (width) x 200 (depth) x height)

Panel:

20.6 (height) x 156.7 (width) x 25 (depth)( the depth of captive screw counted)

20.6 (height) x 156.7 (width) x 12.3(depth) ( the depth of captive screw not

counted)

Refer toTable 58.




Chapter 3 Technical Specifications

Note 1: The weight of subrack includes that of the backplane. And the subrackdimensions include those of the removable feet washer. When installing the

subrack in the cabinet, remove the feet washer if necessary.

Note 2: Refer to the subrack that is installed in ZTE transmission cabinet, IECstandard cabinet or hung on the wall. The weight of subrack includes that of both

backplane and installation hug. The dimensions include those of removable feetwasher.

Power Supply Requirements

Voltage RangeZXMP S200 supports three kinds of power supply:

-48 V DC power supply (PWA)

+24 V DC power supply (PWB)

110 V/220 V AC power supply (PWC)

Table 57 lists the allowable fluctuation range for each kind of input voltage.

T A B L E 57 A L L O W A B L E VO L T A G E FL U C T U A T I O N R A NG E OF ZXM P S200

Power Module Input Voltage Fluctuation Range

PWA -48 V DC -72 V to -36 V

PWB +24 V DC +18 V to +36 VPWC 110 V/220 V AC 90 V to 290 V, 45 Hz to 65 Hz

Power Consumption and WeightTable 58 lists the power consumption and the weight of each board.

T A B L E 58 PO WER CO NSUM PT I O N AND W EI G HT O F E A C H B O A R D A V A I L A B L E F O R ZXM P

S200

Board Code

Max. PowerConsumptio

n underNormal

Temperature (25 )(W)

Max. Power

Consumptionunder High

Temperature(45 )(W)

Weight

(kg)Remark

SMBxD75E0 17.33 17.85 0.830

SMBxD75T0 18.83 19.39 0.830

SMBxF75E0 19.50 20.09 0.870

SMBxF75T0 19.54 20.13 0.870

SMB mainboard

SMBxD120E 18.50 19.06 0.830

Descriptions of themainboardrefer toTable 10.






Board Code


n underNormal

Temperatur

e (25 )(W)

Max. PowerConsumptionunder High

Temperature

(45

)(W)

Weight

(kg)Remark

0

SMBxD120T0

19.50 20.09 0.830

SMBxF120E0

19.84 20.44 0.790

SMBxF120T0

20.18 20.79 0.870

SMBxD100E0

17.49 18.01 0.830

SMBxD100F0

19.17 19.75 0.830

SMBxF100E0

19.17 19.75 0.870

SMBxF100F0

19.84 20.44 0.870

SMCxD75E 19.50 20.09 0.760

SMCxF75E 20.85 21.48 0.800

SMCxD75T 20.18 20.79 0.760

SMCxF75T 21.52 22.17 0.800

SMCxD120E 19.17 19.75 0.760

SMCxF120E 19.84 20.44 0.800

SMCxD120T 19.84 20.44 0.760

SMCxF120T 20.51 21.13 0.800

SMCxD100E 19.92 20.52 0.760

SMCxF100E 20.70 21.32 0.800

SMCxD100T 21.07 21.70 0.760

SMC mainboard

SMCxF100T 21.85 22.51 0.800

Descriptions of themainboardrefer toTable 10.

2 M bit/sBITSinterfaceboard

IBB 0.43 0.44 0.020

2 MHzBITSinterfaceboard

IBBZ 0.43 0.44 0.025

BITSinterfaceboardinstalledon the

PCB ofthe mainboardprovidesthe clockinterface.

-48 Vpower

board

PWA7.49 7.71 0.718

Efficiencyof PWA

≥75%





Board Code


n underNormal

Temperatur

e (25 )(W)


Temperature

(45

)(W)

Weight

(kg)Remark

+ 24 V

powerboard

PWB 8.14 8.38 0.700

EfficiencyofPWB≥72%

110 V/220V powerboard

PWC 9.11 9.38 0.710

EfficiencyofPWC≥70%

2-channel

V.35 databoard

V35B 2.21 2.28 0.250 -

21-channel E1electricaltributaryboard (75ohm)

ET1-75 8.69 8.95 0.294 -

21-channel E1

electricaltributaryboard (120

ohm)

ET1-120 8.70 8.96 0.290 -

21-channel T1electricaltributaryboard (100

ohm)

TT1-100 11.28 11.62 0.300 -

3-channel

E3/T3electricalinterfaceboard

EIE3 2.16 2.20 0.290 -

4-channeltransparent-transmission fastEthernetelectricalinterfaceboard

TFEx4 0.86 0.89 0.220 -

4-channel

transparent-transmission fast

TFEx4B 2.59 2.67 0.294

The typesof theopticalmoduleare S-1.1,





Board Code


n underNormal

Temperatur

e (25 )(W)


Temperature

(45

)(W)

Weight

(kg)Remark

Ethernetopticalinterfaceboard

L-1.1 orL-1.2,and theLC/PCopticalinterfacesareadopted.

Orderwireboard

OW 3.50 3.61 0.282 -

Audio

board AI 1.78 1.83 0.368 -

4xFEenhanced

smartEthernetboard

SEC 9.60 9.89 0.270 -

SHDSLinterfaceboard

SDB 3.94 4.06 0.300 -

Fanmodule

FAN 3.46 3.56 0.154 -

The overall power consumption of ZXMP S200 depends on its configuration.

If SMB main board is equipped, Table 59 lists the power consumption

for the typical configuration of ZXMP S200, and Table 60 lists themaximum power consumption of ZXMP S200.

T A B L E 59 PO WER CO NSUM PT I O N F O R T HE T Y P I C A L CO NF I G URAT I O N O F ZXM P S200

( S M B )

Component Name Component ID Unit Number

ZXMP S200 subrack (including fanmodule and motherboard)

- Set 1

System Main Board with Four opticalinterfaces and Twenty-one 75 Ω E1interfaces

SMBxF75T0 Piece 1

Fan module FAN Set 1

-48 V power module PWA Piece 1

2 Mbit/s BITS interface board IBB Piece 1

Total power consumption (w) 29.96




T A B L E 60 M A X I MUM PO WER CO NSUM PT I O N O F ZXM P S200 (SM B)



- Set 1

System Main Board with Four opticalinterfaces and Twenty-one 120 Ω E1interfaces

SMBxF120T0 Piece 1




21-channel E1 electrical tributaryboard (75 ohm)

ET1-75 Piece 1


If SMC main board is equipped, Table 61 lists the power consumptionfor the typical configuration of ZXMP S200, and Table 62 lists themaximum power consumption of ZXMP S200.

T A B L E 61 PO WER CO NSUM PT I O N F O R T HE T Y P I C A L CO NF I G URAT I O N O F ZXM P S200

(SM C)

Component Name Component ID Unit NumberZXMP S200 subrack (including fanmodule and motherboard)

- Set 1

System Main Center with Four opticalinterfaces and Twenty-one 75 Ω E1interfaces

SMCx75T Piece 1





T A B L E 62 M A X I MUM PO WER CO NSUM PT I O N O F ZXM P S200 (SM C)



- Set 1

System Main Center with Four opticalinterfaces and Twenty-one 120 Ω E1interfaces

SMCxF120T Piece 1










21-channel E1 electrical tributaryboard (75 ohm)

ET1-75 Piece 1


Environment RequirementsThe environment requirements of ZXMP S200 include:

Grounding and lightning protection requirements

Temperature and humidity requirements

Cleanness requirements

Application environment requirements

Grounding and Lightning Protection

RequirementsRequirements for Grounding System in Equipment Room

All PCBs of boards and the cover of ZXMP S200 must be connected tothe protection ground in the equipment.

If the equipment room adopts the joint grounding mode, the followingrequirements should be met:

The grounding resistance of the central equipment room should beno more than 1 Ω.

The grounding resistance of a far-end equipment room should be

no more than 5 Ω.

If the equipment room adopts the independent grounding mode, thegrounding resistances should meet the requirements in Table 63.

T A B L E 63 GRO UNDI NG RE S I S T A N C E R EQ UI REM ENT S I N I NDEPENDENT G RO UNDI NG

MO D E

Grounding Resistance Value (Ω)

AC working ground resistance ≤4

DC working ground resistance ≤4

Security protection ground resistance ≤4





Grounding Resistance Value (Ω)

Lightning protection ground resistance ≤4

Copper busbar with cross section area of no less than 120 mm2 should

be used as earth busbar or earth bar. Galvanized flat steel with thedimensions equal to or more than 40 mm×4 mm can also be used.

Be sure to use copper flanges, bolts and spring washers to fasten theconnections between equipment grounding cables and the earth busbaror earth bars. One bolt can only be used to connect one grounding

cable. Determine the joint grounding cable size and the number ofscrews according to the quantity of equipment’s grounding cables inthe equipment room.

Requirements for Grounding and Lightning Protection ofPower SupplyTable 64 lists typical power supply lightning protection classes.

T A B L E 64 T Y P I C A L PO WER SU P P L Y L I G HT NI NG P RO T ECT I O N CL A S S I F I C A T I O N

Class ParameterLocation of Lightning Protection

Circuit

Class B 40 kA (8 μs /20 μs) AC power distribution board/unit

Class C 20 kA (8 μs/20 μs) DC power cabinet

Class D6000 V (combinationwave)

-48 V power rectifier

ZXMP S200 must meet the following power supply lightning protectionrequirements.

