bece burn in socket

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BECE PTE LTD , Address : Blk 5000, #03-09, Ang Mo Kio Ave 5, Techplace II , SINGAPORE 569870 . E-mail : [email protected] Website : www.bece.com.sg . Tel : +65 68531065 , Fax : +65 68531965 High Performance Burn-in Socket BeCe ™ provides an exciƟng technology for making a high performance electrical connecƟon for a wide range of applicaƟons. The low proﬁle, low force and low resistance contacts are excellent for low inductance burn‐in test. The compact, surface mount design allow maximum number of socket per burn‐ in board, maximizing real estate while reducing board costs. (BeCe is a patented technology owned by Che-Yu Li & co. LLC) BeCe ™ GENERAL SPECIFICATIONS Socket Material: ESD Engineering Plastic Probe Material: 304V S/S with Pd/Au coated Contact Force : Less than 15g per pin Operating Temperature : ‐45°C to 125°C Max. Current : 1.5A Estimated Contact Life: 1,000 cycles All Hardware: Aluminum with ESD plating BeCe Unique Features For CSP, μBGA, DSP and LGA Devices. Device pitches 0.40mm or larger Pressure mounting, no soldering required 8 Point tips insures scrub on solder oxides Signal path only 0.04 mil [1.016mm] Contact Resistance less than 40 mOhm Self Inductance less than 0.4 nH Bandwidth more than 30 GHz@1dB

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Page 1: Bece burn in socket

BECE PTE LTD , Address : Blk 5000, #03-09, Ang Mo Kio Ave 5, Techplace II , SINGAPORE 569870 . E-mail : [email protected] Website : www.bece.com.sg . Tel : +65 68531065 , Fax : +65 68531965

High Performance Burn-in Socket

BeCe™

provides an exci ng technology for making a high performance

electrical connec on for a wide range of applica ons. The low profile, low force and low resistance contacts are excellent for low inductance burn‐in test. The compact, surface mount design allow maximum number of socket per burn‐in board, maximizing real estate while reducing board costs.

(BeCe is a patented technology owned by Che-Yu Li & co. LLC)

BeCe™

GENERALSPECIFICATIONS SocketMaterial:ESDEngineeringPlastic

ProbeMaterial:304VS/SwithPd/Aucoated

ContactForce:Lessthan15gperpin

OperatingTemperature:‐45°Cto125°C

Max.Current:1.5A

EstimatedContactLife:1,000cycles

AllHardware:AluminumwithESDplating

BeCeUniqueFeatures ForCSP,µBGA,DSPandLGADevices.

Devicepitches0.40mmorlarger

Pressuremounting,nosolderingrequired

8Pointtipsinsuresscrubonsolderoxides

Signalpathonly0.04mil[1.016mm]

ContactResistancelessthan40mOhm

SelfInductancelessthan0.4nH

Bandwidthmorethan30GHz@1dB

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