future test solution korea test conference september 1, 2015 james j. ko
Post on 04-Jan-2016
223 Views
Preview:
TRANSCRIPT
Future Test Solution Korea Test Conference September 1, 2015
James J. Ko
Teradyne Proprietary Information2
Semiconductor Innovation Drivers
• Mobile Computing Revolution• Higher Bandwidth/Complexity/Performance• Lower power• Smaller Footprint• Lower cost• “The Internet of Everything”
Teradyne Proprietary Information3
Semiconductor Growth Drivers
Teradyne Proprietary Information4
Semiconductor Innovation challenges
• Shrinking Litho• Greater sensitivity to atomic level
defects• Decrease signal/noise• Increasing complexity• Flat Clock Frequency• High MPU data volume
Teradyne Proprietary Information5
Test technique Progression and Future
a
Teradyne Proprietary Information6
3D-IC Device Market Drivers
Performance
SizeCost3D vs.
Lithography Improvements
Electrical performance• Lower Power• High Speed• Heterogeneous integration
- RF, Logic, Memory, MEMS
Density
Future device testing 3D-ICWhat is Driving this Innovation ?
Teradyne Proprietary Information7
2D vs. 3D Manufacturing Flow
Final Test
Stack/PackageDie 1,2,3
Scrap
3D IC 3 Die Stack
Scrap
StackDie 1 and
Die 2
KGSTest
KGD
KGD
2D IC
AssemblePkg Test
FABWafer Test
Scrap Scrap
Scrap
FabDie 3
Wafer Test
FabDie 1
Scrap
Wafer Test
FabDie 2
Wafer Test
Scrap
Teradyne Proprietary Information8
ATE SLT Into the 3D-IC Manufacturing Flow
SLT Final Test
Stack/PackageDie 1,2,3
Scrap
3D IC 3 Die Stack
Scrap
StackDie 1 and
Die 2
KGSTest
KGD
KGD
Scrap
FabDie 3
SLT Wafer Test
FabDie 1
Scrap
SLT Wafer Test
FabDie 2
SLT Wafer Test
Scrap
Teradyne Proprietary Information9
More Test Challenges
Teradyne Proprietary Information10
Test Innovations and Future Solution?
top related