A central equipment room should meet the following lightningprotection requirements:

AC power cables should be led into the cable vault or power room

underground.

Install Class B lightning protection unit in the AC power distributionboard/unit or at the entrance of it. The unit is grounded byconnecting the floor earth bar through the AC power distribution

board/unit.

Install Class C lightning protection unit in the DC power cabinet,being grounded by connecting the floor earth bar through the DCpower cabinet.

Install Class D lightning protection unit in the rectifier, being

grounded by connecting the floor earth bar through the rectifierand the DC power cabinet.

A far-end equipment room should meet the following lightningprotection requirements:

AC power cables should be led into the far-end equipment room

underground.




Connect Class B lightning protection unit to the protectiongrounding bar in the equipment room through the AC powerdistribution board/unit.

Connect Class C lightning protection unit to the protection

grounding bar in the equipment room through the DC powercabinet.

Connect Class D lightning protection unit to the protection

grounding bar in the equipment room through the rectifier and theDC power cabinet.

Connect the -48 V ground of the DC power cabinet to the working

grounding bar in the equipment room.

If there is no working grounding bar in the equipment room,connect it to the protection grounding bar instead.

Figure 46 illustrates the connection for power supply lightning

protection in a far-end equipment room.

F I G URE 46 PO WER SU P P L Y L I G HT NI NG PRO T ECT I O N CO NNECT I O N I N A F A R -E ND

EQ UI PM ENT RO O M

AC DC

AC Power DistributionBoard/Unit

DC Power Cabinet

Class B Class C

Protection Grounding BarWorking Grounding Bar

-48V

-48V GND

Since the AC power distribution board/unit and the DC powercabinet in the same equipment room, the distance between Class Band Class C lightning protection units should meet the followingdecoupling distance requirements:

When the protection grounding bar is laid independently, thedistance between Class B and Class C lightning protection units

should no less than 5 m.

When the protection grounding bar and the power cords are laid inparallel, the distance between Class B and Class C lightning

protection units should no less than 15 m.

If the required decoupling distance can not be satisfied due to somerestriction in the equipment room, additional decouplinginductance(s) should be installed before the Class C lightning

protection unit by 1.5μH/m.

Bunched copper wires with cross section area no less than 35 mm2

should be used as the grounding cables of the Class B lightning





protection unit (AC power distribution board/unit), and theprotection grounding cables and working grounding cables of theClass C lightning protection unit (DC power cabinet), which are

connected to the protection grounding bar in the equipment room.Keep the length of grounding cables as short as possible.

Requirements for Grounding and Lightning Protection ofZXMP S200

The requirements for the lightning protection of subrack, indoorcabinet and transmission outdoor cabinet where ZXMP S200 is installedare as follows:

For ZXMP S200 installed in an indoor cabinet or transmissionoutdoor cabinet, its protection grounding wire should be connected

to the protection grounding busbar in the cabinet.For the indoor cabinet and transmission outdoor cabinet, their

protection grounding adopt bunched copper wires whose crosssection area is no less than 16 mm2. The protection groundingwires are connected to the earth busbar or earth bar (includingcolumn-head power cabinet).

If the equipment uses DC power supply, its protection groundshould be short circuited with the ground of DC power supply and

then connected to the protection grounding busbar in the indoorcabinet or transmission outdoor cabinet.

It is forbidden to lead the protection grounding wire of the

equipment out of the cabinet and connect it to the earth busbar orearth bar (including column-head power cabinet) in the equipment

room directly.

The requirements for the lightning protection of ZXMP S200 installedon desktop or mounted on wall are as follows:

If ZXMP S200 uses DC power supply, short circuit its protection

ground with the ground of DC power supply first, and then connectit to the earth busbar or earth bar (including column-head powercabinet) in the equipment room with bunched copper wires withcross section area no less than 4 mm2.

For the wall-mounted ZXMP S200, it should be mounted on the

inner wall of the equipment room. Keep the expansion screws usedto fix the brackets away from reinforcing steel bars inside the wallas far as possible.

Requirements for Grounding and Lightning Protection ofOther Equipment

Implement strict equipotential connections among equipmentconnected to ZXMP S200, such as DC power cabinet, switch and digitaldistribution frame (DDF).





The protection grounds of DC power cabinet, switch and DDF should beconnected to the earth busbar in the equipment room with bunchedcopper wires with cross section area no less than 35 mm2.

Other metal equipment and components in the equipment room, such

as the monitoring unit, metal door and windows and AC powerdistribution unit, should be connected to the nearby earth busbar inthe equipment room with bunched copper wires with appropriate crosssection area.

Before being led into a central equipment room, external optical cablesin the cable vault must be connected to the earth busbar through lead-in connection devices.

In a far-end equipment room, external optical cables must be

connected to the protection grounding busbar or outdoor lightningprotection ground through optical termination box, which is connectedto the protection grounding busbar or earth network with bunched

copper wires with cross section area no less than 16 mm

2

.

Temperature/Humidity RequirementsZXMP S200 should operate in the environment meeting the following

temperature and humidity requirements, as listed in Table 65.

T A B L E 65 T E M P E R A T U R E A N D H UM I D I T Y R EQ UI REM ENT S O F ZXMP S200

Item Requirement

Working temperature (on the desktop, in the indoor

cabinet or on the wall)

-5°C to +50°C

Working temperature (in the outdoor functionalcabinet)

-5°C to +45°C

Working temperature (in the field power supplycabinet)

-40°C to +45°C

Performance-guaranteedindex

10% to 95%Relative humidity

Operation-guaranteed index 5% to 95%

Cleanness RequirementsThe cleanliness represents the requirement for the dust and harmful gas inthe air. The equipment room where ZXMP S200 works should meet thefollowing cleanliness requirements.

There is no explosive, conductive, magnetic-conductive and corrosivedust in the equipment room.

The concentration of dust with dimension above 5 µm should be nomore than 3×104 particles/m3.

There is no harmful gas which may destroy metal and insulation, suchas SO2, NH3, H2S and NO2.





Table 66 lists the requirements for the concentration of harmful gas inthe equipment room.

T A B L E 66 REQ UI REM ENT S F O R C O NCENT RAT I O N O F H A R M F UL G A S I N EQ UI PM ENT

R O OM

ConcentrationHarmful Gas

Average (mg/m3) Maximum (mg/m3)

SO2 <0.2 <1.5

H2S <0.006 <0.03

NO2 <0.04 <0.15

NH3 <0.05 <0.15

Cl2 <0.01 <0.3

Keep the equipment room clean, and confirm that the door andwindows are sealed.

Application Environment RequirementsAccording to China national standard GB/T 4798 and the application scope

of ZXMP S200, the application environment requirements are listed inTable 67.

T A B L E 67 A P P L I C A T I O N ENVI RO NM ENT REQ UI REM ENT S O F ZXMP S200

Application Environment Condition Class Time Limit

Storage 1K5/1Z1/1B2/1C2/1S3/1M3 180 days

Transportation 2K4P/2B2/2C2/2S3/2M3 30 days

Use 3K5/3Z2/3Z7/3B2/3C2/3S2/3M3 20 years

Note: For the meaning of the environment class in the above table, please refer tothe China national standard GB/T 4798 Environmental Conditions Existing in the Application of Electric and Electronic Products, which is an equivalent standard ofIEC 60721.

Earthquake-Proof PerformanceThe earthquake proof performance meets the requirements specified inthe following China standards for telecommunication industry:

YD 5091-2000 Specification for Seismic Test of Optical TransmissionsEquipment

YD 5083-99 Specification for Seismic Test of TelecommunicationsEquipment

ZXMP S200 meets the requirements during the seismic test with the

magnitude 8.





Reliability IndexesThe reliability indexes of ZXMP S200 are listed in Table 68.

T A B L E 68 RE L I A B I L I T Y I NDEXES O F ZXMP S200

Item Index

Mean Time Between Failures (MTBF) ≥ 20000 hours

Mean Time Between Critical Failures (MTBCF) ≥ 40000 hours

Service life ≥ 20 years

Electromagnetic CompatibilityCriterion Performance A

At digital signal ports: The equipment operates normally under the

test. After each single disturbance, the bit error count does notexceed the bit error number allowed during normal operation. ForZXMP S200, the allowable bit error number is zero, which means nobit error occurs.

At analog audio signal ports: Continuous connections are kept

under the test. The noise measured with 600 Ω impedance fromthe equipment under test does not exceed -40 dBm.

Performance B

At digital signal ports: Temporary function degradation caused bythe disturbance occurs under the test. However, the function ofequipment recovers automatically after the disturbance beingcancelled. Under the disturbance, there is no loss of the framequeue and synchronization. No alarm occurs after electromagneticdisturbance.

At analog audio signal ports: Continuous connections are keptunder the test. The connection interruption is allowable under thesurge test. After the disturbance finishes, the performance ofequipment under test should recover.

Performance C

Temporary function degradation caused by the disturbance occursunder the test. After the disturbance being cancelled, the function ofequipment can recover automatically, or recover after being resetmanually.





Immunity Performance Electrostatic discharge (ESD) immunity

It complies with the standard of IEC61000-4-2.

Table 69 shows the ESD immunity indices.

T A B L E 69 ESD IM M UNI T Y INDI CES

Contact Discharge Air Discharge Examination Criterion

6 kV 8 kV Performance B

Radiated Susceptibility (RS)

The radiated susceptibility of ZXMP S200 complies with the standard

IEC61000-4-3, as listed in Table 70.

