application of pulsed dc to suppress bubble incorporation & control deposit morphology during...

APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT BUBBLE INCORPORATION & CONTROL DEPOSIT

MORPHOLOGY DURING AQUEOUS MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) ELECTROPHORETIC DEPOSITION (EPD)

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Constant current Continuous DC EPD

Constant current Continuous DC EPD

Constant current Pulsed EPD

Constant current Pulsed EPD

Constant current Pulsed EPD

Constant current Pulsed EPD

Constant current Pulsed EPD

Mechanism

1.How the particles maintain electrophoretic mobility during pulse

OFF time.

2.Why the bubble incorporation decreases at lower pulse widths.

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Contd….PART - 4

APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS BUBBLE TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING

AQUEOUS ELECTROPHORETIC DEPOSITION (EPD)AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) PART – 4 PART – 4 (Coming Soon) (Coming Soon)

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