T A B L E 70 R A D I A T ED SU S C E P T I B I L I T Y INDI CES

Frequency Range: 80 MHz - 1000 MHz, 1.4 GHz – 2 GHz

Electric FieldIntensity

Amplitude Modulation Criterion

10 V/m 80% AM at 1 kHz rate Performance A

Electrical Fast Transient (EFT) immunity

The EFT immunity of ZXMP S200 complies with the standard

IEC60001-4-4.

Table 71 lists the EFT immunity indices on DC power supply ports.

T A B L E 71 EFT I M M UNI T Y I NDI CES O N DC PO WER S U P P L Y PO RT S

Generator WaveformVoltage Repetition

RateCriterion

5 ns/50 ns ±1 kV 5 kHz Performance B

Table 72 lists the EFT immunity indices on signal and control ports(with capacitive coupling clamp).

T A B L E 72 EFT I M M UNI T Y I NDI CES O N S I G N A L A N D CO N T R O L PO RT S

Generator WaveformVoltage Repetition

RateCriterion






Table 73 lists the EFT immunity indices on AC power supply ports(direct coupling).

T A B L E 73 EFT I M M UNI T Y I NDI CES O N A C PO WER S U P P L Y PO RT S

Generator WaveformVoltage

RepetitionRate

Criterion


Lightning strike and surge immunity

The lightning strike and surge immunity of ZXMP S200 complies with

the standard IEC61000-4-5.

Table 74 lists the lightning surge immunity indices of DC power supply.

T A B L E 74 DC PO WER SU P P L Y L I G HT NI NG S URG E IM M UNI T Y INDI CES

Generator Waveform: 1.2 μs/50 μs (8 μs/20 μs)

Test Mode SourceImpedance

Test Voltage Criterion

Line to line 2 Ω ±1 kV Performance B

Line to ground 12 Ω ±2 kV Performance B

Table 75 lists the lightning surge immunity indices of AC power supply.

T A B L E 75 A C PO WER SU P P L Y L I G HT NI NG S URG E IM M UNI T Y INDI CES




Line to line 2 Ω ±2 kV Performance B


Table 76 lists the surge immunity indices of outdoor signal line.

T A B L E 76 O UT DO O R S I G N A L L I NE SURG E IM M UNI T Y I NDI CES

Generator Waveform: 10 μs/700 μs




Table 77 lists the surge immunity indices of signal line with length

more than 10 m.





T A B L E 77 S I G N A L L I NE SURG E IM M UNI T Y I NDI CES





Conducted Susceptibility (CS)

The conducted susceptibility of ZXMP S200 complies with the standardIEC61000-4-6, as listed in Table 78.

T A B L E 78 CO NDUCT ED SU S C E P T I B I L I T Y INDI CES

Frequency Range: 0.15 MHz - 80 MHz

Test Intensity Amplitude Modulation Criterion

3 V 80% AM at 1 kHz rate Performance A

AC voltage transient dropout immunity

This item is only applicable to the PWC board when AC power issupplied to ZXMP S200. The immunity satisfies the standard IEC1000-4-11.

Table 79 lists the AC voltage transient dropout immunity indices of thePWC board.

T A B L E 79 A C VO L T A G E T R A N S I E N T DRO PO UT IM M UNI T Y I NDI CES

Dropout Ratio Duration (ms) Criterion

30% 10 Performance B

30% 500 Performance C

60% 100 Performance C

>95% 50 Performance B

>95% 5000 Performance C

Disturbance CharacteristicsDisturbance characteristics include conducted emission characteristic and

radiated emission characteristic.

The corresponding indices of ZXMP S200 satisfy the Class B specified inthe standard CISPR 22.

Conducted emission

Table 80 lists the conducted emission indices at DC/AC power ports.





T A B L E 80 C O NDUCT ED EM I SSI O N INDI CES A T D C / A C PO WER PO RT S

Voltage (dB μV)Frequency Range (MHz)

Quasi-peak Average

0.15 - 0.5 79 660.5 - 30 73 60

Table 81 lists the conducted emission indices at communication/controlports.

T A B L E 81 C O NDUCT ED EM I SSI O N INDI CES AT CO M M UNI CAT I O N /CO N T R O L PO RT S

Voltage (dB μV) Current (dB μA)Frequency Range(MHz) Quasi-peak Average Quasi-peak Average

0.15 - 0.5 97 – 87 84 - 74 53 - 43 40 - 30

5 - 30 87 74 43 30

Radiated emission

Table 82 lists the radiated emission indices of ZXMP S200.

T A B L E 82 R A D I A TE D EM I SSI O N I NDI CES O F ZXM P S200

Quasi-Peak Limit (dB μV/m)Frequency Range (MHz)

Test Distance: 10 m Test Distance: 3 m

30 - 230 40 50

230 - 1000 47 57

Eye Pattern of Optical LaunchedSignalsThe eye patter of ZXMP S200 meets the specification in ITU-T G957, asshown in Figure 47.





F I G URE 47 EY E P A T T ERN O F OP T I C A L L A UNCHE D S I G N A L S

Time

1

1＋y1

UIx3 x4x2x1

y1

-y1

0

0.5

y2

1Mean level of logical "1"

Mean level of logical "0"

A m p l i t u d e

Table 83 lists the parameters specifying the eye diagram.

T A B L E 83 P A R A M ET ERS O F TRANSM I T T I NG S I G N A L E YE P A T T ERN

ValueParameter

STM-1 STM-4

x1/x4 0.15/0.85 0.25/0.75

x2/x3 0.35/0.65 0.40/0.60

y1/y2 0.20/0.80 0.20/0.80

Optical Interfaces SpecificationsTable 84, Table 85, Table 86 and Table 87 list the specifications of opticalinterfaces in ZXMP S200.

T A B L E 84 SPECI F I CAT I O NS O F STM -1 O P T I C A L INT ERF ACES

Performancetype

Performanceitem

Unit Specification

Code pattern Line code pattern - Scrambled NRZ code

Nominal rate kbps 155 520

Optical module - S-1.1 L-1.1 L-1.2

Operating wavelength range nm1261-1360

1280-1335

1480-1580

Transmission distance km ≤15 ≤40 ≤80

Maximum mean optical launchedpower

dBm -8 -8 0

Minimum mean optical launchedpower

dBm -15 -15 -5






Performancetype

Performanceitem

Unit Specification

Worst sensitivity dBm -28 -34 -34

Minimum extinction ratio dB 8.2 10 10

Minimum overload point dBm -8 -8 -10

UI0.50 (the filter for testing: 500Hz-1.3 MHz)

Output jitter

UI0.10 (the filter for testing: 65kHz-1.3 MHz)

Input jitter and wandertolerance

-Meets the requirement for STM-1level network interface specified inITU-T G.825

Maximum frequencyoffset of optical input

interface

ppm ±20 ppm

Maximum AIS rate offsetof optical outputinterface

- Rate offset within ±20 ppm

1. The line code pattern of optical interfaces complies with the specification aboutthe synchronous scrambler in ITU-T G.707.

2. For STM-1 interface, 1 UI=6.43 ns

3. 1 ppm=1×10-6

Table 85 lists the specification of STM-4 optical interfaces in ZXMP S200.

T A B L E 85 SPECI F I CAT I O N O F STM -4 OP T I C A L IN T E R F A C E S

Parametertype

Performance item Unit Specification

Code pattern Line code pattern - Scrambled NRZ code

Nominal rate kbps 622 080

Optical module - S-4.1 S-4.1 S-4.1

Operating wavelength range nm1261-1360

1280-1335

1480-1580

Transmission distance km ≤15 ≤40 ≤80

Maximum mean optical launchedpower

dBm -8 2 2

Minimum mean optical launchedpower

dBm -15 -3 -3

Worst sensitivity dBm -28 -28 -28

Minimum extinction ratio dB 8.2 10 10

Minimum overload point dBm -8 -8 -8

UI0.50 (the filter for testing: 1000Hz- 5 MHz) Output jitter

UI 0.10 (the filter for testing: 250





Parametertype

Performance item Unit Specification

kHz-5 MHz)

Input jitter and wandertolerance -

Meets the requirement for STM-1,

STM-4 level network interfacespecified in ITU-T G.825

Maximum frequency offset ofoptical input interface

ppm ±20

Maximum AIS rate offset ofoptical output interface

- Rate offset within ±20 ppm

1. The line code pattern of optical interfaces complies with the specification aboutthe synchronous scrambler in ITU-T G.707.

2. 1 UI=1.61 ns

3.1 ppm=1×10-6

T A B L E 86 SPECI F I CAT I O NS O F STM -4 S I N G L E F I B E R W I T H D U A L D I RECT I O NS OP T I C A L

INT ERF ACES

Items Unit Performance Specifications

Module Name - Optical module A

achieving theapplication of singlefiber with bi- direction

Optical module B achieving

the application of singlefiber with bi- direction

Transmissiondistance

km 20 20

Transmitting

optical wavelength

nm 1550 1310

Receiving opticalwavelength

nm 1310 1550

Mean outputtingoptical power

dBM -15 - -8 -15 - -8

Receiversensitivity

dBm ≤ -28 ≤ -28

Module A and module B should work cooperatively. For example, in order toachieve the application of single fiber with bi-direction, if a site uses the optical

module A (or optical module B), then the opposite site should use the opticalmodule B (or optical module A) correspondingly.

T A B L E 87 SPECI F I CAT I O NS O F 100 MB I T / S ET HERNET O P T I C A L I NT ERF ACES


Module Name - 100Base-FX, multiplemode

100Base-FX, singlemode

Transmissiondistance

km 2 15

Mean launchedoptical power

dBM -15 - -8 -15 - 0

Minimum

extinction ratio

dB 8.2 10






Receiversensitivity

dBm ≤ -28 ≤ -28

Receiver overloadoptical power

dBm -8 -10

Electrical InterfacesSpecifications

Specification of STM-1 Electrical

InterfacesTable 89 lists the specifications of STM-1 electrical interfaces.

T A B L E 88 SPECI F I CAT I O NS O F STM -1 EL E C T R I C A L IN T E R F A C E S

Parameter Specification

Nominal rate 155520 kbit/s

Code pattern CMI [Note 1]

Allowable attenuation atoutput port (square-rootattenuation)

0-12.7 dB, 78 MHz

Allowable frequency offsetat input port

> ±20 ppm[Note 2]

Bit ratio tolerance at outputport

< ±20 ppm

Mapping jitter at tributaryport

f1-f4: 0.4UI

f3-f4: 0.075UI

Combined jitter Meets the requirement specified in ITU-T G.783

Pulse shape at output port Complies with the mask specified in ITU-T G.703

Test load impedance 100 Ω Input jitter and wandertolerance

Meet the requirement specified in ITU-T G.824

[Note 1]: CMI: Code Mark Inversion

[Note 2]: 1 ppm= 10-6, for 1544 kbit/s interface, 1UI=648 ns.

Specification of E1 Electrical InterfacesTable 89 lists the specifications of E1 electrical interfaces.




T A B L E 89 SPECI F I CAT I O NS O F E1 EL E C T R I C A L I N T E R F A C E S


Nominal rate 2 048 kbit/s

Code pattern HDB3 [Note 1]Allowable attenuation at

input port (square-rootattenuation)

0-6 dB, 1024 kHz


> ±50 ppm [Note 2]


< ±50 ppm

f1 High-pass, 20 Hz, 20 dB/dec

f3 High-pass, 18 kHz, 20 dB/decFiltercharacteristic

f4 Low-pass, 100 kHz, -60 dB/dec

Mapping jitter at outputport

f1-f4: 1.5UI [Note 3]

f3-f4: 0.2UI


f1-f4: 0.4UI

f3-f4: 0.075UI



Test load impedance 75 Ω or 120 Ω

Anti-interference capabilityat input port (SNR)

18 dB



Outputport

51 kHz to 102 kHz, ≥6 dB

102 kHz to 3072 kHz, ≥8 dB Reflectanceattenuation

Input port

51 kHz to 102 kHz, ≥12 dB

102 kHz to 2048 kHz, ≥18 dB

2048 kHz to 3072 kHz, ≥14 dB

[Note 1]: HDB3: High Density Bipolar of order 3

[Note 2]: 1 ppm= 10-6

[Note 3]: 1UI=488 ns

Specification of T1 Electrical InterfacesTable 90 lists the specification of T1 electrical interfaces.

T A B L E 90 SPECI F I CAT I O N O F T1 EL E C T R I C A L IN T E R F A C E S



Code pattern AMI, B8ZS







Allowable attenuation atinput port (square-rootattenuation)

0-6 dB, 772 kHz


> ±32 ppm

Bit ratio tolerance atoutput port

< ±32 ppm


f3 High-pass, 8 kHz, 20 dB/decFiltercharacteristic


Jitter at output portf1-f4: 5.0UI

f3-f4: 0.1UI

Mapping jitter at tributaryport f1-f4: 0.7UI

f3-f4: 0.1UI





Test load impedance 100 Ω

Note:

1. AMI: Alternate Mark Inversion; B8ZS: Bipolar with 8-Zero Substitution

2. 1 ppm= 10-6

3. 1UI=648 ns

Specification of E3 Electrical InterfacesThe specification of E3 electrical interfaces is listed in Table 91.

T A B L E 91 SPECI F I CAT I O N O F E 3 EL E C T R I C A L I NT ERF ACES



Code pattern HDB3 [Note 1]

Allowable attenuation at outputport (square-root attenuation)

0-12 dB, 17 184 kHz

Allowable frequency offset atoutput port

> ±20 ppm [Note 2]

Bit ratio tolerance at output port < ±20 ppm


f3 High-pass, 10 kHz, 20 dB/dec Filter characteristic


Jitter at output port f1-f4: 1.5UI [Note 3]






f3-f4: 0.15UI

Mapping jitter at tributary portf1-f4: 0.4UI

f3-f4: 0.1UI

Combined jitterMeets the requirement specified in ITU-TG.783

Pulse shape at output portComplies with the mask specified in ITU-TG.703


Anti-interference capability atinput port (SNR)

20 dB

Input jitter and wander toleranceMeets the requirement specified in ITU-TG.823

Output port860 kHz to 1720 kHz, ≥6 dB

1720 kHz to 51550 kHz, ≥8 dBReflectanceattenuation

Input port

860 kHz to 1720 kHz, ≥12 dB

1720 kHz to 34368 kHz, ≥18 dB

34368 kHz to 51550 kHz, ≥14 dB

[Note 1]: HDB3: High Density Bipolar of order 3

[Note 2]: 1 ppm= 10-6

[Note 3]: 1UI=29.1 ns

Specification of T3 Electrical InterfacesThe specification of T3 electrical interfaces is shown in Table 92.

T A B L E 92 SPECI F I CAT I O N O F T3 EL E C T R I C A L IN T E R F A C E S



Code pattern B3ZS [Note 1]

Allowable attenuation atoutput port (square-rootattenuation)

0-20 dB, 22 368 kHz

Allowable frequency offsetat output port

> ±20 ppm [Note 2]


< ±20 ppm


f3 High-pass, 30 kHz, 20 dB/decFilter characteristic


Jitter at output portf1-f4: 5.0UI [Note 3]

f3-f4: 0.1UI







f1-f4: 0.4UI

f3-f4: 0.1UI

Combined jitter Meets the requirement specified in ITU-T G.783Pulse shape at output port Complies with the mask specified in ITU-T G.703



Meets the requirement specified in ITU-T G.824

[Note 1]: B3ZS: Bipolar with 3-Zero Substitution

[Note 2]: 1 ppm= 10-6

[Note 3]: 1UI=22.4 ns

Clock Timing & SynchronizationThe clock timing and synchronization specifications of ZXMP S200,complying with ITU-T G.813, are as follows:

Output jitter

The output jitter does not exceed 0.05UI peak-peak when measured bythe interval of 60s through a single pole band-pass filter with cornerfrequencies at 20 Hz and 100 kHz, where 1UI equals to 488 ns.

Excursion transfer characteristic

In the pass band range from 1 Hz to 10 Hz, the phase gain is smallerthan 0.2 dB.

Free oscillation output frequency deviation: < 4.6 ppm, where 1 ppmequals to 1×10-6.

Pull-in and pull-out range: ≥ 4.6 ppm, where 1 ppm equals to 1×10-6.

Wander in locked mode

Table 93 and Table 94 list the mean time interval error (MTIE) limit

and time deviation (TDEV) limit respectively.

T A B L E 93 MTIE L I M I T I N L O C K E D MO DE (WI T H CO NST ANT T EM PERAT URE )

Observation Interval τ (s) MTIE Limit (ns)

0.1 < τ ≤ 1 40

1 < τ ≤ 100 40τ0.1

100 < τ ≤ 1000 25.25τ0.2

T A B L E 94 MTIE L I M I T I N L O C K E D MO DE (WI T H TEM PERAT URE EF F ECT S )


τ ≤ 100 0.5τ






τ > 100 50

T A B L E 95 TDEV L I M I T I N L O C K E D MO DE ( WI T H CO NST ANT T EM PERAT URE )

Observation Interval τ (s) TDEV Limit (ns)

0.1 < τ ≤ 25 3.2

25 < τ ≤ 100 0.64τ0.1

100 < τ ≤ 1000 6.4τ0.2

Bit Error PerformanceZXMP S200 reports no bit error in continuous 24 hours.

Protection Switching TimeThe protection switching time of ZXMP S200 is less than 50 ms.

Compliant Standards ofInterfacesTable 96 lists the standards which the interfaces of ZXMP S200 complywith.

T A B L E 96 ST A N D A R D S O F INT ERF ACES PR O V I D E D B Y ZXMP S200

Interface Standard Remark

ITU-T G.707Network node interface for thesynchronous digital hierarchy (SDH)

ITU-T G.957Optical interfaces for equipments andsystems relating to synchronous digitalhierarchy (SDH)

Optical interfaces

at

155520 kbit/s

622080 kbit/s

ITU-T G.825The control of jitter and wander withindigital networks which are based on thesynchronous digital hierarchy(SDH)

ITU-T G.703Physical/electrical characteristics ofhierarchical digital interfaces

Electrical interface(155520 kbit/s)

ITU-T G.707Network node interface for thesynchronous digital hierarchy (SDH)





Interface Standard Remark

ITU-T G.825The control of jitter and wander withindigital networks which are based on thesynchronous digital hierarchy(SDH)


ITU-T G.704Synchronous frame structures used at1544, 6312, 2048, 8448 and 44736kbit/s hierarchical levels

Electricalinterfaces at

1544 kbit/s

2048 kbit/s

34368 kbit/s

44736 kbit/s ITU-T G.825

The control of jitter and wander withindigital networks which are based on thesynchronous digital hierarchy(SDH)

2.048 MHznetwork clock

synchronizationinterface

ITU-T G.703

Physical/electrical characteristics ofhierarchical digital interfaces

User data channelinterface (64kbit/s)


Ethernet interface

100BASE-TX

10BASE-T

IEEE 802.3

Meets the requirements related to100BASE-TX and 10BASE-T physicalinterfaces specified in IEEE 802.3

Orderwiretelephoneinterface

-

Frequency range: 300 Hz to 3400 Hz

Pulse Mode Modulation (PCM)

Bit rate: 64 kbit/s



C h a p t e r 4

Networking andConfigurations


Functions of the ZXMP S200 as an SDH NE,

Supportable networking modes of ZXMP S200,

A networking example of ZXMP S200.

Functions as an SDH NEZXMP S200 can act as a terminal multiplexer, an add/drop multiplexer or a

regenerator, performing corresponding functions in SDH networks.

Terminal Multiplexer (TM)As a TM, ZXMP S200 terminates aggregate signals and SDH overheads atthe line side. It adds or drops E1/T1 tributary signals at the terminal side.

Figure 48 illustrates ZXMP S200 acting as a TM.

F I G URE 48 ZXM P S200 A S A TE R M I N A L MU L T I P L E X E R (TM )





Add/Drop Multiplexer (ADM)As an ADM, ZXMP S200 has two line directions. In each line direction, itcan add or drop E1/T1 tributary signals, or pass them straight without

damage.

In addition, ZXMP S200 can terminate, forward and originate SDHoverheads, or pass them directly through the equipment.

Figure 49 illustrates ZXMP S200 acting as an ADM.

F I G URE 49 ZXM P S200 A S A N A DD /DRO P M U L T I P L E X E R (ADM )

E1/T1

STM-1/STM-4ZXMP S200

(ADM)STM-1/STM-4

Regenerator (REG)As a REG equipment, ZXMP S200 regenerates and amplifies optical signals.It only processes regenerator section overheads (RSOH), instead of

service signals. Multiplex section overheads (MSOH) will pass through ittransparently.

Figure 50 illustrates ZXMP S200 acting as an REG.

F I G URE 50 ZXM P S200 A S A RE G E N E R A T O R (REG)

Networking ModesZXMP S200 supports multiple networking modes, such as point-to-point,chain, ring networking mode and hybrid networking mode with other SDH

equipment, as shown in Figure 51.




Chapter 4 Networking and Configurations

F I G URE 51 NET WO RKI NG MO DES O F ZXMP S200

1.Point-to-Point 2.Chain 3.Ring

4.Hybridnetworking

SDH

transmission

network

Point-to-Point NetworkingPoint-to-point network can be used in inter-office trunk and capacityexpansion, or used to replace original PDH system.

The point-to-point networking of ZXMP S200 is shown in Figure 52.

F I G URE 52 PO I NT -T O -PO I NT NET WO RKI NG O F ZXM P S200

Chain NetworkingChain network is applicable to communication networks with distributedtraffic in chains, or chain-shaped branch networks.

The chain networking of ZXMP S200 is shown in Figure 53.

F I G URE 53 CH A I N N ET WO RKI NG O F ZXMP S200

Ring NetworkingRing network is applicable to distributed NEs which can construct a ring.

Due to the self-closing feature of line interface in ring network, services





can be transmitted end-to-end in two directions (eastward and westward)in the ring. Ring networks have strong survivability and self-healing ability.

The ring networking of ZXMP S200 is shown in Figure 54.

F I G URE 54 R I NG N ET WO RKI NG O F ZXMP S200

ADM

ADM

ADMADM

ZXMP S200

ZXMP S200

ZXMP S200 ZXMP S200

The self-healing ring is divided into two categories: the path switched ringand the multiplex section (MS) switched ring. In terms of abstract

functional structure, the path switched ring supports subnet connectionprotection while the MS switched ring supports path protection.

ZXMP S200 can form two-fiber unidirectional path switched ring at STM-1/STM-4 level and two-fiber bidirectional MS switched ring at STM-4 level.

Two-fiber unidirectional path switched ring

The path switched ring enables the fast and flexible protectionswitching at various capacity levels. The switching is determined locallyand is independent of the topology. It is applicable to all kinds of

complicated network topologies and is not confined to the ring.Therefore, it is more applicable to dynamic network environments,such as cellular telecommunication networks.

However, because the principle of “concurrent transmitting andpreferential receiving” is adopted for all tributary signals, so all the

tributary signals are transmitted to the receiving node in two directions,which is equivalent to transmission through the whole ring. Thereforethe total of the add/drop traffic in each NE can not exceed the system

capacity of ADM NEs. Two-fiber bidirectional MS switched ring

The two-fiber bidirectional MS switched ring has the transmissioncapability up to K/2 × STM-N, where K is the quantity of nodes in thering, STM-N is the highest rate of the ring.

The MS switched ring supports the large transmission capacity andflexible protection switching. However, fault response and recoveringtime will be longer because it needs time to process APS protocolduring the switching.





Hybrid NetworkingHybrid networking is applied to capacity expansion or interconnection ofexisting SDH networks. The hybrid networking can sufficiently utilize the

existing network resources, to compensate the ZXMP S200’s limitations interms of capacity and networking capability.

ZXMP S200 can cooperate with other SDH equipment and DWDMequipment of ZTE CORPORATION for hybrid networking. The samenetwork management system can be used to implement the unifiedmanagement.

When ZXMP S200 is used for hybrid networking with equipment of othermanufacturers, E1 network management channels can be used to transfer

the management information, so as to implement the integrated networkmanagement in a hybrid network.

Networking Application ofEthernet

OverviewIf the ZXMP S200 equipment is configured with the SEC board, it functionsnot only as traditional SDH equipment, but also as Multi-Service

Transportation Platform (MSTP) node equipment with Ethernet dataprocess functions.

As the MSTP node equipment, ZXMP S200 can access the service ofEthernet Private line (EPL), Ethernet Virtual Private Line (EVPL), EthernetPrivate LAN (EPLAN) and Ethernet Virtual Private LAN (EVPLAN), moreover,provides the flow control and QoS function according to the actualrequirements.

Ethernet Private Line (EPL)EPL service has two accessing points through which the Ethernet service is

transparently transported point to point. Each user’s service is carried bythe private SDH channel in EPL, so different users have no need to sharebandwidth one another. Thus, EPL has the same bandwidth guarantee andsecurity performance as SDH.

Besides, it is a point-to-point transmission mode, so neither L2 switch norMAC address learning is needed.

Figure 55 shows a typical networking of EPL. The Ethernet service between

user X and user Y is transparently transmitted through MSTP equipment Aand J, as well as the passing-by sites such as B, C, D, E, F, G and H.





F I G URE 55 -A T Y P I C A L NET WO RKI NG O F E P L

Ethernet Virtual Private Line (EVPL)In EVPL, users can share the bandwidth with each other, which is the main

difference between EVPL and EPL. EVPL uses VLAN ID and othermechanisms to distinguish the data from the different users. QoSmechanism is adopted once the service varies with the user.

Because the user’ services are only separated logically, as another point-to-point transmission mode, EVPL has the security performance lower thanEPL.

Figure 56 shows a typical networking of EVPL. User 1 has the service FE1and FE2, and user 2 has the service FE3 and FE4. The service of user 1and user 2 are isolated when passing by the sites A, B, C, D, E, F, G, Hand J.





F I G URE 56 -A T Y P I C A L NET WO RKI NG O F E V P L

Ethernet Private LAN (EPLAN)EPLAN, as a point to multi-point transmission mode, can guarantee thebandwidth and isolate the service perfectly, so the users have no need toshare the SDH bandwidth. Meanwhile, QoS and security mechanism arenot needed.

Because multi points are involved in an EPLAN networking, the data istransferred based on MAC address, so the functions of MAC addresslearning and L2 switch are needed.

Figure 57 shows a typical networking of EPLAN. The services of two

braches Z and Y of the user pass through the SDH network formed by the

timeslots links, then converge at the central node X. Moreover, thebandwidth is exclusive from each branch to the central.





F I G URE 57 -A T Y P I C A L NET WO RKI NG O F E P L A N

Ethernet Virtual Private LAN (EVPLAN)EVPLAN can be achieved in virtue of MPLS, VLAN stack (Q-in-Q) and other

technologies. From the point of user view, the network of the carriers islike a LAN because of EVPLAN. The difference between EPLAN and EVPLANis that the user of EVPLAN should share the bandwidth. EVPLAN has theespecial attributes about protection, usability, bandwidth, MAC addresslearning and data frame transferring.

Figure 58 shows a typical networking of EVPLAN. The traffic FE3 and FE5of user 1 converge as the traffic FE1 at M through A and J. The traffic FE4and FE5 of user 2 converge as the traffic FE2 at M through A and J. Thetraffic of user 1 and user 2 are isolated by VLAN ID in the SDHtransmission channel.





F I G URE 58 -A T Y P I C A L NET WO RKI NG O F E V P L A N

Application ExampleThis section introduces a simple networking example of ZXMP S200,

including the selection and analysis of networking mode and theequipment configuration based on network requirements.

Network DescriptionSuppose three new sties A, B and C need to be constructed. -48 V DCpower supply is available for all equipment.

Site Locations

As shown in Figure 59, Sites A and B are connected directly through

optical cables, Sites B and C are connected through an SDH transmissionnetwork. The network element management system (EMS) is configured at

Site A.






F I G URE 59 TO PO L O G Y O F N ET WO RKI NG EX A M P L E

15km15km 15km

A B C

SDHtransmission

network

There is 2 M bidirectional service between Site A and Site B as well as SiteB and Site C.

Networking AnalysisThe network topology structure should be selected according to sitedistribution and service allocation. Generally, ring networking is preferableas long as the routes are permitted due to its excellent self-healingcapability. Some special condition is exceptional, for example, networks

along the railway or highway are often chain networks. However, ringnetwork is recommended if adequate optical fibers are available.

In this sample, Site A, B and C form a chain network.

Access NE is the NE that accesses the EMS computer in the network. Itshould be selected according to user’s requirement and generally in majorsite with centralized traffic.

In this sample, NE A (site A) is selected as the access NE.

Since Site B and C are connected through an SDH transmission network,the whole network can be seemed as a hybrid network.

To implement the integrated management of ZXMP S200 equipment, thenetwork management channel between Site B and C adopts E1 mode, thatis, the 1st-3rd timeslots of the 5th-8th E1 channels are used to transmitnetwork management information.

The network management channel between Site A and B still adopts SDHoverhead mode.

Based on the above analysis, the system networking diagram is illustrated

in Figure 60.

Services

Determine the

NetworkingMode

Set the AccessNE

Select ECC

NetworkingConfigurations




F I G URE 60 NET WO RKI NG DR A W I N G

EMS

NEA NECNEB

155Mbit/s SDHtransmission

network

155Mbit/s 155Mbit/s

Board ConfigurationsWhile configuring the ZXMP S200 equipment, the following two factors

should be considered.

Power voltage

ZXMP S200 supports both AC power supply and DC power supply. Youcan choose the power board according to actual power supply.

In this example, all the sites use -48 V DC power supply.

Optical module type

The STM-1 optical interface of ZXMP S200 supports three types ofoptical modules: S-1.1, L-1.1, and L-1.2.

Select proper optical module type according to the actual transmission

distance.

Table 97 lists the transmission distance corresponding to each optical

module type for your reference.

T A B L E 97 T RANSM I SSI O N D I ST ANCE F O R D I F F ERENT OP T I C A L MO D U L E TY P E S

Optical Module Type Reference Transmission Distance

S-1.1 ≤ 15 km

L-1.1 ≤ 40 km

L-1.2 ≤ 80 km

Note: In actual use, the transmission distance of optical modules may changedue to fiber types or line quality.

In this example, S-1.1 optical modules are used in the site A, B and C.

Then determine the equipment type and boards to be used in each siteaccording to the interface type. Table 98 lists the configurations of site A,B and C.

T A B L E 98 CO NF I G URAT I O NS O F S I T E A , B A N D C

Configuration Site A Site B Site C

Power supply voltage -48 V -48 V -48 V

Optical module type S-1.1 S-1.1 S-1.1






Configuration Site A Site B Site C

Main board type SMCxD75E SMCxD75E SMCxD75E

Installation ConfigurationsAfter equipment configurations, the installation/mounting of equipmentshould be completed.

The installation configurations include the mounting of equipment,accessories, cables and fiber pigtails, uninterrupted power supply (UPS)

for network management system, as well as DDF and ODF.

Note: For detailed installation procedure, please refer to Unitrans ZXMPS200 (V3.00) SDH Based Multi-Service Node Equipment Installation &

Maintenance Manual .

Configurations in the EMSAfter installation, networking configurations in ZXONM E300 should be

implemented for the ZXMP S200 equipment, such as services andconnections. Based on the status of an NE (equipment), online or offline,two configuration procedures are as follows.

Create online NE

Create online NE → Select the access NE → Install boards (cards) →

Establish connections between NEs→

MS protection configuration→

Configure services → Configure overheads → Set clock source → Set

orderwire → Extract NCP time

Create offline NE

Create offline NE → Select the access NE → Install boards (cards) →

Establish connections between NEs → MS protection configuration →

Configure services → Configure overheads → Set clock source → Set

orderwire → Change the NE status to Online → Download database of

NE → Extract NCP time

Note: Refer to the ZXONM E300 EMS/SNMS operation manual for detailedoperations of networking configuration.

Networking FeaturesIn this example, the ZXMP S200 equipment and other SDH equipmentform a hybrid network, to utilize the existing network resources sufficiently.Through the usage of E1 ECC channels, the unified network element

management to all ZXMP S200 equipment is implemented.





On the other hand, the network consisting of ZXMP S200 can be regardedas a chain network disregarding the network topology of other SDHequipment in the example.




This page is intentionally blank.




A p p e n d i x A

Compliant Recommendationsand Standards

The design of ZXMP S200 complies with the recommendations andstandards listed in Table 99.

T A B L E 99 CO M P L I A N T RECO M M ENDAT I O NS AND ST A N D A R D S

Recommendation/Standard

Title

ITU-T G.703Physical/electrical characteristics of hierarchical digitalinterfaces

ITU-T G.704Synchronous frame structures used at 1544, 6312, 2048,8448 and 44736 kbit/s hierarchical levels

ITU-T G.706Frame alignment and cyclic redundancy check (CRC)procedures relating to basic frame structures defined inRecommendation G.704

ITU-T G.707Network node interface for the synchronous digitalhierarchy (SDH)

ITU-T G.773Protocol suites for Q-interfaces for management oftransmission systems

ITU-T G.774Synchronous digital hierarchy (SDH) managementinformation model for the network element view

ITU-T G.774.01Synchronous digital hierarchy (SDH) bidirectional

performance monitoring for the network element view

ITU-T G.774.02Synchronous digital hierarchy (SDH) configuration of thepayload structure for the network element view

ITU-T G.774.03Synchronous digital hierarchy (SDH) management ofmultiplex-section protection for the network element view

ITU-T G.774.04Synchronous digital hierarchy (SDH) management of thesubnetwork connection protection for the networkelement view

ITU-T G.774.05Synchronous digital hierarchy (SDH) management ofconnection supervision functionality (HCS/LCS) for thenetwork element view







Title

ITU-T G.774.06Synchronous digital hierarchy (SDH) unidirectionalperformance monitoring for the network element view

ITU-T G.774.07Synchronous digital hierarchy (SDH) management oflower order path trace and interface labelling for thenetwork element view

ITU-T G.780Terms and definitions for synchronous digital hierarchy(SDH) networks

ITU-T G.783Characteristics of synchronous digital hierarchy (SDH)equipment functional blocks

ITU-T G.784 Synchronous Digital Hierarchy (SDH) management

ITU-T G.803Architecture of transport networks based on thesynchronous digital hierarchy (SDH)

ITU-T G.805 Generic functional architecture of transport networksITU-T G.810 Definitions and terminology for synchronization networks

ITU-T G.811 Timing characteristics of primary reference clocks

ITU-T G.812Timing requirements of slave clocks suitable for use asnode clocks in synchronization networks

ITU-T G.813Timing characteristics of SDH equipment slave clocks(SEC)

ITU-T G.823The control of jitter and wander within digital networkswhich are based on 2048 kbit/s hierarchy

ITU-T G.825

The control of jitter and wander within digital networks

which are based on the synchronous digitalhierarchy(SDH)

ITU-T G.826End-to-end error performance parameters and objectivesfor international, constant bit-rate digital paths andconnections

ITU-T G.831Management capabilities of transport networks based onthe synchronous digital hierarchy (SDH)

ITU-T G.832Transport of SDH elements on PDH networks - Frame and

multiplexing structures

ITU-T G.841Types and characteristics of SDH network protection

system

ITU-T G.842 Interworking of SDH network protection architectures

ITU-T G.957Optical interfaces for equipments and systems relating tosynchronous digital hierarchy (SDH)

ITU-T G.958Digital line systems based on the synchronous digitalhierarchy for use on optical fiber cables

ITU-T K.41Resistibility of internal interfaces of telecommunicationcenters to surge voltage

ITU-T M.20 Maintenance philosophy for telecommunication networks

ITU-T M.2100Performance limits for bringing-into-service andmaintenance of international PDH paths, sections andtransmission systems



Appendix A Compliant Recommendations and Standards



Title

ITU-T M.2101Performance limits and objectives for bringing-into-service and maintenance of international SDH paths and

multiplex sections

ITU-T M.2120PDH path, section and transmission system and SDH pathand multiplex section fault detection and localizationprocedures

ITU-T M.3010 Principles for a telecommunications management network

ITU-T M.3400 TMN management functions

ITU-T Q.811 Lower-layer protocol frame of the Q3 interface

ITU-T Q.812 Higher-layer protocol frame of Q3 interface

ITU-T X.214

(ISO 8072)

Information technology - open systems interconnection -transport service definition

ITU-T X.215

(ISO 8326)

ITU-T application - Open Systems Interconnection -Session service definition

ITU-T X.216

(ISO 8822)

Information technology - Open Systems Interconnection -Presentation service definition

ITU-T X.217

(ISO 8649)

ITU-T application - Open Systems Interconnection -Service definition for the Association Control ServiceElement

ITU-T X.219

(ISO IS 9072-1)Remote Operations: Model, notation and service definition

ITU-T X.224(ISO 8073)

Protocols and specifications for information processing

system - interconnecting of open systems - connectionorientated transmitting

ITU-T X.225

(ISO 8327)

Information technology - Open Systems Interconnection -Connection-oriented Session protocol: Protocolspecification

ITU-T X.226

(ISO 8823)

Information technology - Open Systems Interconnection -Connection-oriented Presentation protocol: Protocolspecification

ITU-T X.229

(ISO IS 9072-2)Remote operation: Protocol specification

ITU-T X.233

Information technology - Protocol for providing the

connectionless-mode network service: Protocolspecification

ITU-T X.511

(ISO9594-3)

Information technology - Open systems interconnection -The directory: Abstract service definition

ITU-T X.519

(ISO9594)

Information technology - Open systems interconnection -The directory: Protocol specifications

ITU-T X.622Information technology - Protocol for providing theconnectionless-mode network service: Provision of theunderlying service by an X.25 Subnetwork

ITU-T X.710

(ISO 9595)

Management information service definition: Public

management information service definition






Title

ITU-T X.710

(ISO 9596-1)

Management information service definition: Publicmanagement information protocol

ISO 7498Information processing system - open systemsinterconnection – Basic reference model

ISO 8073/AD2Information technology – Open systems interconnection –Protocol for providing the connection-mode transportservice Amendment 2

ISO 8348Information technology – Open systems interconnection –Network service definition

ISO 8473Information technology – Protocol for providing theconnectionless-mode network service

ISO 8571.1Information processing systems – Open systemsinterconnection – File transfer, access and management –Part 1: General introduction

ISO 8571.2Information processing system - Open systemsinterconnection - File transfer, access and management -Part 2: Virtual filestore definition

ISO 8571.3Information processing system - Open systemsinterconnection - File transfer, access and management -

Part 3: File service definition

ISO 8571.4Information processing system - Open systemsinterconnection - File transfer, access and management -Part 4: File protocol specification

ISO 8648

Information processing system - Open system

interconnection - Internal organization of the networklayer

ISO 8802.2

Information technology – Telecommunications andinformation exchange between systems – Local andmetropolitan area networks – Specific requirements – Part2: Logical link control

ISO 8802.3

Information technology - Telecommunications andinformation exchange between systems - Local andmetropolitan area networks – Specific requirements - Part3: Carrier sense multiple access with collision detection(CSMA/CD) access method and physical layer

ISO 9542

Information processing system - Telecommunications andinformation exchange between systems - End system tointermediate system routing exchange protocol for use inconjunction with the protocol for providing theconnectionless-mode network service (ISO 8473)

ISO 9545Information technology - Open systems interconnection –Application layer structure

ISO 9546-1Information processing system - Open systemsinterconnection - Common management informationprotocol specification

ISO 10172Information processing system - Open systemsInterconnection - Telecom and information switching

network/transport protocol interworking specification



Appendix A Compliant Recommendations and Standards



Title

ISO 10589

Information technology – Telecommunications andinformation exchange between systems – Intermediate

system to intermediate system intra-domain toutinginformation exchange protocol for use in conjunction withthe protocol for providing the connectionless-modenetwork service (ISO8473)

YDN 099-1998 Optical synchronous transport network technical system

YD/T 1238-2000Technical Requirements for SDH Multi-Service TransportPlatform

YD 5083-1999Specification for Seismic Test of TelecommunicationsEquipment

GB 4943Safety Standard of the Information and TechnologyEquipment

GB 9254 Information Technology Equipment – Radio DisturbanceCharacteristics – Limits and Methods of Measurement

GB/T 2423Environment Experiment for Electric and ElectronicProducts

GB/T 4796–1984Classification of environmental parameters and theirseverities of electric and electronic products

GB 7247.1-2001Safety of Laser Products--Part 1: EquipmentClassification, Requirements and User's Guide

GB/T 17618-1998Information technology equipment--Immunitycharacteristics--Limits and methods of measurement

GB 17625.1Electromagnetic compatibility - Limits - Limits forharmonic current emissions (equipment input current≤16A per phase

GB 17625.2Electromagnetic compatibility Limits Limitation of voltagefluctuations and flash in low-voltage supply systems forequipment with rated current ≤16A

GB/Z 17625.3Electromagnetic compatibility Limits Limitation of voltagefluctuations and flash in low-voltage supply systems forequipment with rated current >16A

GB/T 17626.2Electromagnetic compatibility – Testing and measurementtechniques – Electrostatic discharge immunity test

GB/T 17626.3

Electromagnetic compatibility - Testing and measurement

techniques - Radiated, radio-frequency, electromagneticfield immunity test

GB/T 17626.4Electromagnetic compatibility - Testing and measurementtechniques - Electrical fast transient/burst immunity test

GB/T 17626.5Electromagnetic compatibility - Testing and measurementtechniques - Surge immunity test

GB/T 17626.6Electromagnetic compatibility - Testing and measurementtechniques-Immunity tl conducted disturbances, inducedby radio - frequency fields

GB/T 17626.8Electromagnetic compatibility - Testing and measurementtechniques - Power frequency magnetic field immunity

test






Title

GB/T 17626.11Electromagnetic compatibility - Testing and measurementtechniques – Voltage dips, short interruptions and voltage

variations immunity tests

GJB/Z 299B-1998 Reliability Prediction of Electronic Equipment



A p p e n d i x B

Abbreviations

Abbreviation Full Name

A

ADM Add-Drop Multiplexer

ADSL Asymmetrical Digital Subscriber Line

ALS Automatic Laser Shutdown

AMI Alternate Mark Inversion

APS Automatic Protection Switching

ATM Asynchronous Transfer Mode

AU-n Administrative Unit, level n

AUG Administrative Unit Group

B

BBE Background Block Error

BER Bit Error

BITS Building Integrated Timing Supply

B8ZS Bipolar with 8-Zero Substitution

B3ZS Bipolar with 3-Zero Substitution

C

CDMA Code Division Multiple Access

Corba Common object request broker architecture

CMI Code Mark Inversion

CV Coding Violation

D

DCC Data Communications Channel

DDF Digital Distribution Frame

DWDM Dense Wavelength Division Multiplexing

E

ECC Embedded Control Channel

EFT Electrical Fast Transient







EPL Ethernet Private Line

EPLAN Ethernet Private Local Area Network

ETSI European Telecommunications Standards Institute

EUT Equipment Under Test

EVPL Ethernet Virtual Private Line

EVPLAN Ethernet Virtual Private Local Area Network

ES Errored Second

ESD Electro-Static Discharge immunity

F

FE Fast Ethernet

FEBBE Far End Background Block Error

FEES Far End Errored Second

FESES Far End Severely Errored Second

G

GFP Generic Framing Protocol

GNE Gateway Network Element

GUI Graphical User Interface

GSM Global System for Mobile communications

H

HDB3 High Density Bipolar of order 3

HDLC High level Digial Link Control

I

IC Integrated Circuit.

IEC International Electrotechnical Commission

IGMP Internet Group Management Protocol

IP Internet Protocol

ITU-TInternational Telecommunication

Union-Telecommunication Standardization Sector

IVL Independent VLAN Learning

L

LAN Local Area Network

LACP Link Aggregation Control Protocol

LCAS Link Capacity Adjustment Scheme

LCT Local Craft Terminal

LST Link Status Transport

LOS Loss Of Signal

M



Appendix B Abbreviations



MAC Media Access Control

MCU Micro Control Unit

MSOH Multiplex Section OverHead

MS-PSC Multiplex Section - Protection Switching Count

MS-PSD Multiplex Section - Protection Switching Duration

MTBCF Mean Time Between Critical Failures

MTBF Mean Time Between Failures

N

NE Network Element

O

ODF Optical fiber Distribution Frame

P

PCB Printed Circuit Board

PCM Pulse Code Modulation

PDH Plesiochronous Digital Hierarchy

PGND Protection GND

PJE+ Positive Pointer Justification Event

PJE- Negative Pointer Justification Event

PPP Point-to-Point Protocol

PRBS Pseudo Random Binary Sequence

PSD Power Spectral Density

PSTN Public Switched Telephone Network

R

REG Regenerator

S

SDH Synchronous Digital Hierarchy

SD Signal Degrade

SES Severely Errored Second

SFP Small Form Factor Pluggable

SF Signal Failure

SHDSL Single-pair High-bit-rate Digital Subscriber Line

SMCC Sub-network Management Control Center

SNC (I) Sub-Network Connection Protection with Inherent monitoring

SNC (N)Sub-Network Connection Protection with Non-intrusivemonitoring

SSM Synchronization Status Message

STM-N Synchronous Transport Module, level N (N=1, 4, 16, 64)






STU SHDSL Transceiver Unit

STU-C STU-Central Office

T

TCP Transfer Control Protocol

TDM Time Division Multiplexing

TM Terminal Multiplexer

TRK Trunk

TU-m Tributary Unit, level m

TUG-m Tributary Unit Group, level m

U

UAS Unavailable Second

UPS Uninterrupted Power Supply

V

VC-n Virtual Container, level n

VCXO Voltage Control Crystal Oscillator

VDSL Very-high-bit-rate Digital Subscriber Line

VLAN Virtual Local Area Network



Figures

Figure 1 ZTE’s Unitrans ZXMP Family ............................................................ 1

Figure 2 Front View of ZXMP S200................................................................ 2

Figure 3 Structure of ZXMP S200.................................................................. 3

Figure 4 Relationships Between Functional Units in ZXMP S200......................... 4

Figure 5 Hierarchical Structure of ZXONM E300 .............................................. 5

Figure 6 Mapping/Multiplexing Structure of ZXMP S200...................................11

Figure 7 Outline and Structure of ZXMP S200................................................15

Figure 8 Structure of the Fan Module ...........................................................16

Figure 9 Structure of the Power Module (PWA) ..............................................17

Figure 10 Operating Principle of SMC Board ..................................................23

Figure 11 Operating Principle of the NCP Unit ................................................24

Figure 12 Operating Principle of the Optical Interface Unit...............................27

Figure 13 Operating Principle of the STM-1 Electrical Interface Unit ..................29

Figure 14 Operating Principle of Tributary Unit ..............................................30

Figure 15 Operating Principle of the Ethernet Interface Unit.............................32

Figure 16 Operating Principle of the Clock Unit ..............................................35

Figure 17 Operating Principle of the Micro Control Unit ...................................36

Figure 18 Operating Principle of SMB Board ..................................................37

Figure 19 Operating Principle of NCP Unit .....................................................38

Figure 20 Operating Principle of the Optical Interface Unit...............................41

Figure 21 Operating Principle of E1/T1 Tributary Unit .....................................43

Figure 22 Operating Principle of E3/T3 Tributary Unit .....................................44

Figure 23 Operating Principle of the Ethernet Interface Unit.............................46

Figure 24 Operating Principle of the Clock Unit ..............................................49 Figure 25 Operating Principle of the Micro Control Unit ...................................50

Figure 26 Front Panel of the Main Board (SMCxF75T) .....................................50

Figure 27 Operating Principle of the PWA/PWB Module....................................54

Figure 28 Front Panel of the PWA Board .......................................................55

Figure 29 Front Panel of the PWB Board .......................................................57

Figure 30 Operating Principle of the PWC Module ...........................................59

Figure 31 Front Panel of the PWC Module......................................................60

Figure 32 Operating Principle of the V35B Board............................................61

Figure 33 Front Panel of the V35B Board ......................................................62

Figure 34 Operating Principle of the E1/T1 Electrical Tributary Board ................63

Figure 35 Front Panel of the Electrical Tributary Board (ET1-75 Board)..............64

Figure 36 Front Panel of the EIE3 Board .......................................................66

Figure 37 Front Panel of the TFEx4 Board .....................................................68

Figure 38 Front Panel of the TFEx4B Board ...................................................70

Figure 39 Operating Principle of the AI Board ................................................71

Figure 40 Front Panel of AI Board ................................................................72

Figure 41 Operating Principle of the OW Board ..............................................75

Figure 42 Front Panel of the OW Board.........................................................75

Figure 43 Front Panel of the SEC Board ........................................................79

Figure 44 Operating Principle of the SDB Board .............................................81

Figure 45 Front Panel of the SDB Board........................................................81

Figure 46 Power Supply Lightning Protection Connection in a Far-End EquipmentRoom................................................................................................92

Figure 47 Eye Pattern of Optical Launched Signals .......................................101

Figure 48 ZXMP S200 as a Terminal Multiplexer (TM) ...................................111

Figure 49 ZXMP S200 as an Add/Drop Multiplexer (ADM) ..............................112

Figure 50 ZXMP S200 as a Regenerator (REG).............................................112






Figure 51 Networking Modes of ZXMP S200.................................................113

Figure 52 Point-to-Point Networking of ZXMP S200 ......................................113

Figure 53 Chain Networking of ZXMP S200 .................................................113

Figure 54 Ring Networking of ZXMP S200 ...................................................114

Figure 55 Topology of Networking Example................................................. 120

Figure 56 Networking Drawing ..................................................................121



Tables

Table 1 Chapter and Appendix Summary ........................................................ i Table 2 Typographical Conventions............................................................... iii

Table 3 Mouse Operation Conventions........................................................... iii Table 4 Interfaces in a Network Management System...................................... 7

Table 5 Cross-connect Capacity of ZXMP S200................................................ 8

Table 6 Service Interfaces Provided by ZXMP S200 (SMB)................................ 8

Table 7 Service Interfaces Provided by ZXMP S200 (SMC)................................ 9

Table 8 MS Protection Modes Supported by ZXMP S200 ..................................11 Table 9 Alarms Triggering SNC Protection Switching.......................................12

Table 10 Board List of ZXMP S200 ...............................................................17

Table 11 List of SMC Main Boards ................................................................19

Table 12 List of SMB Boards .......................................................................21

Table 13 Differences between SMB Board and SMC Board ...............................22

Table 14 Functions of Modules in the NCP.....................................................24

Table 15 Overheads Processed by Optical Interface Unit .................................26

Table 16 Functions of Modules in the Optical Interface Unit .............................27

Table 17 Overheads Processed by STM-1 Electrical Interface Unit.....................28

Table 18 Functions of Modules in the Electrical Interface Unit ..........................29

Table 19 Functions of Modules in Tributary Unit.............................................31

Table 20 Descriptions of Virtual Concatenation Group.....................................32

Table 21 Functions of Modules in the Ethernet Interface Unit ...........................33

Table 22 Functions of Modules in the Micro Control Unit ..................................36

Table 23 Functions of Modules in NCP Unit....................................................39

Table 24 Overheads Processed by Optical Interface Unit .................................40

Table 25 Functions of Modules in the Optical Interface Unit .............................41

Table 26 Functions of Modules in E1/T1 Tributary Unit....................................43

Table 27 Functions of Modules in E3/T3 Tributary Unit....................................44

Table 28 Description of Virtual Concatenation Group ......................................45

Table 29 Functions of Modules in the Ethernet Interface Unit ...........................46

Table 30 Functions of Modules in the Micro Control Unit ..................................50

Table 31 Components on the Front Panel of Main Board..................................51

Table 32 Units in the PWA/PWB Board..........................................................55

Table 33 Components on the Front Panel of PWA Board ..................................55

Table 34 Components on the Front Panel of PWB Board ..................................57

Table 35 Units in the PWC Module ...............................................................59 Table 36 Components on the Front Panel of the PWC Module...........................60

Table 37 Units in the V35B Board ................................................................61

Table 38 Components on the Front Panel of V35B Board .................................62

Table 39 Relations Between E1/T1 Electrical Tributary Board and ID.................63

Table 40 Functions of Units in the E1/T1 Electrical Tributary Board ...................64

Table 41 Components on the Front Panel of ET1 Board ...................................64

Table 42 Descriptions of Components on the Front Panel of EIE3 Board.............66

Table 43 Components on the Front Panel of TFEx4 Board ................................68

Table 44 Components on the Front Panel of TFEx4B Board..............................70

Table 45 Positions of the Used Overhead Bytes in the SDH Frame .....................71

Table 46 Functions of Units in the AI Board...................................................72

Table 47 Components on the Front Panel of AI Board .....................................72

Table 48 Signal Definitions of Pins in the Audio Interface ................................73





Table 49 Positions of the Idle Overhead Bytes Used to Carry the Low-Speed DataService..............................................................................................74

Table 50 Units in the OW Board...................................................................75

Table 51 Components on the Front Panel of OW Board ...................................76

Table 52 Signal Definitions of Pins in RS232/RS485/RS422 Interface................76

Table 53 Components on the Front Panel of SEC Board...................................79 Table 54 Units in the SDB Board..................................................................81

Table 55 Components on the Front Panel of SDB Board ..................................81

Table 56 Dimensions & Weight of Components in ZXMP S200 ..........................84

Table 57 Allowable Voltage Fluctuation Range of ZXMP S200 ...........................85

Table 58 Power Consumption and Weight of Each Board Available for ZXMP S200........................................................................................................85

Table 59 Power Consumption for the Typical Configuration of ZXMP S200 (SMB) 88

Table 60 Maximum Power Consumption of ZXMP S200 (SMB)..........................89

Table 61 Power Consumption for the Typical Configuration of ZXMP S200 (SMC) 89

Table 62 Maximum Power Consumption of ZXMP S200 (SMC)..........................89

Table 63 Grounding Resistance Requirements in Independent Grounding Mode ..90

Table 64 Typical Power Supply Lightning Protection Classification.....................91

Table 65 Temperature and Humidity Requirements of ZXMP S200....................94

Table 66 Requirements for Concentration of Harmful Gas in Equipment Room....95

Table 67 Application Environment Requirements of ZXMP S200........................95

Table 68 Reliability Indexes of ZXMP S200....................................................96

Table 69 ESD Immunity Indices ..................................................................97

Table 70 Radiated Susceptibility Indices .......................................................97

Table 71 EFT Immunity Indices on DC Power Supply Ports ..............................97

Table 72 EFT Immunity Indices on Signal and Control Ports.............................97

Table 73 EFT Immunity Indices on AC Power Supply Ports...............................98

Table 74 DC Power Supply Lightning Surge Immunity Indices..........................98

Table 75 AC Power Supply Lightning Surge Immunity Indices ..........................98

Table 76 Outdoor Signal Line Surge Immunity Indices ....................................98

Table 77 Signal Line Surge Immunity Indices ................................................99

Table 78 Conducted Susceptibility Indices......................................................99

Table 79 AC Voltage Transient Dropout Immunity Indices ...............................99

Table 80 Conducted Emission Indices AT DC/AC Power Ports 100

sjzl20081400-unitrans zxmp s200 (v3.00) product descriptions_514548

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